JP2002005947A - Rotation detecting sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-priced high-quality rotation detecting sensor with excellent durability. SOLUTION: This rotation detecting sensor 10 is made by installing a rotation detecting element 14 and a capacitor 13 in a sensor body 11 by means of a pair of terminals 12 and 12, and housing the detecting element 14, the capacitor 13 and the end 12c sides of the pair of terminals 12 and 12 in a case 15 to cover them by the case 15. Capacitor mounting parts 12d of the pair of terminals 12 and 12 are about 90 deg. bent relative to their axial direction and lead insertion parts 12e are formed on the front edge sides of the bent mounting parts 12d. As the capacitor, a discrete-type capacitor 13 is used. A pair of leads 13a and 13a of the capacitor 13 are inserted into the insertion parts 12e of the pair of mounting parts 12d and 12d, respectively, and the mounting parts 12d are connected by soldering to the leads 13a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotation detecting sensor such as a semiconductor pickup sensor for detecting rotation of a gear used for an engine or a transmission of an automobile.

[0002]

2. Description of the Related Art FIG.
A semiconductor pickup sensor shown in FIG. 7 is known. As shown in FIG. 7, the semiconductor pickup sensor 1 has a sensor body 2 made of a synthetic resin in which a pair of terminals 3 and 3 are integrally formed by insert molding of a resin, and a leg 2b of the sensor body 2 and a pair of terminals. A substantially cylindrical case 6 made of synthetic resin with a bottom for housing and covering portions of the terminals 3 except for the base end side and the like is provided.

The sensor body 2 has a substantially cylindrical body 2a, a substantially semi-cylindrical leg 2b integrally formed below the body 2a, and a horizontal portion extending from one side of the body 2a. A substantially cylindrical L-shaped side with a bottomed and substantially cylindrical hood portion (not shown) formed integrally with and extending so as to extend. In the hood portion of the sensor main body 2, the base ends of the pair of terminals 3 and 3 are exposed to the outside from the bottom surface thereof. Are electrically connected to a pair of female terminals, respectively.

A pair of terminals 3, 3 are bent in an L-shape so as to extend substantially along the center of the sensor main body 2, and between the central portions 3b of the pair of terminals 3, 3 exposed along the legs 2b. The chip capacitor 4 is directly connected and fixed by soldering. Furthermore, at each tip 3c of the pair of terminals 3, 3,
A pair of leads 5 of a Hall IC 5 as a rotation detecting element
a and 5a are connected and fixed by soldering. The Hall IC 5 has a built-in magnet (not shown), and detects a change in magnetic flux of a magnetic circuit formed by the magnet and the gear (detected body) 9 to detect the rotation speed of the gear 9. .

[0005] A case 6 made of a synthetic resin has a leg 2b of the sensor body 2, a pair of terminals 3, 3 and a hole I through its opening.
A substantially cylindrical tubular portion 6a having a bottom in which C5 is accommodated;
The flange portion 6b integrally formed so as to extend horizontally in the horizontal direction from the upper end of the upper portion a has a substantially L-shaped side surface. An annular recess 6c is formed at the center of the outer periphery of the cylindrical portion 6a of the case 6, and a rubber O
The ring 7 is assembled.

As shown in FIG. 8, an annular welding projection 6d formed on the upper end surface of the cylindrical portion 6a of the case 6 is ultrasonically welded to the butting surface 2d of the body 2a of the sensor body 2.
Alternatively, welding and fixing are performed by a welding method such as orbital vibration welding. Further, as shown in FIG. 7, a round hole 6e for attachment is formed in the flange portion 6b of the case 6, and the vehicle body (covered) is inserted through a fastening means such as a bolt (not shown) inserted into the round hole 6e. 8). This allows
As shown in FIG. 6, the case 6 side of the semiconductor pickup sensor 1 is brought close to a gear 9 used for an engine or a transmission of an automobile. The unevenness of the projection 9a and the recess 9b of the gear 9 rotating in the direction of arrow A in FIG. 6 is detected by the Hall IC 5 of the semiconductor pickup sensor 1, and the rotation speed of the gear 9 is detected. .

[0007]

However, in the conventional semiconductor pickup sensor 1, the chip capacitor 4 having no leads is directly soldered to the central portions 3b of the pair of terminals 3,3. Therefore, manual soldering or the like is basically impossible, and the workability of soldering the chip capacitor 4 is poor. Further, during soldering of the chip capacitor 4, there is a possibility of cracking of the capacitor due to thermal shock (rapid change in ambient temperature, that is, thermal shock), resulting in poor durability (heat shock resistance).

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and has as its object to provide an inexpensive and high-quality rotation detection sensor having excellent durability.

