JP2002030433A5 - - Google Patents

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Publication number
JP2002030433A5
JP2002030433A5 JP2000212073A JP2000212073A JP2002030433A5 JP 2002030433 A5 JP2002030433 A5 JP 2002030433A5 JP 2000212073 A JP2000212073 A JP 2000212073A JP 2000212073 A JP2000212073 A JP 2000212073A JP 2002030433 A5 JP2002030433 A5 JP 2002030433A5
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JP
Japan
Prior art keywords
target
magnetic circuit
substrate
voltage value
mask member
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Application number
JP2000212073A
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English (en)
Japanese (ja)
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JP2002030433A (ja
JP4082852B2 (ja
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Priority to JP2000212073A priority Critical patent/JP4082852B2/ja
Priority claimed from JP2000212073A external-priority patent/JP4082852B2/ja
Publication of JP2002030433A publication Critical patent/JP2002030433A/ja
Publication of JP2002030433A5 publication Critical patent/JP2002030433A5/ja
Application granted granted Critical
Publication of JP4082852B2 publication Critical patent/JP4082852B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000212073A 2000-07-13 2000-07-13 薄膜形成装置 Expired - Fee Related JP4082852B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000212073A JP4082852B2 (ja) 2000-07-13 2000-07-13 薄膜形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000212073A JP4082852B2 (ja) 2000-07-13 2000-07-13 薄膜形成装置

Publications (3)

Publication Number Publication Date
JP2002030433A JP2002030433A (ja) 2002-01-31
JP2002030433A5 true JP2002030433A5 (enrdf_load_stackoverflow) 2005-08-04
JP4082852B2 JP4082852B2 (ja) 2008-04-30

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ID=18708039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000212073A Expired - Fee Related JP4082852B2 (ja) 2000-07-13 2000-07-13 薄膜形成装置

Country Status (1)

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JP (1) JP4082852B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5393972B2 (ja) * 2007-11-05 2014-01-22 Ｈｏｙａ株式会社 マスクブランク及び転写用マスクの製造方法
KR100932934B1 (ko) * 2007-12-13 2009-12-21 삼성모바일디스플레이주식회사 스퍼터링 장치 및 스퍼터링 장치를 사용한 평판 표시장치의제조방법
JP5302916B2 (ja) * 2010-03-05 2013-10-02 キヤノンアネルバ株式会社 基板処理装置
JP5849334B2 (ja) * 2012-02-14 2016-01-27 株式会社Ｊｏｌｅｄ スパッタリング装置のメンテナンス時期決定方法、メンテナンス方法、スパッタリング装置
TWI438297B (zh) * 2012-06-06 2014-05-21 Au Optronics Corp 濺鍍機及其磁鐵的控制方法
CN105803410B (zh) * 2016-04-29 2018-07-17 京东方科技集团股份有限公司 磁控溅射装置、磁控溅射设备及磁控溅射的方法

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