JP2002005945A - Rotation detecting sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-priced high-quality rotation detecting sensor capable of shortening welding time and capable of enhancing airtightness reliability. SOLUTION: In a rotation detecting sensor 1 made by installing a rotation detecting element 5 on a sensor body 2, providing a case 6 for housing the detecting element 5 therein, providing a projection 6e for welding a butt surface 6d of the case 6 at the sensor body 2, and weld-fixing the sensor body 2 on the case 6 by melting the projection 6e, a plurality of projections 6e and 6e, for welding are provided on the butting surface 6d of the case 6 at the sensor body 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotation detecting sensor such as a semiconductor pickup sensor for detecting rotation of a gear used for an engine or a transmission of an automobile.

[0002]

2. Description of the Related Art FIGS.
A semiconductor pickup sensor shown in FIG. 8 is known. This semiconductor pickup sensor 1 is shown in FIGS.
As shown in FIG. 3, a sensor body 2 made of synthetic resin in which a pair of terminals 3 and 3 are integrally formed by insert molding of resin, a leg 2b of the sensor body 2 and a base end 3a side of the pair of terminals 3 and 3 And a substantially cylindrical case 6 'made of a synthetic resin having a bottom for accommodating and covering portions other than the above.

The sensor body 2 has a substantially cylindrical body 2a, a substantially semi-cylindrical leg 2b integrally formed below the body 2a, and a horizontal portion extending from one side of the body 2a. A substantially cylindrical L-shaped side with a bottomed and substantially cylindrical hood portion (not shown) formed integrally with and extending so as to extend. Further, in the hood portion of the sensor body 2, the respective base ends 3a of the pair of terminals 3, 3 are exposed to the outside from the bottom surface, and the respective base ends 3a are mated connectors (not shown) fitted to the hood portion. Are electrically connected to a pair of female terminals (not shown).

A pair of terminals 3, 3 are bent in an L-shape along substantially the center of the sensor main body 2, and the pair of terminals 3, 3 exposed along the legs 2b of the sensor main body 2 are formed. A pair of leads 4a, 4a of a discrete type capacitor 4 are connected and fixed at predetermined positions of each central portion 3b by soldering. Further, a pair of terminals 3, 3
Each end 3c has a Hall IC 5 as a rotation detecting element.
The pair of leads 5a, 5a are connected and fixed by soldering. The Hall IC 5 has a built-in magnet (not shown), and detects a change in magnetic flux of a magnetic circuit formed by the magnet and the gear (detected body) 9 to detect the rotation speed of the gear 9. .

A synthetic resin case 6 'has a substantially cylindrical bottomed cylindrical portion 6a for accommodating the leg 2b of the sensor main body 2, a pair of terminals 3, 3 and the Hall IC 5 from its opening. The flange 6b is integrally formed with the flange 6b so as to extend horizontally in the horizontal direction from the upper end of the portion 6a, and has a substantially L-shaped side surface. An annular concave portion 6c is formed at the center of the outer periphery of the cylindrical portion 6a of the case 6 ', and an O-ring 7 made of rubber is attached to the annular concave portion 6c.

Further, as shown in FIGS. 6 and 7, an annular welding projection 6e formed at the center butting surface 6d of the upper end surface of the cylindrical portion 6a of the case 6 'is attached to the body 2 of the sensor body 2.
A welding step such as ultrasonic welding or orbital vibration welding is used for welding and fixing to the stepped portion 2e of the abutting surface 2d. Further, as shown in FIGS. 6 and 8, a round hole 6h for mounting is formed in the flange portion 6b of the case 6 '.
It is attached to the vehicle body (attached body) 8 via fastening means such as bolts (not shown) inserted into the round hole 6h. As a result, as shown in FIG. 5, the case 6 'side of the semiconductor pickup sensor 1 is brought close to the gear 9 used for the engine or the transmission of the automobile. Then, the bumps 9a and the recesses 9b of the gear 9 rotating in the direction of arrow A in FIG. 5 are detected by the Hall IC 5 of the semiconductor pickup sensor 1, and the rotation speed of the gear 9 is detected. .