[0009]

According to a first aspect of the present invention, a rotation detecting element and a capacitor are assembled to a sensor main body via a pair of terminals, and the rotation detecting element, the capacitor and each end of the pair of terminals are connected to each other. In a rotation detection sensor, which is housed in a case and covered with the case, and each of which has a capacitor mounting portion for mounting the capacitor at a predetermined position of the pair of terminals, each of the capacitor mounting portions of the pair of terminals has an axis. While being formed at approximately 90 ° with respect to the direction, a lead insertion portion is formed at the front edge side of each of the bent capacitor mounting portions, while a discrete type capacitor is used as the capacitor, and a pair of the discrete type capacitors is used. Insert the lead into each lead insertion part of the pair of capacitor mounting parts. Characterized in that the Luo and each capacitor mounting portion and the leads are connected by soldering.

In this rotation detecting sensor, when a discrete type capacitor is soldered to a pair of terminals,
Thermal expansion and contraction are absorbed by the pair of leads of the capacitor, and thermal shock resistance is improved.

According to a second aspect of the present invention, there is provided the rotation detecting sensor according to the first aspect, wherein a protrusion for preventing displacement is formed at a position of the sensor body facing the discrete type capacitor. I do.

In this rotation detecting sensor, a pair of leads of the capacitor are inserted into the respective capacitor mounting portions of the pair of terminals by a displacement prevention protrusion formed at a position of the sensor body facing the discrete type capacitor. When each of the capacitors is inserted and assembled into a corresponding part, displacement of the capacitor with respect to the capacitor mounting part is reliably prevented. This makes it possible to automate soldering, thereby improving workability.

According to a third aspect of the present invention, there is provided the rotation detecting sensor according to the first aspect, wherein the lead insertion portions each having a substantially U-shaped concave shape are formed at the front edges of the pair of capacitor mounting portions,
Each of the leads can be freely inserted into the lead insertion portion having a substantially U-shaped concave shape from the direction facing the front edge of each of the capacitor mounting portions as it is.

According to this rotation detecting sensor, it is possible to automate the mounting of the pair of leads of the capacitor to the respective capacitor mounting portions of the pair of terminals, and the mounting workability is improved.
Further, since the forming of the pair of leads of the capacitor is not required, the cost can be further reduced.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view showing a semiconductor pickup sensor according to one embodiment of the present invention, FIG. 2 is a front view of a sensor body used in the semiconductor pickup sensor, and FIG. 4 is a side view of the sensor body, and FIG. 5 is a sectional view of the semiconductor pickup sensor.

As shown in FIGS. 1 to 3 and 5, a semiconductor pickup sensor (rotation detecting sensor) 10 has a sensor body 11 made of synthetic resin in which a pair of terminals 12, 12 are integrally formed by resin insert molding. And a leg 11 b of the sensor main body 11 and a base end 12 of the pair of terminals 12, 12.
A substantially cylindrical case 15 made of a synthetic resin with a bottom that accommodates and covers portions other than the a-side is provided.

The sensor main body 11 has a substantially cylindrical body 11a.
And a substantially semi-cylindrical leg 11b integrally formed at a lower portion of the body 11a, and a substantially cylindrical shape having a bottom integrally formed so as to extend horizontally from one side of the body 11a in a horizontal direction. And the hood portion 11c. The bottom surface 1 is provided in the hood portion 11c of the sensor body 11.
Each base end 12a of the pair of terminals 12, 12 is exposed to the outside from 1d, and each base end 12a is
The connector is electrically connected to a pair of female terminals of a mating connector (not shown) to be fitted to the connector c. Electric wires are respectively connected to the female terminals, and the electric wires are connected to a control controller (not shown) on the vehicle side.

Further, as shown in FIGS. 2, 4 and 5,
A pair of projections 11f, 11f for preventing displacement are integrally formed at positions of the leg 11b of the sensor body 11 facing a discrete type capacitor 13 described later. That is, a pair of protrusions 11 for preventing the displacement
The dimension between f and 11f is slightly larger than the width of the capacitor 13, so that the capacitor 13 is sandwiched between the pair of protrusions 11f and 11f.

A pair of terminals 1 arranged at a predetermined distance from each other
The portion between each base end 12a and each central portion 12b of the sensor body 11 is formed by insert molding of resin.
It is bent in an L-shape integrally with 1a and the hood portion 11c. Each central portion 12b of the pair of terminals 12, 12 exposed along the leg 11b of the sensor body 11
At a predetermined position, a discrete type capacitor 13
Are connected and fixed by soldering.

