JP2002009211A - Image sensing device and cooling material unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable to cool an image sensing element without increasing the size and cost of the device and enable to a long time exposure such as photographing of celestial objects. SOLUTION: In an electronic camera which forms an image of an object obtained through a lens 21 and takes it photograph by through an image sensing element 22, a pocket 12 for charging provided in the vicinity of a cooling agent is the back of the image sensing element 22, and a thermal conducting member connecting thermally the pocket 12 and a lead frame 25 on which a semiconductor chip of the image sensing element 22 is mounted is provided, and a photograph of celestial objects is taken under low dark current condition by charging dry ice into the pocket 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device using an image pickup device such as a CCD, and more particularly to an image pickup device having a function of cooling an image pickup device for long-time photographing, and a coolant unit used for the same. .

[0002]

2. Description of the Related Art In an electronic camera (digital still camera) using an image pickup device such as a CCD, it is necessary to perform long-time exposure in order to photograph a subject having extremely low luminance, such as astronomical photography. For long-time exposure, it is most important to reduce the dark current, and the image sensor must be cooled for the purpose of reducing the dark current. As a technique for cooling an imaging device in an electronic camera, it is known to use an electronic cooling device such as a Peltier device (Japanese Patent Laid-Open No. 7-38).
019 publication).

[0003] However, this type of apparatus has the following problems. That is, since an electronic cooling element such as a Peltier element is used, it is necessary to consume relatively large power and to radiate heat generated by the cooling element. For this reason, there has been a problem that the apparatus is totally dedicated exclusively, the apparatus configuration becomes large, and the manufacturing cost increases. Further, it is inconvenient to carry such an electronic camera on a daily basis.

[0004]

As described above, conventionally, in the cooling imaging technique of the image pickup apparatus, since an electronic cooling element such as a Peltier element is generally used, it is necessary to consume electric power and dissipate heat generated by the cooling element. As a result, there is a problem that the size of the apparatus is increased and the cost is increased.

[0005] The present applicant also provides an imaging device which enables a simple cooling photographing by providing a pocket in the camera body and putting or attaching a readily available coolant such as dry ice into the pocket. Has already been proposed (Japanese Patent Application No. 2000-77137). However, when such cooling is actually performed, the imaging element is locally cooled, so that dew condensation caused by water vapor in the surrounding atmosphere is induced, and the outer surface of the protective glass may become cloudy and image quality may be degraded. .
As a countermeasure for preventing condensation in a cooled imaging device, a method in which the space near the imaging element is sealed and kept in a vacuum can be considered, but such a configuration causes an increase in the size of the device and can be carried around as a general camera on a daily basis. It is practically difficult to apply the present invention to an imaging device capable of temporarily performing cooling imaging as needed.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to cool an image pickup device without increasing the size and cost of the apparatus.
It is another object of the present invention to provide an imaging apparatus capable of reliably preventing dew condensation on a protective glass due to cooling of an imaging device and capable of performing long-time exposure such as astronomical photography.

Another object of the present invention is to provide a coolant unit suitable for use in the above-described imaging device.

[0008]

(Structure) In order to solve the above-mentioned problem, the present invention employs the following structure.

That is, the present invention relates to an image pickup apparatus for forming an image of a subject obtained through a lens on a light receiving surface of an image pickup device and picking up an image of a subject with the image pickup device, provided near the image pickup device. It is characterized by comprising a pocket for supplying a coolant, and a heat conducting member for thermally connecting the pocket and a lead frame on which the semiconductor chip of the image pickup device is mounted.

[0010] The present invention is also an imaging apparatus which forms an image of a subject obtained through a lens on a light receiving surface of an image sensor, and captures an image of the subject with the image sensor, provided near the image sensor. A mounting pocket in which a coolant unit can be mounted, and a heat conducting member for thermally connecting the cooling unit mounted in the pocket and a lead frame on which the semiconductor chip of the imaging device is mounted. It is characterized by.

Here, preferred embodiments of the present invention include the following.

(1) The image pickup device is sealed in an insulating package, and the lead frame has a protruding portion extending outside the insulating package, and the heat conducting member is connected to the protruding portion. .

