JP2002010618A - Linear motor, and stage device, exposure device having this - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stage device and an exposure device which use a linear motor which eliminates an influence on a positioning accuracy, thermal deformation of structure, measurement error of a laser interferometer and the like by suppressing heating of coil of linear motor, and the manufacturing method and the like of the devices. SOLUTION: In the linear motor which has a coil and a jacket which covers the coil and of which internal space a coolant is supplied, the jacket has a structure of a double jacket consisting of inside jacket sheets 4, 4' and outside jacket sheets 7, 7'. Heat generated from the coil 1 is conducted to the inside jacket sheets 4, 4' by closely fixing the inside jacket sheets 4, 4' and the coil 1, and the heat generated from the coil 1 is released outside by the coolant flowing through the double jacket.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a linear motor suitably used for an apparatus for performing precise positioning such as an exposure apparatus and a high-precision processing machine.

[0002]

2. Description of the Related Art In an exposure apparatus used for manufacturing semiconductors and the like and a positioning apparatus of the order of nanometer used in a high-precision processing machine, heat generated from a linear motor as a driving source adversely affects the positioning. Factors such as thermal deformation of the structure due to heat generation or a measurement error of the laser interferometer for position measurement due to an increase in air temperature deteriorate the positioning accuracy of the device equipped with the linear motor. For example, 1
When a temperature change of [° C.] occurs, a low thermal expansion material of 100 [mm] (coefficient of thermal expansion: 1 × 10 ⁻⁶ ) is deformed by 100 [nm], and in the optical path of the optical interferometer. Even if the change in air temperature is 1 [° C] or less, the measured value is 100
[Nm] error occurs. Therefore, it is necessary to cool the linear motor, in particular, to recover the heat generated from the linear motor, as a measure for preventing such a temperature change.

On the other hand, with an increase in the performance of the apparatus, an increase in the output of the linear motor is required. Therefore, when the current flowing through the coil is increased, the amount of heat generated also greatly increases. Therefore,
Further cooling capacity is needed. It is also important to increase the cooling capacity of the coil in order to prevent an increase in coil resistance and damage to the coil wire due to an increase in coil temperature.

FIG. 11 is a diagram showing a configuration of a conventional linear motor having a cooling means. In FIG. 1, a coil 1 and a permanent magnet 3 fixed to yokes 2 on both sides of the coil 1 are covered with a jacket composed of thin sheets 34 and 34 ′ and a frame 5.
The coil 1 is fixed to the frame 5 by a fixture 37. Here, heat generated from the coil 1 is recovered by flowing a refrigerant through the internal space 36 of the jacket.

[0005]

In the above prior art, it is effective to use a refrigerant having a high heat absorption efficiency in order to increase the cooling capacity of the coil while keeping the flow rate constant. When the refrigerant is activated, the protective film on the surface of the coil is damaged, and electrical breakdown occurs, and the function of the linear motor may be lost. In order to prevent this, a chemically inert refrigerant is used for coil cooling.However, in general, the inert refrigerant has poor heat absorption efficiency. The ability could be insufficient.

The present invention has been made in view of the above problems, and suppresses heat generation of a coil of a linear motor, eliminates effects on positioning accuracy, thermal deformation of a structure, measurement errors of a laser interferometer, and the like. It is an object of the present invention to provide an excellent stage apparatus, exposure apparatus, device manufacturing method, and the like using the linear motor.

[0007]

In order to achieve the above object, a linear motor according to the present invention has a coil and a jacket covering the coil and supplying a coolant to an internal space, wherein the jacket has an inner jacket and an inner jacket. It has a double jacket structure comprising an outer jacket. In the present invention, the heat generated from the coil is transmitted to the member by bringing the member constituting the inner jacket into close contact with the coil, and the heat generated from the coil by the refrigerant flowing through the double jacket is externally transmitted. It can have a release mechanism.

It is preferable that the structure of the double jacket is formed by joining the frame and two members constituting the inner and outer jackets with the frame interposed therebetween.

