JP2002028585A - Substrate treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of uniformly applying all treatments to both surfaces of a substrate in one treatment chamber. SOLUTION: The substrate treatment apparatus has the substrate support stand 1 provided in the treatment chamber S, a lift stand 4 performing the giving and receiving of the substrate W with respect to the substrate support stand 1, a drive means 45 for moving the lift stand 4 up and down, a pair of upper and lower slide members 2, 2 movable on the lift stand 4 in a horizontal direction, a drive means 21 for rotating the slide members 2, 2 and washing liquid supply means 31, 32, 33, 34 and is equipped with a slide washing unit 3 for washing the upper and rear surfaces of the substrate W supported on the lift stand 4 by a pair of the slide members 2, 2 and a running means 47 for allowing the slide washing unit 3 to run on the lift stand 4 in a horizontal direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus capable of performing all kinds of processing on a substrate such as a semiconductor (silicon) wafer, a liquid crystal glass substrate, a glass substrate for a photomask, and a substrate for an optical disk in one processing chamber. In particular, the present invention relates to a substrate processing apparatus capable of performing double-sided brush cleaning.

[0002]

2. Description of the Related Art For example, a TFT substrate constituting a liquid crystal substrate is manufactured through various processes. Among them, in order to form a circuit pattern on the surface of the substrate, a developer or a resist film is applied and peeled off. Are repeatedly performed. Further, the substrate is repeatedly washed when introduced into the process or during the process.

In such a case, for example, a substrate processing apparatus as shown in FIG. 8 (see Japanese Patent Application Laid-Open No. 10-154652) is used. The cleaning section of this substrate processing apparatus
It has a double-sided brush cleaning mechanism, and is configured to perform processing while transporting a substrate.

In FIG. 8, the substrate processing apparatus takes out substrates W carried in units of cassettes CA one by one from the cassettes CA, and transfers the substrates W having undergone a series of processing to any of the four cassettes CA. It has an indexer section 110 to be stored, a cleaning section 120 for cleaning the substrate W with a predetermined cleaning liquid, and a resist coating and developing section 130 for performing processing such as resist coating on the washed substrate W.

[0005] The substrate W taken out of the cassette CA of the indexer unit 110 by the indexer robot at the substrate loading / unloading unit 121 is transported horizontally and sequentially by being supported by a plurality of transport rollers (not shown). Moving. In the UV processing unit 122, the substrate surface is irradiated with ultraviolet rays to incinerate oil and fat components and the like on the substrate surface. The substrate W that has been subjected to the ultraviolet treatment is straightly moved by horizontal conveyance using a plurality of conveyance rollers (not shown), and then changes its traveling direction in the direction perpendicular to the posture and horizontally moves to the substrate inclined portion 123. In the substrate inclined portion 123, the inclination angle with respect to the horizontal plane is 3 ° to 4
The substrate W is tilted together with the transport roller within a range of 0 °, and the substrate is carried into the cleaning unit 120 with the tilted posture.

The cleaning section 120 is of a conveyor type, and has a chemical cleaning section 124 for performing chemical processing on the upper and lower surfaces of the substrate W in an inclined position, a pure water cleaning section 125 for cleaning the upper and lower surfaces of the substrate W with pure water, An air knife drying unit 126 for drying the washed substrate W is provided, and is washed with a chemical solution (washing solution), rinsed with pure water, and dried by blowing air.

[0007] The substrate W after being dried by the air knife drying unit 126 is carried into the delivery unit 127, where the substrate W is dried.
After being returned from the inclined posture to the horizontal posture, and once accumulated, it is carried into the resist coating / developing unit 130 from the substrate entrance / exit portion 131 of the resist coating / developing unit 130 by the transport robot TR. On the other hand, the exposed and developed substrate is carried out from the substrate loading / unloading section 131, passed to the shuttle transport section 129 via the transport robot TR, and stored in the cassette of the indexer section 110 via the substrate introducing section 121. You.

