JP2002015978A - Exposure system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a exposure system, capable of smoothly analyzing abnormality in the devise by easily attaching an external memory, in which information on errors on operation log is preserved, from the exposure device and easily enabling a connection to a general-purpose personal computer(PC) or the like. SOLUTION: This device has a second external memory 107 as a memory, dedicated to data log capable of reading the data of errors in the exposure system by means of the general PC, the second external memory 107 can be separated from the inside of this exposure system and the system has a means (such as an uninterruptible power source 108) for preserving detailed data of errors in the second external memory 107, from the occurrence of errors in the exposure system to the stop of the exposure system or after the stoppage of the exposure system.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device manufacturing apparatus used for manufacturing devices such as semiconductors, and more particularly, to an exposure apparatus having an abnormality status storing means and an abnormality status confirming means in an exposure apparatus.

[0002]

2. Description of the Related Art Conventionally, in an exposure apparatus used for manufacturing semiconductors and the like, since there are a plurality of measurement units and drive mechanisms in the apparatus, there are many factors that cause an apparatus abnormality. Therefore, information about the abnormality is displayed on a display or the like mounted on the apparatus operation unit to notify an operator or an engineer of the exposure apparatus. When an abnormality occurs, the engineer grasps the state of the abnormality based on the information on the abnormality displayed on the display, and repairs the abnormal part. Further, since the exposure apparatus is equipped with an external memory such as a hard disk for storing an operation system (OS), a database of abnormality information, operation logs, measurement data, and the like, the abnormality status is stored in an external memory in the apparatus. It is kept as a history. Therefore, even if the exposure apparatus stops (power is turned off) due to an apparatus abnormality, the abnormality status can be confirmed by restarting.

[0003]

However, in the conventional method, when an apparatus abnormality occurs and the abnormality is judged by the apparatus controller to be an abnormality having a high degree of risk, a circuit for turning off the apparatus power operates to stop the exposure apparatus. Sometimes. Therefore, even if the abnormal status is stored in an external memory in the apparatus and remains as a history before the power of the apparatus is turned off, it is necessary to turn on the power of the exposure apparatus again to confirm the abnormal status. Turning on the power to the exposure apparatus without repairing the abnormal part may cause danger depending on the degree of the abnormality. Further, when the control unit for displaying the information relating to the abnormality on the display cannot be started, or when it is desired to check the error information, the operation log, etc., the external memory is removed from the device and the data is collected. However, this external memory has a large capacity such as a hard disk so as to be able to store an operation system (OS), a database of abnormality information, operation logs, measurement data, and the like. ), Etc., it takes time to retrieve the data, and it takes time to analyze the data.

Further, depending on the abnormal state, the power may be immediately turned off in priority to storing the abnormal status in the external memory. Therefore, no information about the abnormality remains, and time is required for restoring the exposure apparatus. Conceivable.

The present invention has been made in view of the above-mentioned problems of the conventional example, and an external memory for storing error-related information and operation logs can be easily removed from the exposure apparatus, and can be easily connected to a general-purpose personal computer or the like. By connecting to
An object of the present invention is to provide an exposure apparatus that can smoothly analyze an apparatus abnormality. It is another object of the present invention to provide an exposure apparatus capable of storing an abnormal status in an external memory even in the case of an abnormal state in which power is immediately turned off without storing an abnormal status in preference to an external memory.

[0006]

In order to achieve the above object, an exposure apparatus according to the present invention is an exposure apparatus for exposing a pattern of an original onto a substrate. Has a data log dedicated memory that can be read by, the data log dedicated memory can be separated from the inside of the exposure apparatus, between the occurrence of an error in the exposure apparatus and the stop of the exposure apparatus, or after the stop of the exposure apparatus Means for storing detailed data of the error in the data log dedicated memory. With this configuration and the like, the above object can be achieved.

In the present invention, the means for storing in the data log dedicated memory stores detailed data of the error in the data log dedicated memory in the case of a serious error such that the exposure apparatus stops. Preferably, there is. With this configuration and the like, it is possible to solve problems such as prevention of reoccurrence of a serious error.

The exposure apparatus further includes a CPU for writing data to the data log dedicated memory, and a power supply (uninterruptible power supply) different from the power supply of the exposure apparatus to at least the data log dedicated memory and the CPU. ). With this configuration and the like, data can be stored even after the exposure apparatus is stopped.