(2) The projecting portion of the lead frame constitutes a mounting portion for mounting or positioning the image pickup device.

(3) The projecting portion of the lead frame is an integrated outer lead formed continuously with a die pad for die bonding a semiconductor chip of an image pickup device.

(4) The protruding portion of the lead frame also serves as the GND terminal of the image sensor.

(5) The pocket is located on the back side of the image sensor and has a room-like structure having a lid, and the lid continuously covers the exterior surface of the device housing containing the image sensor and the lens. It must be composed.

(6) The cooling agent is dry ice.

The present invention also provides a coolant unit for cooling an image pickup device of an image pickup device provided with an image pickup device for photographing a subject image, the coolant unit being detachably mounted in a pocket provided near the image pickup device. It is characterized by being attached. Here, it is desirable that the exposed surface in a state of being attached to the pocket continuously forms the exterior surface of the device housing containing the imaging element and the lens.

(Operation) According to the present invention, a dark current in an image pickup device can be obtained by putting or mounting an inexpensive and readily available coolant represented by dry ice in a pocket provided in the image pickup device main body. Can be made extremely small, and long-time exposure required for astronomical photography or the like can be performed. In this case, since the imaging device can be easily cooled without using a Peltier device or the like, it is possible to suppress an increase in the size and cost of the device configuration. That is,
In normal times, the camera can be carried around as a general camera on a daily basis, and cooling imaging can be temporarily performed as needed.

Further, by cooling through the lead frame on which the semiconductor chip of the image sensor is mounted, it is possible to selectively cool only the semiconductor chip of the image sensor instead of cooling the entire image sensor. . Therefore, the cooling of the protective glass is suppressed, and the air (or the sealed gas) inside the protective glass is dry, so that dew condensation can be prevented beforehand.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the illustrated embodiments.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
1A is a view for explaining a basic configuration of an electronic camera according to the embodiment, FIG. 1A is a horizontal sectional view seen from above, and FIG.
Is a rear view.

In the figure, reference numeral 10 denotes a camera housing, in which a lens 21, an image pickup device 22, a mounting board 23,
And various components (not shown) are accommodated. Lens 21
Is the outermost lens and one surface is exposed to the outside. Further, a focusing lens and a zoom lens (not shown) are arranged between the lens 21 and the image sensor 22.

The image pickup device 22 is, for example, a device in which a CCD image pickup device chip (semiconductor chip) is hermetically sealed in a package, and is mounted on a mounting substrate 23. A protective glass 24 is attached to the light receiving surface side of the image sensor 22, and a connection terminal 25 formed of a lead frame extends from the image sensor 22.

The basic configuration up to this point is the same as that of a conventional general electronic camera, but in this embodiment, in addition to this, a coolant supply port for supplying a coolant to the back side 11 of the camera housing 10. A pocket 12 is provided. The pocket 12 is located on the back side of the image sensor 22 and has a room-like structure having the lid 13. The lid portion 13 continuously forms the exterior surface of the camera housing 10, and is locked to the camera housing 10 by the lock mechanism 14 in a closed state. In addition, pocket 1
A metal plate 28 as a heat transfer member is provided in 2, and the metal plate 28 is connected to the connection terminal 25 of the image sensor 22.

FIG. 2 is a sectional view showing a more specific structure of the cooling mechanism of the pocket portion and the image pickup device. Pocket 1
Reference numeral 2 denotes a resin outer case, a metal plate 28 serving as a heat transfer member is attached to the bottom of the pocket, and a part of the metal plate 28 is bent as a foot to protrude toward the CCD mounting board. The pocket itself may be formed of a metal plate as in a second embodiment described later, and the metal plate forming the pocket may also be used as a heat transfer member.

The foot of the metal plate 28 and the connection terminal 25 of the image sensor 22 are fixed together by soldering on the mounting board 23. That is, the connection terminal 25 between the metal plate 28 and the image sensor 22
Are thermally connected by solder 29.

