JP2002045770A - Spin treater for platy work and method for spin treatment - Google Patents

Spin treater for platy work and method for spin treatment

Info

Publication number
JP2002045770A
JP2002045770A JP2000237844A JP2000237844A JP2002045770A JP 2002045770 A JP2002045770 A JP 2002045770A JP 2000237844 A JP2000237844 A JP 2000237844A JP 2000237844 A JP2000237844 A JP 2000237844A JP 2002045770 A JP2002045770 A JP 2002045770A
Authority
JP
Japan
Prior art keywords
plate
workpiece
chuck
suction chuck
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000237844A
Other languages
Japanese (ja)
Other versions
JP3886326B2 (en
Inventor
Futoshi Shimai
太 島井
Hirotsugu Kumazawa
博嗣 熊澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2000237844A priority Critical patent/JP3886326B2/en
Priority to TW90126786A priority patent/TWI237290B/en
Publication of JP2002045770A publication Critical patent/JP2002045770A/en
Application granted granted Critical
Publication of JP3886326B2 publication Critical patent/JP3886326B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a spin treater wherein the planarity of a large work is kept when a liquid such as a developing agent is fed onto the surface of the work. SOLUTION: A mechanism 16 that supports a work W from the lower side is provided in the position coinciding with each of the four corners of the work W. The mechanism 16 consists of a vertical cylinder 17 secured on a base 10 and a support part 18 that is lifted or lowered by the actuation of the cylinder 17. The rod of the cylinder 17 is inserted into the holes formed on the lower plate 5b and the upper plate 5a so as for its upper end to go beyond the upper plate 5a, and the support part 18 is fixed to the upper end of the rod.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はガラス基板や半導体
ウェーハ等の板状被処理物に対し、現像液、洗浄液、S
OG溶液、レジスト溶液等を塗布する回転処理装置とこ
の処理装置を用いた処理方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a developing solution, a cleaning solution,
The present invention relates to a rotation processing apparatus for applying an OG solution, a resist solution, and the like, and a processing method using the processing apparatus.

【0002】[0002]

【従来の技術】ガラス基板や半導体ウェーハ等の板状被
処理物の表面に塗布液や現像液等の液体を供給する装置
として、特開平7−284716号公報、特開平8−2
2952号公報或いは特開平11−168051号公報
に開示される装置が知られている。
2. Description of the Related Art Japanese Patent Application Laid-Open Nos. 7-284716 and 8-2 disclose devices for supplying a liquid such as a coating solution or a developing solution to the surface of a plate-like workpiece such as a glass substrate or a semiconductor wafer.
An apparatus disclosed in Japanese Patent Publication No. 2952 or Japanese Patent Application Laid-Open No. H11-168051 is known.

【0003】これら従来装置は、カップ内に配置した吸
引チャック上に板状被処理物を載置し、次いで吸引チャ
ックで板状被処理物を保持するとともに板状被処理物の
中心部に塗布液や現像液等の液体を供給し、この後引き
続いて吸引チャックを回転せしめることで板状被処理物
も一体的に回転させ、この回転によって生じる遠心力に
て供給した液体を板状被処理物の表面全体に均一に行き
渡らすようにしている。
[0003] In these conventional apparatuses, a plate-like workpiece is placed on a suction chuck arranged in a cup, and then the plate-like workpiece is held by the suction chuck and applied to the center of the plate-like workpiece. A liquid such as a liquid or a developer is supplied, and then the suction chuck is rotated to rotate the plate-like workpiece integrally, and the liquid supplied by the centrifugal force generated by this rotation is used to process the plate-like workpiece. They are spread evenly over the entire surface of the object.