In the exposure apparatus, a normally open type relay is provided on an output line of a power supply different from the power supply of the exposure apparatus for the data log dedicated memory and the CPU. When an emergency stop circuit (EMO circuit) is activated, the relay is opened and power supply to the exposure apparatus can be stopped. With this configuration and the like, it is possible to conform to the safety standards of the semiconductor manufacturing apparatus.

The data log dedicated memory is provided separately from the first external memory for storing at least one of an operation system (OS), an application, and measurement data used in the exposure apparatus. It is preferably a second external memory for storing error information and operation logs of the device. With this configuration and the like, even small-capacity memories can be stored, and the number of times of writing can be reduced.

The error information and the operation log are stored in the first external memory in the case of an error that does not reach the abnormal stop of the exposure apparatus, and the error information and the operation log are stored in the first external memory. In this case, it is preferable that the data is automatically stored in the second external memory. With this configuration and the like, the operation of the exposure apparatus according to claim 4 can be further achieved.

[0012] Further, it is possible to have means for allowing an operator to copy information in the first external memory to the second external memory by an apparatus operation unit when the exposure apparatus operates. With this configuration and the like, various information regarding the exposure apparatus can be easily taken in by a general-purpose personal computer, and data can be sent to the developer quickly using electronic mail or the like.

The data log dedicated memory is a PC card type flash memory that can be used in a general-purpose notebook personal computer, and the flash memory can be used for storing error information and operation logs. With this configuration and the like, it is possible to easily confirm data on the spot.

[0014] Preferably, a database is constructed in the second external memory, and at least one of detailed information and countermeasures relating to the error is stored. With this configuration and the like, abnormality analysis of the exposure apparatus can be quickly performed.

Further, the exposure apparatus has a control unit for detecting an abnormality due to occurrence of an error, a means for judging the degree of the abnormality detected by the control unit in a stepwise manner, and a power supply for the exposure apparatus based on the degree of the abnormality. Means for determining whether or not to stop (OFF). With this configuration and the like, it is possible to realize an effective data log function in addition to the above operation.

A method of manufacturing a semiconductor device using an exposure apparatus according to the present invention comprises the steps of: installing a manufacturing apparatus group for various processes including the exposure apparatus in a semiconductor manufacturing plant; and performing a plurality of processes using the manufacturing apparatus group. And a step of manufacturing

The method of manufacturing a semiconductor device according to the present invention may further comprise a step of connecting the group of manufacturing apparatuses via a local area network, and a step of connecting the group of manufacturing apparatuses between the local area network and an external network outside the semiconductor manufacturing factory. And data communication of information on at least one of the devices.

Further, according to the semiconductor device manufacturing method of the present invention, a database provided by a vendor or a user of the exposure apparatus is accessed via the external network to obtain maintenance information of the manufacturing apparatus by data communication.
Alternatively, production management can be performed by performing data communication between the semiconductor manufacturing plant and another semiconductor manufacturing plant via the external network.

A semiconductor manufacturing plant accommodating the exposure apparatus of the present invention includes a manufacturing apparatus group for various processes including the above-described exposure apparatus, a local area network connecting the manufacturing apparatus group, and a local area network connected to the outside of the factory. The information processing apparatus may include a gateway that enables access to an external network, and may enable data communication of information on at least one of the manufacturing apparatuses.

The method for maintaining an exposure apparatus according to the present invention is a method for maintaining an exposure apparatus installed in a semiconductor manufacturing plant,
A step of providing a maintenance database connected to an external network of a semiconductor manufacturing plant by a vendor or a user of the exposure apparatus, and a step of permitting access to the maintenance database from the inside of the semiconductor manufacturing factory via the external network. Transmitting the maintenance information stored in the maintenance database to the semiconductor manufacturing factory via the external network.

The exposure apparatus according to the present invention is the exposure apparatus, wherein a display, a network interface,
A computer that executes network software, so that the maintenance information of the exposure apparatus can be data-communicated via a computer network.

Furthermore, the network software provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed. Then, it is possible to obtain information from the database via the external network.

[0023]

Next, an embodiment of the present invention will be described in detail with reference to the drawings. [First Embodiment] FIG. 1 is a block diagram showing an electric circuit configuration of an exposure apparatus used for manufacturing a semiconductor or the like according to a first embodiment of the present invention.

