JP2001338854A - Semiconductor manufacturing apparatus, console part therefor, semiconductor manufacturing system and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To use one console part in common in a plurality of semiconductor manufacturing apparatuses. SOLUTION: The semiconductor manufacturing apparatus is constituted in such a way that a console connection part 7 from or to which the console part 2 can be separated or connected freely even while an apparatus body part 9 is being operated is installed at a communication line 13, which connects an apparatus console part 8 used to control the apparatus body part 9 to the console part 2 for a man-machine interface and that, according to a request for an assistance need or the like, the console part 2 is connected. By realizing the semiconductor manufacturing apparatus which is not equipped with any console part, the low cost, the miniaturization or the like of the semiconductor manufacturing system can be promoted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor manufacturing apparatus for manufacturing a semiconductor device and the like, a console unit of the semiconductor manufacturing apparatus, a semiconductor manufacturing system, and a device manufacturing method.

[0002]

2. Description of the Related Art A semiconductor manufacturing apparatus is provided with a console section for man-machine interface with an operator, and the operator issues various commands and settings from a console section to an apparatus control section such as an exposure apparatus. Receive various information. A console section in a conventional semiconductor manufacturing apparatus will be described below with reference to FIG.

The console unit 502 includes a keyboard, a mouse, a touch panel, a storage medium interface such as an MO drive and an FDD as an input device 504, and a display, a buzzer, a lamp, and a storage medium interface as an output device 505. Console control unit 5
Reference numeral 03 controls these input / output devices.

[0004] The operator inputs commands to start / stop the operation of the apparatus and inputs various information to an apparatus control section 508 which controls the apparatus main body section 509 by using these input / output devices, and inputs various information from the apparatus control section 508. Check the status of the device such as acquisition and error.

In recent years, semiconductor manufacturing plants have become increasingly unmanned and automated, and as shown in FIG.
By performing online control of 01a to 501c using an online communication cable 520, a system has been developed which can be remotely controlled from a host computer 530 in a central control room at another location. In this case, since the input and output of various types of information in the normal manufacturing process can be performed online, the console units 502a to 502c of the semiconductor manufacturing apparatuses 501a to 501c are used less frequently.

[0006] Even in the case of performing such online control, exceptional work different from the normal process that requires assistance by an operator due to some abnormal situation or requires equipment maintenance such as equipment failure or periodic inspection. In order to perform the operation, an operator or a serviceman must operate the apparatus while accessing the apparatus, so that the apparatus requires a console unit.

[0007] In a semiconductor manufacturing plant having no online facilities, a console section is indispensable because an operator naturally operates.

[0008]

However, according to the above-mentioned prior art, as described above, the frequency of use of the console unit in a semiconductor manufacturing apparatus installed in a semiconductor manufacturing factory having an online facility is considerably low, and it is possible that It is considered to be several percent or less of the operation time.

Further, even when the console unit is installed in a semiconductor manufacturing factory having no online facility, the frequency of use of the console unit in each semiconductor manufacturing apparatus will be at most 10%.

[0010] As with various general apparatuses, demands for cost reduction, size reduction, and energy saving are increasing in semiconductor manufacturing apparatuses. From such a viewpoint, there is a great merit in manufacturing a semiconductor manufacturing apparatus in which the console unit which is not frequently used is eliminated.

However, it is difficult to eliminate exceptional operations such as operator follow-up and maintenance due to an assist request, and a console function of a semiconductor manufacturing apparatus is indispensable in a semiconductor manufacturing factory without online facilities. It was difficult to realize the removed semiconductor manufacturing apparatus.

The present invention has been made in view of the above-mentioned unresolved problems of the prior art, and uses a console unit that can be arbitrarily separated and connected to a semiconductor manufacturing apparatus to achieve one unit. A semiconductor manufacturing apparatus and a semiconductor manufacturing apparatus which can contribute to cost reduction, size reduction, energy saving, etc. by sharing the console section of a plurality of semiconductor manufacturing apparatuses and greatly reducing the number of console sections used in the entire semiconductor manufacturing system. It is an object to provide a console unit, a semiconductor manufacturing system, and a device manufacturing method.

