JP4366412B2 - Stage apparatus and exposure apparatus - Google Patents

Description

  The present invention relates to a stage suitably used for high-precision processing such as a semiconductor lithography process, and a stage apparatus and an exposure apparatus including the stage.

  Conventionally, as an exposure apparatus used for manufacturing a semiconductor device or the like, a pattern of an original (reticle or mask) is projected through a projection optical system to a plurality of exposure areas on the substrate while moving the substrate (wafer or glass substrate) stepwise. Step-and-repeat type exposure apparatus (sometimes referred to as a stepper) that performs sequential exposure, or step-and-scan type that repeats exposure transfer to multiple areas on the substrate by repeating step movement and scanning exposure A typical exposure apparatus (sometimes referred to as a scanning exposure apparatus or a scanner) is typical. In particular, the step-and-scan type uses only the portion of the projection optical system that is relatively close to the optical axis by limiting the exposure light flux with a slit, so that it is possible to expose fine patterns with higher accuracy and wider field of view. It has become.

These exposure apparatuses have a stage device (wafer stage or reticle stage) that moves and positions a wafer or reticle at high speed. However, mounting disturbance transmitted from piping or wiring prevents high-speed and high-accuracy positioning of the stage. there is a possibility.

Several proposals have been made to solve this mounting disturbance . For example, in the apparatus described in Japanese Patent Application Laid-Open No. 9-149672, in order to prevent mounting disturbance , a table for temporarily scanning the stage and correcting a position error from the target value is created to improve accuracy. Further, as another conventional example, a configuration in which a fine movement stage is mounted on a stage top plate and a disturbance of a coarse movement stage that can be moved by a large stroke using a multiphase linear motor is generally used.

However, in the above control method , the disturbance frequency increases as the stage speed increases, the amplitude level increases, and the stage accuracy deteriorates. In the other conventional examples, a fine movement mechanism must be formed on the stage top. This complicates the configuration of the stage and increases the mass, resulting in deterioration of control performance and an increase in heat generation.

The As described in the conventional example, there is a problem which has wiring and resistance or disturbance by pipes connected to the stage aggravate the stage control accuracy during constant speed scanning exposure. The present invention solves the above-described problem of deterioration in stage control accuracy during constant-speed scan exposure, that is, improves control accuracy during stage constant-speed scan exposure, and improves image performance and overlay accuracy. The purpose is that.

A stage apparatus of the present invention for achieving the above object includes a main stage and a sub stage that are individually movable, a stator, and a plurality of movers that are respectively fastened to the main stage and the sub stage and share the stator. A multi-phase coil type electromagnetic actuator that drives the main stage and the sub stage using a force generated between the stator and the plurality of movers, and the main stage and the sub stage. And a single-phase coil type electromagnetic actuator capable of transmitting a force to each other, and the main stage and the substage are connected by a mounting means.

Here, the stage is, for example, a plurality of stages rigidly fastened to the plurality of individually movable elements. In the exposure apparatus, the apparatus base or reference structure and the stage on which the reticle or wafer is mounted are connected by hardware mounting means such as wiring for power supply, communication cables, and piping through which fluid such as cooling water flows. . However, in this second stage apparatus, these mounting means are first connected to another stage (substage), relayed at this substage, and connected to a stage (main stage) on which a reticle or wafer is mounted, The relative position of these stages should not be changed so that no disturbance will enter the main stage. As a result, the control accuracy during constant-speed scan exposure of the main stage can be improved, and the image performance and overlay accuracy can be improved. A stage that moves in a predetermined direction, a first actuator of a multiphase type that generates a driving force when the stage is accelerated or decelerated in the predetermined direction, and a driving force in the predetermined direction when the stage moves at a constant speed. A single-phase type second actuator is generated.

  When the stage apparatus of the present invention is used in an exposure apparatus, vibration disturbances acting on a stage on which a reticle or wafer is mounted during exposure, for example, cogging and mounting disturbances generated when switching a multiphase linear motor can be minimized. Therefore, it is possible to achieve higher accuracy than before in terms of overlay accuracy, line width accuracy, etc., and improve throughput.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows the configuration of a stage apparatus according to an embodiment of the present invention. A top plate (main stage) 5 in this stage apparatus has XYθ 3-axis degrees of freedom, and is used, for example, as a reticle scan stage in the scanning exposure apparatus (scanner).