In the figure, a workstation (EW)
S) 101 is located at the highest level of the apparatus control unit and controls the exposure apparatus. The EWS operation panel unit 102
Is a man interface unit that includes a display, a keyboard, a mouse, and the like, and that operates the exposure apparatus or displays information related to the exposure apparatus. Reference numeral 103 denotes a main CPU, which is located below the EWS 101;
C that controls and controls each unit in the apparatus according to a command from the WS 101 or an operation sequence of the main CPU 103
PU. 104 is a control unit for each unit,
It is configured as a unit such as a wafer stage drive unit, a focus detection unit, a transfer system, and an illumination system. Each unit control unit 104 is a main CPU 1
The operation is performed according to the instruction from 03.

Reference numeral 105 denotes a non-volatile storage device, which is an external memory (first external memory) such as a hard disk. An operation system (OS) and a database are built in the memory 105, and are used for storing error codes, error messages, display contents (measures), device control parameters, measured value data, operation logs, and the like. Used.

Reference numeral 106 denotes a power supply control unit of the exposure apparatus. The power supply control unit 106 has a function of shutting down the device power supply in response to a command from the main CPU 103 or detecting an abnormality in the power supply control unit 106 when a device abnormality that involves a danger occurs without turning off the device power supply. Have.

Reference numeral 107 denotes an external memory (second external memory) for storing data like the external memory 105. Here, the difference between the first external memory 105 and the second external memory 107 will be described. First external memory 105
Stores a database, an EWS 101, a program executed by the main CPU 103, an OS, and the like, and thus requires a large-capacity storage device. For example, a nonvolatile magnetic circuit and a storage device using a magnetic material are used. On the other hand, the second external memory 107 is dedicated to error information and operation logs (memory dedicated to data logs), has a small capacity, can be easily removed (separated) from the exposure apparatus, and can be easily connected to a general-purpose personal computer (PC). It is a memory that can be connected (data can be read). In recent notebook personal computers, a PC card slot is standardized, and a PC card type flash (FLASH) memory is generally used. Therefore, it is optimal to use the FLASH memory of the PC card. The data format to be stored is
It is preferable to use a text format so that error information and operation log information can be confirmed from any PC. Also, recently, large-capacity FLASH memory has been released, so we built applications and databases, etc.
Detailed information on the abnormal status, a countermeasure, and the like are stored in the second external memory 107 in advance.

Reference numeral 108 denotes an uninterruptible power supply (UPS). This is a protection power supply for equipment that may be damaged if the power suddenly goes down when a power failure or emergency stop circuit is activated. For example, a device that may be damaged is a workstation. In this embodiment, not only the workstation 101 but also the main CPU 103, the external memories 105 and 107, and the power control unit 106 are connected to the UPS 10.
8 to supply power. Power control unit 106
Is a configuration that can be supplied from the facility power supply and the uninterruptible power supply 108.

Next, a description will be given of a process in a case where an abnormality is detected by a certain unit control section 104 and the abnormality requires that the power of the apparatus be turned off. FIG. 2 illustrates a main CPU according to the present embodiment.
103 is a processing flowchart when an error is received. Hereinafter, this embodiment will be described with reference to FIGS.

When an abnormality is detected by a certain unit control unit 104, the unit control unit 104 transmits the abnormality status to the main CPU 103 located at a higher position. Upon receiving the abnormal status, the main CPU 103 determines the degree of the abnormal status. In this determination, it is determined stepwise such that the power supply of the apparatus is 0FF, the exposure apparatus is stopped without turning off the power, and the apparatus operation can be continued at a warning level (step S201).

From the determination result of step S201, it is determined in step S202 that the power supply of the apparatus is to be turned off in step S205, and that the power supply is not turned off in step S205.
The process branches to step 203 (in step S202, it is determined whether the power is to be turned off).

When the power is not turned off (step S2)
02 (NO in step S20), the abnormal status is stored in the first external memory 105 (step S20).
3). This abnormal status is stored in the first external memory 105
And do not overwrite it, and keep it as a history. Thereafter, in step S204, a stop command is issued to each unit to stop the operation of the apparatus, and the abnormal status is displayed on the apparatus display. In the case of a warning or the like, only the abnormal status is displayed without issuing a stop command, and the operation returns to the normal operation again or the power is not turned off but the operation is stopped.

Next, when it is determined that a serious error requires the power supply of the apparatus to be turned off (YE in step S202).
In the case of S), the power supply control unit 1
06 (step S205). After the transmission, in step S206, the process transits to the shutdown sequence,
In order to prevent the exposure apparatus from being affected even if the power is turned off, an operation stop command is issued to each unit, a communication socket is closed, and the like.