【0004】ところで、液晶表示装置用のガラス基板は
1枚のガラス基板にホトレジストを塗布・乾燥し、更に
露光、現像等の処理を施し、最終的に1枚のガラス基板
から所定寸法のガラス基板を複数切り出している。そし
て、生産の効率化及びコストダウンを図るため、ガラス
基板の縦横の寸法は大きくなる傾向にある。しかしなが
らガラス基板の厚みは0.7mm程度で変化しない。そ
の結果、矩形状ガラス基板にあっては長辺方向において
吸引チャックからの食み出しが大きくなり、自重によっ
て撓んでしまう。この撓み量が1mmを超えると液盛り
に必要な液量が増し、安定した液盛りもできなくなる。
Meanwhile, a glass substrate for a liquid crystal display device is coated with a photoresist on a single glass substrate, dried, subjected to exposure, development, and the like. Is cut out multiple times. And, in order to increase production efficiency and reduce costs, the vertical and horizontal dimensions of the glass substrate tend to increase. However, the thickness of the glass substrate does not change at about 0.7 mm. As a result, the rectangular glass substrate is protruded from the suction chuck in the long side direction, and is bent by its own weight. If the amount of deflection exceeds 1 mm, the amount of liquid required for the liquid level increases, and stable liquid level cannot be achieved.

【0005】[0005]

【発明が解決しようとする課題】上記した板状被処理物
の撓みを解消する手段として、吸引チャックの径を大き
くする手段、或いはホルダ等によって板状被処理物の外
周を保持する手段が考えられる。
As means for solving the above-mentioned bending of the plate-like workpiece, means for increasing the diameter of the suction chuck or means for holding the outer periphery of the plate-like workpiece by a holder or the like are considered. Can be

【0006】しかしながら、吸引チャックの径を大きく
した場合には板状被処理物と吸引チャックとが接近し、
特に板状被処理物が矩形状をなす場合には、短辺方向に
おいて板状被処理物の端部と吸引チャックとが近づき過
ぎ、板状被処理物の裏面に廻り込んだ液体が吸引チャッ
クまで到達し、乾燥後に飛散して板状被処理物の表面に
付着する虞れがある。また、ホルダ等によって板状被処
理物の外周を保持する手段にあっては、ホルダ等が乱流
発生の原因になってしまう。
However, when the diameter of the suction chuck is increased, the plate-like workpiece and the suction chuck approach each other,
In particular, when the plate-like workpiece is rectangular, the end of the plate-like workpiece and the suction chuck are too close to each other in the short side direction, and the liquid spilled on the back surface of the plate-like workpiece is the suction chuck. , And may be scattered after drying and adhere to the surface of the plate-like workpiece. Further, in the means for holding the outer periphery of the plate-shaped workpiece by a holder or the like, the holder or the like causes turbulence.

【0007】[0007]

【課題を解決するための手段】上記課題を解決すべく本
発明に係る回転処理装置は、カップ内に吸引チャックを
配置し、この吸引チャックで板状被処理物を保持して回
転せしめることで板状被処理物表面に供給した液体を板
状被処理物の表面全体に行き渡らすようにした回転処理
装置において、前記チャックよりも外側位置にチャック
から食み出した板状被処理物の端部下面を非回転時に下
から支持して板状被処理物の水平度を維持する支持機構
を設けた。
In order to solve the above-mentioned problems, a rotary processing apparatus according to the present invention comprises a suction chuck disposed in a cup, and a plate-shaped workpiece to be held and rotated by the suction chuck. In a rotary processing apparatus configured to spread the liquid supplied to the surface of the plate-shaped workpiece over the entire surface of the plate-shaped workpiece, an end of the plate-shaped workpiece that protrudes from the chuck to a position outside the chuck. A support mechanism is provided to support the lower surface of the plate from below when not rotating and maintain the horizontality of the plate-like workpiece.