[0008]

In the above-described conveyor type substrate processing apparatus, a processing chamber is provided for each type of processing, and there is a problem that the apparatus size is large. Further, it is difficult to cope with different processes, and a cleaning unit is required for each type of process. In other words, when a substrate that requires a step of cleaning with a chemical solution (cleaning liquid) and rinsing with pure water and a substrate that must be cleaned with pure water alone coexist, the latter substrate requires a chemical solution during transport. In such a case, inconvenience may occur, so that the same cleaning unit as the former substrate cannot be cleaned,
A separate cleaning section without a chemical cleaning section must be provided. In addition, when the size of the equipment is increased, it is difficult to increase the capacity according to the production volume. When installing the equipment, the equipment with such a processing capacity is introduced from the beginning in anticipation of the later maximum production capacity. However, there is a problem that initial capital investment becomes large.

On the other hand, in a substrate processing apparatus capable of covering different processes in one processing chamber, various types of processing are performed while a substrate is supported on a substrate support table.
There is a problem that the back side processing cannot be performed. This problem is particularly remarkable when performing cleaning using a brush.

In view of such problems, the present invention provides
An object of the present invention is to provide a substrate processing apparatus capable of uniformly performing all processes on both surfaces of a substrate in one processing chamber.

[0011]

In order to achieve the above object, a substrate processing apparatus according to the present invention comprises a substrate support provided in a processing chamber, and a transfer of substrates to and from the substrate support. An elevator that supports and lifts the periphery of a substrate horizontally mounted on a substrate support, a driving unit that moves the elevator up and down, and a pair of upper and lower movable horizontally on the elevator. A rubbing unit comprising: a rubbing unit; a driving unit for rotating the rubbing unit; and a cleaning liquid supply unit; and a rubbing cleaning unit for cleaning upper and lower surfaces of a substrate supported by the elevating table with the pair of rubbing units. It is characterized in that it is provided with a traveling means for causing the dynamic cleaning unit to travel on the elevating table in the horizontal direction.

When processing is performed in one processing chamber,
Conventionally, since the substrate W must be fixedly supported on the support table, the operation of rubbing the back side of the substrate, such as double-sided brush cleaning, is conventionally performed by a member such as a support pin abutting on the back side. Although not prevented, the substrate is lifted while supporting a part of the peripheral edge thereof by the elevating table, so that cleaning with a rubbing member such as double-sided brush cleaning can be easily performed. Therefore, the installation area of the apparatus can be drastically reduced as compared with the conventional conveyor system. In addition, since another apparatus can be incorporated in the processing chamber, it is not necessary to add an apparatus corresponding to another process, and it is possible to cope with cleaning of any process.

According to a second aspect of the present invention, in addition to the first aspect, a vertical width adjusting mechanism for adjusting a distance between the pair of rubbing members is provided.

When the user moves from the elevating table onto the substrate, or when the user wants to deal with a substrate having a different thickness or a different pressing amount, it can be easily dealt with by the vertical width adjusting mechanism.

According to a third aspect of the present invention, in addition to the first aspect of the present invention, the rubbing cleaning unit includes an upper portion which is in contact with an upper surface of a substrate supported by the lift table. A roller and a lower roller contacting the lower surface of the substrate are provided, and the substrate is supported by the upper roller and the lower roller.

Even when the substrate is thin and large, such as a substrate that is bent by supporting the periphery, the substrate can be washed in a non-bent state by being supported by the upper and lower rollers, so that a uniform cleaning process can be performed.

According to the present invention described in claim 4, in addition to the invention described in any one of claims 1 to 3, the elevator is provided with:
When the rubbing cleaning unit travels in the horizontal direction, the pair of rubbing members travels while sandwiching the substrate from above and below. It is configured to be.

That is, since the supporting structure of the substrate has a structure in which the peripheral edge of the substrate is sandwiched, the upper and lower surfaces of the substrate can be effectively and uniformly cleaned.

According to the present invention described in claims 5 to 8, in addition to the invention described in any one of claims 1 to 3, the processing liquid or the processing gas is supplied from the upper surface side of the substrate supported on the substrate support base. An upper processing liquid supply means or an upper processing gas supply means for supplying, or a lower processing liquid supply means or a lower processing gas supply means for supplying a processing liquid or a processing gas from the lower surface side is provided.

By providing such processing liquid and processing gas supply means in one processing chamber, it is possible to clean all processes. Therefore, even when substrates requiring different processes are mixed, one processing chamber is provided. Only one processing room needs to be added, and the overall size can be dramatically reduced. In addition, it is easy to increase the number of units in accordance with the production scale of the factory, and there is no waste in capital investment.