In FIG. 1, a reference planar guide surface 6 is provided on a reference structure 4, and a stage guide 3 is connected on the reference surface 6. The top plate 5 is supported in a non-contact manner with respect to the stage guide 3 by a hydrostatic bearing and is movable in the XYθ direction. On both sides of the top plate 5, there are provided electromagnetic actuators for driving the top plate 5 with a long stroke in the Y direction and a short stroke in the X direction. The electromagnetic actuator has a mover 2 and stators 1 and 1 'separated and independent from each other on the left and right. The left and right movers 2 are rigidly connected to the top plate 5. The left and right stators 1, 1 ′ are supported in a non-contact manner by a hydrostatic bearing with respect to the planar guide surface 6, and are movable in the XYθ direction (planar direction). The stators 1 and 1 ′ have a predetermined weight and have a reaction force counter function to be described later. The movable element 2 has two left and right movable part Y magnets 10 and two left and right movable part X magnets 11 attached thereto. Inside the left and right stators 1, 1 ′ are arranged an X-axis linear motor single-phase coil 12 and a Y-axis linear motor multiphase coil 13 in which a plurality of coils are arranged in the Y direction. Is controlled to move in the X axis-Yθ axis.

  The position information of the top 5 includes a laser head 16, a Y-axis measuring mirror 17, an X-axis measuring bar mirror 18, two left and right Y-axis measuring interferometers 19, two front and rear X-axis measuring interferometers 20, and the like. It is measured by a laser interference length measuring system composed of That is, the Y-axis positions of the stators 1 and 1 ′ are measured by the two left and right stator Y-axis measuring interferometers 21. Further, the X-axis position of the top plate 5 is such that the optical elements 22 and 22 ′ mounted on the top plate 5 are irradiated with laser light from the Y direction, and the measurement light is reflected or polarized in the X-axis direction. The measurement bar mirror 18 is irradiated and measured by the X-axis measurement interferometer 20.

The sub-top plate (sub-stage) 8 is supported in a non-contact manner by the hydrostatic bearing with respect to the stage guide 3 like the top plate 5 and is movable in the XYθ direction. On both sides of the sub top plate 8, there are provided electromagnetic actuators for driving with a long stroke in the Y direction and a short stroke in the X direction. The mover 7 of the electromagnetic actuator is rigidly connected to both sides of the sub top plate 8. The left and right movable elements 7 are provided with two left and right movable part Y magnets and two left and right movable part X magnets. The left and right stators 1, 1 ′ are common to the stator that drives the top plate 5.

  The position of the sub-top 8 is measured by a laser interferometry system comprising a sub-top measurement mirror 9, two left and right Y-axis measurement interferometers 23, an X-axis measurement interferometer 29 and the like.

  An electromagnetic actuator capable of generating a driving force in a non-contact manner is provided between the top plate 5 and the sub top plate 8. The left and right coils 25 constituting the electromagnetic actuator are attached to the sub top plate 8, and the magnet 26 is attached to the top plate 5. Further, between the top plate 5 and the sub top plate 8, mounting means 28 such as wiring for power feeding, a communication cable, and a pipe through which a fluid flows are connected.

  A flat cable and a flat tube type mounting means 27 are connected between the mover 7 and the reference surface plate 4, and the mounting means 27 moves while following the reference surface 6 which is a plane as the mover 7 moves. .

  The stage apparatus of this embodiment can be used as a reticle stage and / or a wafer stage of an exposure apparatus, and an original plate 24 (reticle) and a substrate (wafer) are mounted on a top plate 5 (XY stage) of a movable part. Put.

  The movable part in which the original plate 24 (reticle) and the substrate (wafer) are placed on the top plate 5 (XY stage) is moved in the XYθ direction by an electromagnetic actuator including the movable element 2 and the left and right stators 1, 1 ′. . The left and right stators 1, 1 ′ receive a driving reaction force that acts on the movement of the entire movable portion. Due to this driving reaction force, the left and right stators 1, 1 ′ move on the planar guide surface 6. The left and right stators 1, 1 ′ move on the planar guide surface 6, so that the left and right stators 1, 1 ′ serve as a reaction force counter. In this embodiment, for example, when the entire movable part moves in the + Y direction, the left and right stators 1, 1 ′ receive a driving reaction force in the −Y direction and move in the −Y direction.