【0008】上記の回転処理装置を用いて板状被処理物
表面に液体を供給するには、先ずカップ内に配置される
吸引チャック上に板状被処理物を載置し、次いで吸引チ
ャックを下降せしめるか吸引チャックの外側に配置した
支持機構の受け部を上昇せしめて吸引チャックから食み
出た板状被処理物の端部下面を下から支持し、これによ
り板状被処理物の水平度を維持した状態で板状被処理物
の表面に液体を供給し、次いで吸引チャックを上昇せし
めるか支持機構の受け部を下降せしめ、板状被処理物の
下面から支持機構の受け部を離した状態で吸引チャック
とともに板状被処理物を一体回転する。こうすること
で、板状被処理物表面に供給した液体を板状被処理物の
表面全体に均一に行き渡らすことができる。
In order to supply a liquid to the surface of a plate-like workpiece using the above-described rotary processing apparatus, first, the plate-like workpiece is placed on a suction chuck arranged in a cup, and then the suction chuck is mounted. By lowering or raising the receiving portion of the support mechanism disposed outside the suction chuck, the lower surface of the end of the plate-shaped workpiece that protrudes from the suction chuck is supported from below, thereby allowing the plate-shaped workpiece to be leveled. While maintaining the degree, the liquid is supplied to the surface of the plate-like workpiece, and then the suction chuck is raised or the receiving part of the support mechanism is lowered, and the receiving part of the supporting mechanism is separated from the lower surface of the plate-like workpiece. In this state, the plate-like workpiece is rotated together with the suction chuck. By doing so, the liquid supplied to the surface of the plate-like workpiece can be evenly distributed over the entire surface of the plate-like workpiece.

【0009】尚、板状被処理物が矩形状ガラス基板の場
合には、前記支持機構は矩形状ガラス基板の四隅を下方
から支持する位置に配置することが望ましい。
When the plate-like workpiece is a rectangular glass substrate, it is desirable that the support mechanism is arranged at a position for supporting the four corners of the rectangular glass substrate from below.

【0010】[0010]

【発明の実施の形態】以下に本発明の実施の形態を添付
図面に基づいて説明する。ここで、図1は本発明に係る
回転処理装置の縦断面図、図2は同回転処理装置の平面
図、図3は吸引チャックが上昇した状態の回転処理装置
の縦断面図である。
Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is a vertical cross-sectional view of the rotary processing apparatus according to the present invention, FIG. 2 is a plan view of the rotary processing apparatus, and FIG. 3 is a vertical cross-sectional view of the rotary processing apparatus with the suction chuck raised.

【0011】回転処理装置1は、平面視で矩形状をなす
ケース2内にリング状カップ3を配置している。このカ
ップ3は外側壁4と底部5から構成され、外側壁4は上
方に向かって徐々にその径が小さくなり、底部5は上板
5aと下板5bからなる二重構造となっている。これら
上板5aと下板5bは平面視でスピンナー軸6を囲むド
ーナッツ状をなし、上板5aの表面にはフッ素樹脂コー
ティングを施し、表面に落下した現像液がスムーズに流
れるようにし、また、上板5a及び下板5bにて囲まれ
る空間はスピンナー軸6に向かって開口7が形成された
トラップ空間Sとされている。
The rotation processing apparatus 1 has a ring-shaped cup 3 disposed in a case 2 having a rectangular shape in plan view. The cup 3 is composed of an outer wall 4 and a bottom part 5, and the diameter of the outer wall 4 gradually decreases upward, and the bottom part 5 has a double structure composed of an upper plate 5 a and a lower plate 5 b. The upper plate 5a and the lower plate 5b have a donut shape surrounding the spinner shaft 6 in a plan view, and the surface of the upper plate 5a is coated with a fluororesin so that the developer dropped on the surface flows smoothly. The space surrounded by the upper plate 5a and the lower plate 5b is a trap space S in which an opening 7 is formed toward the spinner shaft 6.

