JP2001351522A - Airtight envelope and manufacturing method for image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an airtight envelope with high accuracy and high productivity. SOLUTION: Two plate bodies 71, 83 are faced, positioned in the plate surface direction, the specified member 184 is fit from the periphery to the plate bodies to fix them, the fixed plate bodies are heated, a sealing material 75 arranged between the plate bodies is softened or melted, the temperature of the plate bodies is lowered while force in the vertical direction to the plate surface is applied from the outside, to solidify the sealing material, and thereby, an airtight space is formed between the plate bodies.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an airtight envelope and an image display device, and more particularly to a method which can be suitably used for manufacturing a flat and thin image display device.

[0002]

2. Description of the Related Art Conventionally, an airtight envelope having a structure in which two substrates, a front plate and a back plate, are opposed to each other at a predetermined position at a predetermined interval, and are joined by using a sealing material, is, for example, a flat thin type. Some are used in image display devices. Among the image display devices using such an airtight envelope, a light emitting element that emits a phosphor using a multi-electron source and a flat and thin image display device using the same will be described as an example.

[0003] As electron-emitting devices as an electron source, a thermionic electron-emitting device and a cold cathode electron-emitting device are used.
Kinds are known. As the electron-emitting device, two types of a hot electron source and a cold cathode electron source are known. The cold cathode electron source includes a field emission type (hereinafter abbreviated as “FE”),
Metal / insulating layer / metal type (hereinafter abbreviated as “MIM”) or surface conduction electron-emitting device (hereinafter abbreviated as “SCE”)
Etc. As an example of the FE type, W. P. . Dyke &
W. W. Dolan, "Field emissio
n ", Advance in Electron Ph
ysics, 8, 89 (1956) and C.I. A. Spin
dt, "Physical properties o
f thin-film field emissio
n cathodes with mollybdenu
m cones ", J. Appl. Phys., 47,
5248 (1976) and the like are known. Examples of the MIM type include C.I. A. Mead "The tunnel-
emission amplifier ", J. App.
l. Phys. , 32, 646 (1961). Examples of the surface conduction electron-emitting device type include those described in M.K.
I. Elinson, RadioEng. Electr
on Phys. , 10 (1965).

[0004] The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current flows through a thin film having a small area formed on a substrate in parallel with the thin film. As this surface conduction type emission element, S
nO ₂ thin film, Au thin film {G. D
ittmer: “Thin Sold Films”,
9, 317, (1972)}, using an In ₂ O ₃ / SnO ₂ thin film {M. Haltwell and C.I.
G. FIG. Fonstad: "IEEE Trans. ED
conf. , 519, (1975)}, using carbon thin film. Hisashi Araki et al .: “Vacuum”, Vol. 26, No. 1
No. 22, p. 22 (1983)}.

[0005] A typical device configuration of these surface conduction electron-emitting devices is described in the aforementioned M.A. FIG. 15 shows a device configuration of the Hartwell. In the figure, 21 is a substrate.
Reference numeral 24 denotes a conductive thin film, which is formed of a metal oxide thin film or the like formed by sputtering in an H-shaped pattern.
Is formed. Since the position and the shape of the electron-emitting portion 25 are unknown, they are shown as a schematic diagram.

In these surface conduction electron-emitting devices, the electron-emitting portion 25 is preliminarily applied to the conductive thin film 24 by an energization process called energization forming before electron emission.
Is generally formed. What is energizing forming?
A direct current or a very gradual increase in voltage, for example, about 1 V / min, is applied to both ends of the conductive thin film 24 to energize it, causing the conductive thin film 24 to be locally broken, deformed or altered, and to have a high electrical resistance. This is to form the electron emitting portion 25 in a state as described above. In the electron emitting portion 25, a crack is generated in a part of the conductive thin film 24, and electrons are emitted from the vicinity of the crack. In the surface conduction type electron-emitting device subjected to the energization forming process, the voltage is applied to the conductive thin film 24 and a current is caused to flow through the device to cause the electron-emitting portion 25 to emit electrons.