Here, the operation of the power supply control unit 106 when the power supply OFF command in step S205 is transmitted will be described.
After receiving the power-off command, the power control unit 106 counts the timer immediately without turning off the power, and turns off the power unilaterally after a certain delay. One-sided power-down is performed in order to ensure that the power can not be turned off when the main CPU 103 is fitted or a communication-related trouble occurs when waiting for a processing end signal from the main CPU 103. It is. In this delay, a time in which the shutdown processing of the main CPU 103 can be completed is set.

After the shutdown sequence in step S206, the power of the apparatus has been turned off. However,
Since the workstation 101, the main CPU 103, and the second external memory 107 are supplied with power from an uninterruptible power supply separately from the apparatus power supply, they can operate even after the apparatus power is turned off. In step S207, unlike step S203, the abnormal status is stored in the second external memory 107. Above, the abnormality is detected by the unit control unit 104,
This is an explanation of the processing when the abnormality requires the power of the apparatus to be turned off.

In the above-described embodiment, the data storage example of only the abnormal status is shown. However, not only the abnormal status but also the history (operation log) of the operation by the operator on the man interface unit 102 is stored in the second external memory 107. To take the form. This operation history is stored in the workstation 1
01 may always be stored in the second external memory 107, or normally written to the first external memory 105 to minimize the number of times of writing to the second external memory 107, and the power of the apparatus is turned off. When such an abnormality occurs, the power may be turned off, and then the data may be copied from the first external memory 105 to the second external memory 107 while the uninterruptible power supply 108 is operating.

The external memories 105 and 107 store data (information) in the first external memory 105 by an operation (by an operator) from a device operation panel unit (device operation unit) 102.
Is provided in the second external memory 107 so that an abnormal status other than the device stoppage, an operation log, and the like can be taken into a general-purpose notebook computer when necessary. In recent years, since information transmission means such as e-mail has been remarkably developed, data taken in by a PC can be sent to a developer as soon as possible, and troubles at a user can be smoothly dealt with.

A database in the second external memory 107;
By constructing an application and storing detailed information and countermeasures regarding the abnormal status in the memory 107 in advance, an engineer performing device repair accesses the database on the PC using the abnormal status as a keyword to obtain detailed information. , You can see what to do. In addition, since the confirmation can be made with a general-purpose notebook computer, the second external memory 107 can be taken out from the exposure apparatus that has stopped abnormally, and the data can be confirmed on the spot.

[Second Embodiment] In the first embodiment, the main CPU 103 is controlled by the unit control unit 104.
The processing operation of receiving the abnormal status from the server and turning off the power of the apparatus and storing the power in the second external memory 107 has been described. In the case of the first embodiment, the unit control unit 104 → the main CPU 103 → the power supply control unit 106 after the occurrence of the device abnormality.
In the case of a device abnormality that requires immediate power-down, a delay such as communication time until the device power-down becomes a problem. For example, there is a high risk of a failure in temperature control of a temperature controller to keep the temperature inside the device constant, a rise / fall in coolant pressure to suppress a rise in temperature of a heat-generating device, and leakage of cooling water. It is necessary to drop the exposure device. Conventionally, a power supply control unit 106 detects a device abnormality or the like that needs to be turned off immediately, and when it detects the power supply, the power supply is immediately turned off in preference to saving the abnormal status. FIG. 3 is a processing flowchart when an error is detected by the power supply control unit 106 according to the second embodiment. Hereinafter, this embodiment will be described with reference to FIGS.

When the power supply control unit 106 detects an apparatus abnormality (step S301), it is determined in step S302 whether or not the power of the exposure apparatus is turned off based on the abnormality status. When the power is not turned off (step S3
(NO at 02), the abnormal status is transmitted to the main CPU 103 (step S303), and the main CPU 103 having received the abnormal status performs the operation described in the first embodiment.

If it is determined in step S302 that the power is off (YES in step S302)
Includes a main CPU 103 and a workstation 101
A signal (fail signal) for notifying that the power is to be turned off is sent (step S304). Thereafter, steps S304 to S305 and S308
The workstation 101 and the main CPU 10
Then, a signal (fail signal) for turning off the power is transmitted to 3.

Here, the failure signal is received (step S
The workstation that has performed 305) stores the operation log in the second external memory 107 (step S306), and then shuts down (step S307). The main CPU 103 that has received the fail signal (step S308) waits for transmission of an abnormal status from the power supply control unit 106 (step S309).