According to a ninth aspect of the present invention, in addition to any one of the first to eighth aspects, the substrate supporting table is driven to rotate by a rotation mechanism, and the substrate is brought into contact with a point contact. It is provided with a supporting member for supporting the substrate and a regulating means for regulating movement of the substrate in the horizontal direction, so that the lift table does not interfere with the regulating means.

The present invention is applicable not only to an apparatus for performing a process while the substrate is stopped, but also to an apparatus for performing a process while rotating the substrate. In any case, the substrate can be lifted and the double-sided brush cleaning can be performed above the processing chamber.
The substrate rotating type apparatus is configured so that the restricting means does not hinder the operation of lifting the substrate on the lifting platform.

As the restricting means, in addition to the protruding body that is in contact with the outer peripheral side of the substrate, an adsorbing body that adsorbs a part of the outer edge of the back surface of the substrate is preferable. In the case of an adsorbent, the contact portion of the support does not wear because the substrate does not shift even when driven to rotate. Therefore, the pin replacement work, which is usually required once every few days, is not required.

In the substrate processing apparatus of the present invention, it is preferable that a substrate detection sensor capable of detecting the presence or absence of the substrate on the substrate support is provided at an appropriate place. Thereby, the loss time of the process can be reduced. In the case of a rotary substrate processing apparatus, the rotation of the substrate can be stopped before the broken substrate is crushed into small pieces by high-speed rotation and scattered around.

According to the thirteenth aspect of the present invention, in the first aspect,
In addition to the invention described in 2, the pressure sensor for detecting the pressure in the suction action path connected to the adsorbent is a substrate detection sensor, and the substrate is inexpensive and does not interfere with the movement of other members. Since it can be provided in the support base and a rotation mechanism for rotating the support base, there is no problem with the installation place.

According to the fourteenth aspect of the present invention, in the first aspect,
In addition to any one of the inventions described in any one of Items 13 to 13, a cup for receiving the processing liquid is provided below the substrate support table, and an exhaust mechanism for exhausting the inside of the cup is provided.

Even if a gas is blown onto both the upper and lower surfaces while the substrate is rotated at a high speed, the air current does not wind up, so that the re-adhesion of droplets and the generation of a watermark due to poor drying can be prevented.

[0028]

Embodiments of the present invention will be described below. FIG. 1 is a front view of a main part of the substrate processing apparatus of the present invention, FIG. 2 is a plan view of a main part of the substrate processing apparatus of FIG. 1, and FIG. FIG. 4 is a vertical cross-sectional view of the cleaning liquid supply means, FIG. 4 is a plan view of the lifting platform with the friction cleaning unit of FIG. 1 removed, and FIG. 5 is an operation explanatory diagram of the friction cleaning unit and the lifting platform. . FIG. 6 is a plan view of the substrate support, and FIG. 7 is a side view of the substrate support of FIG.

In FIG. 1, this substrate processing apparatus has one processing chamber S in which a substrate support table 1 for supporting a substrate W is provided.
Inside, a cylindrical rubbing member 2, a rubbing cleaning unit 3 supporting the rubbing member 2, and an elevating table 4 supporting the rubbing cleaning unit 3 are provided.
In the same processing chamber S, the first processing liquid supply unit 5,
Second processing liquid supply unit 6, processing gas supply unit 7,
The apparatus is provided with a lower processing gas supply unit 8 and a lower processing liquid supply unit 9, and can cope with any cleaning process. Further, a cup 10 is provided below the substrate support 1.
Is provided, and the used processing liquid is recovered from the cup 10 to the recovery tank 101 outside the processing chamber S.

The substrate support 1 is a hollow shaft 1 which is a rotating body of a rotating mechanism 11 erected substantially at the center of the lower surface of the processing chamber S.
2 is rotatably driven by a drive motor 13 which is fitted to the outer end of the second shaft 2 and connected to the hollow shaft 12. The substrate W is supported via a support 14 and an adsorbent 15 provided on the upper surface of the substrate support 1. As shown in FIG. 2, the substrate support 1 has a disk shape.