【0012】また、下板5bには1個以上の排気口8
を、上板5aと下板5bが下方に傾斜し合流するところ
には複数個の排液排出口9を設けている。排気口8はト
ラップ空間S内を減圧するためのものであり、排気口8
の上端部は下板5bより3mm以上高くなっている。そ
の結果、トラップ空間S内に入った液体は排気口8の中
には入らずに排液排出口9より排出されることになり、
排気系の汚染が防止できる。
The lower plate 5b has at least one exhaust port 8.
A plurality of drain outlets 9 are provided where the upper plate 5a and the lower plate 5b are inclined downward and join. The exhaust port 8 is for reducing the pressure in the trap space S.
Is 3 mm or more higher than the lower plate 5b. As a result, the liquid that has entered the trap space S is discharged from the drain discharge port 9 without entering the exhaust port 8,
Exhaust system contamination can be prevented.

【0013】また、トラップ空間Sは全体形状が径方向
外側に向かって下方に傾斜しているため、一旦トラップ
空間S内に回収された液体が軸受けの部分に廻り込むこ
とがなく、スピンナー軸6まで廻り込んだ液体を塗布空
間に戻すことなくスムーズに排出することができる。た
だし、本発明に係る回転処理装置としては、必ずしも底
部を二重構造にする必要はない。
Further, since the trap space S has an overall shape inclined downward toward the outside in the radial direction, the liquid once recovered in the trap space S does not flow into the bearing portion, and the spinner shaft 6 The liquid that has flowed up to can be discharged smoothly without returning to the application space. However, the rotation processing apparatus according to the present invention does not necessarily need to have a double bottom structure.

【0014】前記スピンナー軸6はベース10に取り付
けたモータ11にて回転せしめられるとともにシリンダ
ユニット12の作動で昇降動可能とされ、更にスピンナ
ー軸6の上端には基板Wを吸着保持するチャック13が
取り付けられている。
The spinner shaft 6 is rotated by a motor 11 mounted on a base 10 and can be moved up and down by the operation of a cylinder unit 12. Further, a chuck 13 for sucking and holding the substrate W is provided on the upper end of the spinner shaft 6. Installed.

【0015】また、前記上板5a及び下板5bは支持部
材14を介して前記ベース10に取り付けられている。
支持部材14は下部支持片14a、中間支持片14b及
び上部支持片14cからなり、下部支持片14a上に下
板5bをボルト等で固着し、中間支持片14b上に上板
5aをボルト等で固着し、上部支持片14cに小寸法の
基板Wに現像処理を施す際に使用する内側整流リング1
5を位置調整可能に取り付けている。
The upper plate 5a and the lower plate 5b are attached to the base 10 via a support member 14.
The support member 14 includes a lower support piece 14a, an intermediate support piece 14b, and an upper support piece 14c. The lower plate 5b is fixed on the lower support piece 14a with a bolt or the like, and the upper plate 5a is mounted on the intermediate support piece 14b with a bolt or the like. An inner rectifying ring 1 that is fixed and used when developing a small-sized substrate W on the upper support piece 14c.
5 is attached so that position adjustment is possible.

【0016】更に、本発明に係る回転処理装置は基板W
の下面を下から支持する支持機構16を設けている。支
持機構16を設ける位置は基板Wが矩形状をなす場合に
は、基板Wの四隅に対応して設ける。
Further, the rotation processing apparatus according to the present invention provides the substrate W
A support mechanism 16 for supporting the lower surface of the device from below is provided. The support mechanism 16 is provided at a position corresponding to the four corners of the substrate W when the substrate W has a rectangular shape.

【0017】前記支持機構16はベース10上に固定さ
れる上下方向のシリンダ17と、このシリンダ17の作
動によって昇降動する受け部18とからなり、シリンダ
17のロッドは下板5b及び上板5aに形成した孔を介
してその上端は上板5aよりも上方に臨み、このロッド
上端に受け部18が固着されている。尚、下板5bに形
成した孔から液体が排気系に入り込むのを防止するた
め、孔の周囲には壁19を設けている。
The support mechanism 16 comprises a vertical cylinder 17 fixed on the base 10 and a receiving portion 18 which moves up and down by the operation of the cylinder 17, and the rod of the cylinder 17 comprises a lower plate 5b and an upper plate 5a. The upper end faces upward from the upper plate 5a through the hole formed in the rod, and the receiving portion 18 is fixed to the upper end of the rod. Note that a wall 19 is provided around the hole to prevent liquid from entering the exhaust system from the hole formed in the lower plate 5b.