It is preferable that the member constituting the inner jacket is made of a material having higher thermal conductivity than at least the outer jacket and the frame constituting the double jacket. Preferably, the double jacket is made of a non-magnetic material, an electrically high-resistance material, or an insulator material. Further, in the linear motor, a member constituting the double jacket can fix the coil. Further, the linear motor causes a refrigerant to flow through both the outer jacket and the inner jacket.
Alternatively, it can flow only to the outer jacket.

The coolant supplied to the double jacket is preferably water having a large heat capacity in order to increase the cooling efficiency. Preferably, an inert refrigerant is used as the refrigerant supplied to the inner jacket.

Further, it is preferable that the linear motor is provided with a yoke to which a magnet is attached with the double jacket interposed therebetween.

The stage device of the present invention can have the linear motor as a drive mechanism. The exposure apparatus of the present invention can include the stage device.

A method of manufacturing a semiconductor device using an exposure apparatus according to the present invention comprises the steps of: installing a manufacturing apparatus group for various processes including the above-described exposure apparatus in a semiconductor manufacturing plant; and performing a plurality of processes using the manufacturing apparatus group. And a step of manufacturing

A step of connecting the group of manufacturing apparatuses via a local area network; and a step of communicating information on at least one of the group of manufacturing apparatuses between the local area network and an external network outside the semiconductor manufacturing plant. And the step of performing.

Further, a database provided by a vendor or a user of the exposure apparatus is accessed via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing factory different from the semiconductor manufacturing factory. And data communication via the external network to perform production management.

A semiconductor manufacturing plant accommodating the exposure apparatus of the present invention includes a group of manufacturing apparatuses for various processes including the above-described exposure apparatus, a local area network connecting the group of manufacturing apparatuses, and a local area network connected to the outside of the factory. The information processing apparatus may include a gateway that enables access to an external network, and may enable data communication of information on at least one of the manufacturing apparatuses.

The maintenance method for an exposure apparatus according to the present invention is a method for maintaining the exposure apparatus installed in a semiconductor manufacturing plant,
A step of providing a maintenance database connected to an external network of a semiconductor manufacturing plant by a vendor or a user of the exposure apparatus, and a step of permitting access to the maintenance database from the inside of the semiconductor manufacturing factory via the external network. Transmitting the maintenance information stored in the maintenance database to the semiconductor manufacturing factory via the external network.

An exposure apparatus according to the present invention is the exposure apparatus, wherein a display, a network interface,
A computer that executes network software, so that the maintenance information of the exposure apparatus can be data-communicated via a computer network.

Further, the network software provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed. Then, it is possible to obtain information from the database via the external network.

[0020]

According to the above-described structure, the inner jacket is formed without flowing refrigerant into the inner jacket of the coil or using an inert refrigerant having generally low cooling capacity without damaging the insulating layer on the coil surface. Heat generated from the coil is given to the member to be heated, and the heat can be efficiently released to the outside by the refrigerant flowing through the outer jacket.

[0021]

Next, an embodiment of the present invention will be described in detail with reference to the drawings. [Embodiment 1] FIG. 1 is a sectional view showing a single-phase linit motor according to one embodiment of the present invention. FIG. 2 is an exploded view showing a jacket configuration of the linear motor, and FIG. 3 is a perspective view showing an appearance of the linear motor.

In FIG. 1, 1 is a coil through which a drive current flows, 2 is two yokes constituting a magnetic circuit, and 3 is a permanent magnet fixed to each yoke 2 and having different magnets arranged facing each other. is there. Reference numerals 4 and 4 'denote members (sheets) constituting an inner jacket disposed with the coil 1 interposed therebetween, and are in close contact with the coil 1 which is a feature of the present embodiment. Reference numeral 5 denotes a frame for supporting the two inner jacket sheets 4, 4 ', and the inner jacket sheets 4, 4'.
And the frame 5 constitute an inner jacket that encloses the coil 1. Reference numeral 6 denotes an inner space of the inner jacket, 7, 7 'denote members (sheets) constituting the outer jacket of the double jacket which is a characteristic member of the present embodiment, and 8, 8' denote the inner space of the outer jacket. Space. The components of these double jackets fix the coil 1. The joint between the inner jacket sheets 4, 4 'and the outer jacket sheets 7, 7' and the frame 5 is fixed with an adhesive, bolts or the like. The material of the frame 5 and the outer jacket sheets 7, 7 'is preferably a non-magnetic material, an electrically high-resistance material, or an insulator material, for example, a polymer resin material or a ceramic material. The material of the inner jacket sheets 4 and 4 ′ is a non-magnetic material, an electrical high-resistance material, or an insulator material for efficiently cooling the heat of the coil 1, and has a higher thermal conductivity than other members. It is preferable that the material has a high viscosity.