[0007]

However, in the conventional semiconductor pickup sensor 1, the sensor body 2
Since the welding area of the welding projection 6e of the butting surface 6d of the case 6 'to the stepped portion 2e of the butting surface 2d is large, the welding strength and airtightness between the sensor body 2 and the case 6' are high, but the welding projection 6e is It was difficult to melt, the welding time was long, and the cost was high.

Accordingly, the present invention has been made to solve the above-mentioned problems, and an inexpensive and high-quality rotation detection sensor capable of shortening the welding time and improving the airtight reliability is provided. The purpose is to provide.

[0009]

According to a first aspect of the present invention, a rotation detecting element is assembled to a sensor main body, a case for accommodating the rotation detecting element is provided, and a welding projection is provided on a surface of the case that abuts the sensor main body. A rotation detection sensor configured to melt the welding protrusion to weld and fix the sensor body and the case, wherein a plurality of the welding protrusions are provided on an abutting surface of the case with the sensor body. It is characterized by the following.

In this rotation detecting sensor, since a plurality of welding projections are provided on the surface of the case abutting on the sensor body, the welding area of each welding projection is reduced, so that the welding is facilitated. The welding time is shortened and the processing cost is reduced. Further, since there are a plurality of welded portions between the sensor main body and the case, the airtight reliability between the sensor main body and the case is improved.

According to a second aspect of the present invention, there is provided the rotation detecting sensor according to the first aspect, wherein the plurality of welding projections of the case are respectively provided at the same height, and among the plurality of welding projections of the case. A burr-preventing projection higher than the outermost welding projection is provided outside the outermost welding projection, and a welding is provided between and adjacent to the burr-preventing projection and the outermost welding projection. And a groove having the same depth is provided between the protrusions.

In this rotation detecting sensor, the plurality of welding projections are substantially uniformly melted to securely weld the sensor body and the case, and at the time of welding, each groove portion and the projection for preventing burrs are used to melt the sensor body. And the outflow toward the outer peripheral surface of the case is reliably prevented.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view showing a semiconductor pickup sensor according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a state before welding the sensor body of the semiconductor pickup sensor and a resin case. Is an enlarged sectional view of a portion B in FIG. 2,
FIG. 4 is a sectional view of the semiconductor pickup sensor.

As shown in FIGS. 1, 2 and 4, a semiconductor pickup sensor (rotation detection sensor) 1 is a sensor body 2 made of synthetic resin in which a pair of terminals 3, 3 are integrally formed by resin insert molding. And a substantially cylindrical case 6 made of synthetic resin with a bottom for housing and covering the leg 2b of the sensor main body 2 and portions of the pair of terminals 3 except for the base end 3a side. I have.

The sensor body 2 has a substantially cylindrical body 2a, a substantially semi-cylindrical leg 2b integrally formed below the body 2a, and a horizontal portion extending from one side of the body 2a. A substantially cylindrical L-shaped side with a bottomed and substantially cylindrical hood portion (not shown) formed integrally with and extending so as to extend. Further, in the hood portion of the sensor body 2, the respective base ends 3a of the pair of terminals 3, 3 are exposed to the outside from the bottom surface, and the respective base ends 3a are mated connectors (not shown) fitted to the hood portion. And a pair of female terminals. Electric wires are respectively connected to the female terminals, and the electric wires are connected to a control controller (not shown) on the vehicle side.

A pair of terminals 3 arranged at a predetermined distance,
The portion between each base end 3a and each central portion 3b of the sensor body 3 is bent into an L-shape integrally with the body 2a and the hood of the sensor body 2 by insert molding of resin. A pair of leads 4a, 4a of a discrete type capacitor 4 are connected and fixed at predetermined positions of respective central portions 3b of the pair of terminals 3, 3 exposed along the legs 2b of the sensor body 2 by soldering. I have.

Further, a pair of leads 5 of a Hall IC 5 as a rotation detecting element is provided at each end 3c of the pair of terminals 3 and 3.
a and 5a are respectively connected and fixed by soldering.
The Hall IC 5 has a built-in magnet (not shown), and detects a change in magnetic flux of a magnetic circuit formed by the magnet and a gear (detected body) 9 to detect the rotation speed of the gear 9. is there.