【0018】尚、図示例にあっては支持機構16をベー
ス10上に設けた例を示したが、上板5a上に設ける
等、設ける箇所は任意であり、また必ずしも支持機構1
6をシリンダ17と受け部18で構成しなくてもよい。
In the illustrated example, the support mechanism 16 is provided on the base 10. However, the support mechanism 16 may be provided on the upper plate 5 a, for example.
6 may not be constituted by the cylinder 17 and the receiving portion 18.

【0019】以上において、露光処理が終了した基板W
に現像処理を施す場合を例にとって説明すると、図3に
示すようにシリンダユニット12の作動でスピンナー軸
6とともにチャック13を上昇せしめ、基板Wを側方か
ら搬送してきてチャック13上に載置する。
In the above, the substrate W after the exposure processing has been completed.
For example, as shown in FIG. 3, the chuck 13 is raised together with the spinner shaft 6 by the operation of the cylinder unit 12, and the substrate W is transported from the side and placed on the chuck 13 as shown in FIG. .

【0020】この後、シリンダユニット12を逆方向に
作動させて、チャック13を下降せしめる。そして、チ
ャック13が最も下降する時点で、支持機構16の受け
部18がチャック13上面と面一になるように受け部1
8がシリンダ17の作動で上昇するように設定している
ため、チャック13が最下位となった際に、支持機構1
6の受け部18にて基板Wの四隅下面が支持され、基板
Wは水平状態で維持される。
Thereafter, the cylinder unit 12 is operated in the reverse direction to lower the chuck 13. When the chuck 13 descends most, the receiving portion 1 of the support mechanism 16 is flush with the upper surface of the chuck 13.
8 is set to rise by the operation of the cylinder 17, so that when the chuck 13 is at the lowest position, the support mechanism 1
The lower surfaces of the four corners of the substrate W are supported by the receiving portions 18 of 6, and the substrate W is maintained in a horizontal state.

【0021】この状態で、図示しないノズルから基板W
表面に現像液を供給し液盛りする。そして、回転処理直
前にシリンダ17を逆方向に作動させ、受け部18を下
げ、モータ11を駆動して基板Wを回転せしめ、基板W
上に盛られた現像液を除去する。このときの回転速度は
5〜200rpmとする。また、回転時間は0.1〜10
秒とする。
In this state, the substrate W
A developer is supplied to the surface and the surface is filled. Immediately before the rotation processing, the cylinder 17 is operated in the reverse direction, the receiving portion 18 is lowered, and the motor 11 is driven to rotate the substrate W.
The developer on top is removed. The rotation speed at this time is 5 to 200 rpm. The rotation time is 0.1 to 10
Seconds.

【0022】この回転速度は、現像液を乾燥させる際の
回転速度に比べて極めて低速であり、このように低速で
回転せしめることで、基板Wから遠心力により除去され
る現像液の速度を遅くし、基板Wから飛散する現像液の
うちの多くの割合の現像液がカップ底部5を構成する上
板5a上に落下し、上板5aの傾斜に沿って径方向外側
に向かって流れ、排液の排出口9を介して図示しない現
像液回収ポケット内に流れ込み、ポンプの駆動でタンク
に回収され、再利用に供される。
This rotation speed is extremely low as compared with the rotation speed at the time of drying the developing solution. By rotating at such a low speed, the speed of the developing solution removed from the substrate W by centrifugal force is reduced. Then, a large proportion of the developer scattered from the substrate W falls on the upper plate 5a constituting the cup bottom 5, flows radially outward along the inclination of the upper plate 5a, and is discharged. The liquid flows into a developer collecting pocket (not shown) through the liquid discharge port 9, is collected in a tank by driving a pump, and is reused.