A specific position of each central portion 12b of the pair of terminals 12, 12 will be described in detail. As shown in FIGS. 2 and 3, a part of each central portion 12b of the pair of terminals 12, 12 It is bent by approximately 90 ° with respect to the direction to form a capacitor mounting portion 12d. At the center of the front edge of each bent capacitor mounting portion 12d, a lead insertion portion 12e is provided.
Is formed. Each of the lead insertion portions 12e is formed so as to be depressed in a substantially U-shaped plane.
Direction C facing the leading edge of 2d (direction of arrow shown in FIG. 4)
The pair of leads 13a, 13a of the discrete type capacitor 13 can be inserted as it is. The lead insertion portions 12e of the capacitor mounting portions 12d of the pair of terminals 12, 12 and the leads 13a of the discrete type capacitor 13 are respectively connected and fixed by soldering.

Each end 12 of the pair of terminals 12
A pair of leads 14a, 14a of a Hall IC 14 as a rotation detecting element are connected and fixed to c by soldering. The Hall IC 14 has a built-in magnet (not shown), and detects a change in magnetic flux of a magnetic circuit formed by the magnet and the gear (detected body) 9 to detect the rotation speed of the gear 9. is there.

The case 15 made of a synthetic resin is connected to the leg 11b of the sensor body 11 and the pair of terminals 12
And a substantially cylindrical tube portion 15a having a bottom for accommodating the capacitor 13 and the Hall IC 14 except for the base end 12a side, and integrally formed so as to extend horizontally and horizontally from an upper end portion of the tube portion 15a. The flange 15b has a substantially L-shaped side surface. An annular recess 15c is formed at the center of the outer periphery of the cylindrical portion 15a of the case 15, and the annular recess 1c is formed.
A rubber O-ring 16 is attached to 5c.

As shown in FIG. 5, an annular welding projection 15e formed on the upper end surface of the cylindrical portion 15a of the case 15.
Is welded and fixed to the butting surface 11e formed on the outer periphery of the lower surface of the body 11a of the sensor body 11 by a welding method such as ultrasonic welding or orbital vibration welding. Further, as shown in FIG. 1, a round hole 15d for mounting is formed in the flange portion 15b of the case 15, and the vehicle body (covered) is fastened through a fastening means such as a bolt (not shown) inserted into the round hole 15d. 8).

In the semiconductor pickup sensor 10 of the embodiment described above, the flange 15b of the resin case 15 is attached to the vehicle body 8 via fastening means such as bolts, and the resin case 15 is connected to the engine or transmission of the automobile. Is used in a state of being brought close to the gear 9 used for the above. That is, the protrusions 9a and the recesses 9b of the gear 9 rotating in the direction of arrow A in FIG. 1 are detected by the Hall IC 14 incorporating the magnet of the semiconductor pickup sensor 10, and the rotational speed of the gear 9 is detected. 9 is controlled by the control controller.

In this semiconductor type pickup sensor 10, a discrete type capacitor 13 is used as a capacitor, and a pair of terminals 12, 12 insert-molded in the sensor main body 11 are bent approximately 90 ° and each of the capacitor mounting portions 12d is substantially in a plane. A pair of leads 13a and 13a of the discrete type capacitor 13 are inserted into the U-shaped concave lead insertion portion 12e in a direction indicated by an arrow C in FIG.
a after being inserted as it is, a pair of terminals 1
2 and 12 and the capacitor 13
And the leads 13a are assembled by soldering.

As described above, the discrete type capacitor 13 is used as the capacitor, and the pair of leads 13a, 1 of the discrete type capacitor 13 is used.
3a is connected to each of the capacitor mounting portions 12 of the pair of terminals 12 and 12.
d, and each of the capacitor mounting portions 12d and each of the leads 13a are connected by soldering.
When the capacitor 13 is soldered to the capacitors 2 and 12, thermal expansion and contraction can be absorbed by the pair of leads 13a and 13a of the capacitor 13, and the thermal shock resistance can be improved. As a result, the overall assembly accuracy can be further improved.

Further, since a pair of projections 11f, 11f for preventing displacement are formed integrally with the legs 11a of the sensor body 11 at positions facing the discrete type capacitor 13, the pair of projections 11f, 11f are formed. 11f, the capacitor 13 is sandwiched.
3 are connected to a pair of terminals 12, 1
2 lead insertion part 12 of each capacitor mounting part 12d
When each of the capacitors 13 is inserted into the capacitor e, the displacement of the capacitor 13 with respect to each of the capacitor mounting portions 12d can be reliably prevented. This makes it possible to automate the soldering, thereby further improving the workability.