2 and 3, reference numeral 10 denotes a lead wire (two wires) of the coil 1, and reference numeral 11 denotes a small hole for leading the lead wire 10 from the inside of the jacket to the outside. After the lead wire 10 is drawn out, the small hole 11 is sealed with an adhesive or the like so that the refrigerant does not leak from the small hole 11. 1
2, 13 are refrigerant supply pipes connected to the inner jacket,
And a collection tube. The refrigerant is supplied from the supply pipe 12, flows through the inner jacket, receives the heat generated by the coil 1,
Collected from the collection tube 13. Although a protective film is formed on the surface of the coil 1 so that the conductor of the coil 1 does not directly contact the refrigerant, an inert refrigerant is supplied even if the refrigerant is liquid or gas so as not to damage the protective film. I do. 14,
Reference numeral 15 denotes a refrigerant supply pipe and a recovery pipe connected to the outer jacket. The refrigerant is supplied from the supply pipe 14 and flows through the outer jacket, and flows from the refrigerant flowing through the inner jacket to the coil 1 via the inner jacket sheets 4 and 4 ′.
At the same time as the side surface of the coil 1 is in close contact with the inner jacket sheets 4 and 4 ', the heat of the coil 1 is directly transmitted by heat conduction and the inner jacket sheets 4 and 4'.
Is collected from the collection pipe 15 through the tub and discharged to the outside.
The coolant supplied to the outer jacket may be a liquid or a gas. Although it is not necessary to use an inert refrigerant, it is preferable to flow water having a large heat capacity, for example, water in order to increase heat cooling efficiency.

In the above configuration, when an electric current is applied to the coil 1 located in the space between the permanent magnets 3 generating the fixed magnetic field, Lorentz force acts, and the coil 1 and the permanent magnet 3 relatively move vertically. I do. For example, in the upper half of the figure, when the magnetic field flows from the left to the right of the paper and the current flows from the back of the paper to the front, a force corresponding to the magnitude of the current is applied to the coil 1 upward in the paper. The permanent magnets 3 respectively act downward and move relative to each other. As described above, by passing a predetermined current through the coil 1, the yoke 2
And a coil 1 for driving a fixed structure. Further, in this embodiment, a so-called moving magnet in which the coil 1 side (a member fixed to the coil 1) is a stator, and the yoke 2 side (a member fixed to the yoke 2) holding the permanent magnet 3 is a mover. Although it is a linear motor of the type, the stator and the mover may be reversed. In FIG. 1, the coil 1 is fixed to the frame 5, but may be fixed to the inner jacket sheets 4, 4 '.

Next, a multi-phase linear motor according to an embodiment of the present invention will be described. FIG. 4 is a perspective view illustrating the configuration of the entire polyphase linear motor. In the figure, 61 is a plurality of coil arrays, 52 is a jacket, 53 is a jacket 5
A fixing member for fixing the magnetic member 2, 62 and 62 ′ are yokes constituting a magnetic circuit, and 63 is a permanent magnet fixed to the yokes 62 and 62 ′ and having different magnetic poles arranged facing each other. 73 is a fixing member for fixing the yokes 62, 62 '.

In the above configuration, when a predetermined current is applied to the coil 61 located in the space between the permanent magnets 63 generating the fixed magnetic field, Lorentz force acts, and the jacket 52 including the coil 61 and the permanent magnet 63 move relative to each other. Exercise. Further, since the plurality of coils 61 are arranged in the driving direction, the stroke of the linear motor can be changed according to the number of coils 61. In this embodiment, the coils 61 are the stator, and the yokes 62 and 6 holding the permanent magnets 63.
Although a so-called moving magnet type linear motor having a mover on the 2 'side is used, the stator and the mover may be reversed.