[0013]

In order to achieve the above object, a semiconductor manufacturing apparatus according to the present invention connects an apparatus control section for controlling an apparatus main body section, a console section for a man-machine interface, and the apparatus control section. A communication line for connecting the console unit even when the apparatus main body is in operation.

It is preferable that a console separation prohibition locking means configured to determine that the communication line is communicating and prohibit separation of the console unit is provided.

It is preferable that the connection section of the communication line includes a termination circuit for stabilizing the communication signal.

[0016] The connection section of the communication line may include a wireless communication device for transmitting data to and from the console section by wireless.

The console section of the semiconductor manufacturing apparatus of the present invention is a console section for a man-machine interface connected to an apparatus control section for controlling the apparatus body section of the semiconductor manufacturing apparatus. A connection unit configured to be connected to or separated from the communication line of the device control unit is provided.

The semiconductor manufacturing system of the present invention has a plurality of semiconductor manufacturing apparatuses and a console section for a man-machine interface which can be selectively connected to an apparatus control section of each semiconductor manufacturing apparatus. And a communication line having a connection unit configured to be able to disconnect or connect the console unit even when the apparatus main body unit is operating.

An on-line facility for controlling a plurality of semiconductor manufacturing apparatuses by a host computer may be provided.

[0020]

By sharing one console for a plurality of semiconductor manufacturing apparatuses, the number of consoles in the entire semiconductor manufacturing system can be reduced. This can greatly contribute to reduction of equipment cost, size reduction, energy saving, and the like in a semiconductor manufacturing plant.

[0021]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram showing a semiconductor manufacturing apparatus according to the first embodiment.

The console unit 2 of the semiconductor manufacturing apparatus 1
The input device 4 includes a keyboard, a mouse, a touch panel, a storage medium interface such as an MO drive and an FDD, and the like, and the output device 5 includes a display, a buzzer, a lamp, a storage medium interface, and the like. The console control unit 3 controls these information input / output devices.

The console section 2 is connected to the apparatus control section 8 and the apparatus power supply section 10 via a console connection section 7 as a connection section. Information is exchanged with a device control unit 8 that controls the device body 9 through a communication line 13, and a power supply line 14 is supplied from a device power supply unit 10 that supplies power to each unit of the device.
Power is supplied to the console battery 6 which is the power supply of the console unit 2 through the power supply.

The console section 2 can be separated from the semiconductor manufacturing apparatus 1 by a console connection section 7. In order to enable the console unit 2 to be separated even during operation of the device,
For connection of the power supply line 14 at the console connection section 7, a hot swap type having a long ground terminal is used.

Since a termination circuit means is required for stabilizing the communication signal of the communication line 13, a detachable termination circuit 18 is provided in the console connection section 7, as shown in FIG. When the console is connected, the terminating circuit 18 is disabled (see FIG. 3A), the terminating circuit 17 in the console section 2 is used, and when the console section is separated, the terminating circuit 18 is enabled (see FIG. 3). (B)). In this way, the communication line 13 can be stabilized both when the console unit 2 is connected and when the console unit 2 is disconnected.

The operator inputs commands to start and stop the operation of the apparatus from the console unit 2, inputs various information, and obtains various information from the apparatus control unit 8. At this time, the device control unit 8 and the console unit 2 perform communication. However, if the console unit 2 is separated during this communication, a communication error or the like causes the device control unit 8 to communicate with the console unit 2.
May not be able to operate normally. Therefore, the device control unit 8 displays the separation prohibition on the output device 5 of the console unit 2 during communication with the console unit 2. Further, the console unit 2 is physically prohibited from being separated by the lock means 15 for console separation prohibition.

In this way, it is possible to safely connect and disconnect the console unit 2 even during operation of the apparatus.

The console unit 2 is connected to the semiconductor manufacturing apparatus 1
In the case of separation from the console unit, the operator notifies the console control unit 8 of a console unit separation request from the console unit 2.
If the device control unit 8 is currently communicating with the console control unit 3, it waits for it to end, and the communication to the console control unit 3 is output and stored in the storage device 11 instead,
A separation permission display is performed on the console unit 2.