【0023】[0023]

【発明の効果】以上に説明したように本発明によれば、
吸引チャックで板状被処理物を保持して回転せしめるよ
うにした回転処理装置において、前記チャックよりも外
側位置にチャックから食み出した板状被処理物の端部下
面を非回転時に下から支持して板状被処理物の水平度を
維持する支持機構を設けたので、基板(板状被処理物)
の水平度を維持した状態で板状被処理物の表面に液体を
供給することができ、液盛りに必要な液量が少なくて済
み、且つ均一な膜厚が得られる。
According to the present invention as described above,
In a rotary processing apparatus configured to hold and rotate a plate-shaped workpiece with a suction chuck, the lower surface of an end portion of the plate-shaped workpiece that protrudes from the chuck to a position outside the chuck from below when not rotating. Since a support mechanism is provided to support and maintain the horizontality of the plate-like workpiece, the substrate (plate-like workpiece)
The liquid can be supplied to the surface of the plate-like workpiece while maintaining the horizontality of, and the amount of liquid required for the liquid level can be reduced, and a uniform film thickness can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る回転処理装置の縦断面図FIG. 1 is a longitudinal sectional view of a rotation processing apparatus according to the present invention.

【図2】同回転処理装置の平面図FIG. 2 is a plan view of the rotation processing apparatus.

【図3】吸引チャックが上昇した状態の回転処理装置の
縦断面図
FIG. 3 is a longitudinal sectional view of the rotation processing apparatus in a state where a suction chuck is raised.

【符号の説明】[Explanation of symbols]

1…回転処理装置、2…ケース、3…リング状カップ、
4…外側壁、5…底部、5a…底部を構成する上板、5
b…底部を構成する下板、6…スピンナー軸、7…開
口、8…排気口、9…排液排出口、10…ベース、11
…モータ、12…シリンダユニット、13…吸引チャッ
ク、14…支持部材、14a…下部支持片、14b…中
間支持片、14c…上部支持片、15…内側整流リン
グ、16…支持機構、17…シリンダ、18…受け部、
19…壁、S…トラップ空間、W…基板(板状被処理
物)。
DESCRIPTION OF SYMBOLS 1 ... Rotation processing apparatus, 2 ... Case, 3 ... Ring-shaped cup,
4 ... Outer wall, 5 ... Bottom part, 5a ... Top plate constituting bottom part, 5
b: lower plate constituting the bottom, 6: spinner shaft, 7: opening, 8: exhaust port, 9: drainage port, 10: base, 11
... Motor, 12 ... Cylinder unit, 13 ... Suction chuck, 14 ... Support member, 14a ... Lower support piece, 14b ... Intermediate support piece, 14c ... Upper support piece, 15 ... Inner rectifying ring, 16 ... Support mechanism, 17 ... Cylinder , 18 ... receiving part,
19: wall, S: trap space, W: substrate (plate-shaped workpiece).

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01L 21/68 H01L 21/30 564C 569C Fターム(参考) 4D075 AC64 AC79 4F042 EB08 EB09 5F031 CA02 CA05 HA13 PA14 PA18 5F046 JA16 LA08 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) H01L 21/68 H01L 21/30 564C 569C F term (Reference) 4D075 AC64 AC79 4F042 EB08 EB09 5F031 CA02 CA05 HA13 PA14 PA18 5F046 JA16 LA08