Here, the connection terminal 25 of the image pickup device 22 is one of the lead frames. In order to cool the CCD image pickup device chip 26 of the image pickup device 22 efficiently, it is particularly necessary to die-bond the chip 26. It is preferable that the outer lead is an integral outer lead connected to the die pad.

Although not necessarily required, the inner leads corresponding to the outer leads are connected to the GND of the CCD image sensor chip 26 by bonding wires 27.
Preferably, it is connected to a pad. In this case, each lead also serves as an electrical connection terminal as a GND of the image sensor 22, and the effect of reducing the number of leads is produced. Further, the metal plate 28 can also serve as a shielding material, in which case the effect of reducing the number of members is produced.

Although the embodiment shown in FIG. 2 may be used together with the embodiment shown in FIG. 3, which will be described later, when not used together, the image pickup device 22 does not have an "attachment portion" which is an extension of the lead frame (accordingly, the lead). Since the frame has only a die pad part and a tie bar in the manufacturing process, the imaging element such as the die pad part and the inner and outer lead parts) has a smaller contact area serving as a thermal contact between the lead frame and the package. More desirable.

In such a configuration, when nothing is put in the pocket 12, it can be used as a normal electronic camera. On the other hand, by introducing a coolant such as dry ice into the pocket 12,
2 can be efficiently cooled and an image can be taken in a state where the dark current is small, so that it is possible to take an object with extremely low brightness, such as an astronomical object requiring long-time exposure.

Here, in the present embodiment, the image sensor 22 and the pocket 12 are not brought into direct thermal contact with each other, but are brought into thermal contact via the lead frame 25 and the heat transfer member 28. For this reason, when the temperature of the pocket 12 decreases due to the introduction of a cooling material such as dry ice, the heat of the CCD image sensor chip 26 is transferred to the lead frame 25 and the heat transfer member 2.
8 into the pocket 12. As a result, the temperature of the chip 26 decreases.

On the other hand, the package for hermetically sealing the chip 26 is formed of ceramic or epoxy resin, and has a very low thermal conductivity as compared with the heat transfer member 28 or the lead frame 25 which is a metal. The contact area between the package and the package is sufficiently small. For this reason,
The heat outflow from the protective glass 24 through the package is extremely small. That is, the protective glass 24 is hardly cooled.

Accordingly, only the CCD image sensor chip 26 in the image sensor 22 is selectively cooled.
As a result, since the chip temperature decreases, high-quality imaging with reduced dark current can be performed, and at the same time, the temperature on the glass surface (external air surface) hardly decreases, so that dew condensation does not occur. Further, even if the temperature of the CCD image sensor chip itself becomes low, since the internal space of the device is in a dry state containing no moisture, no internal dew condensation occurs.

As described above, according to the present embodiment, as compared with a conventional apparatus using a cooling mechanism such as a Peltier element for cooling the image pickup element 22, the apparatus configuration can be downsized, and the manufacturing cost can be significantly reduced. Can be cheaper. Moreover,
Only the CCD image sensor chip 26 of the image sensor 22 can be selectively cooled, and the cooling of the protective glass 24 can be suppressed, so that dew condensation can be prevented. In addition, the camera can be carried around as a general camera on a daily basis, and can be cooled and photographed temporarily as needed, and its usefulness is extremely large.

(Second Embodiment) FIG. 3 shows a second embodiment of the present invention.
FIG. 3 is a cross-sectional view illustrating a configuration of a main part of the electronic camera according to the embodiment. The same parts as those in FIG.
Detailed description is omitted.

This embodiment differs from the first embodiment described above in that the mounting portion is used for cooling instead of the integrated outer lead of the image pickup device.

The pocket 12 is a metal plate 3 as a heat transfer member.
8, a part of which constitutes a frame member and a heat transfer member for mounting the CCD. In addition, as shown in FIG. 2, a configuration in which a dedicated metal plate is used as the heat transfer member may be used.

The mounting portion 35, which is an extension projecting portion of the lead frame, is screwed to the frame member / heat transfer member 38 by a screw 39 using the hole. Note that soldering may be performed as shown in FIG. The leads other than the mounting portion are soldered to the mounting board 33. Further, an insulating heat insulating sheet 31 is disposed between the mounting board 33 and the frame member / heat transfer member 38 constituting the pocket 12.