By supplying and flowing a temperature-controlled refrigerant into the internal space of the jacket 52, heat generated when the coil 61 is energized is recovered, and the temperature of the coil 61 itself is increased and a linear motor is mounted. The temperature rise of the equipment and its atmosphere is suppressed.

According to the above embodiment, the deformation and breakage of the jacket can be suppressed even if the pressure of the refrigerant is increased or the jacket sheet is thinned, so that the flow rate of the refrigerant can be increased and the cooling efficiency can be improved. The size of the jacket can be reduced, and the thrust of the linear motor can be improved.

[Embodiment 2] Next, an embodiment of a scanning type exposure apparatus in which the stage device using the linear motor according to Embodiment 1 described above as a drive mechanism is mounted as a wafer stage will be described.
This will be described with reference to FIG. Here, FIG. 5 is a schematic diagram of a scanning type exposure apparatus in which a stage device using the linear motor according to the first embodiment as a driving mechanism is mounted as a wafer stage.

The lens barrel base 96 is supported from the floor or base 91 via a damper 98. In addition, the lens barrel surface plate 96
Supports a reticle stage base 94 and a projection optical system 97 located between a reticle stage 95 and a wafer stage 93.

The wafer stage 93 is supported on a stage base 92 supported by a floor or a base 91, and positions and positions a wafer. Also, reticle stage 95
Is a reticle stage base 9 supported by a barrel base 96
The reticle having a circuit pattern formed thereon is supported on the reticle 5 and is movable. Exposure light for exposing the reticle mounted on the reticle stage 95 to the wafer on the wafer stage 93 is generated from an illumination optical system 99.

The wafer stage 93 is scanned in synchronization with the reticle stage 95. Reticle stage 9
During the scanning of the wafer 5 and the wafer stage 93, the positions of the two are continuously detected by the interferometer, and are fed back to the driving units of the reticle stage 95 and the wafer stage 93, respectively. As a result, both the scanning start positions can be accurately synchronized, and the scanning speed of the constant-speed scanning region can be controlled with high accuracy. While both are scanning with respect to the projection optical system 97, the reticle pattern is exposed on the wafer, and the circuit pattern is transferred.

In the present embodiment, since the stage device having a high cooling efficiency using the linear motor of the above-described embodiment as a driving mechanism is used as a wafer stage, a large amount of power can be supplied by the coil, and high speed and high precision can be achieved. Exposure becomes possible.

According to this embodiment, since the cooling efficiency of the linear motor is increased and the heat generated from the coil is recovered,
Since the heat from the linear motor is not transmitted to the wafer stage to raise the temperature or the ambient temperature, the positioning accuracy of the wafer stage can be dramatically improved, and as a result, exposure transfer with higher precision than ever before Becomes possible.

[Embodiment of Semiconductor Production System] Next, a device such as a semiconductor (I) utilizing the above-described exposure apparatus
An example of a production system for a semiconductor chip such as C or LSI, a liquid crystal panel, a CCD, a thin-film magnetic head, a micromachine, etc.) will be described. In this method, maintenance services such as troubleshooting and periodic maintenance of a manufacturing apparatus installed in a semiconductor manufacturing factory or provision of software are performed using a computer network outside the manufacturing factory.

FIG. 6 shows the whole system cut out from a certain angle. In the figure, reference numeral 101 denotes a business establishment of a vendor (apparatus supply maker) that provides a semiconductor device manufacturing apparatus. As an example of a manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing plant, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film formation equipment,
It is assumed that flattening equipment and the like and post-processing equipment (assembly equipment, inspection equipment, etc.) are used. In the business office 101, a host management system 10 for providing a maintenance database of manufacturing equipment
8. It has a plurality of operation terminal computers 110 and a local area network (LAN) 109 connecting these to construct an intranet or the like. Host management system 1
Reference numeral 08 includes a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the business office, and a security function for restricting external access.