As shown in FIG. 1, the rubbing members 2, 2
A pair of upper and lower brushes is provided, and a brush formed by implanting nylon bristles or the like in a cylindrical shape is preferable, but may be formed of a sponge or the like. The rubbing members 2 and 2 are housed in boxes 30, 30 whose opposing surfaces are open to form a rubbing cleaning unit 3. As shown in FIG. 2, both ends of a center shaft 20 of the rubbing member 2 are rotatably supported by a bearing block 22.
A drive motor 21 is connected to one end of the drive motor 21. The drive motor 21 is attached to a bearing block 22 via a support member (not shown).

The bearing block 22 is guided vertically by a linear guide 23, and a rack 24 is provided on the other surface. On the other hand, the pinion 2 meshing with the rack 24
Numerals 5 are provided at both ends of two shafts 26, 26 parallel to the central axis 20, and are rotated by servo motors provided at appropriate positions (not shown) to move the bearing blocks 22 at both ends of the central axis 20 up and down. Let it. These vertical width adjustment mechanisms (bearing block 22, linear guide 23, rack 2
4, pinion 25, shaft 26 and servo motor)
Thereby, the separation / contact operation between the friction members 2 and 2 and the amount of pressing against the substrate W can be adjusted.

The rubbing cleaning unit 3 rotates the rubbing member while cleaning the substrate W while moving in the direction of arrow 48 along the traveling unit 47 provided on the lift 4. The traveling unit 47 is a combination of, for example, a guide member such as a rail for guiding in the direction of the arrow 48, and a drive unit such as a rack and a pinion for linear drive.

As shown in FIG. 1, the rubbing cleaning unit 3 has rollers 27, 27, 28, 28 before and after the rubbing members 2, 2 in the running direction. Roller 2
A plurality of the members 7 and 28 are provided at appropriate intervals in the axial direction of the rubbing member 2.

Further, as shown in FIG. 2, a pipe 32 communicating with the cleaning liquid supply source 31 is laid in the box 30 of the rubbing cleaning unit 3 so that it can be moved forward and backward with respect to the traveling direction of the rubbing member. Injecting nozzles 33, 3 for spraying the processing liquid from the side
4 are provided at predetermined intervals. As shown in FIG. 3, the cleaning liquid is sprayed from the spray nozzle 33 to a contact portion between the sliding body 2 and the substrate W when the sliding body is rubbing. The cleaning liquid is sprayed from the spray nozzle 34 to a portion away from the contact portion. The jet nozzle 33 or the jet nozzle 34 may be configured to jet ultrasonically excited pure water.

As shown in FIG. 1, the lift 4 is provided with a substantially rectangular bottom plate 41 having a through-hole 41a through which the substrate W passes, and a connection member 43 above the bottom plate 41 with an appropriate space therebetween. And a frame 102 on which a cover 103 covering the processing chamber S is placed.
It is guided by a support column 44 that is set up vertically, and is moved up and down by a motor or a drive cylinder 45 (elevation platform drive means). On the bottom plate 41, a traveling unit 47 for moving the rubbing cleaning unit 3 in the direction of arrow 48 is laid.

A pair of frames 42, 42 of the lift 4 are provided with a plurality of claws 42a which are mounted by hooking a part of the peripheral edge of the substrate 42.
And a frame 42b facing the substrate 42 and supporting the claws 42a horizontally. As shown in FIG. 4, a drive cylinder 49 is connected to a corner of the frame 42b via a link plate 50, and the frame 42b moves in the direction of the arrow 51 by pushing and pulling the drive cylinder 49,
The pair of frame members 42, 42 are separated from each other and transfer the substrate W. The ends of the frame 42b are respectively linked 53,
It is supported by 54 so as to be movable in the direction of arrow 51.

It is preferable that the width of the claw 42a in the vertical direction is made as thin as possible so that the claw 42a can easily pass between the pair of upper and lower friction members 2,2. By doing so, when moving the sliding bodies 2, 2 from the frame bodies 42, 42 to the substrate W on the lifting platform 4, the operation of opening and closing the pair of upper and lower sliding bodies 2, 2 is unnecessary, This can be moved smoothly. Further, a step is provided at the tip of the claw 42a, and the outer edge portion of the substrate is placed on the step and the frame 4
The substrate can be fixed by sandwiching the substrate from the outer peripheral side on the side surface of the step by the separating / contacting operation of Step 2.