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 カップ内に吸引チャックを配置し、この
吸引チャックで板状被処理物を保持して回転せしめるこ
とで板状被処理物表面に供給した液体を板状被処理物の
表面全体に行き渡らすようにした回転処理装置におい
て、前記チャックよりも外側位置にチャックから食み出
した板状被処理物の端部下面を非回転時に下から支持し
て板状被処理物の水平度を維持する支持機構を設けたこ
とを特徴とする板状被処理物の回転処理装置。
A suction chuck is disposed in a cup, and the plate-like workpiece is held and rotated by the suction chuck so that liquid supplied to the surface of the plate-like workpiece is supplied to the entire surface of the plate-like workpiece. In the rotary processing apparatus, the lower surface of the end of the plate-shaped workpiece protruding from the chuck at a position outside the chuck is supported from below when not rotating, and the horizontality of the plate-shaped workpiece is adjusted. A rotation mechanism for a plate-like workpiece, provided with a support mechanism for maintaining the pressure.
【請求項2】 請求項1に記載の板状被処理物の回転処
理装置において、前記板状被処理物は矩形状ガラス基板
であり、前記支持機構を前記矩形状ガラス基板の四隅を
下方から支持する位置に配置したことを特徴とする板状
被処理物の回転処理装置。
2. The apparatus according to claim 1, wherein the plate-shaped workpiece is a rectangular glass substrate, and the support mechanism is configured to move four corners of the rectangular glass substrate from below. A rotation processing apparatus for a plate-like workpiece, which is disposed at a position where the plate-like workpiece is supported.
【請求項3】 カップ内に配置される吸引チャック上に
板状被処理物を載置せしめ、次いで吸引チャックを下降
せしめるか吸引チャックの外側に配置した支持機構の受
け部を上昇せしめて吸引チャックから食み出た板状被処
理物の端部下面を下から支持し、これにより板状被処理
物の水平度を維持した状態で板状被処理物の表面に液体
を供給し、次いで吸引チャックを上昇せしめるか支持機
構の受け部を下降せしめ、板状被処理物の下面から支持
機構の受け部を離した状態で吸引チャックとともに板状
被処理物を回転せしめ、板状被処理物表面に供給した液
体を板状被処理物の表面全体に行き渡らすことを特徴と
する板状被処理物の回転処理方法。
3. A suction chuck, wherein a plate-like workpiece is placed on a suction chuck disposed in a cup, and then the suction chuck is lowered or a receiving portion of a support mechanism disposed outside the suction chuck is raised. The lower surface of the end of the plate-like workpiece that has protruded from the bottom is supported from below, thereby supplying liquid to the surface of the plate-like workpiece while maintaining the levelness of the plate-like workpiece, and then suctioning the liquid. Raise the chuck or lower the receiving part of the supporting mechanism, rotate the plate-like workpiece together with the suction chuck with the receiving part of the supporting mechanism separated from the lower surface of the plate-like workpiece, and rotate the plate-like workpiece surface. Wherein the liquid supplied to the plate is spread over the entire surface of the plate-like workpiece.
JP2000237844A 2000-08-07 2000-08-07 Rotation processing apparatus and rotation processing method for plate-like workpiece Expired - Fee Related JP3886326B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000237844A JP3886326B2 (en) 2000-08-07 2000-08-07 Rotation processing apparatus and rotation processing method for plate-like workpiece
TW90126786A TWI237290B (en) 2000-08-07 2001-10-29 Spin processor and method for treating the planar work pieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000237844A JP3886326B2 (en) 2000-08-07 2000-08-07 Rotation processing apparatus and rotation processing method for plate-like workpiece

Publications (2)

Publication Number Publication Date
JP2002045770A true JP2002045770A (en) 2002-02-12
JP3886326B2 JP3886326B2 (en) 2007-02-28

Family

ID=18729632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000237844A Expired - Fee Related JP3886326B2 (en) 2000-08-07 2000-08-07 Rotation processing apparatus and rotation processing method for plate-like workpiece

Country Status (2)

Country Link
JP (1) JP3886326B2 (en)
TW (1) TWI237290B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159322A (en) * 2003-10-31 2005-06-16 Nikon Corp Surface plate, stage apparatus, exposure device and exposing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159322A (en) * 2003-10-31 2005-06-16 Nikon Corp Surface plate, stage apparatus, exposure device and exposing method

Also Published As

Publication number Publication date
JP3886326B2 (en) 2007-02-28
TWI237290B (en) 2005-08-01

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