On the other hand, reference numerals 102 to 104 denote manufacturing factories of a semiconductor manufacturer as users of the manufacturing apparatus. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 connecting them to construct an intranet or the like, and a host as a monitoring apparatus for monitoring the operation status of each manufacturing apparatus 106 are provided. A management system 107 is provided. Each factory 1
Host management system 107 provided in the storage system 02 to 104
Has a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, access from the LAN 111 of each factory to the host management system 108 on the vendor 101 side via the Internet 105 is possible, and only users limited by the security function of the host management system 108 are permitted to access. In particular,
Via the Internet 105, status information indicating the operation status of each manufacturing apparatus 106 (for example, the symptom of the manufacturing apparatus in which a trouble has occurred) is notified from the factory side to the vendor side, and response information corresponding to the notification (for example, (Information for instructing a coping method for the trouble, software and data for coping), and maintenance information such as the latest software and help information can be received from the vendor side. Each factory 1
02-104 and the vendor 101, and the data communication on the LAN 111 in each factory, a communication protocol (TCP) generally used on the Internet.
/ IP) is used. Instead of using the Internet as an external network outside the factory, it is also possible to use a dedicated line network (such as ISDN) that is not accessible from a third party and has high security. Further, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network, and permit access from a plurality of factories of the user to the database.

FIG. 7 is a conceptual diagram showing the entire system according to the present embodiment cut out from an angle different from that shown in FIG. In the above example, a plurality of user factories each having a manufacturing device and a management system of a vendor of the manufacturing device are connected via an external network, and the production management of each factory and at least one device are connected via the external network. Data communication of the information of the manufacturing apparatus. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors is connected to a management system of each of the plurality of manufacturing equipments via an external network outside the factory, and maintenance information of each manufacturing equipment is stored. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturer), and a manufacturing line for performing various processes, for example, an exposure apparatus 202, a resist processing apparatus 203;
A film forming apparatus 204 is introduced. Although only one manufacturing factory 201 is illustrated in FIG. 7, a plurality of factories are actually networked similarly. Each device in the factory is connected by a LAN 206 to form an intranet or the like, and a host management system 205 manages the operation of the production line. On the other hand, an exposure apparatus maker 210, a resist processing apparatus maker 220, a film forming apparatus maker 230, etc.
Each business establishment of the vendor (equipment maker) is provided with host management systems 211, 221, and 231 for remote maintenance of the supplied equipment, and these are provided with the maintenance database and the gateway of the external network as described above. . The host management system 205 that manages each device in the user's manufacturing factory and the vendor management systems 211, 221, and 231 of each device are connected to the external network 20.
0 or a dedicated line network. In this system, if a trouble occurs in any of a series of manufacturing equipment in the manufacturing line, the operation of the manufacturing line is stopped, but remote maintenance is performed via the Internet 200 from the vendor of the equipment in which the trouble has occurred. As a result, quick response is possible, and downtime of the production line can be minimized.

Each of the manufacturing apparatuses installed in the semiconductor manufacturing factory has a display, a network interface, and a computer that executes network access software and apparatus operation software stored in a storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser.
A user interface of a screen as shown in FIG. The operator who manages the manufacturing equipment at each factory, refers to the screen and checks the model of the manufacturing equipment 40
1, serial number 402, trouble subject 403,
Date of occurrence 404, urgency 405, symptom 406, coping method 40
7. Information such as progress 408 is input to input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the resulting appropriate maintenance information is returned from the maintenance database and presented on the display. The user interface provided by the web browser further includes a hyperlink function 41 as shown in the figure.
0, 411, 412, allowing the operator to access more detailed information on each item, extract the latest version of software used for manufacturing equipment from the software library provided by the vendor, and provide information for factory operators. An operation guide (help information) can be pulled out. Here, the maintenance information provided by the maintenance database includes the information on the present invention described above, and the software library also provides the latest software for realizing the present invention.

Next, a manufacturing process of a semiconductor device using the above-described production system will be described. FIG.
1 shows a flow of an overall semiconductor device manufacturing process. In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and an assembly process (dicing, dicing,
Bonding), an assembly process such as a packaging process (chip encapsulation) and the like. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Also, between the pre-process factory and the post-process factory,
Information for production management and device maintenance is communicated via the Internet or a dedicated line network.

