JP2002050711A - Sealing method of vacuum vessel for electronic component - Google Patents

Sealing method of vacuum vessel for electronic component

Info

Publication number
JP2002050711A
JP2002050711A JP2000266202A JP2000266202A JP2002050711A JP 2002050711 A JP2002050711 A JP 2002050711A JP 2000266202 A JP2000266202 A JP 2000266202A JP 2000266202 A JP2000266202 A JP 2000266202A JP 2002050711 A JP2002050711 A JP 2002050711A
Authority
JP
Japan
Prior art keywords
container
sealing member
small hole
sealing
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000266202A
Other languages
Japanese (ja)
Other versions
JP4517376B2 (en
Inventor
Yoshiya Okada
恵也 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microstone Corp
Original Assignee
Microstone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microstone Corp filed Critical Microstone Corp
Priority to JP2000266202A priority Critical patent/JP4517376B2/en
Publication of JP2002050711A publication Critical patent/JP2002050711A/en
Application granted granted Critical
Publication of JP4517376B2 publication Critical patent/JP4517376B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide the sealing method of a vacuum vessel for an electronic component which does not need a vacuum tank provided with a large and complicated mechanism and a vacuum pump having high-level capabilities, lessens the generation of gas in the processes of the sealing method, and can execute sealing of the vacuum container for the electronic component, easily and simply and at low cost, using an inexpensive device. SOLUTION: The sealing method of a vacuum container for an electronic component consists of a process for completing a box-shaped container consisting of a metallic base stand with an airlight insulating terminal and a cover, providing the electronic component in its interior, and airtightly bonding (such as a seam welding) its peripheral edges to the cover; a process for evacuating gas in the interior through small holes provided in the container in a vacuum tank; and a process that a sealing material (such as small metal balls) for blocking the small holes is made to abut on the apertures provided in the outer ends of the small holes in the same vacuum tank; and the sealing member is resistance-welded to the apertures provided in the outsides of the small holes.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は気密な容器の内部に
電子部品を納め、その電子部品を真空の環境内で動作さ
せるために、容器の内部を真空に保って封止を行う技術
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for enclosing an electronic component in a hermetically sealed container and keeping the interior of the container at a vacuum in order to operate the electronic component in a vacuum environment.

【0002】[0002]

【従来の技術】真空中で動作させるべき電子部品の種類
は多い。例えば半導体を用いた素子は劣化を避けるため
に真空中または不活性ガス中で動作させる。また周波数
基準となる水晶振動子や振動ジャイロセンサ用の振動子
で高精度を要求されるものは、振動に対する気体の抵抗
力を除くために、例えば1Pa以内の真空度である環境
中で励振されることが望ましい。そこでそれらの電子素
子を真空中に置くためには、まず大気中で気密な容器
(パッケージ)内部に組立て、かつ容器に設けたハーメ
チック端子に対して必要な接続を行い、その後容器内の
空気を排気した上で密閉することが行われる。
2. Description of the Related Art There are many types of electronic components to be operated in a vacuum. For example, an element using a semiconductor is operated in a vacuum or an inert gas to avoid deterioration. In addition, a crystal oscillator or a vibrator for a vibrating gyro sensor, which is required to have high accuracy, is excited in an environment having a degree of vacuum of 1 Pa or less, for example, in order to remove gas resistance to vibration. Is desirable. Therefore, in order to place these electronic elements in a vacuum, first assemble them inside an airtight container (package) in the air, make the necessary connections to the hermetic terminals provided on the container, and then release the air inside the container. Sealing is performed after evacuation.

【0003】容器は多くの場合箱型をなす。容器は通常
ハーメチック端子群を備えた基台と蓋との2部材から成
る。電子部品を内部に実装し組み立てを終わった容器を
気密に構成するには次の方法がある。(1)ハンダ付け
法は基台と蓋との周縁部を溶融ハンダで接合する。
(2)抵抗溶接法は例えば蓋の周縁部に枠状のプロジェ
クションを設けておき、それを基台の周縁部に加圧接触
させて通電し、一挙に接合する。(3)コールドウェル
ド法は重ね合わせた基台と蓋の周縁部を金型で強く圧接
する。(4)シーム溶接法は抵抗溶接法の一種である
が、ローラー状をなした電極を重ね合わせた基台と蓋の
周縁部に沿って動かしつつパルス状の溶接電流を短い間
隔で反復して流し接合する。
[0003] Containers are often box-shaped. The container usually comprises two members, a base provided with a group of hermetic terminals and a lid. There are the following methods to airtightly construct the assembled container in which electronic components are mounted and assembled. (1) In the soldering method, the peripheral edges of the base and the lid are joined with molten solder.
(2) In the resistance welding method, for example, a frame-shaped projection is provided on the peripheral edge of the lid, and the projection is brought into contact with the peripheral edge of the base by applying pressure, thereby energizing and joining at once. (3) In the cold welding method, the base and the peripheral edge of the lid which are overlapped are strongly pressed with a mold. (4) The seam welding method is a kind of resistance welding method, in which a pulse-like welding current is repeated at short intervals while moving along a peripheral edge of a base and a lid on which roller-shaped electrodes are overlapped. Sink and join.

【0004】上記(4)のシーム溶接技術は本願発明の
実施の形態の一例にも用いるので詳しく説明しておく。
図4はシーム溶接装置の要部(電極および被溶接物)を
示す部分断面図である。図4において、1は箱型をなす
容器であり、ガラス部材をリード線が貫通している気密
端子1b付きのコバール等より成る金属の基台1aと、
平板である金属の蓋1cとより成る。基台1aと蓋1c
とには無電解NiメッキまたはAuメッキ(例えば厚さ
数μm以内)が施されている。容器1の内部の箱型の空
間には電子部品2が収容され、気密端子1bのリード線
と接続されかつ固定されている。電子部品2は真空中で
動作させることが好ましい部品で、例えば振動ジャイロ
センサや加速度センサの主体となる振動体であり、ある
いは半導体より成る電子部品である。
[0004] The seam welding technique (4) is also used in an embodiment of the present invention and will be described in detail.
FIG. 4 is a partial cross-sectional view showing a main part (electrode and workpiece) of the seam welding apparatus. In FIG. 4, reference numeral 1 denotes a box-shaped container, and a metal base 1a made of Kovar or the like with an airtight terminal 1b through which a lead wire passes through a glass member;
And a metal lid 1c which is a flat plate. Base 1a and lid 1c
Is subjected to electroless Ni plating or Au plating (for example, within a thickness of several μm). An electronic component 2 is housed in a box-shaped space inside the container 1 and connected to and fixed to a lead wire of the hermetic terminal 1b. The electronic component 2 is a component that is preferably operated in a vacuum, for example, a vibrating body that is a main component of a vibration gyro sensor or an acceleration sensor, or an electronic component made of a semiconductor.

