JP2001510738A5 - - Google Patents

Download PDF

Info

Publication number
JP2001510738A5
JP2001510738A5 JP2000501874A JP2000501874A JP2001510738A5 JP 2001510738 A5 JP2001510738 A5 JP 2001510738A5 JP 2000501874 A JP2000501874 A JP 2000501874A JP 2000501874 A JP2000501874 A JP 2000501874A JP 2001510738 A5 JP2001510738 A5 JP 2001510738A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000501874A
Other versions
JP4354630B2 (ja
JP2001510738A (ja
Filing date
Publication date
Priority claimed from US09/094,930 external-priority patent/US5921856A/en
Application filed filed Critical
Publication of JP2001510738A publication Critical patent/JP2001510738A/ja
Publication of JP2001510738A5 publication Critical patent/JP2001510738A5/ja
Application granted granted Critical
Publication of JP4354630B2 publication Critical patent/JP4354630B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000501874A 1997-07-10 1998-07-02 研磨パッドコンディショニングヘッドのｃｖｄダイヤモンド被覆基材及びその作製方法 Expired - Fee Related JP4354630B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US5214597P 1997-07-10 1997-07-10
US60/052,145 1997-07-10
US09/094,930 US5921856A (en) 1997-07-10 1998-06-15 CVD diamond coated substrate for polishing pad conditioning head and method for making same
US09/094,930 1998-06-15
PCT/US1998/013865 WO1999002309A1 (en) 1997-07-10 1998-07-02 Cvd diamond coated substrate for polishing pad conditioning head and method for making same

Publications (3)

Publication Number Publication Date
JP2001510738A JP2001510738A (ja) 2001-08-07
JP2001510738A5 true JP2001510738A5 (ja) 2006-01-05
JP4354630B2 JP4354630B2 (ja) 2009-10-28

Family

ID=26730242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000501874A Expired - Fee Related JP4354630B2 (ja) 1997-07-10 1998-07-02 研磨パッドコンディショニングヘッドのｃｖｄダイヤモンド被覆基材及びその作製方法

Country Status (5)

Country Link
US (1) US5921856A (ja)
JP (1) JP4354630B2 (ja)
KR (1) KR100528678B1 (ja)
TW (1) TW411302B (ja)
WO (1) WO1999002309A1 (ja)