The case 6 made of a synthetic resin is connected to the legs 2b of the sensor body 2 and the bases 3 of the pair of terminals 3, 3 from the opening thereof.
A portion excluding the side a, a bottomed substantially cylindrical tube portion 6a for accommodating the capacitor 4 and the Hall IC 5, and a flange portion 6b integrally formed so as to extend horizontally in the horizontal direction from the upper end portion of the cylindrical portion 6a. And the side is substantially L-shaped. An annular recess 6c is formed at the center of the outer periphery of the cylindrical portion 6a of the case 6, and an O-ring 7 made of rubber is provided in the annular recess 6c.
Has been assembled.

As shown in FIG. 2 and FIG.
A plurality of annular welding projections 6e, 6e 'are formed on the abutting surface 6d at the center of the upper end surface of the cylindrical portion 6a, respectively, and as shown in FIG.
e ′ is ultrasonically welded to the step 2 e of the butting surface 2 d formed on the outer periphery of the lower surface of the body 2 a of the sensor body 2, or
It is fixed by welding such as orbital vibration welding.

More specifically, the construction of the welding portion will be described in detail. A plurality of annular welding projections 6e and 6e 'having the same width are integrally formed on the abutting surface 6d of the case 6 with the sensor body 2. I have. Each of the welding projections 6e and 6e 'is formed at the same height, and the outermost welding projection 6e' located on the outermost surface of the butting surface 6d of the case 6 is provided with the outermost welding. Projection 6e '
An annular burr prevention projection 6f higher than the projection is integrally formed. Further, each welding projection 6e, 6 between and adjacent to the burr prevention projection 6f and the outermost welding projection 6e '.
The annular groove portions 6g, 6g 'having the same depth and the same width and having an inverted U-shaped cross section are formed between the groove portions 6g and 6g', respectively.

As shown in FIG. 3, the step portion 2e of the butting surface 2d of the sensor body 2 and the welding projections 6e and 6e 'of the case 6 are formed in the same size so as to face each other. As shown in FIGS. 2 and 4, a round hole 6h for attachment is formed in the flange portion 6b of the case 6, and through a fastening means such as a bolt (not shown) inserted into the round hole 6h. It is designed to be attached to a vehicle body (attached body) 8.

When assembling the semiconductor pickup sensor 1 of the above embodiment, first, a discrete type capacitor 4 and a Hall IC 5 are assembled to a pair of terminals 3 of the sensor main body 2 by soldering. Next, FIG.
As shown in FIG. 7, the leg 2b of the sensor body 2 is inserted through the central opening of the butting surface 6d of the case 6, and the step 2e of the butting surface 2d of the sensor body 2 and the plurality of welding protrusions 6e of the case 6 are formed. , 6e '. In this state, as shown in FIG. 4, the sensor main body 2 and the case 6 are welded and fixed by a welding method such as ultrasonic welding or orbital vibration welding. Finally, the semiconductor pickup sensor 1 is completed by fitting the O-ring 7 into the annular concave portion 6c of the case 6.

When the sensor body 2 and the case 6 are fixed by welding, the total welding area is substantially the same as the conventional one.
Since two welding projections 6e and 6e 'make the projection of the welding surface to the stepped portion 2e of the abutting surface 2d of the sensor body 2 two, the welding area of each welding projection 6e and 6e' becomes small. As a result, the welding time between the sensor body 2 and the case 6 can be shortened, and the cost can be reduced. Further, since the welding portion between the sensor body 2 and the case 6 is plural, the stepped portion 2e of the butting surface 2d of the sensor body 2 and the two welding projections 6e and 6e 'of the butting surface 6d of the case 6 are reliably welded. Thus, the airtight reliability between the sensor body 2 and the case 6 can be further improved.