The pair of frames 42, 42 may be configured to face each other with the substrate interposed therebetween. As shown in FIG. 4, a P-shaped frame which is substantially symmetric with respect to the direction in which the substrate is divided into two by a diagonal line is used. , L-shape, or a U-shape or a simple plate shape by changing the direction and number of divisions.

Next, the operation of the rubbing cleaning unit 3 and the lift 4 will be described with reference to FIG. First, the lift 4 is waiting at the standby position A above the processing chamber S, and the rubbing cleaning unit 3 is waiting at one end of the lift 4. Next, the elevating platform 4 descends and receives the substrate W loaded from outside by another transporting means (not shown) placed on the claws 42a of the frame 42 and stops at the cleaning position B. Here, the rubbing cleaning unit 3 makes one reciprocation of the substrate W and cleans both surfaces of the substrate W. When the cleaning is completed, the lifting table 4 is further lowered to transfer the substrate W onto the substrate supporting table 1 at the transfer position C. Here, by driving the drive cylinder 49, the pair of frame bodies 42 move in directions away from each other, and the substrate W separates from the claws 42a. Finally, the lift 4 is raised to the first standby position A, and a series of double-sided cleaning steps is completed.

An up / down width adjusting mechanism for adjusting the distance between the rubbing members 2 and 2, when moving from the frame 42 to the substrate W, first narrows the rubbing members 2 and 2 and then applies an appropriate pressing amount. Finely adjust the interval so that In other words, although the degree of the effect of cleaning by the rubbing members 2 and 2 depends on the amount of pressing of the rubbing members 2 and 2 against the substrate W, the thickness dimension of the substrate W varies depending on the product. If the cleaning is performed for a period of time, the rubbing members 2 and 2 are worn, and furthermore, the cleaning performance is improved on the front side as much as possible, while the cleaning property on the rear side is such that dust is removed so as not to go around to the front side. In some cases, for example, it is desired to change the detergency between the front side and the back side of the substrate W, and the distance between the rubbing members 2 is constantly adjusted.

In FIGS. 1 and 2, the first processing liquid supply unit 5, the second processing liquid supply unit 6, and the processing gas supply unit 7, which are provided at the corners inside the processing chamber S, have a conventional processing liquid and processing gas supply unit. A structure used for supplying gas can be used as appropriate. That is, the nozzle group is provided on the arm that can move up and down and pivot so that the arm can move back and forth on the substrate W without interference.

The nozzle of the first processing liquid supply unit 5 or the second processing liquid supply unit 6 has a megasonic nozzle,
There are a bubble jet (registered trademark) nozzle, an ultrasonic nozzle, and the like, and a chemical solution or pure water is appropriately discharged according to a necessary process. Further, for example, pressurized argon gas such as nitrogen is sprayed from the nozzle of the processing gas supply unit 7 while rotating the substrate 1 at a high speed to perform draining and drying.

1 and 2, a lower processing gas supply unit 8 and a lower processing liquid supply unit 9 are provided.
Is the hollow part 1 of the rotating mechanism 11 formed by combining hollow shafts.
1a, a processing liquid or a processing gas is sprayed on the substrate W from below to perform various processing. The lower processing gas supply unit 8 has one nozzle at the center, and creates a gas flow of the processing gas from the center to the outer periphery to dry. A plurality of nozzle groups of the lower processing liquid supply unit 9 are provided around the lower processing gas supply unit 8. In the drying step, the processing gas supply unit 7 is advanced above the substrate W, and while the substrate 1 is rotating at a high speed, nitrogen or the like pressurized from above and below is sprayed to quickly and surely drain and dry. In addition, when the processing liquid is supplied from the upper first processing liquid supply unit 5 or the second processing liquid supply unit 6, pure water is supplied from the back side to perform rinsing on the back side. Can respond to processes.

The cup 10 has a rotating mechanism 11 on the inner diameter side.
And the outer diameter side has an appropriate size further outside the outer edge of the substrate support table 1 and is configured in two stages of upper and lower portions, and the upper portion 10a rises upward as necessary. . The inside of the cup 10 is evacuated by the exhaust mechanism 104 to quickly recover the used processing liquid. In particular, when the substrate W is rotated at a high speed in the drying step after the cleaning, the liquid can be prevented from being rolled up in the cup 10, so that reattachment to the substrate W can be prevented. Therefore, a stain-free substrate is finished.