  According to the present embodiment, the stator 1, 1 'receives the reaction force during acceleration / deceleration when the moving body including the top plate 5 and the sub top plate 8 of the stage device moves as a reaction force counter. The reaction force is converted into kinetic energy by the movement of the stator 1, 1 ′ (reaction force counter). Further, since the acting force and the reaction force are limited within the planar guide surface 6 on the reference structure 4, the reaction force of the stage device is prevented from vibrating the reference structure 4, and the device The disturbance to the installed floor can be eliminated, and the vibrations to other devices can be eliminated. Further, since the left and right independent stators 1, 1 ′ (reaction force counter) move on the reference structure 4 in accordance with the acceleration of the moving body, the offset load when the moving body moves can be reduced, and this stage When the apparatus is used as an exposure apparatus, the overlay accuracy of the exposure apparatus can be improved. That is, according to the present embodiment, since the stators 1 and 1 ′ move in the direction opposite to the direction in which the moving body moves, the movement of the center of gravity including the moving body and the stator is suppressed and the movement is suppressed. Uneven load when the body moves can be reduced.

  In this embodiment, left and right Y-axis position control linear motors 14 for pushing back the left and right stators 1 and 1 ′ that have moved more than a predetermined amount in the Y-axis direction are provided in the reference structure 4. Four X-axis position control linear motors 15 that push back the stators 1, 1 ′ that have moved more than a predetermined amount in the direction are arranged on the reference structure 4. As a result, when the movable part moves more than a predetermined value, the stators 1 and 1 'are also moved more than a predetermined value. However, the Y-axis position control linear motor 14 and the X-axis position control linear are also moved. The stator 1, 1 ′ can be controlled to be in a predetermined position by the motor 15. In addition, even if the stator position is shifted due to the influence of resistance or friction, the Y-axis position control linear motor and the X-axis position control linear motor described above can be used regardless of the driving of the electromagnetic actuator. For example, the position of the stator can be corrected.

  Next, the scanning operation of the top 5 when the stage apparatus of the present embodiment is used for a scanning exposure apparatus will be described. When accelerating, the top plate 5 is accelerated to a predetermined speed by electromagnetic force acting between the left and right movable elements 2 and the stators 1 and 1 '. When entering the constant velocity region, the current of the multiphase coil 13 is controlled so that the electromagnetic force acting in the Y direction is not generated on the mover 2 of the top plate 5, and the control of the top plate 5 in the Yθ direction is controlled by two single-phase coils. This is done by controlling the electromagnetic force between the magnet 25 and the magnet 26.

  The X direction of the top plate 5 is performed by a long single-phase coil 12. The sub top plate 8 is controlled by electromagnetic force acting between the left and right movable elements 7 and the stators 1 and 1 'during constant speed and acceleration / deceleration. Since the positions of the top 5 and the sub top 8 are measured by an interferometer, they can be positioned independently. The top plate 5 is precisely positioned to satisfy the exposure accuracy, but the sub top plate 8 only needs to be positioned to the extent that no mechanical interference occurs.

  According to the present embodiment, the electromagnetic force between the multiphase coil 13 and the mover 2 is not generated in the section in which the top plate 5 travels at a constant speed, and the sub top plate 8 is moved by the multiphase coil 13 and the mover 7. When driven, the position of the top plate 5 is controlled by the relative position with respect to the sub top plate 8 using the electromagnetic force between the single-phase coil 25 and the magnet 26. In this embodiment, in this way, during the scanning exposure, that is, in the constant speed traveling section of the top plate 5, the driving of the XYθ axes is driven by the single-phase linear motor, so there is no cogging that occurs when the coils of the multi-phase linear motor are switched. The vibration due to cogging generated on the sub-top plate 8 is driven to the top plate 5 by a non-contact single-phase linear motor, so that the transmission to the top plate 5 is minimized.

  In this embodiment, the mounting means 27 that moves with a large stroke is attached to the sub top plate 8, and the mounting means 28 that moves only a small stroke is attached to the top plate 5. The mounting disturbance is generated by the mounting means 27 that moves with a large stroke, and the vibration is transmitted to the sub top plate 8. However, since the distance between the top plate 5 and the sub top plate 8 changes only within a range of several tens of μm, no mounting disturbance that affects the accuracy of the top plate 5 occurs from the mounting means 28. That is, the mounting disturbance generated by the mounting means 27 is not transmitted to the top plate 5 as vibration that affects the accuracy.