FIG. 10 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a photosensitive agent is applied to the wafer.
Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Productivity can be improved.

[0042]

According to the present invention, the heat generated from the coil is brought into close contact with the members constituting the inner jacket in parallel with the flow of the inert refrigerant through the inner jacket with the double jacket structure. To the member, the refrigerant flowing through the outer jacket can efficiently release the heat generated by the coil to the outside, and the overall cooling efficiency can be improved. As a result, a large amount of power can flow through the coil, and the speed of the stage device can be increased by improving the thrust of the linear motor. Further, since the heat generated from the coil can be reduced, the thermal deformation of the structure due to the heat of the stage device and the measurement error of the laser interferometer can be reduced, and the accuracy of the stage device can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a single-phase linit motor according to one embodiment of the present invention.

FIG. 2 is an exploded view showing a jacket configuration of the linear motor according to one embodiment of the present invention.

FIG. 3 is a perspective view illustrating an appearance of a linear motor according to one embodiment of the present invention.

FIG. 4 is a perspective view illustrating a configuration of an entire polyphase linear motor according to one embodiment of the present invention.

FIG. 5 is a schematic view of a scanning exposure apparatus in which a stage device using a linear motor as a driving mechanism according to the first embodiment is mounted as a wafer stage.

FIG. 6 is a conceptual view of a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention, as viewed from a certain angle.

FIG. 7 is a conceptual view of a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention, as viewed from another angle.

FIG. 8 is a diagram showing a specific example of a user interface in a semiconductor device production system including an exposure apparatus according to one embodiment of the present invention.

FIG. 9 is a diagram illustrating a flow of a device manufacturing process by the exposure apparatus according to one embodiment of the present invention.

FIG. 10 is a diagram illustrating a wafer process by the exposure apparatus according to one embodiment of the present invention.

FIG. 11 is a diagram illustrating a configuration of a linear motor including a cooling unit according to a conventional example.

[Explanation of symbols]

1: coil, 2: yoke, 3: permanent magnet, 4, 4 ': inner jacket sheet, 5: frame, 6: inner space of inner jacket, 7, 7': outer jacket sheet, 8,
8 ': internal space of the outer jacket, 10: lead wire, 1
1: stoma, 12: supply tube connected to the inner jacket,
13: collection tube connected to the inner jacket, 14: supply tube connected to the outer jacket, 15: collection tube connected to the outer jacket, 34, 34 ': thin sheet, 3
6: internal space, 37: fixture, 52: jacket, 5
3: fixing member for fixing the jacket, 62, 62 ': yoke, 63: permanent magnet, 73: fixing member for fixing the yoke, 91: floor / base, 92: stage base, 93: wafer stage, 94: reticle Stage surface plate, 95: reticle stage, 96: lens barrel surface plate, 97: projection optical system, 9
9: Illumination optical system, 101: Vendor office, 102, 1
03,104: Manufacturing plant, 105: Internet, 1
06: manufacturing equipment, 107: factory host management system,
108: host management system on the vendor side; 109: local area network (LAN) on the vendor side; 11
0: operation terminal computer, 111: factory local area network (LAN), 200: external network, 201: manufacturing apparatus user's manufacturing factory, 202: exposure apparatus, 203: resist processing apparatus, 204: film forming processing apparatus, 205 : Factory host management system; 206: factory local area network (LAN); 210: exposure apparatus maker; 211: exposure apparatus maker's office management system; 220: resist processing apparatus maker;
21: Host management system of a business site of a resist processing apparatus maker, 230: Film forming apparatus maker, 231: Host management system of a business site of a film forming apparatus maker, 401: Model of manufacturing apparatus, 402: Serial number, 403: Trouble Subject, 404: date of occurrence, 405: urgency, 406: symptom, 407: remedy, 408: progress, 410, 411
412: Hyperlink function.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/30 515G F-term (Reference) 2F078 CA02 CA08 CB02 CB05 CB09 CB12 CC11 5F046 AA28 BA05 CC01 CC03 CC18 DA07 DA26 DD01 DD06 5H609 BB08 BB18 PP02 PP06 PP09 QQ03 QQ04 QQ12 QQ13 QQ17 RR12 RR26 RR32 RR37 RR42 RR43 RR73 5H641 BB06 BB18 BB19 GG02 GG03 GG05 GG07 GG11 HH02 HH03 HH06 JB04 JB05