【0005】基台1aは絶縁材であるセラミクス台13
上にセットされる。例えばセラミクス等の台13は図示
しない案内装置によって直線または回転移動ができるジ
グテーブル14上に固定されていて共に移動する。12
a、12bはテーパー形状を与えられ、回転するローラ
電極であり、それらは溶接電源11の2つの出力端子に
接続されており、また基台1a上に載置された蓋1bの
縁に圧接しながら転動する。溶接電源11からは短い間
隔で連続したパルス状の溶接電流が発生している。溶接
電流は主にローラ電極12a、蓋1b、基台1a、基台
1aの他側、蓋1bの他側、ローラ電極12bの経路を
通って流れる。(蓋1bは薄いので蓋内部を通って短絡
する電流は少ない。)
The base 1a is a ceramics base 13 which is an insulating material.
Set on top. For example, a base 13 for ceramics or the like is fixed on a jig table 14 that can be moved linearly or rotationally by a guide device (not shown) and moves together. 12
Reference numerals a and 12b denote tapered and rotating roller electrodes which are connected to the two output terminals of the welding power source 11 and which are pressed against the edge of the lid 1b mounted on the base 1a. Roll while rolling. A continuous pulse-like welding current is generated from the welding power source 11 at short intervals. The welding current mainly flows through the path of the roller electrode 12a, the lid 1b, the base 1a, the other side of the base 1a, the other side of the lid 1b, and the roller electrode 12b. (Since the lid 1b is thin, a short-circuit current through the inside of the lid is small.)

【0006】その結果、蓋1bと基台1aとはその周縁
に沿って連続的に十分密接した間隔で、従って気密に多
点溶接される。なおシーム溶接によっては、溶接条件に
もよるが、蓋1bまたは基台1aの母材はあまり融け
ず、主にメッキが融けて創設が行われるともいわれる。
容器1の平面形状が方形である場合には、相対向する平
行縁辺の溶接後、ジグテーブル14を90°回転し、残
りの対向する縁辺の溶接を行へば、蓋1bと基台1aと
の完全な気密接合が完成する。シーム溶接法は容器のサ
イズ変更に対しても容易に対応でき、比較的大型の容器
(例えば数10mm角)のシールも効率よく行える長所
がある。
[0006] As a result, the lid 1b and the base 1a are continuously welded at a sufficiently close interval along the peripheral edge thereof, and thus are air-tightly welded at multiple points. In some seam welding, the base material of the lid 1b or the base 1a is not melted much, and it is said that the plating is mainly melted and founded, though depending on welding conditions.
When the planar shape of the container 1 is rectangular, the jig table 14 is rotated by 90 ° after welding of the parallel edges facing each other, and the welding of the remaining opposite edges is performed, so that the lid 1b and the base 1a are connected to each other. Complete hermetic bonding is completed. The seam welding method has an advantage that it can easily cope with a change in the size of the container and can efficiently seal a relatively large container (for example, several tens of mm square).

【0007】さて従来例一般の説明に戻る。最終的に容
器の内部を真空にするには2通りの方法がある。第1の
方法は基台と蓋との周縁部を真空中で溶着する方法であ
り、1工程で真空封止が完成する。例えばハンダ付け法
では基台と蓋とにハンダメッキしておき、真空中で接触
加熱して接続する。またコールドウェルド法では重ね合
わせた基台と蓋の周縁部を真空中にて金型で強く冷間圧
接する。あるいは真空中で他に孔のない容器のシーム溶
接を行う。また第2の方法は基台と蓋とのいずれか一方
に容器内部に通じる小孔を設けておき、小孔を残して気
密接合を大気中で行い、次いで真空中に移してから小孔
を塞ぐ方法である。塞ぐ方法としては溶融ハンダで封止
する方法やインジウムのような軟質金属を小孔に押しつ
ける方法等がある。また小孔ではないが、銅などの小パ
イプを予め容器に貫通させてロウ付けしておき、真空中
でパイプを潰す方法もある。
Returning to the general description of the conventional example. Finally, there are two ways to evacuate the interior of the container. The first method is to weld the peripheral portions of the base and the lid in a vacuum, and the vacuum sealing is completed in one step. For example, in the soldering method, a base and a lid are solder-plated, and contact heating and connection are performed in a vacuum. In the cold weld method, the peripheral portion of the lid and the base that are overlapped with each other are strongly cold-pressed with a metal mold in a vacuum. Alternatively, seam welding of a container having no other hole is performed in a vacuum. In the second method, a small hole communicating with the inside of the container is provided in one of the base and the lid, airtight joining is performed in the atmosphere while leaving the small hole, and then the small hole is transferred to a vacuum. It is a method of closing. As a closing method, there is a method of sealing with molten solder, a method of pressing a soft metal such as indium into small holes, and the like. Although not a small hole, there is a method in which a small pipe of copper or the like is penetrated through a container in advance and brazed, and the pipe is crushed in a vacuum.

【0008】[0008]

【発明が解決しようとする課題】上記の従来技術につい
ては次のような問題点がある。まず第1の方法(真空中
での全周封着)において、ハンダ付け法では溶融ハンダ
の一部が気化して容器内に飛散残留し、内部の電子部品
を汚染する可能性が高い。コールドウェルド法では、特
に多数の製品を同時に封じるためには、金型の上型と下
型とを平行移動させしかも大きな圧接力を発生させるよ
う大型の頑丈な金型を高精度で真空槽内で動かさねばな
らない。シーム溶接機も圧接、転動、平行移動、回転等
多種の可動部が多く、従って大型となる。これらの装置
を収容するため、極めて容積の大きな真空槽を必要と
し、その可動機構や加圧機構は外部から遠隔操作する必
要性も加えて甚だ複雑とならざるを得ない。また大面積
で複雑な可動部からは吸蔵ガスが発生するので、槽内を
能率よく排気するためには高能率かつ到達真空度の高い
排気ポンプを必要とする。即ち真空装置が大型で高価と
なる。
The above prior art has the following problems. First, in the first method (peripheral sealing in a vacuum), in the soldering method, there is a high possibility that a part of the molten solder vaporizes and scatters and remains in the container, thereby contaminating the internal electronic components. In the cold weld method, especially in order to seal many products at the same time, a large, sturdy mold is moved in a vacuum chamber with high precision so that the upper and lower molds of the mold are translated and a large pressing force is generated. Must be moved. Seam welding machines also have many types of movable parts such as pressure welding, rolling, parallel movement, and rotation, and are therefore large in size. In order to accommodate these devices, an extremely large-sized vacuum chamber is required, and the movable mechanism and the pressurizing mechanism have to be extremely complicated in addition to the need for remote control from the outside. In addition, since occluded gas is generated from a large-area and complicated movable portion, a highly efficient exhaust pump having a high ultimate vacuum is required to efficiently exhaust the inside of the tank. That is, the vacuum device is large and expensive.