The above-described surface conduction electron-emitting device has a simple structure and is easy to manufacture, and thus has the advantage that a large number of devices can be arranged and formed over a large area. Various applied researches that make use of such characteristics have been made. While a large number of surface conduction electron-emitting devices are formed in an array, the surface conduction electron-emitting devices are arranged in parallel, and both ends of each of the devices are wired (this is also called a common wiring). And an electron source arranged in a large number of rows.
For example, JP-A-64-31332, JP-A-1-2
83749 and JP-A-1-257552. In particular, in image display devices such as display devices, in recent years, flat display devices using liquid crystal have become widespread in place of CRTs.
Since it is not a self-luminous type, there is a problem that a backlight must be provided. Therefore, it has been desired to develop a self-luminous display device using the above-described electron-emitting device. For example, US Pat. No. 5,066,883 discloses an electron source having a large number of surface conduction electron-emitting devices, and an electron source. An image display device, which is a display device in which a phosphor that emits visible light by electrons emitted from a source is combined, is disclosed.

The above-described electron-emitting device has an airtight envelope structure because it is operated in a vacuum, and when a display device is constructed using the electron-emitting device, it may have an anti-atmospheric pressure structure. Required. Particularly, in the case of a display device having a large-area image display surface, the thickness of the members constituting the envelope (vacuum container) of the device becomes extremely large, and the weight and cost of the entire device are reduced. Feasibility is poor.
As a method of avoiding this problem, there is a method of arranging a spacer that supports the atmospheric pressure inside the envelope than inside the envelope.

FIG. 11 shows a configuration in which two substrates, a front plate and a back plate, are opposed to each other at a predetermined interval and at a predetermined interval using the electron source as described above, and are bonded using a sealing material. 1 is an exploded schematic view showing a configuration of an image display device having an airtight envelope structure. 12 and 13
12A and 12B are a perspective view and a sectional view showing a state where the image display device of FIG. 11 is assembled. FIG. 14 is a side view showing a state during the assembling process.

As shown in FIG. 11, this image display device is provided with a back plate 202 on which an electron-emitting device group 205 including a plurality of electron-emitting devices is mounted, and disposed opposite to the back plate 202. A plurality of image forming members 204 such as phosphors on which an image is formed by irradiation with an electron beam from 205
, Front plate 201 and rear plate 20
2 to form a vacuum-tight enclosure,
For example, a support frame 203 that supports the peripheral edges of the front plate 101 and the back plate 102 is provided. Further, as described above, in order to prevent the container from being destroyed due to the atmospheric pressure applied to the vacuum-tight envelope, as shown in FIG. 13, a spacer 207 for supporting the atmospheric pressure from the inside of the envelope is arranged inside the envelope. May be.

On the front plate 201, alignment marks 271a and 271b for adjusting the positional relationship between the image forming member 204 and the electron-emitting device group 205 are formed.
Similar alignment marks 273a and 272b are also formed on the back plate 202. These alignment marks are formed at positions that do not interfere with the image forming member 204, the electron-emitting device group 205, and the like. Adhesive surface 2 of support frame 203 in contact with front plate 201 and back plate 202
At 72a and 272b, a sealing material such as frit glass is arranged in advance, and pre-baked. Further, the front plate 201, the back plate 202, and the support frame 203 are made of float glass of the same material having the same coefficient of thermal expansion.

To configure this image display device, FIG.
As shown in FIG. 13 and FIG.
2 are joined by sealing materials 272c and 272d such as frit glass applied to both surfaces of the support frame 203, respectively, to form a sealed airtight envelope. At this time, the alignment mark 271a on the front plate 201 and the rear plate 2
02, the alignment mark 271b on the front plate 201 and the back plate 2
By arranging the front plate 201 and the back plate 202 such that the positions of the alignment marks 273b on the reference numeral 02 have a predetermined positional relationship, the image forming member 204 and the electron-emitting device group 205 are accurately positioned. In addition,
Generally, a sealing material such as frit glass is in a solidified state at room temperature (room temperature) and is often in a molten state at 400 ° C. or higher. Therefore, in order to bond the substrates with a sealing material such as frit glass, a temperature cycle step of raising and lowering the temperature is required.