  As described above, since the vibration disturbance in the exposure section does not enter the top plate 5, the overlay accuracy and the line width accuracy can be improved. Further, when the stage speed is increased, vibration disturbance increases. However, by adopting the above configuration, there is no deterioration in accuracy with respect to the speed improvement, so that the throughput can be improved.

  The stage apparatus of the present invention performs exposure while synchronously scanning both the reticle and the wafer, performs exposure transfer of the reticle pattern to one shot area of the wafer, and arranges the patterns in a plurality of shot areas by moving the wafer stepwise. It is suitably used for a so-called step-and-scan type scanning exposure apparatus (scanner) for transferring. However, the present invention is not limited to application to a step-and-scan type exposure apparatus, but is also effective in a step-and-repeat type exposure apparatus (stepper) in which the wafer stage moves at high speed.

  FIG. 2 shows the configuration of a stage apparatus according to the second embodiment of the present invention. The stage apparatus of FIG. 2 has a configuration in which the linear motor coil 25 and the magnet 26 between the top plate 5 and the sub top plate 8 are eliminated from the one shown in FIG. Further, the laser interferometer 29 that measures the position of the sub top plate 8 in the X direction is not used.

  In this embodiment, the vibration disturbance from the mounting means 27 is configured not to be transmitted to the top plate 5 as in the first embodiment. However, unlike the first embodiment, cogging occurs because the mover 2 and the stators 1 and 1 'are used even when the top plate 5 is traveling at a constant speed. However, since there is no linear motor between the top plate 5 and the sub top plate 8, there is an advantage that the movable part can be reduced in weight and the heat generation of the multiphase linear motor coil 13 can be suppressed.

  Furthermore, the accuracy of the top plate 5 can be improved by reducing the number of mounting means 28 by using communication means such as infrared rays for the mounting means 28 between the top plate 5 and the sub top plate 8.

  According to this embodiment, when this is used in an exposure apparatus, vibration disturbance from the mounting means does not enter the top plate 5 during the exposure section as described above, and heat generation from the linear motor can be suppressed. Therefore, high acceleration can be achieved at the same time, and overlay accuracy, line width accuracy, and throughput can be improved.

Next, an embodiment of a scanning exposure apparatus in which the stage apparatus of the above-described embodiment is mounted as a wafer stage will be described with reference to FIG.
The lens barrel surface plate 39 is supported from the floor or base 40 via a damper 41. The lens barrel surface plate 39 supports the reticle stage surface plate 42 and also supports the projection optical system 45 positioned between the reticle stage 43 and the wafer stage 44. The wafer stage 44 is supported on a stage surface plate 46 supported from the floor or the base, and performs positioning by placing the wafer. The reticle stage 43 is supported on a reticle stage surface plate 42 supported by the lens barrel surface plate 39, and is movable by mounting a reticle on which a circuit pattern is formed. Exposure light for exposing the reticle mounted on the reticle stage 43 onto the wafer on the wafer stage 44 is generated from the illumination optical system 47.

  The wafer stage 44 is scanned in synchronization with the reticle stage 43. During scanning of the reticle stage 43 and the wafer stage 44, the positions of the both are continuously detected by the interferometers and fed back to the drive units of the reticle stage 43 and the wafer stage 44, respectively. This makes it possible to accurately synchronize both scanning start positions and to control the scanning speed of the constant speed (constant speed) scanning area with high accuracy. While both are scanning the projection optical system, the reticle pattern is exposed on the wafer, and the circuit pattern is transferred.

  In this embodiment, since the stage apparatus described in the above-described embodiment is used as the reticle stage 43 and the wafer stage 44, the accuracy of the position and posture during exposure of the stage is improved, so that high-speed and high-precision exposure is possible. It becomes.

<Example of semiconductor production system>
Next, an example of a production system for semiconductor devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin film magnetic heads, micromachines, etc.) will be described. In this method, maintenance services such as troubleshooting, periodic maintenance, and software provision for manufacturing equipment installed in a semiconductor manufacturing factory are performed using a computer network outside the manufacturing factory.