【0009】また第2の方法(残した小孔等の真空中封
口)においては、第1の方法ほどの大規模な真空設備を
必要としない長所はあるが、溶融ハンダ使用の場合はや
はりガス発生のおそれがあり、軟質金属使用の場合は取
扱いがやや面倒であり、信頼性が十分であるとは言えな
い。パイプ潰し法はパイプ溶接の予備工程が必要な上、
封止後の容器にかなり大きな突起が生じるので好ましく
ない。
The second method (sealing of small holes or the like in a vacuum) has the advantage that a large-scale vacuum facility is not required as in the first method, but the gas is still required in the case of using molten solder. There is a risk of occurrence, and when a soft metal is used, handling is somewhat troublesome and reliability cannot be said to be sufficient. The pipe crushing method requires a preliminary process of pipe welding,
It is not preferable because a considerably large protrusion is formed on the container after sealing.

【0010】本発明の目的は、複雑な操作機構を備えた
大型の真空槽や高度な能力の真空ポンプを必要とせず、
工程中のガス発生が少なく、結果的に簡素で廉価な装置
を用いて容易かつ簡便に低コストで実施できる、電子部
品の真空封止方法を提供することである。
An object of the present invention is to eliminate the need for a large vacuum tank having a complicated operation mechanism or a high-performance vacuum pump,
An object of the present invention is to provide a vacuum sealing method for an electronic component which generates little gas during the process and consequently can be easily and simply carried out at low cost using a simple and inexpensive apparatus.

【0011】[0011]

【課題を解決するための手段】上記目的を達成するため
本発明の電子部品の真空容器の封止方法は次の特徴を備
える。 (1)箱型の容器の部品である、気密絶縁端子付きの金
属の基台と蓋とを準備し、それらの一方に前記容器の内
外に貫通する小孔を設ける工程と、前記基台上に真空中
で動作させるべき電子部品を取り付けかつ前記気密絶縁
端子と接続する工程と、大気中またはガス中で前記基台
の周縁部と前記蓋の周縁部とを気密に接合することによ
って前記電子部品が内装された前記箱型の容器を完成す
る工程と、真空槽の中で前記小孔より内部の気体を排気
する工程と、同じ真空槽の中で前記小孔の外端開口部に
前記小孔を塞ぐ封口部材を当接させ前記小孔の外側開口
部とを抵抗溶接する工程とを含むこと。
In order to achieve the above object, a method for sealing a vacuum container of an electronic component according to the present invention has the following features. (1) A step of preparing a metal base with a hermetically insulated terminal and a lid, which are parts of a box-shaped container, and providing a small hole penetrating inside and outside of the container on one of them; Attaching an electronic component to be operated in a vacuum to the airtight insulating terminal and connecting the peripheral portion of the base and the peripheral portion of the lid in the air or gas in an airtight manner. A step of completing the box-shaped container in which the components are installed, and a step of exhausting gas from the small hole in a vacuum chamber, and forming the outer end opening of the small hole in the same vacuum chamber. Abutting a sealing member that closes the small hole and resistance welding the outer opening of the small hole.

【0012】本発明の電子部品の真空容器の封止方法は
更に以下の特徴の少なくとも一つを備えることがある。 (2)前記大気中またはガス中で基台の周縁部と前記蓋
の周縁部とを気密に接合する工程にはシーム溶接技術を
用いたこと。
The method for sealing a vacuum container of an electronic component according to the present invention may further include at least one of the following features. (2) The seam welding technique is used in the step of hermetically joining the peripheral portion of the base and the peripheral portion of the lid in the atmosphere or gas.

【0013】(3)前記抵抗溶接の工程において、前記
封口部材の少なくとも一部の溶融の程度および変形の程
度が、溶接の相手である前記基台あるいは蓋の溶融の程
度および変形の程度よりも大であるような溶接条件(封
口部材の材質・形状、加圧力、電流、溶接電極の材質・
形状)を与えたこと。
(3) In the resistance welding step, the degree of melting and the degree of deformation of at least a part of the sealing member are larger than the degree of melting and the degree of deformation of the base or the lid to be welded. Large welding conditions (material and shape of sealing member, pressing force, current, material of welding electrode,
Shape).

【0014】(4)前記封口部材は前記小孔の内径より
も大きな直径を持つ金属球であり、該金属球が主に溶融
変形しつつ溶接の相手である前記基台あるいは蓋に押し
込まれる結果、該基台あるいは蓋の表面よりの最終突出
高さが、前記金属球の元の半径程度以下となること。
(4) The sealing member is a metal sphere having a diameter larger than the inner diameter of the small hole, and the metal sphere is mainly melted and deformed and is pushed into the base or lid to be welded. The final protruding height from the surface of the base or the lid is not more than about the original radius of the metal sphere.

【0015】(5)前記金属球の素材の直径は好ましく
は前記小孔の内径の1.3倍ないし2倍であること。
(5) The diameter of the material of the metal sphere is preferably 1.3 to 2 times the inner diameter of the small hole.

【0016】(6)前記封口部材は半球状または円錐状
の突出部を有する小板であり、前記溶接工程において、
前記突出部が前記小孔に挿入されること。
(6) The sealing member is a small plate having a hemispherical or conical projection, and in the welding step,
The protrusion is inserted into the small hole.

【0017】(7)前記封口部材はリング状のプロジェ
クションを有する小板であり、前記溶接工程において、
前記リング状のプロジェクションが前記小孔の周囲に当
接すること。
(7) The sealing member is a small plate having a ring-shaped projection.
The ring-shaped projection abuts around the small hole.

【0018】(8)前記小孔の外端開口部に浚い部を設
け、前記封口部材の一部または全部を前記浚い部に沈め
たこと。
(8) A dredging portion is provided at the outer end opening of the small hole, and part or all of the sealing member is submerged in the dredging portion.

【0019】(9)前記封口部材の材質はステンレス鋼
であること。
(9) The material of the sealing member is stainless steel.

【0020】(10)前記容器の排気を行っている期
間、前記封口部材を磁力によって保持すること。
(10) The sealing member is held by magnetic force while the container is being evacuated.

