JP2002037676A - Fixture for firing cermic electronics parts - Google Patents

Fixture for firing cermic electronics parts

Info

Publication number
JP2002037676A
JP2002037676A JP2000254664A JP2000254664A JP2002037676A JP 2002037676 A JP2002037676 A JP 2002037676A JP 2000254664 A JP2000254664 A JP 2000254664A JP 2000254664 A JP2000254664 A JP 2000254664A JP 2002037676 A JP2002037676 A JP 2002037676A
Authority
JP
Japan
Prior art keywords
zirconia
firing
layer
base material
silicon carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000254664A
Other languages
Japanese (ja)
Inventor
Koji Hayashi
晃司 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OSAKA YOGYO FIRE BRICK
Yotai Refractories Co Ltd
Original Assignee
OSAKA YOGYO FIRE BRICK
Yotai Refractories Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OSAKA YOGYO FIRE BRICK, Yotai Refractories Co Ltd filed Critical OSAKA YOGYO FIRE BRICK
Priority to JP2000254664A priority Critical patent/JP2002037676A/en
Publication of JP2002037676A publication Critical patent/JP2002037676A/en
Pending legal-status Critical Current

Links

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  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Products (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a fixture for firing a ceramic electronics parts having an improved durability by suppressing a reaction with a body to be fired. SOLUTION: A three layered structure is formed by one body forming. The structure has a base material consists of a refractory raw material of 85 wt.% silicon carbide and its both faces (inside and outside) consist of zirconia (yttoria stabilized zirconia or carcia stabilized zirconia) whose zirconia content is not less than 80 wt.%. The ratio of the thickness of the base material to both faces being 1:1 to 4:1 and the total thickness of which is not less than 5 mm and not more than 30 mm.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【001】[0101]

【産業上の利用分野】本発明は、セラミック電子部品を
焼成する際に使用する治具に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig used for firing ceramic electronic components.

【002】[0092]

【従来の技術】フェライトやセラミックコンデンサー、
サーミスターなどの電子部品を焼成する場合において
は、一般的にムライト質、コージェライト質、アルミナ
質、炭化珪素質等の耐熱衝撃性の匣鉢、棚板、セッター
等の焼成治具が使用されている。しかしフェライト等の
セラミック電子部品は高純度で反応性に富む原料からな
るものが多く、焼成用治具にSiO2を多〈含むものを
使用するとSiO2との間に反応を生じ、透磁率が低下
するといった欠点を生ずる。そこで、従来はこれらの耐
熱衝撃性焼成用治具の上に高純度アルミナ質のセッター
を積載したり、被焼成物と接する面に高純度アルミナ、
マグネシア、ジルコニア等の難反応性物質をコーティン
グする方法がとられており、窯詰時や窯出時の組立てや
分解が容易でフェライトと全く反応しない棚板や割れ、
亀裂、剥離等を防止したジルコニア質コート層を有する
匣鉢、棚板、セッター等が焼成用治具として開示されて
いる。(例えば、特開昭63−217190公報や特開
平3−177383号公報等)
[Prior Art] Ferrite and ceramic capacitors,
When baking electronic components such as thermistors, baking jigs such as heat-shock saggers, shelves, and setters of mullite, cordierite, alumina, silicon carbide, etc. are generally used. ing. However, many ceramic electronic components such as ferrites are made of high-purity and highly reactive raw materials. If a firing jig containing a large amount of SiO2 is used, a reaction occurs with the SiO2 and the magnetic permeability decreases. The following disadvantages occur. Therefore, conventionally, a high-purity alumina setter is mounted on these thermal shock resistant firing jigs, or high-purity alumina is placed on the surface in contact with the object to be fired.
It is a method of coating hard-to-react materials such as magnesia and zirconia.
Saggers, shelves, setters, and the like having a zirconia-based coating layer in which cracking, peeling, and the like are prevented are disclosed as firing jigs. (For example, JP-A-63-217190 and JP-A-3-177383)

【003】[0093]