  FIG. 4 illustrates the entire system cut out from a certain angle. In the figure, reference numeral 101 denotes a business office of a vendor (apparatus supply manufacturer) that provides a semiconductor device manufacturing apparatus. As an example of a manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing factory, for example, equipment for a pre-process (lithography apparatus such as an exposure apparatus, a resist processing apparatus, an etching apparatus, a heat treatment apparatus, a film forming apparatus, and a planarization Equipment) and post-process equipment (assembly equipment, inspection equipment, etc.). The office 101 includes a host management system 108 that provides a maintenance database for manufacturing apparatuses, a plurality of operation terminal computers 110, and a local area network (LAN) 109 that connects these to construct an intranet. The host management system 108 includes a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting access from the outside.

  On the other hand, 102 to 104 are manufacturing factories of semiconductor manufacturers as users of manufacturing apparatuses. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers, or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 that connects them together to construct an intranet, and host management as a monitoring apparatus that monitors the operating status of each manufacturing apparatus 106 are provided. A system 107 is provided. The host management system 107 provided in each factory 102 to 104 includes a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, the host management system 108 on the vendor 101 side can be accessed from the LAN 111 of each factory via the Internet 105, and only a limited user is permitted to access by the security function of the host management system 108. Specifically, status information (for example, a symptom of a manufacturing apparatus in which a trouble has occurred) indicating the operating status of each manufacturing apparatus 106 is notified from the factory side to the vendor side via the Internet 105, and the notification is also handled. It is possible to receive response information (for example, information for instructing a coping method for trouble, coping software or data), maintenance information such as the latest software and help information from the vendor side. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between the factories 102 to 104 and the vendor 101 and data communication on the LAN 111 in each factory. Instead of using the Internet as an external network outside the factory, it is also possible to use a high-security dedicated line network (such as ISDN) without being accessible from a third party. Further, the host management system is not limited to the one provided by the vendor, and the user may construct a database and place it on the external network, and allow access to the database from a plurality of factories of the user.

  FIG. 5 is a conceptual diagram showing the overall system of this embodiment cut out from an angle different from that in FIG. In the previous example, a plurality of user factories each equipped with a manufacturing apparatus and a management system of a vendor of the manufacturing apparatus are connected via an external network, and production management of each factory or at least one unit is performed via the external network. Data communication of manufacturing equipment was performed. On the other hand, in this example, a factory equipped with a plurality of vendors' manufacturing devices and a management system of each vendor of the plurality of manufacturing devices are connected by an external network outside the factory, and maintenance information of each manufacturing device is obtained. Data communication. In the figure, reference numeral 201 denotes a manufacturing factory of a manufacturing apparatus user (semiconductor device manufacturer), and a manufacturing apparatus for performing various processes on the manufacturing line of the factory, in this example, an exposure apparatus 202, a resist processing apparatus 203, and a film forming processing apparatus. 204 has been introduced. In FIG. 5, only one manufacturing factory 201 is depicted, but actually, a plurality of factories are similarly networked. Each device in the factory is connected by a LAN 206 to form an intranet, and the host management system 205 manages the operation of the production line. On the other hand, vendors (apparatus supply manufacturers) such as exposure apparatus manufacturer 210, resist processing apparatus manufacturer 220, and film formation apparatus manufacturer 230 have host management systems 211, 221 for remote maintenance of the supplied devices. 231 and these comprise a maintenance database and an external network gateway as described above. The host management system 205 that manages each device in the user's manufacturing factory and the vendor management systems 211, 221, and 231 of each device are connected by the external network 200, which is the Internet or a dedicated line network. In this system, if a trouble occurs in any one of a series of production equipment on the production line, the operation of the production line is suspended, but remote maintenance via the Internet 200 is received from the vendor of the troubled equipment. This enables quick response and minimizes production line outages.

  Each manufacturing apparatus installed in the semiconductor manufacturing factory includes a display, a network interface, a computer for executing network access software stored in a storage device and software for operating the apparatus. The storage device is a built-in memory, a hard disk, or a network file server. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 6 on the display. The operator who manages the manufacturing apparatus in each factory refers to the screen while referring to the screen of the manufacturing apparatus (401), serial number (402), trouble subject (403), date of occurrence (404), urgency (405), Information such as symptom (406), coping method (407), progress (408), etc. is input to the input items on the screen. The input information is transmitted to the maintenance database via the Internet, and appropriate maintenance information as a result is returned from the maintenance database and presented on the display. The user interface provided by the web browser further realizes a hyperlink function (410 to 412) as shown in the figure, and the operator can access more detailed information on each item or use the software library provided by the vendor for the manufacturing apparatus. The latest version of software can be pulled out, and operation guides (help information) can be pulled out for reference by factory operators.