Claims (19)

[Claims] 1. A linear motor, comprising: a coil; and a jacket covering the coil and supplying a coolant to an internal space, wherein the jacket has a double jacket structure including an inner jacket and an outer jacket. . 2. The heat generated from the coil is transmitted to the member by bringing the member constituting the inner jacket into close contact with the coil, and the heat generated from the coil by the refrigerant flowing through the double jacket is transmitted to the outside. The linear motor according to claim 1, further comprising a discharging mechanism. 3. The structure of the double jacket, wherein the frame and two members each constituting the inner and outer jackets are overlapped and joined with the frame interposed therebetween. 3. The linear motor according to 1 or 2. 4. The member constituting the inner jacket,
The linear motor according to any one of claims 1 to 3, wherein the linear motor is made of a material having higher thermal conductivity than at least the outer jacket and the frame constituting the double jacket. 5. The non-magnetic material according to claim 5, wherein the double jacket is a non-magnetic material,
The linear motor according to any one of claims 1 to 4, wherein the linear motor is made of an electrically high-resistance material or an insulator material. 6. The linear motor according to claim 1, wherein a member forming the double jacket fixes the coil. 7. The linear motor according to claim 1, wherein the linear motor allows the refrigerant to flow through both the outer jacket and the inner jacket or only through the outer jacket. 8. The linear motor according to claim 1, wherein the refrigerant supplied to the double jacket is water having a large heat capacity in order to increase cooling efficiency. 9. The refrigerant supplied to the inner jacket is an inert refrigerant.
A linear motor according to any one of claims 1 to 8. 10. The linear motor according to claim 1, wherein the linear motor is provided with a yoke to which a magnet is attached with the double jacket interposed therebetween. 11. A stage device comprising the linear motor according to claim 1 as a drive mechanism. 12. An exposure apparatus comprising the stage device according to claim 11. 13. A step of installing a manufacturing apparatus group for various processes including the exposure apparatus according to claim 12 in a semiconductor manufacturing factory, and a step of manufacturing a semiconductor device by a plurality of processes using the manufacturing apparatus group. A semiconductor device manufacturing method, comprising: 14. A step of connecting the manufacturing equipment group by a local area network, and data communication between at least one of the manufacturing equipment group between the local area network and an external network outside the semiconductor manufacturing factory. 14. The method of claim 13, further comprising the step of: 15. A semiconductor manufacturing factory different from the semiconductor manufacturing factory by accessing a database provided by a vendor or a user of the exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication. 15. The production management is performed by performing data communication with the device via the external network.
3. The method for manufacturing a semiconductor device according to 1. 16. A manufacturing apparatus group for various processes including the exposure apparatus according to claim 12, a local area network connecting the manufacturing apparatus group, and an external network outside the factory can be accessed from the local area network. A semiconductor manufacturing plant having a gateway for performing data communication of information on at least one of the manufacturing apparatus groups. 17. The semiconductor device according to claim 1, which is installed in a semiconductor manufacturing plant.
2. The maintenance method of an exposure apparatus according to 2, wherein a vendor or a user of the exposure apparatus provides a maintenance database connected to an external network of a semiconductor manufacturing plant; and A step of permitting access to the maintenance database via the external device, and a step of transmitting maintenance information stored in the maintenance database to the semiconductor manufacturing plant via the external network. Method. 18. The exposure apparatus according to claim 12, wherein: a display; a network interface;
An exposure apparatus, further comprising: a computer that executes network software, and enabling data communication of maintenance information of the exposure apparatus via a computer network. 19. The network software,
Provided on the display is a user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed, and from the database via the external network. 19. The exposure apparatus according to claim 18, wherein information can be obtained.