Further, the two welding projections 6e,
6e 'are made the same height, and the welding projection 6
A projection 6f for preventing burrs higher than the outer welding projection 6e 'is integrally formed on the outer side of the outer welding projection e', and each welding between and adjacent to the burr preventing projection 6f and the outer welding projection 6e '. Since the groove portions 6g and 6g 'having the same depth and the same width are formed between the protrusions 6e and 6e', respectively, the two welding protrusions 6e and 6e 'are substantially uniformly melted, and the sensor body 2 and the case 6 are fused. And can be reliably welded,
At the time of welding, the grooves 6g, 6g 'and the projections 6f for preventing burrs can reliably prevent the melt from flowing out toward the outer peripheral surfaces of the sensor body 2 and the case 6. This eliminates the necessity of deburring work after welding, thereby further reducing the cost as a whole.

The semiconductor type pickup sensor 1 completed in this manner has a flange 6 b of the resin case 6.
Is attached to the vehicle body 8 via fastening means such as bolts, and the resin case 6 is used in a state in which the resin case 6 is close to a gear 9 used for an engine or a transmission of an automobile. That is, a gear 9 that rotates in the direction of arrow A in FIG.
The rotation of the gear 9 is detected by detecting the unevenness of the projection 9a and the recess 9b, and the rotation of the gear 9 is controlled by the control controller.

According to the above-described embodiment, the unevenness of the gears used for the engine, transmission, etc. of the automobile is reduced by the hole I.
Although the semiconductor type pickup sensor which detects at C and controls the number of rotations of the gear by the control controller has been described, the object to be detected is not limited to a gear used for an engine or a transmission of an automobile, and other objects to be detected. Needless to say, the embodiment can be applied to a rotation detection sensor that detects the rotation of the detection body.

[0028]

As described above, according to the first aspect of the present invention, since a plurality of welding projections are provided on the surface of the case abutting on the sensor body, the welding area of each welding projection is reduced. It becomes smaller and easier to melt, so that the welding time between the sensor body and the case can be shortened, and the processing cost can be reduced. Furthermore, since there are a plurality of welded portions between the sensor main body and the case, the airtight reliability between the sensor main body and the case can be improved.

According to the invention of claim 2, the plurality of welding projections of the case are provided at the same height, and the plurality of welding projections of the case are provided outside the welding projections located at the outermost positions of the plurality of welding projections. A burr prevention projection higher than the outermost welding projection is provided, and a groove having the same depth is provided between the burr prevention projection and the outermost welding projection and between each adjacent welding projection. Since the plurality of welding projections are substantially uniformly melted, the sensor body and the case can be reliably welded to each other. Outflow in the outer peripheral surface direction can be reliably prevented.

[Brief description of the drawings]

FIG. 1 is a front view showing a semiconductor pickup sensor according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a state before welding the sensor body of the semiconductor pickup sensor and a resin case.

FIG. 3 is an enlarged sectional view of a portion B in FIG. 2;

FIG. 4 is a cross-sectional view of the semiconductor pickup sensor.

FIG. 5 is a front view showing a usage state of a conventional semiconductor pickup sensor.

FIG. 6 is a cross-sectional view showing a state before welding the sensor body and the resin case of the conventional semiconductor pickup sensor.

FIG. 7 is an enlarged sectional view of a portion C in FIG. 6;

FIG. 8 is a cross-sectional view of the conventional semiconductor pickup sensor.

[Explanation of symbols]

 Reference Signs List 1 semiconductor pickup sensor (rotation detection sensor) 2 sensor main body 5 Hall IC (rotation detection element) 6 case 6d butting surface 6e, 6e 'plural welding projections 6f burr prevention projections 6g, 6g' groove

Claims (2)

[Claims] 1. A rotation detecting element is assembled to a sensor body,
A case for accommodating the rotation detecting element is provided, and a welding projection is provided on a surface of the case that abuts on the sensor main body. The welding projection is melted to fix the sensor main body to the case by welding. A rotation detection sensor, wherein a plurality of the welding projections are provided on a surface of the case that abuts against the sensor body. 2. The rotation detection sensor according to claim 1, wherein the plurality of welding projections of the case are provided at the same height, and are located at the outermost of the plurality of welding projections of the case. A burr prevention projection higher than the outermost welding projection is provided outside the welding projection to be formed, and between the burr prevention projection and the outermost welding projection and between adjacent welding projections. A rotation detection sensor, wherein grooves having the same depth are provided on the rotation detecting sensor.