【0021】(11)前記電子部品は機械的振動子であ
ること。
(11) The electronic component is a mechanical vibrator.

【0022】[0022]

【発明の実施の形態】図1は本発明の実施の形態の一例
において使用する小型封口装置の要部の断面図である。
1は真空封止すべき容器で、記述の図4の従来技術にお
いて説明したものと基本的に同じである。容器1は電子
部品2を内蔵し、基台1aと蓋1cとより成り、両者は
以前の工程において大気圧の空気中または不活性ガス中
でシーム溶接されている。容器はセラミックス等の絶縁
性の台7上に載置される。台7の一方には容器1に残さ
れた小孔1dに面して溶接電極4が固定される。溶接電
極4は溶着を避けるためクロム銅等の材質とし、小孔4
aを有し内部には磁石6を埋めてある。封口部材である
ステンレス製の金属球3aは磁力により吸引されて小孔
5の外端に保持されている。
FIG. 1 is a sectional view of a main part of a small-sized sealing device used in an example of an embodiment of the present invention.
Reference numeral 1 denotes a container to be vacuum-sealed, which is basically the same as that described in the prior art of FIG. The container 1 incorporates an electronic component 2 and includes a base 1a and a lid 1c, both of which are seam-welded in air at atmospheric pressure or in an inert gas in a previous step. The container is placed on an insulating stand 7 made of ceramics or the like. The welding electrode 4 is fixed to one side of the base 7 so as to face the small hole 1 d left in the container 1. The welding electrode 4 is made of a material such as chromium copper to avoid welding.
The magnet 6 is buried inside. The metal ball 3 a made of stainless steel as a sealing member is attracted by magnetic force and is held at the outer end of the small hole 5.

【0023】台7の他方の側には容器1の側面を押すた
めのプランジャー7aであって、台7に設けた直動ベア
リング7d内を軸方向に摺動する。押圧力(溶接時の加
圧力)は予め圧縮されたコイルバネ7bとバネ受板7c
とにより与えられる。またプランジャー7aの左端には
カム板7fが固着されており、カム板7fの右面は台7
に植えたストッパーピン7eに当たっているが、カム板
7fが回されてそのスリット7gにストッパーピン7e
が落ち込むとプランジャー7aはバネ力により矢印9方
向に移動し、容器1を滑らせ、小孔1dの開口部を金属
球3aに当接させかつ加圧する。
On the other side of the table 7, there is a plunger 7a for pushing the side surface of the container 1, which slides in a linear motion bearing 7d provided on the table 7 in the axial direction. The pressing force (pressing force at the time of welding) is a previously compressed coil spring 7b and a spring receiving plate 7c.
And given by A cam plate 7f is fixed to the left end of the plunger 7a.
The cam plate 7f is turned, and the stopper pin 7e is inserted into the slit 7g.
When the plunger 7a falls, the plunger 7a moves in the direction of arrow 9 by the spring force, slides the container 1, brings the opening of the small hole 1d into contact with the metal ball 3a, and presses it.

【0024】上記の装置は、真空槽内では封口部材を小
孔に圧接するという実質的に1自由度(1方向)の動作
が行えればよく、その遠隔操作手段も含めて構造が単純
で、しかも圧接力も大きくないので、全体を比較的小型
の真空槽(図示せず)内に納めることができる。なお真
空槽の外部に単発の電流パルスを発生させる溶接電源1
0があり、その電流出力線は真空槽の絶縁端子を経由し
て、溶接電極4と他方の溶接電極を兼ねるプランジャー
7aとに結線されている。本装置の可動部は極めて簡単
な構造なので吸蔵ガスの発生も少なく、大能力の排気ポ
ンプを用いずとも、電子部品2が振動体を封止する場合
に好適な例えば5/100Pa程度の真空度が容易に得
られる。
The above-mentioned device is only required to perform substantially one degree of freedom (one direction) operation of pressing the sealing member against the small hole in the vacuum chamber, and its structure is simple including its remote control means. In addition, since the pressing force is not large, the whole can be accommodated in a relatively small vacuum chamber (not shown). A welding power source 1 that generates a single current pulse outside the vacuum chamber
0, and the current output line is connected to the welding electrode 4 and the plunger 7a also serving as the other welding electrode via the insulating terminal of the vacuum chamber. Since the movable part of the present apparatus has a very simple structure, generation of occluded gas is small, and a vacuum degree of, for example, about 5/100 Pa suitable for sealing the vibrating body of the electronic component 2 without using a large capacity exhaust pump. Can be easily obtained.

【0025】真空封止工程は以下のようである。プラン
ジャー7aを左に引いてコイルバネ7bをチャージし、
カム板7fをストッパーピン7eに当接させておく。金
属球3aを溶接電極4に吸引保持させ、台7上に周縁部
の封止を終わった容器1を正しい位置に乗せる。小孔1
dと金属球3aとは容器1内の排気を容易にするため少
し離しておく。この状態で真空槽を閉じ、排気する。所
定の真空度に達したら、真空槽を貫通した回転軸を有す
る操作部材8を外部のハンドルによって回転させ、カム
板7fを引っかけて回し、ストッパーピン7eをスリッ
ト7g内に落とし、プランジャー7aで容器1を押し、
小孔1dと金属球3aを当接させる。次に溶接電源10
のスイッチ(図示せず)を投入し、プランジャー7a−
容器1−小孔1d外端部−金属球3a−溶接電極4の経
路で流れる電流によって金属球3aを容器1に抵抗溶接
し、真空封止を完了する。
The vacuum sealing step is as follows. Pull the plunger 7a to the left to charge the coil spring 7b,
The cam plate 7f is kept in contact with the stopper pin 7e. The metal ball 3 a is suction-held by the welding electrode 4, and the container 1, whose peripheral edge has been sealed, is placed on a table 7 at a correct position. Small hole 1
d and the metal sphere 3a are slightly separated from each other to facilitate exhaustion of the container 1. In this state, the vacuum chamber is closed and the air is exhausted. When the predetermined degree of vacuum is reached, the operating member 8 having a rotating shaft penetrating the vacuum chamber is rotated by an external handle, the cam plate 7f is hooked and turned, the stopper pin 7e is dropped into the slit 7g, and the plunger 7a is used. Press container 1,
The small hole 1d is brought into contact with the metal ball 3a. Next, the welding power source 10
Switch (not shown) is turned on, and the plunger 7a-
The metal ball 3a is resistance-welded to the container 1 by a current flowing through the path of the container 1, the outer end of the small hole 1d, the metal ball 3a, and the welding electrode 4, thereby completing the vacuum sealing.