Although not essential, connection pads provided at appropriate places (continuous with the mounting portion) of the lead frame are connected to the GND pads of the CCD image sensor chip 26 by bonding wires 27. Is desirable. In this case, the mounting portion is the image sensor 22
Will also serve as an electrical connection terminal as GND.
There is an effect that the number of leads can be reduced. Furthermore, the metal plate 3
8 can also serve as a shielding material, in which case the effect of reducing the number of members is produced.

The embodiment shown in FIG. 3 may be used together with the embodiment shown in FIG. 2. However, when not used together, the image pickup device does not have an integral outer lead extending from the lead frame (accordingly, all the outer leads are not provided). An image pickup element such as that the leads are individually separated after the tie bar cut in the manufacturing process) is more preferable because the contact area serving as a thermal contact between the lead frame (die pad) and the package becomes smaller.

With such a configuration, the image pickup device 22 can be cooled if necessary, and only the CCD image pickup device chip 26 of the image pickup device 22 can be selectively cooled as in the first embodiment. However, since the cooling of the protective glass 24 can be suppressed, the same effects as those of the first embodiment can be obtained.

(Third Embodiment) FIG. 4 shows a third embodiment of the present invention.
1A is a view for explaining a basic configuration of an electronic camera according to the embodiment, FIG. 1A is a horizontal sectional view seen from above, and FIG.
Is a rear view, and (c) is a structural sectional view of a coolant unit. The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

The present embodiment differs from the first embodiment described above in that a mounting pocket 16 to which a coolant unit 40 can be mounted is provided instead of the dry ice charging pocket 12. The pocket 16 is formed by providing a concave portion on the rear side 11 of the camera housing 10, and the coolant unit 40 is detachable.

As shown in FIG. 4 (c), the coolant unit 40 comprises a structure 41 having an internal cavity and a refrigerant 42 filled and sealed in the cavity. It is determined to get stuck. In the mounted state, as shown in FIG. 4A, the rear surface (exposed surface) of the unit 40 continuously forms the exterior surface of the camera housing 10.

The structure for thermally connecting the coolant unit 40 and the image pickup device 22 is the same as that of FIG. 2 except that a metal plate is provided at the bottom of the pocket 16 and a part is led out to the CCD mounting side. The integrated outer lead 25 of the image sensor 22 may be soldered to the mounting board 23 together with the metal plate 28 by using the component 28. Further, as shown in FIG. 3, the pocket itself may be formed of a metal plate.

The refrigerating agent 42 of the cooling unit 40 utilizes the heat storage effect of the latent heat of the substance, and can be cooled very easily for a relatively long period of time by previously cooling it in, for example, a freezing room of a home refrigerator. It is assumed that. In addition, such a refrigerant itself has been put into practical use as a general-purpose refrigerant pack (in which a refrigerant is sealed in a soft plastic pack) used for homes such as "ice bags that do not require ice," and various kinds of compositions are used. Things exist. Coolant 42 according to the invention
Can be used, but for example, a mixture of water, a gelling agent and ethylene glycol may be used.

With such a configuration, it is possible to use the coolant unit 40 as a normal electronic camera with the coolant unit 40 attached without any particular cooling. Alternatively, if the unit 40 is removed from the pocket 16 and used, the weight can be further reduced. On the other hand, by cooling the coolant unit 40 sufficiently beforehand and fitting it into the pocket 16,
The imaging element 22 can be efficiently cooled, and an extremely low-luminance subject can be photographed as in astronomical photography. Moreover, in this case, only the CCD image sensor chip of the image sensor 22 can be selectively cooled, and the cooling of the protective glass 24 can be suppressed, so that the same effect as in the first embodiment can be obtained.

(Fourth Embodiment) Next, as a fourth embodiment of the present invention, an example of an imaging device particularly suitable for use in the present invention is shown in FIGS.