Further, as shown in FIG.
In a state where the sealing materials 272c and 272d are applied and pre-baked, the sealing materials 272c and 272d are raised in a convex state. Therefore, when the height H of the support frame 203 is the same as the height Hs of the spacer 207, a gap ΔZ is generated between the lower end of the spacer 207 and the upper surface of the back plate 202. Therefore, the sealing materials 272c and 27
In a state where 2d is heated to a melting (softening) temperature and is melted (the sealing material such as frit glass or the like has a viscosity instead of being in a water state even when melted), the front plate 201 and the back plate 20 are formed.
It is required to apply a load between the two and crush it.
By this crushing, the lower end of the spacer 207 contacts the upper surface of the back plate 202. Thereby, the sealing material 272c
And 272d spread over the upper and lower surfaces 272a and 272b of the support frame 203, and reach the state of FIG. 13 to ensure airtightness. At this time, the front plate 201 and the back plate 2 are also squeezed in the Z direction, that is, in the vertical direction.
02 in the horizontal direction (X, Y and θ directions) must be accurately maintained. Front plate 201 and back plate 202
If the position in the horizontal direction, that is, the misalignment between the electron-emitting device and the image forming member, is insufficient, the brightness of the pixels will vary, and in the case of color, the RGB colors will be mixed. This is because deterioration occurs.

In order to solve this alignment problem, a conventional method of manufacturing an image display device in which a plurality of plates are aligned and assembled is disclosed in Japanese Patent Application Laid-Open No. 58-214245. A method is disclosed in which a plurality of plates constituting the apparatus are aligned with holes formed in the plates and positioning pins.

Japanese Patent Application Laid-Open No. Hei 5-232451 discloses a method for positioning and assembling a liquid crystal display device as an example of a method for manufacturing a flat-panel image display device. The contents will be described with reference to FIG. First, a first substrate and a second substrate are prepared (steps 1 and 2), and these are aligned. These substrates are provided with an electrode pattern, an alignment pattern (alignment mark), and a sealing material. These first and second substrates are set in an alignment device (Step 3), and are heated and kept warm (Step 4). Next, the first substrate and the second substrate are aligned via an alignment pattern (alignment mark). Next, the first substrate and the second substrate are pressurized (Step 5), and are simultaneously positioned (Step 6). Finally, after holding for a predetermined time in the pressurized state,
The pressurization is released (step 7), and the assembled liquid crystal cell is removed from the alignment device. It is stated that this makes it possible to perform positioning with high accuracy even if a displacement occurs in a high temperature state. This publication also describes a method in which, after alignment at room temperature, temporary fixing is performed using a photocurable adhesive, and the sealing material is further heated and cured.

[0016]

However, according to the method disclosed in Japanese Patent Application Laid-Open No. 58-214245, there is a problem that the positioning accuracy is deteriorated due to the accuracy of the holes in the plate and the positioning pins. Also, the sliding between the pin and the hole is bad,
There is also a problem that it is impossible to descend in the Z direction to crush the sealing material such as frit glass.

The method disclosed in Japanese Patent Laid-Open No. Hei 5-232451 has the following problems. That is, in this method, the first substrate and the second substrate are heated at a high temperature, and the adhesive disposed between the first substrate and the second substrate is pressed while being softened. After the first substrate and the second substrate are aligned, the adhesive is solidified to align the first substrate and the second substrate. At this time, the alignment is performed in a high-temperature bath or by installing a heater in a pressing jig. For this reason, the alignment apparatus is required to have high-temperature specification accuracy, the process is complicated, and the productivity is reduced. On the other hand, as pointed out in this publication, the manufacturing method based on room temperature alignment and temporary fixing also causes problems such as displacement of the adhesive due to softening of the adhesive.

On the other hand, in an image display device in which an electron beam is emitted from the electron-emitting device to collide with a phosphor to emit light, it is necessary to further form a vacuum envelope. A sealing material such as frit glass is used as a bonding material corresponding to the provided adhesive, and the bonding is performed while maintaining a vacuum. However, the softening temperature of the organic adhesive is 15
While the temperature is about 0 ° C., the temperature at the time of assembly using a sealing material such as frit glass is a high temperature of 400 ° C. or more, so that highly accurate alignment and assembly are very difficult. In addition, since the first substrate and the second substrate have different coefficients of thermal expansion, the temperature distribution in the substrate may cause a reduction in alignment or generation of stress, and the vacuum envelope may be damaged.

The present invention has been made in view of the above-mentioned problems of the prior art, and provides a method for manufacturing an airtight envelope and an image display device with high accuracy and high productivity. It is in.