【0026】溶接条件は例えば以下のようであった。容
器1の材質はコバール(Fe−Ni−Co合金)、小孔
1dの直径は1mm(0.3Cの面取り付き)、金属球
3aの材質はSUS304またはSUS440C、直径
は1.5mm、溶接電極4の小孔4aの直径は1mm
(金属球3aに接する側に0.3Cの面取り付き)、加
圧力は150N、溶接電流は1500A、通電時間は5
0ms。なお金属球3aの直径を変えて試したところ、
1mmでは溶接されず、1.2mmでは気体のリークが
認められ、1.5mmで完全な封口ができた。直径の上
限は更に大きく、2mm程度(あるいは小孔1dの直径
の約2倍程度)までは許容できるであろうと思われる。
The welding conditions were, for example, as follows. The material of the container 1 is Kovar (Fe-Ni-Co alloy), the diameter of the small hole 1d is 1 mm (with a chamfer of 0.3C), the material of the metal ball 3a is SUS304 or SUS440C, the diameter is 1.5 mm, the welding electrode 4 The diameter of the small hole 4a is 1 mm
(0.3 C chamfered on the side in contact with the metal ball 3 a), the pressing force is 150 N, the welding current is 1500 A, and the energizing time is 5
0 ms. When I tried changing the diameter of the metal ball 3a,
At 1 mm, no welding was performed. At 1.2 mm, gas leakage was observed, and at 1.5 mm, complete sealing was achieved. The upper limit of the diameter is even larger, and it seems that up to about 2 mm (or about twice the diameter of the small hole 1d) may be acceptable.

【0027】金属球はボールベアリング等に使用されて
いるため入手が容易でありかつ安価である。また上記の
ようにステンレス材を用いた理由は、他の材質に比して
ステンレス材は体積固有抵抗が高くて通電による発生熱
量が多く、抵抗溶接に適しているからである。また耐蝕
性に優れ製品の信頼性の点でも好ましい。また金属球は
上記上限よりも更に大きくても抵抗溶接は可能である
が、本例の構造において封口溶接後の容器表面からの突
出高さを過大にしないために、ある限度内の球径である
ことが望ましい。なお更に大きな直径の金属球を用い得
る他の実施の形態については図5を用いて後述する。
Metal balls are easily available and inexpensive because they are used for ball bearings and the like. The reason why the stainless steel material is used as described above is that the stainless steel material has a higher volume specific resistance and a larger amount of heat generated by energization than other materials, and is suitable for resistance welding. It is also excellent in corrosion resistance and is preferable in terms of product reliability. In addition, resistance welding is possible even if the metal ball is larger than the above upper limit, but in the structure of this example, in order to prevent the projection height from the container surface after sealing welding from becoming excessive, a ball diameter within a certain limit is used. Desirably. Another embodiment in which a metal sphere having a still larger diameter can be used will be described later with reference to FIG.

【0028】図2(a)、(b)に溶接前後の状態を拡
大して断面図で示す。(a)は溶接直前の電極4、金属
球3a、小孔1dの相互位置関係、(b)は溶接後の状
況である。溶接電流は小孔4aの面取り部と小孔1dの
面取り部による小面積のリング状の接触面から金属球3
aに出入りし、その付近の金属球が溶融して加圧力によ
ってフランジ状に広がって潰れ、同時に容器の小孔1d
の外端部と金属球の一部とが、材質成分(Fe)が共通
で親和性があるため溶着していると考えられる状態が示
されている。このように金属球はかなり強く潰されるの
で、封止完了後の容器の外部への突出量も例えば元の金
属球の半径程度以下で済む。
FIGS. 2A and 2B are enlarged sectional views showing states before and after welding. (A) shows the mutual positional relationship between the electrode 4, the metal ball 3a, and the small hole 1d immediately before welding, and (b) shows the situation after welding. The welding current is applied to the metal ball 3 from the small-area ring-shaped contact surface formed by the chamfered portion of the small hole 4a and the chamfered portion of the small hole 1d.
a, the metal sphere in the vicinity melts and spreads in a flange shape by the pressing force and collapses, and at the same time, the small hole 1d of the container.
3 shows a state where the outer end portion of the metal ball and a part of the metal sphere are considered to be welded because the material component (Fe) is common and has affinity. As described above, since the metal sphere is considerably strongly crushed, the amount of protrusion of the container after the sealing is completed can be, for example, about the radius of the original metal sphere or less.

【0029】図3(a)、(b)、(c)はそれぞれ本
発明の他の実施の形態の要部を示す関係部品の配置の部
分断面図である。各実施の形態においては、用いる封口
部材3の形状が球状ではなく異なっている。各封口部材
3は塑性変形加工した板材から打ち抜かれたもので、い
ずれも容器1の小孔1d側に向けた凸面を有し、他の面
はほぼ平面をなす。他の面に当接する溶接電極4の面に
は従って小孔を設ける必要がないので平面としている。
(a)の封口部材3は板材に半球状の突起(プロジェク
ション)を、(b)は円錐状の突起を、(c)は小孔1
dの周囲に当接するリング状の突起を有する。
3 (a), 3 (b) and 3 (c) are partial cross-sectional views showing the arrangement of related parts showing the main parts of another embodiment of the present invention. In each of the embodiments, the shape of the sealing member 3 used is not spherical but different. Each sealing member 3 is stamped from a plastically deformed plate material, and has a convex surface facing the small hole 1d side of the container 1, and the other surfaces are substantially flat. Therefore, the surface of the welding electrode 4 which is in contact with the other surface does not need to be provided with a small hole, so that the surface is flat.
The sealing member 3 of (a) has a hemispherical projection (projection) on a plate material, (b) has a conical projection, and (c) has a small hole 1.
It has a ring-shaped projection that abuts around d.

【0030】(a)、(b)は小孔1dの外端部の縁部
と封口部材3の突起との接触部に溶接電流が集中して両
材が互いに融け合い、(c)ではリング状の突起の頂点
と容器1の表面とのリング状の接触部が溶着する。これ
らの封口部材は溶接後の突出高さが低い利点がある。ま
た各封口部材の位置決めはその外形(円板や角板)を利
用してもよいし、帯材を母材として打抜き、母材に戻し
て帯材上に保持させてもよく、また球状の場合のように
磁力で溶接電極4の面に吸着させて保持してもよい。
(A) and (b) show that the welding current concentrates on the contact portion between the edge of the outer end of the small hole 1d and the projection of the sealing member 3 so that the two materials fuse with each other. A ring-shaped contact portion between the apex of the protrusion and the surface of the container 1 is welded. These sealing members have the advantage that the protrusion height after welding is low. The positioning of each sealing member may be performed by using its outer shape (a disk or a square plate), or may be performed by punching a strip as a base material, returning the base material to the base material, and holding the base material on the strip. As in the case, it may be held by being attracted to the surface of the welding electrode 4 by a magnetic force.