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100328108B1 (ko) 1996-10-15 2002-03-09 아사무라 타카싯 반도체 기판용 연마패드의 드레서, 그 제조방법 및 그것을 사용한 화학적 기계적 연마방법
US7124753B2 (en) * 1997-04-04 2006-10-24 Chien-Min Sung Brazed diamond tools and methods for making the same
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US7491116B2 (en) * 2004-09-29 2009-02-17 Chien-Min Sung CMP pad dresser with oriented particles and associated methods
US7368013B2 (en) * 1997-04-04 2008-05-06 Chien-Min Sung Superabrasive particle synthesis with controlled placement of crystalline seeds
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US7323049B2 (en) * 1997-04-04 2008-01-29 Chien-Min Sung High pressure superabrasive particle synthesis
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US6679243B2 (en) 1997-04-04 2004-01-20 Chien-Min Sung Brazed diamond tools and methods for making
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
JP3052896B2 (ja) * 1997-06-13 2000-06-19 日本電気株式会社 研磨布表面のドレス治具及びその製造方法
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US6093280A (en) * 1997-08-18 2000-07-25 Lsi Logic Corporation Chemical-mechanical polishing pad conditioning systems
US6159087A (en) * 1998-02-11 2000-12-12 Applied Materials, Inc. End effector for pad conditioning
KR19990081117A (ko) * 1998-04-25 1999-11-15 윤종용 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
DE19833476B4 (de) 1998-07-24 2005-08-25 Huss, Ralf, Dr. Genetisch modifizierte CD34-Negative, adhärent wachsende hämatopoetische Stammzellen und deren Verwendung in der Gentherapie
US6206759B1 (en) 1998-11-30 2001-03-27 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
US6217418B1 (en) * 1999-04-14 2001-04-17 Advanced Micro Devices, Inc. Polishing pad and method for polishing porous materials
WO2000078504A1 (en) * 1999-06-19 2000-12-28 Speedfam-Ipec Corporation Method and apparatus for increasing the lifetime of a workpiece retaining structure and conditioning a polishing surface
DE19938781B4 (de) * 1999-08-16 2004-09-09 Infineon Technologies Ag Konditionierscheibe zum Konditionieren von CMP-Pads
US6290883B1 (en) * 1999-08-31 2001-09-18 Lucent Technologies Inc. Method for making porous CMP article
US6281129B1 (en) * 1999-09-20 2001-08-28 Agere Systems Guardian Corp. Corrosion-resistant polishing pad conditioner
US6240415B1 (en) 1999-10-07 2001-05-29 J. Seth Blumberg Corporate and entertainment management interactive system using a computer network
US7201645B2 (en) * 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
JP3527448B2 (ja) * 1999-12-20 2004-05-17 株式会社リード Ｃｍｐ研磨布用ドレッサー及びその製造方法
US20020027294A1 (en) * 2000-07-21 2002-03-07 Neuhaus Herbert J. Electrical component assembly and method of fabrication
TW504864B (en) 2000-09-19 2002-10-01 Nanopierce Technologies Inc Method for assembling components and antennae in radio frequency identification devices
KR100380183B1 (ko) * 2000-09-22 2003-04-11 한국과학기술연구원 랩핑용 ｃｖｄ다이아몬드 정반 및 이의 제작방법
US6551176B1 (en) 2000-10-05 2003-04-22 Applied Materials, Inc. Pad conditioning disk
EP1328373A2 (en) * 2000-10-24 2003-07-23 Nanopierce Technologies Inc. Method and materials for printing particle-enhanced electrical contacts
US6815052B2 (en) * 2000-12-01 2004-11-09 P1 Diamond, Inc. Filled diamond foam material and method for forming same
US6632127B1 (en) 2001-03-07 2003-10-14 Jerry W. Zimmer Fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and method for making same
JPWO2003009362A1 (ja) * 2001-07-19 2004-11-11 株式会社ニコン 研磨体、ｃｍｐ研磨装置及び半導体デバイスの製造方法
US7037177B2 (en) * 2001-08-30 2006-05-02 Micron Technology, Inc. Method and apparatus for conditioning a chemical-mechanical polishing pad
US7037184B2 (en) * 2003-01-22 2006-05-02 Raytech Innovation Solutions, Llc Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
TWI260256B (en) * 2002-03-25 2006-08-21 Thomas West Inc Conditioner and conditioning methods for smooth pads
US7410483B2 (en) * 2003-05-23 2008-08-12 Novare Surgical Systems, Inc. Hand-actuated device for remote manipulation of a grasping tool
DE10328842B4 (de) * 2003-06-26 2007-03-01 Siltronic Ag Suszeptor für eine chemische Gasphasenabscheidung, Verfahren zur Bearbeitung einer Halbleiterscheibe durch chemische Gasphasenabscheidung und nach dem Verfahren bearbeitete Halbleiterscheibe
US20050025973A1 (en) * 2003-07-25 2005-02-03 Slutz David E. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US7089925B1 (en) 2004-08-18 2006-08-15 Kinik Company Reciprocating wire saw for cutting hard materials
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US7762872B2 (en) * 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US7658666B2 (en) * 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8678878B2 (en) * 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
DE602006004047D1 (de) * 2005-06-03 2009-01-15 Metso Paper Inc Verfahren und vorrichtung zur mechanischen entfaserung von holz
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
TW200726582A (en) * 2005-10-04 2007-07-16 Mitsubishi Materials Corp Rotary tool for processing flexible materials
JP2007152493A (ja) * 2005-12-05 2007-06-21 Ebara Corp 研磨パッドのドレッサー及びその製造方法
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
JP4854445B2 (ja) * 2006-09-25 2012-01-18 三菱マテリアル株式会社 Ｃｍｐコンディショナおよびその製造方法
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
KR20100106328A (ko) * 2007-11-13 2010-10-01 치엔 민 성 Ｃｍｐ 패드 드레서
TWI388402B (en) * 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
WO2009114413A1 (en) * 2008-03-10 2009-09-17 Morgan Advanced Ceramics, Inc. Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing
DE102008016463A1 (de) * 2008-03-31 2009-10-01 Texas Instruments Deutschland Gmbh Verfahren zur Planarisierung einer Halbleiterstruktur
US8252263B2 (en) * 2008-04-14 2012-08-28 Chien-Min Sung Device and method for growing diamond in a liquid phase
EP2411181A1 (en) * 2009-03-24 2012-02-01 Saint-Gobain Abrasives, Inc. Abrasive tool for use as a chemical mechanical planarization pad conditioner
WO2010141464A2 (en) * 2009-06-02 2010-12-09 Saint-Gobain Abrasives, Inc. Corrosion-resistant cmp conditioning tools and methods for making and using same
CN102612734A (zh) 2009-09-01 2012-07-25 圣戈班磨料磨具有限公司 化学机械抛光修整器
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
TWI464839B (zh) 2010-09-21 2014-12-11 Ritedia Corp 單層鑽石顆粒散熱器及其相關方法
CN103329253B (zh) 2011-05-23 2016-03-30 宋健民 具有平坦化尖端的化学机械研磨垫修整器
GB201116305D0 (en) 2011-09-21 2011-11-02 Df & G Ltd Composition
KR101186165B1 (ko) * 2012-02-06 2012-10-02 한국과학기술연구원 신선 다이용 다이아몬드 및 그 제조방법
US9457450B2 (en) * 2013-03-08 2016-10-04 Tera Xtal Technology Corporation Pad conditioning tool
GB201305217D0 (en) * 2013-03-21 2013-05-01 For Your Diamonds Only Ltd Cleaning method
JP5824182B1 (ja) * 2015-06-29 2015-11-25 ジャスト株式会社 把持具の把持面のめっき処理方法及び把持具
JP2018032745A (ja) * 2016-08-24 2018-03-01 東芝メモリ株式会社 ドレッサー、ドレッサーの製造方法、及び半導体装置の製造方法
CN110914016A (zh) 2017-07-11 2020-03-24 3M创新有限公司 包括可适形涂层的磨料制品和由其制成的抛光系统
US11213927B2 (en) * 2017-12-28 2022-01-04 Entregis, Inc. CMP polishing pad conditioner
CN110052962A (zh) * 2019-04-25 2019-07-26 西安奕斯伟硅片技术有限公司 一种抛光垫修整器、加工装置及方法
DE102019218725A1 (de) * 2019-12-03 2021-06-10 Robert Bosch Gmbh Verfahren zum Bilden eines elektrischen Kontakts und Verfahren zum Bilden einer Halbleitervorrichtung