Next, the substrate support 1 and its rotating mechanism 11 will be described with reference to FIGS.

The substrate support 1 is, as shown in FIG.
It has a wheel shape in which the inner ring portion 1a and the outer ring portion 1c are connected by a spoke portion 1b, and a support body 14 that supports the substrate W in point contact is provided upright toward the center of the spoke portion 1b. The adsorbents 15 are provided in a widened portion near the outer periphery of the spoke portion 1b, are open at the upper end, and are provided two by two along four sides adjacent to the four corners of the substrate W.

As shown in FIG. 7, a passage 15b penetrating from the opening 15a on the upper surface to the lower surface is provided inside the adsorbent 15, and the spoke portion 1 of the substrate support base 1 is provided.
b communicates with a first gas passage 16a formed inside. The first gas passage 16a is further connected from the inner ring portion 1a to the second gas passage 16b which communicates with the vacuum pump 16 provided outside through the inside of the rotation mechanism 11. In addition, the pressure in the suction action path is set to one of the suction action paths (passage 15b, first and second gas paths 16a, 16b) between the opening 15a in contact with the substrate W and the vacuum pump 16. A pressure sensor 17 for detecting is provided.
The pressure sensor 17 is a substrate cracking sensor. When the substrate W breaks and the inside of the suction passage is no longer in vacuum, this can be detected instantaneously, and the response to the next substrate W is promptly performed. And production in a certain period of time increases.

On the upper surface side of the substrate support 1, a liquid recovery auxiliary plate 18 is attached by screws or the like. Support 14
And the adsorbent 15 penetrate the auxiliary liquid recovery plate 18,
It is erected on the substrate support 1.

According to the present invention, in addition to the restricting means such as the adsorbent 15, a column-shaped protruding body having an increased height of the support 14 is provided on the side of the substrate so as to be in contact with the outer periphery of the substrate. Conventionally, as a means for restricting the horizontal movement of the substrate, such as one that has a stepped tip and a protrusion that has a stepped tip, and that is arranged at a position where the outer edge of the substrate rests on the step surface Can be appropriately adopted. In any case, the claw 42a of the frame 42 is provided at a position where the outer edge of the substrate in a portion where these regulating means are not disposed can be placed.

Further, in the present invention, in addition to the substrate detection sensor such as the pressure sensor 17, a non-contact proximity sensor using ultrasonic waves, magnetism, light, or the like, a photoelectric sensor, or the like is appropriately used as the substrate detection sensor. Can be. These non-contact sensors can be directly attached to the substrate support 1, or can be appropriately attached above the substrate support 1 in the substrate processing apparatus.

[Brief description of the drawings]

FIG. 1 is a front view of a substrate processing apparatus according to the present invention.

FIG. 2 is a plan view of the substrate processing apparatus of FIG. 1;

FIG. 3 is a vertical sectional view of a cleaning liquid supply unit of the rubbing cleaning unit of FIG. 1;

FIG. 4 is a plan view of the elevating table with the rubbing cleaning unit of FIG. 1 removed.

FIG. 5 is an operation explanatory view of the rubbing cleaning unit and the elevating table.

FIG. 6 is a plan view of a substrate support.

FIG. 7 is a side view of the substrate support of FIG. 6;

FIG. 8 is an explanatory view of a conventional substrate processing apparatus having double-sided brush cleaning.

[Explanation of symbols]

 W Substrate S Processing chamber 1 Substrate support 2 Sliding body 3 Rubbing cleaning unit 4 Lifting table 5 First processing liquid supply unit 6 Second processing liquid supply unit 7 Processing gas supply unit 8 Lower processing gas supply unit 9 Lower processing liquid supply Unit 10 Cup 11 Rotating mechanism 14 Support 15 Adsorber 15a Opening 15b Passage (suction path) 16 Vacuum pump 16a First gas path (suction path) 16b Second gas path (suction path) 17 Pressure sensor 20 Friction body Center shaft 21 sliding motor drive motor 22 bearing block (vertical width adjusting mechanism) 23 linear guide (vertical width adjusting mechanism) 24 rack (vertical width adjusting mechanism) 25 pinion (vertical width adjusting mechanism) 26 shaft (vertical width adjusting mechanism) 27, 28 Roller 31 Cleaning liquid supply source (Cleaning liquid supply means) 32 Piping (Cleaning liquid supply means) 33, 34 Injection nozzle (cleaning liquid supply means) 42 Frame 44 Support (elevation platform driving means) 45 Driving cylinder (elevation platform driving means) 47 Traveling unit 49 Frame driving cylinder