【発明が解決しようとする課題】しかしながら、匣鉢、
棚板、セッターの表面に難反応性物質のコーティングを
施す場合、一度焼成した匣鉢、棚板、セッターの表面に
刷毛若しくはスプレーガンにより、難反応性物質を塗布
し、再度、乾燥や焼成の処理を行い、塗布した難反応性
物質を匣鉢、棚板、セッターの表面に焼き付けなければ
ならない。この時、ムライト質、コージェライト質、ア
ルミナ質、炭化珪素質等の基材と高純度アルミナ、マグ
ネシア、ジルコニア等の難反応性物質コーティング層と
の熱膨張率の差などから、長期にわたって使用していく
とコートの亀裂、剥離が起こり易くなる。
However, the sagger,
When applying a coating of a hard-to-reactive substance on the surface of a shelf or a setter, apply the hard-to-reactive substance to the surface of the sagger, shelf, or setter once baked with a brush or a spray gun, and then dry and bake again. After treatment, the applied hard-to-react material must be baked on the surface of the sagger, shelf, or setter. At this time, due to the difference in the coefficient of thermal expansion between the base material of mullite, cordierite, alumina, silicon carbide, etc., and the coating layer of a non-reactive material such as high purity alumina, magnesia, zirconia, etc. As the coating proceeds, cracking and peeling of the coat tend to occur.

【004】[0093]

【課題を解決するための手段】本発明は炭化珪素質基材
の両面(表裏)がジルコニア(イットリア安定化ジルコ
ニア又は、カルシア安定化ジルコニア)層から成る三層
を一体成形により成形し、一度に焼成することにより被
焼成物との反応がなく、耐用が大きく向上したセラミッ
ク電子部品焼成用治具である。
SUMMARY OF THE INVENTION According to the present invention, a silicon carbide-based base material is formed by integrally molding three layers each having a zirconia (yttria-stabilized zirconia or calcia-stabilized zirconia) layer on both surfaces (front and back). This is a firing jig for firing ceramic electronic components, which has no reaction with the object to be fired and has a greatly improved durability.

【005】[0056]

【作用】本発明は、炭化珪素として85wt%以上から
なる基材の両面(表裏)がジルコニア(イットリア安定
化ジルコニア又は、カルシア安定化ジルコニア)で構成
され、ジルコニア含有量として80wt%以上の三層構
造を一体成形により形成したセラミック電子部品焼成用
治具である。基材とその両面層(表裏層)の厚みの比は
1:1から4:1でかつ全体の厚みは5mm以上 30
mm以下(表裏層の総厚み:1〜15mm)が良い。ジ
ルコニア層の厚みがこの範囲よりも簿い場合はジルコニ
ア層が、均一な厚みになり難い。その結果ジルコニア質
層に炭化珪素成分が移動して露出してしまい被焼成物を
汚染する。反対にジルコニア層が厚すぎると、炭化珪素
質に比較してジルコニア質の熱膨張率が大きいので、表
面層が剥離しやすくなる。
According to the present invention, there is provided a three-layer structure in which both sides (front and back) of a substrate made of 85% by weight or more of silicon carbide are made of zirconia (yttria-stabilized zirconia or calcia-stabilized zirconia) and have a zirconia content of 80% by weight or more. This is a ceramic electronic component firing jig having a structure formed by integral molding. The ratio of the thickness of the base material to the thickness of the double-sided layers (front and back layers) is from 1: 1 to 4: 1, and the total thickness is 5 mm or more.
mm or less (total thickness of front and back layers: 1 to 15 mm). When the thickness of the zirconia layer is less than this range, it is difficult for the zirconia layer to have a uniform thickness. As a result, the silicon carbide component moves to and is exposed to the zirconia-based layer, thereby contaminating the object to be fired. Conversely, if the zirconia layer is too thick, the zirconia material has a larger coefficient of thermal expansion than silicon carbide, so that the surface layer is easily peeled.