【0031】図5(a)、(b)はそれぞれ本発明の更
に他の実施の形態における封口部分の溶接直前(封口部
材が小孔に圧着されたが未溶接)の状態を示した要部断
面図である。本実施の形態においては、容器1の小孔1
dの外端開口部に浚い部1eを設け、封口部材3(金属
球3aを含む)の一部あるいは全部を容器内に沈めた構
造とした。このことにより、例えば大形の封口部材を用
いても溶接後の容器からの突出高さを減らしあるいは無
くし、また完成品が他物に当って封口部材が脱落する危
険を減らすことができる。
FIGS. 5 (a) and 5 (b) are main portions showing a state immediately before welding of a sealing portion (a sealing member is pressed into a small hole but not welded) in still another embodiment of the present invention. It is sectional drawing. In the present embodiment, the small hole 1 of the container 1
A dredging portion 1e was provided at the outer end opening of d, and a part or all of the sealing member 3 (including the metal ball 3a) was submerged in the container. As a result, for example, even if a large-sized sealing member is used, the height of protrusion from the container after welding can be reduced or eliminated, and the risk that the completed product hits another object and the sealing member falls off can be reduced.

【0032】以上複数の本発明の実施の形態について述
べたが、本発明の技術的範囲はこれらの実施の形態に限
定されるものではない。例えば容器1の予備的封止はシ
ーム溶接に限らず、他の手段、例えばハンダその他のロ
ウ材を用いてもよいし、小孔を蓋側に設けたり、その内
径、面取り、形状、表面仕上げあるいは表面処理等を変
更あるいは追加したり、封口装置の構造、作動手段、封
口部や封口部材の形状や保持方法等に更に異なる形態や
材質を与えてもよい。また溶接条件も例示のものに限ら
れないことは当然である。また同一の真空槽内で並列に
セットした複数の容器の封口操作を同時にあるいは順次
に行うことも容易に実施できる。
Although a plurality of embodiments of the present invention have been described above, the technical scope of the present invention is not limited to these embodiments. For example, the preliminary sealing of the container 1 is not limited to seam welding, and other means, for example, solder or other brazing material may be used, or a small hole may be provided on the lid side, or its inner diameter, chamfer, shape, surface finish. Alternatively, the surface treatment or the like may be changed or added, or a different form or material may be given to the structure of the sealing device, the operating means, the shape or the holding method of the sealing portion or the sealing member, or the like. Also, the welding conditions are not limited to the examples. It is also easy to simultaneously or sequentially perform the sealing operation of a plurality of containers set in parallel in the same vacuum chamber.

【0033】[0033]

【発明の効果】(1)本発明は請求項1に示すように、
小孔を残した気密容器を大気圧中で完成し、真空中で排
気すると共に小孔を封口部材を用いて、単純な動作でか
つ比較的小さな圧接力を与えて抵抗溶接により封じる方
法であるから、大型で複雑な内外操作機構を備えた真空
槽や高度な能力の真空ポンプを必要とせず、工程中のガ
ス発生が少なく、結果的に廉価な装置を用いて容易かつ
簡便に低コストで実施することができる効果がある。
(1) According to the present invention, as set forth in claim 1,
This is a method in which an airtight container with small holes is completed at atmospheric pressure, exhausted in vacuum, and the small holes are sealed by resistance welding by applying a relatively small pressing force with a simple operation using a sealing member. Therefore, there is no need for a large and complicated vacuum chamber with complicated internal / external operation mechanisms or a high-performance vacuum pump, and there is little gas generation during the process.As a result, inexpensive equipment can be used easily, simply and at low cost. There is an effect that can be implemented.

【0034】また請求項2以下の構成を加えたときに得
られる更なる個別の効果を、各請求項に対応させた番号
を付して列記する。 (2)容器の気密接合にシーム溶接技術を用いたことに
より、大型の容器でも簡便かつ確実に封止することがで
きる効果がある。
Further, further individual effects obtained by adding the following constitutions will be listed with numbers corresponding to the respective claims. (2) The use of the seam welding technique for hermetically joining the containers has the effect that even large containers can be easily and reliably sealed.

【0035】(3)封口部材の方法が容器よりも大きな
変形を受けるような溶接条件を与えたことにより、封口
部の溶着を確実化し、容器内部の真空維持の信頼性を向
上することができた。 (4)封口部材として容器の小孔の内径よりも大きな直
径の金属球を用い、これを大きく変形させて容器側に押
し込み、容器表面よりの最終突出高さを金属球の元の半
径程度以下としたので、やはり封口部の溶着を確実化
し、真空維持の信頼性を向上する効果を得ることができ
た。 (5)金属球の素材の直径を容器側の小孔の内径の1.
3倍ないし2倍とすることにより、確実性のある封口が
行えるようにした効果がある。
(3) By providing welding conditions such that the method of the sealing member undergoes greater deformation than that of the container, welding at the sealing portion can be ensured, and the reliability of maintaining the vacuum inside the container can be improved. Was. (4) A metal sphere having a diameter larger than the inner diameter of the small hole of the container is used as the sealing member. The metal sphere is largely deformed and pushed into the container, and the final projection height from the container surface is equal to or less than the original radius of the metal sphere. Therefore, the effect of ensuring the welding of the sealing portion and improving the reliability of maintaining the vacuum was obtained. (5) The diameter of the material of the metal sphere is defined as 1 of the inner diameter of the small hole on the container side.
By setting it to 3 times or 2 times, there is an effect that reliable sealing can be performed.

【0036】(6)封口部材として半球状または円錐状
の突出部を有する小板を用いることにより、球状の封口
部材でなくても確実な真空維持を達成すると共に容器面
からの突出高さの小さい封止形状が得られた。 (7)封口部材としてリング状のプロジェクションを有
する小板を用いることにより、球状の封口部材でなくて
も確実な真空維持を達成すると共に容器面からの突出高
さの小さい封止形状が得られた。 (8)封口部材を封口部に設けた浚い部に沈めたことに
より、封口後の突出部を少なくし、あるいは無くすこと
ができる。
(6) By using a small plate having a hemispherical or conical projection as a sealing member, a reliable vacuum can be maintained even if the sealing member is not a spherical sealing member, and the height of the projection from the container surface can be reduced. A small sealed shape was obtained. (7) By using a small plate having a ring-shaped projection as the sealing member, it is possible to achieve a reliable vacuum maintenance even if the sealing member is not a spherical sealing member and to obtain a sealing shape with a small projection height from the container surface. Was. (8) Since the sealing member is submerged in the dredging portion provided in the sealing portion, the number of protrusions after sealing can be reduced or eliminated.

