JP2002009444A5 - - Google Patents

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Publication number
JP2002009444A5
JP2002009444A5 JP2000192670A JP2000192670A JP2002009444A5 JP 2002009444 A5 JP2002009444 A5 JP 2002009444A5 JP 2000192670 A JP2000192670 A JP 2000192670A JP 2000192670 A JP2000192670 A JP 2000192670A JP 2002009444 A5 JP2002009444 A5 JP 2002009444A5
Authority
JP
Japan
Prior art keywords
multilayer wiring
ceramic
via hole
wiring board
ceramic multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000192670A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002009444A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000192670A priority Critical patent/JP2002009444A/ja
Priority claimed from JP2000192670A external-priority patent/JP2002009444A/ja
Publication of JP2002009444A publication Critical patent/JP2002009444A/ja
Publication of JP2002009444A5 publication Critical patent/JP2002009444A5/ja
Pending legal-status Critical Current

Links

JP2000192670A 2000-06-22 2000-06-22 セラミック多層配線基板の構造 Pending JP2002009444A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000192670A JP2002009444A (ja) 2000-06-22 2000-06-22 セラミック多層配線基板の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000192670A JP2002009444A (ja) 2000-06-22 2000-06-22 セラミック多層配線基板の構造

Publications (2)

Publication Number Publication Date
JP2002009444A JP2002009444A (ja) 2002-01-11
JP2002009444A5 true JP2002009444A5 (enExample) 2005-02-24

Family

ID=18691773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000192670A Pending JP2002009444A (ja) 2000-06-22 2000-06-22 セラミック多層配線基板の構造

Country Status (1)

Country Link
JP (1) JP2002009444A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4478567B2 (ja) * 2002-07-05 2010-06-09 富士通株式会社 ポストビアを有する薄膜基板
JP3983146B2 (ja) * 2002-09-17 2007-09-26 Ｎｅｃエレクトロニクス株式会社 多層配線基板の製造方法
JP4170137B2 (ja) * 2003-04-24 2008-10-22 新光電気工業株式会社 配線基板及び電子部品実装構造
CN104321862B (zh) * 2012-07-31 2017-06-27 株式会社村田制作所 层叠基板
KR101483874B1 (ko) * 2013-07-29 2015-01-16 삼성전기주식회사 인쇄회로기판
CN114566480A (zh) * 2022-02-23 2022-05-31 中国电子科技集团公司第十四研究所 一种可盲插的厚膜电路封装结构

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