A substantially U-shaped concave lead insertion portion 1 of each capacitor mounting portion 12d of the pair of terminals 12, 12 is provided.
2e, a pair of leads 13a, 13a of the capacitor 13 from the direction C facing the front edge of each of the capacitor mounting portions 12d.
Can be freely inserted as it is, so that it is possible to automate the mounting of the pair of leads 13a, 13a of the capacitor 13 to the respective capacitor mounting portions 12d of the pair of terminals 12, 12, thereby improving the overall mounting workability. It can be further improved. Further, since the forming process of the pair of leads 13a, 13a of the capacitor 13 becomes unnecessary, the cost can be further reduced.

According to the above-described embodiment, the unevenness of the gear used for the engine or the transmission of the automobile is changed by the hole I.
Although the semiconductor type pickup sensor which detects at C and controls the number of rotations of the gear by the control controller has been described, the object to be detected is not limited to a gear used for an engine or a transmission of an automobile, and other objects to be detected. Needless to say, the embodiment can be applied to a rotation detection sensor that detects the rotation of the detection body.

[0031]

As described above, according to the first aspect of the present invention, a discrete-type capacitor is used as a capacitor, and a pair of leads of this discrete-type capacitor are inserted into the respective capacitor mounting portions of a pair of terminals. Each of the capacitor mounting parts and each lead are connected by soldering, so when soldering the capacitor to a pair of terminals, thermal expansion and contraction due to the pair of leads of the capacitor Can be absorbed, and the thermal shock resistance can be improved.

According to the second aspect of the present invention, since the projection for preventing displacement is formed at the position of the sensor body facing the discrete type capacitor, the pair of leads of the capacitor are connected to the pair of terminals by this projection. When each of the capacitor mounting portions is inserted into the lead insertion portion and assembled, the displacement of the capacitor with respect to the capacitor mounting portion can be reliably prevented. This makes it possible to automate the soldering and improve the workability.

According to the third aspect of the present invention, a pair of discrete type capacitors are inserted into the substantially U-shaped concave lead insertion portion of each capacitor mounting portion of the pair of terminals from the direction facing the front edge of each capacitor mounting portion. Can be inserted as they are, so that it is possible to automate the mounting of the pair of leads of the capacitor to the respective capacitor mounting portions of the pair of terminals, and the mounting workability can be further improved. Further, since the forming of the pair of leads of the capacitor is not required, the cost can be further reduced.

[Brief description of the drawings]

FIG. 1 is a front view showing a semiconductor pickup sensor according to an embodiment of the present invention.

FIG. 2 is a front view of a sensor main body used in the semiconductor pickup sensor.

FIG. 3 is a sectional view taken along line BB in FIG. 2;

FIG. 4 is a side view of a sensor main body used in the semiconductor pickup sensor.

FIG. 5 is a sectional view of the semiconductor pickup sensor.

FIG. 6 is a front view showing a usage state of a conventional semiconductor pickup sensor.

FIG. 7 is a cross-sectional view of the conventional semiconductor pickup sensor.

FIG. 8 is an enlarged sectional view of a main part for explaining welding of the sensor body of the conventional semiconductor pickup sensor and a resin case.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 semiconductor pickup sensor (rotation detection sensor) 11 sensor main body 11 f projection 12 for preventing misalignment 12, pair of terminals 12 c tip 12 d, 12 d pair of capacitor mounting parts 12 e lead insertion part 13 capacitor 13 a, 13 a pair of leads 14 Hall IC (rotation detecting element) 15 Case C Direction facing the front edge of capacitor mounting part

Claims (3)

[Claims] 1. A rotation detecting element and a capacitor are assembled to a sensor body via a pair of terminals, and the rotation detecting element, the capacitor and the respective distal ends of the pair of terminals are housed in a case and covered with the case. A rotation detection sensor having a capacitor mounting portion for mounting the capacitor at a predetermined position of the pair of terminals, wherein each of the capacitor mounting portions of the pair of terminals is formed by bending approximately 90 ° with respect to its axial direction. A lead insertion portion is formed on the leading edge side of each of the bent capacitor mounting portions, and a discrete-type capacitor is used as the capacitor, and a pair of leads of the discrete-type capacitor is connected to the respective leads of the pair of capacitor mounting portions. Insert each of these capacitor mounting parts and each lead A rotation detection sensor, wherein the rotation detection sensor is connected by soldering. 2. The rotation detection sensor according to claim 1, wherein a projection for preventing displacement is formed at a position of the sensor body facing the discrete type capacitor. 3. The rotation detecting sensor according to claim 1, wherein each of the lead insertion portions having a substantially U-shaped concave shape is formed at a front edge of the pair of capacitor mounting portions, and the lead having a substantially U-shaped concave shape is formed. A rotation detection sensor, wherein each of the leads is freely insertable into the insertion portion from a direction facing a front edge of each of the capacitor mounting portions.