【006】基材に炭化珪素を用いているのは、ムライト
やアルミナに比べてセラミックコンデンサーやフェライ
トを焼成する温度域での熱間強度が高いという特徴があ
り、この特徴を生かすことにより、被焼成物の製品荷重
に耐え、長期間の使用でも焼成用治具の反りの発生を防
止出来る。また、熱伝導率が高いことにより、迅速焼
成,製品の均一焼成及び省エネ化が可能となる。基材に
85wt%以上の炭化珪素を用いているのは、炭化珪素
質が85wt%未満になると、基材の強度が低下し、割
れ、亀裂が発生し易くなり製品寿命が20〜50%低下
するためである。表層にジルコニアを用いているのは、
アルミナやマグネシアに比べて被焼成物との反応が少な
いため、耐用が向上すると共に電子部品の製品特性も向
上する。また、未安定のジルコニアを両面(表裏)に使
用した場合、熱間での繰り返し使用により、表面ジルコ
ニア層が相転位し、組織劣化が早くなる。また、ジルコ
ニア含有量が80wt%未満になると、ジルコニア層の
副成分が被焼成物側に移動して製品歩留まりが悪くな
る。
The use of silicon carbide for the base material is characterized by a higher hot strength in the temperature range in which ceramic capacitors and ferrite are fired than mullite and alumina. It can withstand the product load of the fired product and prevent the firing jig from warping even when used for a long time. In addition, the high thermal conductivity enables rapid firing, uniform firing of the product, and energy saving. The reason for using 85 wt% or more of silicon carbide for the base material is that when the silicon carbide content is less than 85 wt%, the strength of the base material is reduced, cracks and cracks are easily generated, and the product life is reduced by 20 to 50%. To do that. The reason that zirconia is used for the surface layer is
Since the reaction with the object to be fired is smaller than that of alumina or magnesia, the durability is improved and the product characteristics of the electronic component are improved. In addition, when unstable zirconia is used on both surfaces (front and back), the surface zirconia layer undergoes phase transition due to repeated use of hot, and the structural deterioration is accelerated. If the zirconia content is less than 80 wt%, the subcomponents of the zirconia layer move to the side of the object to be fired, and the product yield deteriorates.

【007】007

【実施例】以下に実施例を示し、本発明の特徴とすると
ころをより一層明確にする。
EXAMPLES Examples are shown below to further clarify the features of the present invention.

【008】(実施例1)基材の炭化珪素含有量が88重
量%、両面(表裏)のジルコニア(カルシア安定化)含
有量が95重量%である三層からなる棚板を製造した。
焼成後の三層からなる棚板の見掛気孔率は18.5%、
かさ比重3.22、1300℃における熱間曲げ強さは
11.5MPaであった。この三層からなる棚板をプッ
シャータイプの連続フェライト焼成炉に供してこの棚板
をムライト質台板の上に3点支柱を使用して3段積みを
行った。この棚板のうえにフェライトコアの素地を一列
に並べて焼成を行ったところ、100回繰り返し通炉し
てもいずれの段についても異常は見られなかった。ま
た、フェライトコア自身にも異常粒成長等の反応は見ら
れなかった。
Example 1 A three-layer shelf board having a silicon carbide content of a base material of 88% by weight and a zirconia (calcia stabilized) content on both sides (front and back) of 95% by weight was manufactured.
The apparent porosity of the three-layer shelf after firing is 18.5%,
The hot bending strength at a bulk specific gravity of 3.22 and 1300 ° C. was 11.5 MPa. The three-layer shelf was subjected to a pusher-type continuous ferrite firing furnace, and the shelf was stacked on a mullite base plate using a three-point support. When the base materials of the ferrite cores were arranged in a line on the shelf plate and fired, no abnormality was observed in any of the stages even after the furnace was passed 100 times. No reaction such as abnormal grain growth was observed in the ferrite core itself.

【009】(実施例2)基材の炭化珪素含有量が88重
量%、両面(表裏)のジルコニア(イットリア安定化)
含有量が89重量%である三層棚板を製造した。焼成後
の三層からなる棚板の見掛気孔率は19.5%、かさ比
重3.22、1300℃における熱間曲げ強さは10.
5MPaであった。実施例1と同様のフェライト焼成炉
及び棚積みを行った。この棚板のうえにフェライトコア
素地を一列に並べて焼成を行ったところ、100回繰り
返し通炉してもいずれの段についても異常は見られなか
った。また、フェライトコア自身にも異常粒成長等の反
応は見られなかった。
Example 2 Zirconia on Both Sides (front and back) with Silicon Carbide Content of 88% by Weight of Base Material (Yttria Stabilized)
A three-layer shelf with a content of 89% by weight was produced. The apparent porosity of the three-layer shelf after firing is 19.5%, the bulk specific gravity is 3.22, and the hot bending strength at 1300 ° C. is 10.
It was 5 MPa. The same ferrite sintering furnace and shelving as in Example 1 was performed. When the ferrite core bodies were arranged in a line on the shelf plate and fired, no abnormality was found in any of the stages even after the furnace was repeatedly passed 100 times. No reaction such as abnormal grain growth was observed in the ferrite core itself.