The power supply control unit 106 will be described again. After transmitting the fail signal in step S304, the apparatus power supply is turned off.
FF (step S310), and sends an abnormal status to the main CPU 103 (step S311). When the main CPU 103 receives the information (in the case of YES in step S309), the abnormal status is stored in the second external memory 107 (step S312), and the process of writing data is completed. If no abnormal status is received in step S309, the process waits for an abnormal status (NO loop).

The power control unit 10 that has transmitted the abnormal status
In step S311 on the sixth side, after a certain delay (step S313), the uninterruptible power supply 108
Is shut down (step S314). This delay needs to be long enough to shut down the workstation 101 (step S307) and store the abnormal status by the main CPU 103 (step S312). Alternatively, the uninterruptible power supply 108 may be turned off after receiving an end signal from the workstation 101 and the main CPU 103.

[Third Embodiment] The first and second embodiments described above
In this embodiment, the case where the operator operates the emergency stop circuit is not considered, and the main CPU 103 and the external memories 105 and 107 are configured to be supplied with power from the uninterruptible power supply 108. Even in this case, the main CPU 103 and the external memories 105 and 107 are operating. However, if the emergency stop circuit is activated,
This would violate the safety standard of the exposure apparatus that power must not be supplied in the apparatus and there must be no unit that operates. Therefore, a case where an emergency stop circuit is considered will be described as a third embodiment. FIG. 4 is a block diagram showing an electric circuit configuration of an exposure apparatus in consideration of an emergency stop circuit according to the third embodiment.

The description of 301 to 308 in FIG. 4 is the same as that of FIG. 1 described above, and thus will be omitted, and only the configuration different from that of FIG. 1 will be described. Reference numeral 309 denotes an emergency stop circuit (EMO circuit), which is a circuit for converting a power supply from the equipment into DC 24V. DC24 output from the emergency stop circuit 309
The V line turns on / off the main power line as shown in FIG.
A relay 310 for turning off and a relay 311 for turning on / off an output line from the uninterruptible power supply 308
Through an emergency stop SW 312 for the operator to emergency stop the exposure apparatus. A main CPU 303 and external memories 305 and 307 are connected to the output line of an uninterruptible power supply 308 having a relay 311. Workstation (EWS) 301
Since the power supply may be damaged if the power is suddenly dropped during operation, it is not connected via a relay so that power can be supplied even when the emergency stop circuit 309 operates. Also, relays 310 and 311
Uses normally open type relays.

When the operator presses the emergency stop SW 312, the DC 24 V line is cut off, and the relays 310 and 311 are opened.
08 can be cut off. Therefore, when the emergency stop circuit 309 operates, the main CPU 3
03. The external memories 305 and 307 can be stopped, and the safety standard of the exposure apparatus can be satisfied.

[Embodiment of Semiconductor Production System] Next, a device such as a semiconductor (I
An example of a production system for a semiconductor chip such as C or LSI, a liquid crystal panel, a CCD, a thin-film magnetic head, a micromachine, etc.) will be described. In this method, maintenance services such as troubleshooting and periodic maintenance of a manufacturing apparatus installed in a semiconductor manufacturing factory or provision of software are performed using a computer network outside the manufacturing factory.

FIG. 5 shows the whole system cut out from a certain angle. In the figure, reference numeral 501 denotes a business office of a vendor (equipment maker) that provides an apparatus for manufacturing semiconductor devices. As an example of a manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing plant, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film formation equipment,
It is assumed that flattening equipment and the like and post-processing equipment (assembly equipment, inspection equipment, etc.) are used. A host management system 50 that provides a maintenance database for manufacturing equipment is located in the business office 501.
8, a plurality of operation terminal computers 510, and a local area network (LAN) 509 connecting these to construct an intranet or the like. Host management system 5
Reference numeral 08 includes a gateway for connecting the LAN 509 to the Internet 505, which is an external network of the business office, and a security function for restricting external access.