As shown in the perspective view of FIG. 5, a protective glass 76 is attached to the light receiving surface side of a package 71 containing a semiconductor chip (not shown), and this package 71 is a part of a lead frame. A connection terminal 74c and a mounting (positioning) portion 74b are provided.

FIG. 6 is a plan view of a lead frame (74 in FIG. 7) before manufacture of the image pickup device, which is described for reference. In FIG. 6, the black portions indicate portions removed by press working or the like. In addition, four corner lines P indicate positions corresponding to the four corners of the manufactured insulating package 71. In FIG. 7, the mounting portion 74b is omitted.

As shown in FIGS. 6 and 7, the lead frame 74 has a die pad 74a (island) on which the semiconductor chip 72 is mounted and die-bonded.
6, and leads (the inside of the package is referred to as an inner lead and the outside is referred to as an outer lead 74c), and tie bars 74d (both right and left ends in FIG. 6) which are lead connection parts at the time of manufacture.

The semiconductor chip 72 is bonded on the die pad 74a by a die bond paste 73. As the die bond paste 73, any one can be used, but it is particularly preferable that the die bond paste 73 be a resin having a high thermal conductivity. In the present embodiment, this is used.

After the connection electrodes of the semiconductor chip 72 and the inner pads provided at the ends of the inner leads are bonded by bonding wires 75 such as gold, the protective glass 7 is dried in a dry atmosphere such as dry air or an inert gas.
6 and bonded and sealed with a sealing resin (adhesive) 77. Thus, the internal space 78 is kept in a dry state that does not contain moisture.

The tie bar 74d is cut along the lines CC and C'-C 'in FIG. 6 after the sealing is completed, whereby each lead except for a part is individually separated.

This element has the following features. (A) The outer leads 74c at the four corners are
(A) from the die pad 74a to the outside of the insulating package 71, a point having a mounting portion 74b extending in a direction different from that of the lead. The lead 74c and the mounting portion 74b are respectively connected to the die pad 7
4a with high heat conductivity (thermal conductivity).

In detail, (a), as shown in FIG. 6, only the square leads, unlike the other leads, are continuously extended as they are from the die pad portion and are integrally formed (see FIG. 6). (Integrally connected inside the package 71), it is separated from other outer leads by tie bar cutting, but not separated from the die pad portion.

On the other hand, the semiconductor chip 72 is
a is in contact with the surface via a thin-layer die bond paste, so that the thermal resistance therebetween is extremely low. In particular, the use of a highly heat-conductive resin for the die bond paste 73 is even more remarkable.

As a result, the integral outer lead 74c and the mounting portion 74b are connected to the semiconductor chip 72 with extremely low thermal resistance. Therefore, by cooling either the integral outer lead 74c or the mounting portion 74b, the semiconductor chip 72 can be efficiently cooled.

Here, as shown in FIG. 6A, the space between the die pad portion 74a and the mounting portion 74b is configured to be narrower than both portions, as shown in FIG. The purpose is to make the contact area between the lead frame body 74 and the package 71 as small as possible. That is, when the package 71 is cooled, the package 71 and the protective glass 76 themselves have a high thermal resistance but the heat conduction is not zero. It may be. To prevent this, it is effective to reduce the heat transfer between the lead frame 74 and the package 71 by making the contact area serving as a thermal contact between the lead frame 74 and the package 71 as small as possible.

In FIG. 7, the die pad portion 74a
Is placed in contact with the package 71 as a whole, so that the package 71 and the die pad 7
4a may be affected. On the other hand, a die bond paste 73 for bonding this portion is used.
It is effective to use an adhesive having a high heat resistance.

(Fifth Embodiment) FIG. 8 is a cross-sectional view showing an example of an imaging device particularly suitable for use in the present invention, similarly to the fourth embodiment described above. The same parts as those in FIG. 7 are denoted by the same reference numerals, and detailed description thereof will be omitted.

This embodiment differs from the fourth embodiment in that a space 8 'is also provided below the die pad 74a for die bonding the semiconductor chip 72.
In this case, the die pad 74a is supported only by the peripheral portion or the corner portion 71a, and this portion is adhered. Of course, if necessary, a few pillars are provided in appropriate places other than the peripheral part, so that secure mounting and die pad 7
The compatibility of the reduction of the contact area with 4a can be further enhanced.