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 644 H01L 21/304 644G 651 651L // H01L 21/68 21/68 N (72) Inventor Katsumi Nakata 1-10 Fuso-cho, Amagasaki-shi, Hyogo Sumitomo Precision Industries, Ltd. (72) Inventor Shunji Matsumoto 1-10, Fuso-cho, Amagasaki-shi, Hyogo Sumitomo Precision Industries, Ltd. F-term (reference) 2H088 FA21 FA30 MA20 2H090 JB02 JC19 3B116 AA02 AB08 AB42 BA02 BA15 BA34 BB24 CC03 3B201 AA02 AB42 BA02 BA15 BA34 BB24 BB93 CB01 CB25 CC12 5F031 CA02 CA05 HA08 HA09 HA14 HA24 HA27 HA29 HA48 HA58 HA59 HA60 JA10 JA23 MA47

Claims (14)

[Claims] A substrate supporting table provided in a processing chamber; a lifting table for transferring a substrate to and from the substrate supporting table, and supporting and lifting a peripheral edge of the substrate horizontally mounted on the substrate supporting table; A driving means for vertically moving the elevator, and a pair of upper and lower rubbing members which can be moved horizontally on the elevator.
A driving unit for rotating the rubbing body, and a rubbing cleaning unit having cleaning liquid supply means, and cleaning the upper and lower surfaces of the substrate supported by the elevating table with the pair of rubbing bodies; and A substrate processing apparatus comprising a traveling unit for traveling in the horizontal direction on a lifting platform. 2. The substrate processing apparatus according to claim 1, further comprising a vertical width adjusting mechanism for adjusting a distance between the pair of rubbing members. 3. The rubbing and cleaning unit includes an upper roller abutting on an upper surface of a substrate supported by the elevating table, and a lower roller abutting on a lower surface of the substrate. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is configured to support the substrate. 4. The lifting platform is configured to fix the periphery of the substrate from the outer peripheral side, and when the rubbing cleaning unit travels in a horizontal direction, the pair of rubbing members are: The substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate processing apparatus is configured to travel while sandwiching the substrate from above and below. 5. The substrate processing apparatus according to claim 1, further comprising an upper processing liquid supply unit configured to supply a processing liquid from an upper surface side to the substrate supported on the substrate support table. 6. The substrate processing apparatus according to claim 1, further comprising an upper processing gas supply unit configured to supply a processing gas from an upper surface side to the substrate supported on the substrate support table. 7. The substrate processing apparatus according to claim 1, further comprising a lower processing liquid supply unit configured to supply a processing liquid to a substrate supported on the substrate support from a lower surface side. 8. The substrate processing apparatus according to claim 1, further comprising a lower processing gas supply unit configured to supply a processing gas from a lower surface side to the substrate supported on the substrate support table. 9. The substrate support table is driven to rotate by a rotation mechanism, and comprises a support for supporting the substrate thereon in point contact, and a restricting means for restricting horizontal movement of the substrate. 9. The substrate processing apparatus according to claim 1, wherein the lifting platform is configured not to interfere with the regulating unit. 10. 10. The substrate processing apparatus according to claim 9, wherein said regulating means is a protruding body that is in contact with an outer peripheral side of said substrate. 11. A substrate detection sensor for detecting the presence or absence of a substrate on the substrate support.
2. The substrate processing apparatus according to any one of 1. 12. The substrate processing apparatus according to claim 9, wherein said regulating means is an adsorbent for adsorbing a part of an outer edge portion of the back surface of the substrate. 13. The substrate according to claim 12, further comprising a pressure sensor for detecting a pressure in a suction operation path connected to the adsorbent, and a substrate detection sensor for detecting the presence or absence of the substrate on the substrate support. Processing equipment. 14. The substrate processing apparatus according to claim 1, further comprising a cup provided below the substrate support table for receiving the processing liquid and an exhaust mechanism for exhausting the inside of the cup.