On the other hand, 502 to 504 are manufacturing factories of a semiconductor manufacturer as users of the manufacturing apparatus. The manufacturing factories 502 to 504 may be factories belonging to different manufacturers, or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 502 to 504, a plurality of manufacturing apparatuses 506, a local area network (LAN) 511 connecting them to construct an intranet or the like, and a monitoring apparatus for monitoring the operation status of each manufacturing apparatus 506 are provided. A management system 507 is provided. Each factory 5
Host management system 507 provided in each of 02 to 504
Has a gateway for connecting the LAN 511 in each factory to the Internet 505 which is an external network of the factory. As a result, the LAN 511 of each factory can access the host management system 508 on the vendor 501 side via the Internet 505, and only the users limited by the security function of the host management system 508 are permitted to access. In particular,
Via the Internet 505, status information indicating the operation status of each manufacturing apparatus 506 (for example, a symptom of the manufacturing apparatus in which a trouble has occurred) is notified from the factory side to the vendor side, and response information corresponding to the notification (for example, (Information for instructing a coping method for the trouble, software and data for coping), and maintenance information such as the latest software and help information can be received from the vendor side. Each factory 5
02-504 and the vendor 501, and data communication on the LAN 511 in each factory, a communication protocol (TC) generally used on the Internet is used.
P / IP) is used. Instead of using the Internet as an external network outside the factory, it is also possible to use a dedicated line network (such as ISDN) that is not accessible from a third party and has high security. Further, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network, and permit access from a plurality of factories of the user to the database.

FIG. 6 is a conceptual diagram showing the entire system according to the present embodiment cut out from a different angle from FIG. In the above example, a plurality of user factories each having a manufacturing device and a management system of a vendor of the manufacturing device are connected via an external network, and the production management of each factory and at least one device are connected via the external network. Data communication of the information of the manufacturing apparatus. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors is connected to a management system of each of the plurality of manufacturing equipments via an external network outside the factory, and maintenance information of each manufacturing equipment is stored. It is for data communication. In the figure, reference numeral 601 denotes a manufacturing factory of a manufacturing apparatus user (semiconductor device manufacturer), and a manufacturing line for performing various processes, such as an exposure apparatus 602, a resist processing apparatus 603,
A film forming apparatus 604 is introduced. Although only one manufacturing factory 601 is illustrated in FIG. 6, a plurality of factories are actually networked similarly. Each device in the factory is connected via a LAN 606 to form an intranet or the like, and a host management system 605 manages the operation of the production line. On the other hand, an exposure apparatus manufacturer 610, a resist processing apparatus manufacturer 620, a film forming apparatus manufacturer 630, etc.
Each business establishment of the vendor (equipment supplier) is provided with a host management system 611, 621, 631 for remote maintenance of the supplied equipment, and these are provided with a maintenance database and an external network gateway as described above. . The host management system 605 that manages each device in the user's manufacturing factory and the management systems 611, 621, and 631 of the vendors of each device are connected to the external network 60.
0 or a dedicated line network. In this system, if a trouble occurs in any of a series of manufacturing equipment in the manufacturing line, the operation of the manufacturing line is stopped, but remote maintenance is performed from the vendor of the troubled equipment via the Internet 600. As a result, quick response is possible, and downtime of the production line can be minimized.

Each manufacturing apparatus installed in the semiconductor manufacturing factory has a display, a network interface, and a computer for executing network access software and apparatus operation software stored in a storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 7 on a display. The operator who manages the manufacturing equipment at each factory, refers to the screen and refers to the manufacturing equipment model 70
1, serial number 702, trouble subject 703,
Date of occurrence 704, urgency 705, symptom 706, coping method 70
7. Information such as progress 708 is input to input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the resulting appropriate maintenance information is returned from the maintenance database and presented on the display. The user interface provided by the web browser further includes a hyperlink function 71 as shown in the figure.
0,711,712, the operator can access more detailed information of each item, extract the latest version of software used for manufacturing equipment from the software library provided by the vendor, and provide it to the factory operator for reference. An operation guide (help information) can be pulled out. Here, the maintenance information provided by the maintenance database includes the information on the present invention described above, and the software library also provides the latest software for realizing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG.
1 shows a flow of an overall semiconductor device manufacturing process. In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and an assembly process (dicing, dicing,
Bonding), an assembly process such as a packaging process (chip encapsulation) and the like. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Also, between the pre-process factory and the post-process factory,
Information and the like for production management and device maintenance are communicated via the Internet or a dedicated line network.

FIG. 9 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Productivity can be improved.

[0055]

As described above, the first embodiment according to the present application is described.
According to the invention, a function (means) is provided for storing detailed data of a serious error such as a stop of the apparatus until the apparatus stops after an error occurs or after the stop. By using a memory dedicated to a data log, which can separate the memory from the data and can read error data with a general-purpose PC, it is possible to solve the conventional problems such as a long data analysis time.