[0020]

In order to solve this problem, a first method for manufacturing an airtight envelope according to the present invention is to dispose two plate-shaped members facing each other and aligning them in the plate surface direction. A predetermined member is attached and fixed from the surroundings, and the temperature of each fixed plate-like body is raised to soften or melt the sealing material between each plate-like body. The airtight space is formed between the respective plate-like bodies by solidifying the sealing material by lowering the temperature while applying a force in a direction perpendicular to the plate.

According to a second method for manufacturing a hermetic envelope, in the first method for manufacturing an hermetic envelope, the predetermined member is displaced in a direction perpendicular to the plate surface in the direction. And

According to a third method for manufacturing a hermetic envelope, in the first or second method for manufacturing an hermetic envelope, the predetermined member has a similar thermal expansion coefficient to each plate-like body. Features.

The fourth method for manufacturing an airtight envelope is the method for manufacturing an airtight envelope according to any one of the first to third methods,
The predetermined member is made of metal, alloy, ceramic or glass.

Further, a first method for manufacturing an image display device according to the present invention is characterized in that an airtight envelope of the image display device is formed by any one of the first to fourth methods for manufacturing an airtight envelope. And

The second method of manufacturing the image display device is as follows.
In the first method for manufacturing an image display device, the image display device is manufactured using a surface conduction electron-emitting device.

In the structure of the present invention, the positioning of the plate-like bodies is performed before the temperature thereof is raised, and the positioning result in the plate surface direction is fixed by mounting a predetermined member, and thereafter, the positioning is performed. It is maintained throughout the temperature raising and lowering steps. That is, the alignment of the plate is performed at room temperature,
It is not performed during subsequent heating and cooling to a high temperature for bonding by softening and solidifying the sealing material. For this reason, the positioning of the plate-like body is easily performed with high accuracy. Therefore, there is no need to use an alignment device corresponding to a high temperature, and the device and process are simplified, and productivity is improved.

In the case where the predetermined member is displaced in the direction perpendicular to the plate surface of the plate-like body by a force in the direction perpendicular to the plate surface, when the force in the direction perpendicular to the plate surface is applied, The sealing material is smoothly squashed due to the displacement of the body, and an airtight envelope that ensures airtightness is formed.

When the predetermined member has the same thermal expansion coefficient as that of the plate-like body, the working temperature of the sealing material is 4.
Even when the temperature is raised to a high temperature of 00 ° C. or more, the assembly is performed while maintaining the alignment result with high accuracy.

When the predetermined member is made of a metal, an alloy, ceramics or glass, a structure for solving the above problem can be easily provided.

In the case of forming an airtight envelope of an image display device, a high-precision, flat and thin one is manufactured with high productivity by simplified devices and processes.

Also, when this image display device is manufactured using a surface conduction electron-emitting device, similarly, high-precision manufacturing with high productivity is performed by simplified devices and processes. .

As described above, according to the method for manufacturing an airtight envelope of the present invention, two airtight bodies are opposed to each other in a predetermined positional relationship, and are joined by using a sealing material. Used in the case of manufacturing an enclosure, the application is not particularly limited, it can be suitably used in the manufacture of a flat thin image display device or a plasma display device using the electron-emitting device as an electron source as described above, In this case, a high-precision assembly is realized without using a complicated alignment device, and an inexpensive and high-quality airtight envelope is provided.

[0033]

EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited to these examples. [Embodiment 1] An airtight envelope according to a first embodiment of the present invention includes the configuration shown in FIGS. FIG.
FIG. 2 is an exploded perspective view showing the configuration, and FIG. 2 is a sectional view. 1 and 2, reference numeral 101 denotes a front plate;
Is a back plate, and both are made of soda lime glass. On the upper surface of the back plate 102, a sealing material 150 is formed on the periphery. The material of the sealing material 150 is frit glass, which has a product number: LS0206 manufactured by NEC Corporation. An alignment mark 171a for adjusting the positional relationship with the rear plate 102 is provided on the upper surface of the front plate 101.
And 171b are formed by a vapor deposition method. The same alignment marks 173a and 1
73b are formed.