【0037】(9)封口部材の材質をステンレス鋼とす
ることにより、容器側材質との溶着性に優れ、また磁力
による保持の可能性もある封止方法が得られた。 (10)溶接前の封口部材を磁力によって保持するよう
にしたので、排気前の封止装置のセッティングが容易に
なり、能率的な真空封止方法を提供することができた。
(9) By using stainless steel as the material of the sealing member, a sealing method which is excellent in welding property to the material on the container side and has a possibility of being held by magnetic force is obtained. (10) Since the sealing member before welding is held by magnetic force, setting of the sealing device before exhaustion is facilitated, and an efficient vacuum sealing method can be provided.

【0038】(11)本発明の方法は、最終到達真空度
の程度、製造工程全体の円滑さを主な理由として、電子
部品が機械的振動子である場合に適用すると極めて総合
的な効果が高い。
(11) The method of the present invention has a very comprehensive effect when applied to a case where the electronic component is a mechanical vibrator, mainly because of the degree of the ultimate vacuum and the smoothness of the entire manufacturing process. high.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態の一例に用いる装置の要部
断面図である。
FIG. 1 is a sectional view of a main part of an apparatus used in an example of an embodiment of the present invention.

【図2】本発明の実施の形態において封口部材として金
属球を用いた封止工程を示す要部断面図で、(a)は封
止前、(b)は封止後の状態である。
FIGS. 2A and 2B are cross-sectional views of a main part showing a sealing step using a metal ball as a sealing member in the embodiment of the present invention, wherein FIG. 2A shows a state before sealing and FIG.

【図3】(a)、(b)、(c)は本発明の他の実施の
形態においてそれぞれ異なる形状の封口部材と、容器お
よび溶接電極との関係を示した要部断面図である。
FIGS. 3 (a), (b), and (c) are cross-sectional views of essential parts showing the relationship between a sealing member having a different shape, a container, and a welding electrode in another embodiment of the present invention.

【図4】本発明にも適用しうる従来技術であるシーム溶
接に用いる装置の要部断面図である。
FIG. 4 is a sectional view of a main part of an apparatus used for seam welding, which is a conventional technique applicable to the present invention.

【図5】(a)、(b)はそれぞれ本発明の更に他の実
施の形態における封口部分の溶接直前の状態を示した要
部断面図である。
FIGS. 5 (a) and 5 (b) are cross-sectional views of essential parts showing a state immediately before welding of a sealing portion in still another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 容器 1a 基台 1b 気密端子 1c 蓋 1d 小孔 1e 浚い部 2 電子部品 3 封口部材 3a 金属球 4 溶接電極 4a 小孔 6 磁石 7 台 7a プランジャー 7b コイルバネ 7c バネ受板 7d 直動ベアリング 7e ストッパーピン 7f カム板 7g スリット 8 操作部材 9 圧接方向 10 溶接電源 11 溶接電源 12a ローラ電極A 12b ローラ電極B 13 セラミックス台 14 治具テーブル DESCRIPTION OF SYMBOLS 1 Container 1a Base 1b Airtight terminal 1c Lid 1d Small hole 1e Dredging part 2 Electronic component 3 Sealing member 3a Metal ball 4 Welding electrode 4a Small hole 6 Magnet 7 7a Plunger 7b Coil spring 7c Spring receiving plate 7d Linear motion bearing 7e Stopper Pin 7f Cam plate 7g Slit 8 Operating member 9 Pressure contact direction 10 Welding power supply 11 Welding power supply 12a Roller electrode A 12b Roller electrode B 13 Ceramic table 14 Jig table

Claims (11)