【010】[0102]

【比較例1】基材の炭化珪素含有量が80重量%で、両
面(表裏)のジルコニア(イットリア安定化)含有量が
89重量%である300×300×12mm、両面(表
裏)の厚みがそれぞれ2.5mmの三層からなる棚板を
製造し、実施例1と同様の焼成炉及び棚組みを行った。
この棚板のうえにフェライトコアを置いて焼成を行った
ところ、50回繰り返し通炉した結果、当初のそりが対
角で0.11mm〜0.33mmあるのに比べて、そり
が対角で1.54mm〜2.36mmと大きくなった。
また、フェライトコア自身には異常粒成長等の反応は見
られなかった。
COMPARATIVE EXAMPLE 1 A base material having a silicon carbide content of 80% by weight, a zirconia (yttria stabilized) content of 89% by weight on both sides (front and back) was 300 × 300 × 12 mm, and the thickness of both sides (front and back) was A 2.5 mm-thick three-layer shelf board was manufactured, and the same firing furnace and shelf assembly as in Example 1 were performed.
When the ferrite core was placed on this shelf and baked, the furnace was repeatedly passed 50 times. As a result, the initial warp was 0.11 mm to 0.33 mm diagonally, but the warp was diagonal. It increased from 1.54 mm to 2.36 mm.
No reaction such as abnormal grain growth was observed in the ferrite core itself.

【011】[0111]

【比較例2】基材の炭化珪素含有量が88重量%、両面
(表裏)のジルコニア(マグネシア安定化)含有量が9
3重量%である300×300×12mm、両面(表
裏)の厚みがそれぞれ2.5mmの三層からなる棚板を
製造し、実施例1と同様の焼成炉及び棚組みを行った。
この棚板のうえにフェライトコアを置いて焼成を行った
ところ、20回繰り返し通炉した結果、イットリア安定
化ジルコニア、カルシア安定化ジルコニアに比べて組織
劣化率が大きかった。(イットリア安定化ジルコニア劣
化率:8.0% カルシア安定化ジルコニア劣化率:
8.5% マグネシア安定化ジルコニア劣化率:14.
5%)また、フェライトコア自身の歩留りにも悪影響を
及ぼした。
Comparative Example 2 The silicon carbide content of the substrate was 88% by weight, and the zirconia (magnesia stabilized) content on both sides (front and back) was 9
A three-layer shelf board of 3% by weight of 300 × 300 × 12 mm and a thickness of both sides (front and back) of 2.5 mm was manufactured, and the same firing furnace and shelf assembly as in Example 1 were performed.
When the ferrite core was placed on this shelf and baked, the furnace was repeatedly passed through 20 times. As a result, the rate of structural deterioration was higher than that of yttria-stabilized zirconia or calcia-stabilized zirconia. (Yttria stabilized zirconia degradation rate: 8.0% Calcia stabilized zirconia degradation rate:
8.5% Magnesia stabilized zirconia Deterioration rate: 14.
(5%) In addition, the yield of the ferrite core itself was adversely affected.

【012】[0122]

【比較例3】基材の炭化珪素含有量が88重量%、両面
(表裏)がアルミナ含有量99%である300×300
×12mm、両面(表裏)の厚みがそれぞれ2.5mm
の三層からなる棚板を製造し、実施例1と同様の焼成炉
及び棚組みを行った。この棚板のうえにフェライトコア
を置いて焼成を行ったところ、5回繰り返し通炉した結
果、アルミナ表面にフェライトコア痕が付き、さらに3
0回繰り返し通炉した結果、表面のアルミナ層にクッラ
クが入り一部剥離が見られた。
Comparative Example 3 300 × 300 having a base material having a silicon carbide content of 88% by weight and both sides (front and back) having an alumina content of 99%.
× 12mm, both sides (front and back) thickness 2.5mm
Was manufactured, and the same sintering furnace and shelf assembly as in Example 1 were performed. When the ferrite core was placed on this shelf plate and baked, the furnace was repeatedly passed five times.
As a result of passing the furnace repeatedly 0 times, cracks entered the alumina layer on the surface, and partial peeling was observed.