After the display of the permission to separate the console unit 2 is performed, the operator may separate the console unit 2.
The device control unit 8 continues device control according to the command from the console unit 2 up to that time.

Further, the semiconductor control device 1 from which the console section 2 is separated can connect the console section 2 at any time. The console control unit 3 monitors the power supply from the power supply line 14, and when the power supply is confirmed, notifies the device control unit 8 via the communication line 13 that the console unit 2 is connected. Upon receiving this notification, the device control unit 8 switches the output to the storage device 11 to the output to the console. When the operator wants to know the output from the apparatus control unit 8 up to that time, he can request the output of the saved information from the console unit 2 to call out the output information at the time of console separation.

When an assist request to the operator is generated due to an error or the like during the separation of the console, the device control unit 8 causes the assist request output means 12 to display an assist request in conjunction with the buzzer function. The operator connects the console unit 2 to check the contents of the assist request and respond.

As shown in FIG. 2, when a plurality of semiconductor manufacturing apparatuses 1a to 1c are installed in a semiconductor manufacturing factory using a semiconductor manufacturing system having an online facility, the console unit 2 controls the plurality of apparatuses. You only need one. Normal operations are performed from the host computer 31 through the online communication cable 30. At the time of an assist request or maintenance, the operator selectively connects the console unit 2 to, for example, the semiconductor manufacturing apparatus 1a, and performs assistance and maintenance while checking the operation and state of the apparatus from the console unit 2.

According to the present embodiment, a single console section is shared by a plurality of semiconductor manufacturing apparatuses, thereby realizing a semiconductor manufacturing apparatus having a console function without having a console section. Compared to a case where a console unit is provided in each of a plurality of semiconductor manufacturing apparatuses, the number of console units in the entire semiconductor manufacturing system can be reduced, which can greatly contribute to reduction in apparatus cost, downsizing of the apparatus, energy saving, and the like.

FIG. 4 shows the second embodiment. The difference from the first embodiment is that the console connection unit is made wireless. The console control unit 3 and the device control unit 8 each include a wireless communication device 19, and communication between the console control unit 3 and the device control unit 8 is performed wirelessly.

The semiconductor manufacturing apparatus 1, the console unit 2, the console control unit 3, the input device 4, the output device 5, the console battery 6, the device control unit 8, the device main unit 9, and the like are the same as those in the first embodiment. Therefore, they are represented by the same reference numerals and description thereof is omitted.

The power supply to the console unit 2 uses a non-contact charging device 20, and the console battery 6 is charged when the console unit 2 is located at a chargeable position. This makes it easier to separate the console.

According to the present embodiment, it is not necessary to use the console unit at a fixed position of the semiconductor manufacturing apparatus, so that it is possible to perform the operation by moving the console unit to a position necessary for the operation, and to improve the working efficiency. The advantage of improvement is added. The other points are the same as in the first embodiment.

Next, a semiconductor device (a semiconductor chip such as an IC or an LSI, a liquid crystal panel,
An example of a production system of a CD, a thin-film magnetic head, a micromachine, and the like will be described. This is a semiconductor manufacturing system that performs maintenance services such as troubleshooting and regular maintenance of a manufacturing apparatus installed in a semiconductor manufacturing factory or provision of software using a computer network outside the manufacturing factory.

FIG. 5 shows the whole system cut out from a certain angle. In the figure, reference numeral 101 denotes a business office of a vendor (equipment supplier) that provides a semiconductor device manufacturing apparatus. As an example of a manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing plant, for example,
It is assumed that equipment for the pre-process (exposure apparatus, resist processing apparatus, heat treatment apparatus, film forming apparatus, etc.) and equipment for the post-process (assembly apparatus, inspection apparatus, etc.). In the business office 101, a host management system 10 for providing a maintenance database of manufacturing equipment
8. It has a plurality of operation terminal computers 110 and a local area network (LAN) 109 connecting these to construct an intranet. Host management system 10
Reference numeral 8 includes a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the business office, and a security function for restricting external access.