In this embodiment, since the space 8 'is also provided below the die pad 74a, the thermal resistance between the semiconductor chip 72 and the package 71 can be further increased. Therefore, heat transfer between the semiconductor chip 72 and the package 71 can be reduced.

When a gas exists in the internal space 78,
The convection causes a slight heat conduction between itself and the protective glass 76, which may affect the heat conduction. In order to cope with this, one of the effective embodiments is to form the internal space 78 in a vacuum (meaning of an industrial vacuum, and it is sufficient to reduce the pressure as needed). For example, the sealing in the imaging element manufacturing process may be performed in a vacuum.

Further, the inner space 78 and the protective glass 76
Regarding, for example, by transparent resin molding technology, "elements that are filled with transparent resin and have no internal space",
There is also a “transparent resin (packaging material) itself that also serves as a surface glass and does not use an independent protective glass member”. Since such a transparent resin usually has low heat conductivity (high heat resistance), the same effect can be obtained by using them.

(Modification) The present invention is not limited to the above embodiments. In the embodiment, the cooling lead frame (outer lead or mounting portion) is G
Although an example in which the ND terminal is shared is described above, another arbitrary signal electrode may be shared. However, from the viewpoint that it is generally not preferable to assign such an electrically useless giant conductor to an AC signal, an example that can be said to be preferably used other than GND is a power supply or a constant voltage bias signal. And the like.

In the first embodiment, dry ice is used as a cooling agent to be charged into the cooling agent charging pocket.
This may be input. Alternatively, a dedicated cooling agent unit corresponding to the shape of the pocket may be prepared and inserted. In this case, it can be said that in the third embodiment, a lid is provided in the pocket. Further, if the pocket is configured to have a waterproof structure, it is possible to use ice, and there is an effect that availability of a usable coolant is significantly increased.

The lid shown in the figure has an outwardly open structure with a hinge. However, if it is configured as a slide type (sliding laterally open), it can be used even with the lid open, so that the lid can be used. In such a case, there is an effect that the heat radiation effect at all times when the coolant is not inserted is improved.

In the third embodiment, a cooling unit filled and sealed with a cooling agent (referred to as a cooling agent type) is used as the cooling unit. However, the present invention is not limited to this. May be provided with a pocket having a lid portion, into which can be put. In this case, the coolant unit (referred to as a pocket type) having such a configuration and the above-described coolant type unit can be formed in a common mounting shape, and can be configured to be exchangeable for one camera. Such a configuration has an extremely large effect having all the features of versatility and low cost by using a pocket type unit as needed, and by using a cold storage type unit as needed.

The opening position of the pocket of the camera is not limited to the rear side of the camera body. If you want to place the monitor LCD in the center position on the back of the camera, or if you have a body that is long in the direction of the lens optical axis, such as a video movie,
It can be provided on any surface as needed, such as by providing a pocket opening on the top side of the camera body (and thus on the rear side of the image sensor). In addition, various modifications can be made without departing from the scope of the present invention.

[0072]

As described in detail above, according to the present invention, a pocket for introducing a coolant or a pocket for attaching a coolant unit is provided near the image sensor, so that the image sensor can be simplified as required. Can be cooled. In this case, the imaging device can be cooled without increasing the size of the device or increasing the cost, and long-time exposure such as in astrophotography can be performed. In addition, by providing a heat conducting member for thermally connecting the coolant supply pocket and the lead frame on which the semiconductor chip of the image sensor is mounted, it is possible to selectively cool only the semiconductor chip of the image sensor. Thus, the cooling of the protective glass can be suppressed to prevent dew condensation.

[Brief description of the drawings]

FIG. 1 is a horizontal sectional view and a rear view for explaining a basic configuration of an electronic camera according to a first embodiment.

FIG. 2 is an exemplary sectional view showing a configuration of a main part of the electronic camera according to the first embodiment;

FIG. 3 is an exemplary sectional view showing a configuration of a main part of an electronic camera according to a second embodiment;

FIG. 4 is a horizontal sectional view and a rear view for explaining a basic configuration of an electronic camera according to a third embodiment, and a structural sectional view of a cooling unit.