  Next, a semiconductor device manufacturing process using the production system described above will be described. FIG. 7 shows the flow of the entire manufacturing process of the semiconductor device. In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (mask production), a mask on which the designed circuit pattern is formed is produced. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer produced in step 4, and is an assembly process (dicing, bonding), packaging process (chip encapsulation), etc. Process. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, the semiconductor device is completed and shipped (step 7). The pre-process and post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. In addition, information for production management and apparatus maintenance is communicated between the pre-process factory and the post-process factory via the Internet or a dedicated network.

  FIG. 8 shows a detailed flow of the wafer process. In step 11 (oxidation), the wafer surface is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), an electrode is formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist process), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed onto the wafer by exposure using the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, it is possible to prevent problems before they occur, and to recover quickly if a problem occurs. Productivity can be improved.

It is a figure which shows the structure of the stage apparatus which concerns on one Example of this invention. It is a figure which shows the structure of the stage apparatus which concerns on the other Example of this invention. It is a figure which shows an example of the exposure apparatus to which the stage apparatus of this invention is applied. It is the conceptual diagram which looked at the production system of the semiconductor device from a certain angle. It is the conceptual diagram which looked at the production system of the semiconductor device from another angle. It is a figure which shows the specific example of a user interface. It is a figure explaining the flow of the manufacturing process of a device. It is a figure explaining a wafer process.

Explanation of symbols

  1, 1 ': Stator, 2: Movable element, 3: Stage guide, 4: Reference structure, 5: Top plate, 6: Planar guide surface, 7: Sub top plate movable element, 8: Sub top plate, 9 : Sub-top plate measurement mirror, 10: Movable part Y magnet, 11: Movable part X magnet, 12: X axis linear motor single phase coil, 13: Y axis linear motor multiphase coil, 14: Y axis position control linear Motor: 15: Linear motor for X-axis position control, 16: Laser head, 17: Mirror for Y-axis measurement, 18: Bar mirror for X-axis measurement, 19: Interferometer for Y-axis measurement, 20: Interferometer for X-axis measurement 21: Interferometer for stator Y-axis measurement, 22, 22 ′: Interferometer for X-axis measurement, 23: Interferometer for Y-axis measurement of sub-top plate, 24: Original plate or substrate, 25: Single-phase linear motor coil, 26: Magnet of single-phase linear motor, 27: Flat cable And flat tube, 28: wiring and piping, 29: interferometer for sub-top plate X-axis measurement, 39: lens barrel surface plate, 40: floor or base, 41: damper, 42: reticle stage surface plate, 43: reticle stage 44: Wafer stage, 45: Projection optical system, 46: Stage surface plate, 47: Illumination optical system.

Claims (9)

Main stage and substage that can be moved individually,
The main stage includes a stator and a plurality of movers that are respectively fastened to the main stage and the substage and share the stator, and using the force generated between the stator and the plurality of movers And a multi-phase coil- type electromagnetic actuator that drives the substage, and a single-phase coil-type electromagnetic actuator that can transmit force between the main stage and the substage,
A stage apparatus characterized in that the main stage and the sub-stage are connected by mounting means.   2. The stage apparatus according to claim 1, further comprising means for measuring the position of each of the main stage and the sub stage.   3. The stage apparatus according to claim 1, further comprising means for performing power supply and communication in a non-contact manner between the main stage and the sub stage.   The stage apparatus according to claim 1, further comprising a guide surface having a degree of freedom in the predetermined direction for guiding the main stage and the substage.   The stage apparatus according to claim 4, wherein the guide surface is formed on a stator of the multiphase coil type electromagnetic actuator or a member mechanically connected to the stator.   6. The stage apparatus according to claim 4, wherein the guides of the main stage and the sub stage are common.   6. The stage apparatus according to claim 4, wherein the guides of the plurality of movable parts are different.   An exposure means for projecting a part of the pattern of the original plate onto the substrate via a projection optical system and exposing a predetermined exposure region of the original pattern on the substrate, and the original plate and / or the substrate for the exposure An exposure apparatus comprising the stage device according to claim 1, wherein the stage device is moved.   A manufacturing apparatus group for various processes including the exposure apparatus according to claim 8 is installed in a semiconductor manufacturing factory, and a semiconductor device is manufactured by a plurality of processes using the manufacturing apparatus group. A semiconductor device manufacturing method.

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