On the other hand, reference numerals 102 to 104 denote manufacturing factories of a semiconductor manufacturer as a user of the manufacturing apparatus. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers, or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106 and a local area network (LAN) 11 for connecting them to construct an intranet.
1 and a host management system 107 as a monitoring device for monitoring the operation status of each manufacturing apparatus 106.
The host management system 107 provided in each of the factories 102 to 104 includes a gateway for connecting the LAN 111 in each of the factories to the Internet 105 which is an external network of the factory. As a result, the LAN 111 of each factory
Can access the host management system 108 on the side of the vendor 101 via the Internet 105, and only the users limited by the security function of the host management system 108 are permitted to access. Specifically, each manufacturing apparatus 1 is connected via the Internet 105.
In addition to notifying the vendor of status information indicating the operating status of the device 06 (for example, a symptom of a manufacturing apparatus in which a trouble has occurred), response information corresponding to the notification (for example, information indicating a solution to the trouble, (Software and data for coping), the latest software, and maintenance information such as help information can be received from the vendor. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between each of the factories 102 to 104 and the vendor 101 and data communication with the LAN 111 in each of the factories. Instead of using the Internet as an external network outside the factory, it is also possible to use a dedicated line network (such as ISDN) which is not accessible from a third party and has high security. Further, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network, and permit a plurality of user factories to access the database.

FIG. 6 is a conceptual diagram showing the entire system according to the present embodiment cut out from another angle than that shown in FIG. In the above example, a plurality of user factories each having a manufacturing device and a management system of a vendor of the manufacturing device are connected via an external network, and the production management of each factory and at least one device are connected via the external network. The data of the manufacturing apparatus was communicated. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors is connected to a management system of each of the plurality of manufacturing equipments via an external network outside the factory, and maintenance information of each manufacturing equipment is stored. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturer);
Manufacturing equipment that performs various processes on the production line of the factory,
Here, as an example, the exposure apparatus 202 and the resist processing apparatus 2
03, a film forming apparatus 204 is introduced. FIG. 7
Although only one manufacturing factory 201 is illustrated, a plurality of factories are actually networked in the same manner. Each device in the factory is connected by a LAN 206 to form an intranet, and the host management system 205 manages the operation of the production line. On the other hand, an exposure apparatus maker 210, a resist processing apparatus maker 220, and a film forming apparatus maker 230
Each of the offices of a vendor (equipment supplier) is provided with host management systems 211, 221, and 231 for performing remote maintenance of the supplied equipment. As described above, these host databases are provided with a maintenance database and an external network gateway. Prepare. The host management system 205 that manages each device in the user's manufacturing factory and the management systems 211, 221, and 231 of the vendors of each device are connected by the external network 200, ie, the Internet or a dedicated line network. In this system, if a trouble occurs in any of a series of manufacturing equipment on the production line, the operation of the production line will be stopped,
Troubled Equipment Vendor Internet 20
By receiving the remote maintenance via the network 0, quick response is possible, and downtime of the production line can be minimized.

Each of the manufacturing apparatuses installed in the semiconductor manufacturing factory includes a display, a network interface, and a computer that executes network access software and apparatus operation software stored in a storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser,
For example, a screen user interface as shown in FIG. 7 is provided on the display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model (401), serial number (402),
Information such as the subject of the trouble (403), the date of occurrence (404), the urgency (405), the symptom (406), the coping method (407), and the progress (408) are input to the input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the resulting appropriate maintenance information is returned from the maintenance database and presented on the display. The user interface provided by the web browser further includes a hyperlink function (410 to 41) as shown in the figure.
2), the operator can access more detailed information of each item, pull out the latest version of software used for the manufacturing equipment from the software library provided by the vendor, and operate the operation guide ( Help information). Here, the maintenance information provided by the maintenance management system includes information on the features of the present invention described above,
The software library also provides the latest software for realizing the features of the present invention.

Next, a device manufacturing method using the above-described production system will be described. FIG. 8 shows the flow of the whole semiconductor device manufacturing process. In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. In step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and assembly such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). Process. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Further, information for production management and apparatus maintenance is also communicated between the pre-process factory and the post-process factory via the Internet or a dedicated line network.