FIG. 5 is a perspective view for explaining a fourth embodiment and showing an example of an imaging device suitable for use in the present invention.

FIG. 6 is a plan view showing a lead frame structure of an image sensor according to a fourth embodiment.

FIG. 7 is a sectional view showing a specific structure of an image sensor according to a fourth embodiment.

FIG. 8 is a sectional view showing a specific structure of an image sensor according to a fifth embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Camera housing 11 ... Back side (camera back side) 12 ... Coolant charging pocket 13 ... Lid 14 ... Lock mechanism 16 ... Coolant unit mounting pocket 21 ... Lens 22 ... Image sensor 23, 33 ... Mounting board 24 , 76 ... Protective glass 25 ... Connection terminal (lead frame) 26, 72 ... CCD image pickup device chip (semiconductor chip) 27, 75 ... Bonding wire 28, 38 ... Metal plate 29 ... Solder 31 ... Insulating heat insulating sheet 35 ... Mounting part (Lead frame) 39 ... Screw 40 ... Coolant unit 71 ... Package 73 ... Die bond paste 74 ... Lead frame 74a ... Die pad 74b ... Mounting part 74c ... Connection terminal 74d ... Tie bar 77 ... Seal resin (adhesive) 78 ... Space

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H04N 5/225 H05K 7/20 Q 5F036 5/335 H01L 23/36 D 5F067 H05K 7/20 27/14 D BF term (reference) 3L044 AA04 BA06 CA14 CA15 DC02 EA04 KA04 4M118 AA05 AA10 AB01 BA10 HA02 HA12 HA19 HA20 HA24 HA30 HA36 5C022 AA01 AB37 AC42 AC54 AC64 AC77 AC78 5C024 CX03 CY47 CY48 EX22 EX26 A12A11A12A11A12A BA06 BA23 BB21 5F067 AA03 AB02 BC12 BD02 BD06 CA07

Claims (9)

[Claims] 1. An imaging device for forming an image of a subject obtained through a lens on a light receiving surface of an image sensor and capturing an image of the subject with the image sensor, wherein a cooling agent provided near the image sensor is provided. An imaging device, comprising: a pocket for heat transfer; and a heat conducting member for thermally connecting the pocket and a lead frame on which the semiconductor chip of the imaging device is mounted. 2. An imaging device for forming an image of a subject obtained through a lens on a light receiving surface of an image sensor, and capturing an image of the subject with the image sensor, wherein a coolant unit is provided near the image sensor. And a heat conductive member for thermally connecting a coolant unit mounted in the pocket and a lead frame on which the semiconductor chip of the image sensor is mounted. Imaging device. 3. The image pickup device is enclosed in an insulating package, and the lead frame has a protruding portion extended outside the insulating package, and the heat conducting member is connected to the protruding portion. 2. The method according to claim 1, wherein
Or the imaging device according to 2. 4. The image pickup apparatus according to claim 3, wherein the projecting portion of the lead frame forms a mounting portion for mounting or positioning the image pickup device. 5. The imaging device according to claim 3, wherein the projecting portion of the lead frame is an integrated outer lead formed continuously with a die pad for die bonding a semiconductor chip of the imaging device. apparatus. 6. The image pickup apparatus according to claim 4, wherein the projecting portion of the lead frame also serves as a GND terminal of the image pickup device. 7. The pocket is located on the back side of the image sensor and has a room-like structure having a lid, and the lid continuously connects an exterior surface of an apparatus housing containing the image sensor and the lens. 2. The method according to claim 1, wherein
Or the imaging device according to 2. 8. A coolant unit for cooling an image pickup device of an image pickup device provided with an image pickup device for photographing a subject image, wherein the coolant unit is detachably attached to a pocket provided in the image pickup device. A coolant unit characterized by the following. 9. The device according to claim 8, wherein the exposed surface attached to the pocket continuously forms an exterior surface of an apparatus housing accommodating the imaging element and the lens. Coolant unit.