【013】[0113]

【発明の効果】以上に述べたように、本発明は炭化珪素
からなる基材の両面(表裏)がジルコニア(イットリア
安定化ジルコニア又は、カルシア安定化ジルコニア)層
からなる三層構造を一体成形により成形し、一度に焼成
することにより被焼成物との反応がなく、耐用を大きく
向上させることができる。
As described above, according to the present invention, a three-layer structure composed of a zirconia (yttria-stabilized zirconia or calcia-stabilized zirconia) layer on both sides (front and back) of a substrate made of silicon carbide is formed by integral molding. By molding and firing at once, there is no reaction with the object to be fired, and the durability can be greatly improved.

【014】[0141]

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の実施例2による三層からなる棚板
の縦断面図である。
FIG. 1 is a vertical sectional view of a three-layer shelf board according to a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1.イットリア安定化ジルコニアまたはカルシア安定化
ジルコニア表層部 2.炭化珪素の基材
1. 1. Yttria-stabilized zirconia or calcia-stabilized zirconia surface layer Silicon carbide substrate

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 基材がSiC含量85wt%以上の炭化
珪素質耐火物であり、基材の両面(表裏)がZrO2含
量80wt%以上98wt%以下の安定化ジルコニア
(イットリア安定化ジルコニア又はカルシア安定化ジル
コニア)である三層構造電子部品焼成用治具。
1. A base material is a silicon carbide refractory having a SiC content of 85 wt% or more, and both surfaces (front and back) of the base material are stabilized zirconia (a yttria-stabilized zirconia or calcia stable) having a ZrO 2 content of not less than 80 wt% and not more than 98 wt%. Zirconia), a jig for firing three-layer electronic components.
【請求項2】 基材の炭化珪素質耐火物と両面(表裏)
の安定化ジルコニア層を一体成形してなる請求項1に記
載の電子部品焼成用治具。
2. The silicon carbide refractory of the base material and both sides (front and back)
The electronic component firing jig according to claim 1, wherein the stabilized zirconia layer is integrally formed.
【請求項3】 基材と両面層(表面層)の厚みの比が
1:1から4:1でかつ全体の厚みは5mm以上30m
m以下である請求項1または2に記載のセラッミク電子
部品焼成用治具。
3. The thickness ratio of the base material to the double-sided layer (surface layer) is 1: 1 to 4: 1, and the total thickness is 5 mm to 30 m.
3. The jig for firing a ceramic electronic component according to claim 1, wherein the diameter is not more than m.
JP2000254664A 2000-07-22 2000-07-22 Fixture for firing cermic electronics parts Pending JP2002037676A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000254664A JP2002037676A (en) 2000-07-22 2000-07-22 Fixture for firing cermic electronics parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000254664A JP2002037676A (en) 2000-07-22 2000-07-22 Fixture for firing cermic electronics parts

Publications (1)

Publication Number Publication Date
JP2002037676A true JP2002037676A (en) 2002-02-06

Family

ID=18743561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000254664A Pending JP2002037676A (en) 2000-07-22 2000-07-22 Fixture for firing cermic electronics parts

Country Status (1)

Country Link
JP (1) JP2002037676A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2017240A1 (en) 2002-08-30 2009-01-21 Mitsui Mining & Smelting Co., Ltd Jig for calcining electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2017240A1 (en) 2002-08-30 2009-01-21 Mitsui Mining & Smelting Co., Ltd Jig for calcining electronic component
US7601442B2 (en) 2002-08-30 2009-10-13 Mitsu Mining & Smelting Co., Ltd. Jig for calcining electronic component
EP2213636A1 (en) 2002-08-30 2010-08-04 Mitsui Mining & Smelting Co., Ltd. Jig for calcining electronic component

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