According to the second aspect of the present invention, for a serious error such as a stop of the exposure apparatus, the detailed data of the error is stored in the data log dedicated memory.
It is possible to avoid such a problem that no information about the abnormality remains and time is spent for restoring the exposure apparatus.

According to the third aspect of the present invention, in the means for storing detailed data of an error, at least a data log dedicated memory and a CPU for writing data into the data log dedicated memory are connected to a power supply (UPS) separate from the apparatus power supply. ), Power can be stored after the device is stopped, which is the first invention.

According to the fourth invention of the present application, when the emergency stop circuit (EMO) is activated, the data log dedicated memory and the function of stopping the separate power supply of the CPU are provided. The first invention that satisfies the safety standard of the device can be easily configured.

According to the fifth aspect of the present invention, the data log dedicated memory is used for the exposure apparatus, and separate from the OS, application, and the first external memory for storing measurement data. Is used as the second external memory for saving the data, a small-capacity memory can be saved, and the number of times of writing can be reduced.

According to the sixth aspect of the present invention, an error that does not lead to a stop of the device is stored in a memory such as an OS or an application, and a serious error such as a stop of the device is automatically detected after the stop of the device. Error information and operation log to the second
The fifth invention can be further achieved by storing in a dedicated memory.

According to the seventh aspect of the present invention, the exposure apparatus is provided with a function that allows an operator to copy information in the first external memory to the second external memory by using the apparatus operation unit when the apparatus is operating. Various information can be easily confirmed on a general-purpose PC. In addition, data can be sent to the developer immediately using e-mail or the like, and information can be smoothly transmitted.

According to the eighth aspect of the present invention, a PC card type FLAS usable in a general-purpose notebook personal computer is provided.
By using the H memory for storing the error information and the operation log, the data can be easily confirmed on the spot.

According to the ninth aspect of the present invention, by storing detailed information on errors and how to deal with them by constructing an error database in the second external memory, it is possible to quickly analyze a device abnormality. become.

According to the tenth aspect of the present invention, the means for judging the degree of abnormality stepwise and the power supply of the exposure apparatus are turned off.
An exposure apparatus having a more effective data log function in addition to the above effects can be provided by means for determining whether or not to perform F.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an electric circuit configuration of an exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a processing flowchart when the main CPU in FIG. 1 receives an error.

FIG. 3 is a processing flowchart when an error is detected by a power supply control unit according to a second embodiment.

FIG. 4 is an electric block diagram in a semiconductor exposure apparatus in consideration of an emergency stop circuit according to a third embodiment.

FIG. 5 is a conceptual view of a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention, as viewed from a certain angle.

FIG. 6 is a conceptual view of a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention, as viewed from another angle.

FIG. 7 is a diagram showing a specific example of a user interface in a semiconductor device production system including an exposure apparatus according to one embodiment of the present invention.

FIG. 8 is a diagram illustrating a flow of a device manufacturing process by the exposure apparatus according to one embodiment of the present invention.

FIG. 9 is a view for explaining a wafer process by the exposure apparatus according to one embodiment of the present invention.

[Explanation of symbols]

101, 301: workstation, 102, 30
2: operation panel unit, 103, 303: main CPU, 1
04, 304: unit control section, 105, 305: first
External memory, 106, 306: power supply control unit, 107, 3
07: second external memory, 108, 308: uninterruptible power supply,
309: Emergency stop circuit (EM0), 310, 311: Relay, S312: Emergency stop SW, 501: Vendor's office, 502, 503, 504: Manufacturing factory, 505: Internet, 506: Manufacturing equipment, 507: Factory Host management system, 508: vendor-side host management system, 509: vendor-side local area network (LAN), 510: operation terminal computer, 511:
Factory Local Area Network (LAN), 60
0: external network, 601: manufacturing apparatus user's manufacturing factory, 602: exposure apparatus, 603: resist processing apparatus,
604: film forming apparatus, 605: factory host management system, 606: factory local area network (L
AN), 610: Exposure equipment maker, 611: Host management system of the business of the exposure equipment maker, 620: Resist processing equipment maker, 621: Host management system of the business of the resist processing equipment maker, 630: Film forming equipment maker
631: host management system of a business site of a film forming apparatus maker, 701: model of a manufacturing apparatus, 702: serial number, 703: subject of trouble, 704: date of occurrence, 70
5: urgency, 706: symptom, 707: remedy, 708:
Progress, 710, 711, 712: hyperlink function.