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2277520A (en) * 1936-03-02 1942-03-24 Carborundum Co Method of making coated abrasives
US2201195A (en) * 1939-09-22 1940-05-21 Carborundum Co Granular coated material
US3334041A (en) * 1964-08-28 1967-08-01 Norton Co Coated abrasives
US4486200A (en) * 1980-09-15 1984-12-04 Minnesota Mining And Manufacturing Company Method of making an abrasive article comprising abrasive agglomerates supported in a fibrous matrix
CH669138A5 (de) * 1982-11-22 1989-02-28 Schweizer Schmirgel Schleif Schleifmittel auf dehnbarer und flexibler unterlage.
US4576612A (en) * 1984-06-01 1986-03-18 Ferro Corporation Fixed ophthalmic lens polishing pad
US4991362A (en) * 1988-09-13 1991-02-12 Minnesota Mining And Manufacturing Company Hand scouring pad
US4992082A (en) * 1989-01-12 1991-02-12 Ford Motor Company Method of toughening diamond coated tools
US5318836A (en) * 1989-06-15 1994-06-07 Ngk Spark Plug Company Limited Diamond-coated body
US5376444A (en) * 1990-07-27 1994-12-27 Grotepass; Wilhelm P. Diamond coated wear resistant tools
US5186973A (en) * 1990-09-13 1993-02-16 Diamonex, Incorporated HFCVD method for producing thick, adherent and coherent polycrystalline diamonds films
DE69123749T2 (de) * 1990-10-09 1997-06-05 Minnesota Mining & Mfg Erodierbare agglomerate enthaltendes beschichtetes schleifmittel
DE69332263T2 (de) * 1992-06-30 2003-08-07 Sumitomo Electric Industries, Ltd. Schneidwerkzeug unter Anwendung von aus der Dampfphase abgeschiedenem polykristallinem Diamant für die Schneidkante und Verfahren zu dessen Herstellung
SE503038C2 (sv) * 1993-07-09 1996-03-11 Sandvik Ab Diamantbelagt skärande verktyg av hårdmetall eller keramik
US5536202A (en) * 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
US5551959A (en) * 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same
US5643669A (en) * 1996-02-08 1997-07-01 Minnesota Mining And Manufacturing Company Curable water-based coating compositions and cured products thereof

Similar Documents

Publication Publication Date Title
JP2002508577A5 (ja)
JP2001510738A5 (ja)
JP2001522207A5 (ja)
JP2001523838A5 (ja)
JP2001522596A5 (ja)
JP2001511590A5 (ja)
JP2001524785A5 (ja)
JP2000100081A5 (ja)
JP2002511595A5 (ja)
JP2000036580A5 (ja)
JP2639373C (ja)
JP2623419C (ja)
JP2564689C (ja)
JP2533515C (ja)
IN190776B (ja)
IN189312B (ja)
IN187719B (ja)
CN3085541S (ja)
CN3080939S (ja)
CN3089347S (ja)
CN3088333S (ja)
CN3086996S (ja)
CN3073771S (ja)
CN3086160S (ja)
CN3088304S (ja)