FIG. 9 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development)
Then, the exposed wafer is developed. In step 18 (etching), portions other than the developed resist image are removed.
In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Productivity can be improved.

[0046]

Since the present invention is configured as described above, the following effects can be obtained.

By sharing one console for a plurality of semiconductor manufacturing apparatuses, it is possible to promote cost reduction of the whole semiconductor manufacturing system, downsizing of the apparatuses, and energy saving.

By using such a semiconductor manufacturing system, the manufacturing cost of semiconductor devices and the like can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a semiconductor manufacturing apparatus according to a first embodiment.

FIG. 2 is a block diagram showing a semiconductor manufacturing system according to the first embodiment.

FIG. 3 is a diagram illustrating a console connection unit.

FIG. 4 is a block diagram showing a semiconductor manufacturing apparatus according to a second embodiment.

FIG. 5 is a block diagram showing the entire semiconductor manufacturing system.

FIG. 6 is a block diagram showing the semiconductor manufacturing system of FIG. 5 cut out from another angle.

FIG. 7 is a diagram showing a display for displaying a user interface on a screen.

FIG. 8 is a flowchart showing a semiconductor manufacturing process.

FIG. 9 is a flowchart showing a wafer process.

FIG. 10 is an explanatory view of a semiconductor manufacturing apparatus according to a conventional example.

FIG. 11 is a diagram illustrating a semiconductor manufacturing system according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 1a-1c Semiconductor manufacturing apparatus 2 Console part 3 Console control part 4 Input device 5 Output device 6 Console battery 7 Console connection part 8 Device control part 9 Device main body part 10 Device power supply part 11 Storage device 13 Communication line 17, 18 Termination Circuit 19 Wireless communication device 20 Non-contact charging device 30 Online communication cable 31 Online host computer

Claims (10)

[Claims] An apparatus control unit for controlling an apparatus main body, a console section for a man-machine interface and a communication line for connecting the apparatus control section, wherein the communication line is operated by the apparatus main body. A semiconductor manufacturing apparatus comprising: a connection portion configured to be able to separate or connect the console portion even in the inside. 2. A console separation prohibition lock means configured to determine that a communication line is in communication and prohibit separation of the console unit is provided. Semiconductor manufacturing equipment. 3. The semiconductor manufacturing apparatus according to claim 1, wherein the connection portion of the communication line includes a termination circuit for stabilizing a communication signal. 4. The semiconductor manufacturing apparatus according to claim 1, wherein the connection unit of the communication line includes a wireless communication device for transmitting a wireless communication with the console unit. 5. A console section for a man-machine interface connected to an apparatus control section for controlling an apparatus main body of a semiconductor manufacturing apparatus, wherein communication of the apparatus control section is performed even when the apparatus main body is in operation. A console section of a semiconductor manufacturing apparatus, comprising: a connection section configured to be connected to or separated from a line. 6. A plurality of semiconductor manufacturing apparatuses, and a console section for a man-machine interface selectively connectable to an apparatus control section of each semiconductor manufacturing apparatus, wherein each semiconductor manufacturing apparatus is operated by an apparatus main body. A semiconductor manufacturing system, comprising: a communication line having a connection portion configured to be able to separate or connect the console portion even inside. 7. The semiconductor manufacturing system according to claim 6, further comprising an online facility for controlling a plurality of semiconductor manufacturing apparatuses by a host computer. 8. A step of installing a manufacturing apparatus group for various processes including the semiconductor manufacturing apparatus according to claim 1 in a semiconductor manufacturing factory, and a semiconductor device by a plurality of processes using said manufacturing apparatus group. Manufacturing a device. 9. A method of connecting a group of manufacturing apparatuses via a local area network, and connecting at least one of the group of manufacturing apparatuses between the local area network and the Internet or a dedicated line network which is an external network outside a semiconductor manufacturing plant. Data communication of information about the device. 10. Access to a database provided by a device manufacturer or a supplier of a manufacturing apparatus group via an external network by data communication to obtain maintenance information of the manufacturing apparatus group, or to establish a connection with another semiconductor manufacturing factory. 9. The device manufacturing method according to claim 8, wherein the production management is performed by performing data communication between the devices via the external network.