Claims (17)

[Claims] 1. An exposure apparatus for exposing a pattern of an original onto a substrate, comprising: a data log memory that can store error information in the exposure apparatus and can be read by a general-purpose personal computer; Means for storing a log-dedicated memory in which the detailed data of the error can be stored in the data log-dedicated memory from the occurrence of an error in the exposure apparatus until the exposure apparatus is stopped, or after the exposure apparatus is stopped. Exposure apparatus characterized by the above-mentioned. 2. The method according to claim 1, wherein the storing unit stores the detailed data of the error in the data log dedicated memory in the case of a serious error such that the exposure apparatus stops. The exposure apparatus according to claim 1, wherein: 3. The exposure apparatus according to claim 1, further comprising a CPU for writing data to the data log dedicated memory, wherein at least the data log dedicated memory and the CPU have a power supply different from a power supply of the exposure apparatus. The exposure apparatus according to claim 1 or 2, wherein 4. The exposure apparatus has a normally open type relay on an output line of a power supply different from a power supply of the exposure apparatus for the data log dedicated memory and the CPU. If the emergency stop circuit is activated,
The exposure apparatus according to claim 1, wherein the relay is opened to stop supplying power to the exposure apparatus. 5. The data log dedicated memory includes at least an operation system used in the exposure apparatus.
A second external memory for storing error information and an operation log of the exposure apparatus, separately from a first external memory for storing any of an application and measurement data. An exposure apparatus according to any one of claims 1 to 4. 6. The error information and the operation log,
In the case of an error that does not reach the abnormal stop of the exposure apparatus, the error is stored in the first external memory, and in the case of a serious error such as the stop of the exposure apparatus, the error is automatically stored in the second external memory. 6. The method according to claim 1, wherein
The exposure apparatus according to any one of the above. 7. An apparatus according to claim 1, further comprising means for allowing an operator to copy information in said first external memory to said second external memory at an operation section of said exposure apparatus. 7. The exposure apparatus according to any one of 6. 8. The data log dedicated memory is a PC card type flash memory usable in a general-purpose notebook personal computer, and the flash memory is used for storing error information and operation logs.
8. The exposure apparatus according to any one of 7. 9. The method according to claim 1, wherein a database is constructed in the second external memory, and at least one of detailed information and a countermeasure regarding the error is stored. Exposure equipment. 10. An exposure apparatus, comprising: a control unit for detecting an abnormality due to occurrence of an error; a unit for determining a degree of the abnormality detected by the control unit in a stepwise manner; and a power supply for the exposure apparatus based on the degree of the abnormality. The exposure apparatus according to any one of claims 1 to 9, further comprising means for determining whether or not to stop the exposure. 11. A step of installing a manufacturing apparatus group for various processes including the exposure apparatus according to claim 1 in a semiconductor manufacturing factory, and a semiconductor device by a plurality of processes using the manufacturing apparatus group. Manufacturing a semiconductor device. 12. A step of connecting the manufacturing equipment group via a local area network, and data communication between at least one of the manufacturing equipment group between the local area network and an external network outside the semiconductor manufacturing plant. 12. The method according to claim 11, further comprising the step of: 13. A semiconductor manufacturing factory different from the semiconductor manufacturing factory by accessing a database provided by a vendor or a user of the exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication. 13. The production management is performed by performing data communication between the device and the external network.
3. The method for manufacturing a semiconductor device according to 1. 14. A manufacturing apparatus group for various processes including the exposure apparatus according to claim 1, a local area network connecting the manufacturing apparatus group, and an external device outside the factory from the local area network. A semiconductor manufacturing plant, comprising: a gateway enabling access to a network; and enabling data communication of information on at least one of the manufacturing apparatus groups. 15. The semiconductor device according to claim 1, which is installed in a semiconductor manufacturing plant.
The maintenance method for an exposure apparatus according to any one of claims 10 to 10, wherein a vendor or a user of the exposure apparatus provides a maintenance database connected to an external network of the semiconductor manufacturing plant; and A step of permitting access to the maintenance database via the external network, and a step of transmitting maintenance information stored in the maintenance database to a semiconductor manufacturing factory via the external network. How to maintain the exposure equipment. 16. The exposure apparatus according to claim 1, further comprising a display, a network interface, and a computer that executes network software, and stores maintenance information of the exposure apparatus via a computer network. An exposure apparatus, which enables data communication. 17. The network software,
Provided on the display is a user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed, and from the database via the external network. The exposure apparatus according to claim 16, wherein information can be obtained.