【特許請求の範囲】[Claims] 【請求項1】 箱型の容器の部品である、気密絶縁端子
付きの金属の基台と蓋とを準備し、それらの一方に前記
容器の内外に貫通する小孔を設ける工程と、前記基台上
に真空中で動作させるべき電子部品を取り付けかつ前記
気密絶縁端子と接続する工程と、大気中またはガス中で
前記基台の周縁部と前記蓋の周縁部とを気密に接合する
ことによって前記電子部品が内装された前記箱型の容器
を完成する工程と、真空槽の中で前記小孔より内部の気
体を排気する工程と、同じ真空槽の中で前記小孔の外端
開口部に前記小孔を塞ぐ封口部材を当接させ前記小孔の
外側開口部とを抵抗溶接する工程とを含むことを特徴と
する電子部品の真空容器の封止方法。
1. A step of preparing a metal base with a hermetically insulated terminal and a lid, which are parts of a box-shaped container, and providing a small hole penetrating inside and outside of the container on one of them. Attaching an electronic component to be operated in vacuum on the base and connecting to the hermetic insulated terminal, and hermetically joining the peripheral part of the base and the peripheral part of the lid in air or gas. A step of completing the box-shaped container in which the electronic component is mounted, a step of exhausting gas inside the small hole in a vacuum chamber, and an outer end opening of the small hole in the same vacuum chamber. Contacting a sealing member for closing the small hole and resistance welding the outer opening of the small hole to the small hole.
【請求項2】 前記大気中またはガス中で基台の周縁部
と前記蓋の周縁部とを気密に接合する工程にはシーム溶
接技術を用いたことを特徴とする請求項1の電子部品の
真空容器の封止方法。
2. The electronic component according to claim 1, wherein the step of hermetically joining the peripheral portion of the base and the peripheral portion of the lid in the atmosphere or gas is performed using a seam welding technique. How to seal a vacuum container.
【請求項3】 前記抵抗溶接の工程において、前記封口
部材の少なくとも一部の溶融の程度および変形の程度
が、溶接の相手である前記基台あるいは蓋の溶融の程度
および変形の程度よりも大であるような溶接条件(封口
部材の材質・形状、加圧力、電流、溶接電極の材質・形
状)を与えたことを特徴とする請求項1あるいは2の電
子部品の真空容器の封止方法。
3. In the resistance welding step, the degree of melting and the degree of deformation of at least a part of the sealing member are larger than the degree of melting and the degree of deformation of the base or lid to be welded. 3. The method for sealing a vacuum container of an electronic component according to claim 1, wherein welding conditions (material and shape of sealing member, pressing force, current, material and shape of welding electrode) are given.
【請求項4】 前記封口部材は前記小孔の内径よりも大
きな直径を持つ金属球であり、該金属球が主に溶融変形
しつつ溶接の相手である前記基台あるいは蓋に押し込ま
れる結果、該基台あるいは蓋の表面よりの最終突出高さ
が、前記金属球の元の半径程度以下となることを特徴と
する請求項1ないし3のいずれかの電子部品の真空容器
の封止方法。
4. The sealing member is a metal sphere having a diameter larger than the inner diameter of the small hole, and the metal sphere is mainly melted and deformed and pushed into the base or lid to be welded. 4. The method according to claim 1, wherein a final projecting height from a surface of the base or the lid is equal to or less than an original radius of the metal sphere.
【請求項5】 前記金属球の素材の直径は好ましくは前
記小孔の内径の1.3倍ないし2倍であることを特徴と
する請求項4の電子部品の真空容器の封止方法。
5. The method according to claim 4, wherein a diameter of the material of the metal sphere is preferably 1.3 to 2 times an inner diameter of the small hole.
【請求項6】 前記封口部材は半球状または円錐状の突
出部を有する小板であり、前記溶接工程において、前記
突出部が前記小孔に挿入されることを特徴とする請求項
1ないし3のいずれかの電子部品の真空容器の封止方
法。
6. The sealing member according to claim 1, wherein the sealing member is a small plate having a hemispherical or conical projection, and the projection is inserted into the small hole in the welding step. The method for sealing a vacuum container of any one of the electronic components.
【請求項7】 前記封口部材はリング状のプロジェクシ
ョンを有する小板であり、前記溶接工程において、前記
リング状のプロジェクションが前記小孔の周囲に当接す
ることを特徴とする請求項1ないし3のいずれかの電子
部品の真空容器の封止方法。
7. The sealing member according to claim 1, wherein the sealing member is a small plate having a ring-shaped projection, and in the welding step, the ring-shaped projection abuts around the small hole. A method for sealing a vacuum container of any of the electronic components.
【請求項8】 前記小孔の外端開口部に浚い部を設け、
前記封口部材の一部または全部を前記浚い部に沈めたこ
とを特徴とする請求項1ないし7のいずれかの電子部品
の真空容器の封止方法。
8. A dredging portion is provided at an outer end opening of the small hole,
8. The method according to claim 1, wherein a part or all of the sealing member is submerged in the dredging part.
【請求項9】 前記封口部材の材質はステンレス鋼であ
ることを特徴とする請求項1ないし8のいずれかの電子
部品の真空容器の封止方法。
9. The method for sealing a vacuum vessel of an electronic component according to claim 1, wherein the material of the sealing member is stainless steel.
【請求項10】 前記容器の排気を行っている期間、前
記封口部材を磁力によって保持することを特徴とする請
求項1ないし9のいずれかの電子部品の真空容器の封止
方法。
10. The method for sealing a vacuum container of an electronic component according to claim 1, wherein the sealing member is held by a magnetic force while the container is being evacuated.
【請求項11】 前記電子部品は機械的振動子であるこ
とを特徴とする請求項1ないし10のいずれかの電子部
品の真空容器の封止方法。
11. The method according to claim 1, wherein the electronic component is a mechanical vibrator.
JP2000266202A 2000-08-01 2000-08-01 Sealing method of vacuum container for electronic parts Expired - Fee Related JP4517376B2 (en)

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Application Number Priority Date Filing Date Title
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* Cited by examiner, † Cited by third party
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US6960870B2 (en) 1997-07-29 2005-11-01 Seiko Epson Corporation Piezo-electric resonator and manufacturing method thereof
US6976295B2 (en) 1997-07-29 2005-12-20 Seiko Epson Corporation Method of manufacturing a piezoelectric device
JP2013072424A (en) * 2011-09-29 2013-04-22 Mitsubishi Electric Corp Compressor and method for fabricating the compressor
JP6223611B1 (en) * 2017-02-10 2017-11-01 日新製鋼株式会社 Vacuum insulating panel manufacturing method and vacuum insulating panel
WO2017217232A1 (en) * 2016-06-13 2017-12-21 日新製鋼株式会社 Vacuum insulation panel manufacturing device
WO2017217233A1 (en) * 2016-06-13 2017-12-21 日新製鋼株式会社 Vacuum insulation panel manufacturing method, and vacuum insulation panel
JP2017223252A (en) * 2016-06-13 2017-12-21 日新製鋼株式会社 Vacuum heat insulation panel manufacturing method and vacuum heat insulation panel
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0964221A (en) * 1995-08-29 1997-03-07 Murata Mfg Co Ltd Method for sealing package airtightly

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US6960870B2 (en) 1997-07-29 2005-11-01 Seiko Epson Corporation Piezo-electric resonator and manufacturing method thereof
US6976295B2 (en) 1997-07-29 2005-12-20 Seiko Epson Corporation Method of manufacturing a piezoelectric device
JP2013072424A (en) * 2011-09-29 2013-04-22 Mitsubishi Electric Corp Compressor and method for fabricating the compressor
CN109312889A (en) * 2016-06-13 2019-02-05 日新制钢株式会社 The manufacturing method and vacuum insulating panel of vacuum insulating panel
WO2017217232A1 (en) * 2016-06-13 2017-12-21 日新製鋼株式会社 Vacuum insulation panel manufacturing device
WO2017217233A1 (en) * 2016-06-13 2017-12-21 日新製鋼株式会社 Vacuum insulation panel manufacturing method, and vacuum insulation panel
JP2017223251A (en) * 2016-06-13 2017-12-21 日新製鋼株式会社 Vacuum insulation panel manufacturing device
JP2017223252A (en) * 2016-06-13 2017-12-21 日新製鋼株式会社 Vacuum heat insulation panel manufacturing method and vacuum heat insulation panel
US10632564B2 (en) 2016-06-13 2020-04-28 Nippon Steel Nisshin Co., Ltd. Vacuum insulation panel manufacturing device
US10639743B2 (en) 2016-06-13 2020-05-05 Nippon Steel Nisshin Co., Ltd. Vacuum insulation panel manufacturing method, and vacuum insulation panel
US10710196B2 (en) 2016-06-13 2020-07-14 Nisshin Steel Co., Ltd. Vacuum insulation panel manufacturing method, and vacuum insulation panel
JP2018128129A (en) * 2017-02-10 2018-08-16 日新製鋼株式会社 Manufacturing method of vacuum heat insulation panel, and vacuum heat insulation panel
JP6223611B1 (en) * 2017-02-10 2017-11-01 日新製鋼株式会社 Vacuum insulating panel manufacturing method and vacuum insulating panel
KR102200124B1 (en) * 2019-11-15 2021-01-08 주식회사 서연이화 Position fixing apparatus capable of locking of both direction

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