FIG. 2 is a sectional view showing a structure in which the front plate 101 is placed on the back plate 102 on which the sealing material 150 is formed. In this state, at room temperature, the positions of the alignment mark 171a on the front plate 101 and the alignment mark 173a on the back plate 102, and the alignment mark 171b on the front plate 101 and the alignment mark 173b on the back plate 102 are respectively set to predetermined positions. The front plate 101 and the rear plate 102 are oriented horizontally (x,
(y, θ directions) for accurate positioning.

FIG. 3 shows a connecting member 16 used in this embodiment.
FIG. In the figure, reference numeral 161 denotes a U-shaped member including a connecting portion 162 connected to the back plate 102. The connecting portion 162 includes a connecting portion 162.
Several fixing devices 163 for fixing to the back plate 102 are installed. A connecting portion 164 is fixed to the U-shaped member 161. The connecting portion 164 is provided with several fixing devices 165 for fixing the connecting portion 164 to the front plate 101. Reference numeral 166 denotes an adjustment mechanism for adjusting the mounting position of the connecting portion 164 with respect to the U-shaped member 161. The material of each of these parts constituting the connecting member 160 is an alloy having a similar thermal expansion coefficient to that of the soda lime glass of the front plate 101 and the back plate 102.

In order to construct an airtight envelope, first, a work 170 as shown in FIG. 4 is constructed. That is, first, the U-shaped member 161 is brought into contact with the front plate 101 and the back plate 102 that have been positioned at room temperature first by the end of the back plate 102 and fixed by the fixing device 163. 161 is attached. Next, the connecting portion 164 of the U-shaped member 161 is brought into contact with the end of the front plate 101 to fix the fixing device 1.
By fixing at 65, the connecting portion 164 is mounted.
Next, the connecting portion 164 and the U-shaped member 161 are joined by the adjusting mechanism 166. Thus, the connecting member 160 is connected to the front plate 101 and the rear plate 102. Thus, the front plate 101 and the back plate 102
On the other hand, by connecting the connecting member 160 at two places, a work 170 as shown in FIG. 4 is configured.

Next, the work 170 is put into a firing furnace.
FIG. 5 is a partially broken perspective view showing the firing furnace. In the figure, 30 is a firing furnace main body, 34 is a controller, 31
Is a 22 kg pressurizing weight. Weight for pressurization 31
Is supported by a lifting device 32 via a chain 33.

Next, the temperature of the firing furnace is raised from room temperature to 440 ° C. at a rate of 10 ° C./min to melt the sealing material 150. During this time, the front plate 101 and the rear plate 102 undergo thermal expansion, but their positions do not shift because they are constrained in the horizontal direction (x, y, θ directions) by the connecting members 160 having similar thermal expansion coefficients. . Sealing material 1
After melting of 50, the lifting weight 32 is used to pressurize the weight 3
1 is lowered onto the front plate 101 and pressurized. The sealing material 150 is crushed by pressing to a thickness of about 0.5 mm.
As a result, the distance between the front plate 101 and the back plate 102 is reduced, and the sealing material 150 covers the periphery of these substrates evenly. At this time, the connecting member 1 is
60 is also elastically deformed and displaced by ΔZ1 in the vertical direction. Thereafter, the temperature of the baking furnace 30 is lowered to around room temperature at a rate of 10 ° C./min, and then the work 170 is taken out.
Then, the connecting member 160 is removed by operating the fixing device 165. Thereby, the airtight envelope is completed.

The produced airtight envelope is evacuated from an exhaust pipe (not shown) provided on the front panel 1 and the rear panel 2, and then the exhaust pipe is sealed to clean the inside of the airtight enclosure. Used as a vacuum. FIG. 6 is a cross-sectional view showing the hermetic envelope thus created. According to the present embodiment, it is possible to easily create an airtight envelope that ensures vacuum airtightness while maintaining the positions of the front plate 101 and the rear plate 102 as shown in FIG.

[Embodiment 2] An airtight envelope according to a second embodiment is such that two substrates, a front plate and a back plate, are opposed to each other at a predetermined interval in a predetermined positional relationship, and a sealing material is used. An airtight envelope constituted by joining together by using a surface-conduction electron-emitting device, which is applied to a flat and thin image display device.

FIG. 7 is a partially cutaway perspective view showing the structure of the image display device. As shown in the figure, the image display device includes a back plate 71, a front plate 83, and a back plate 71.
A support frame 82 for supporting the front plate 83 above, and a plurality of spacers 8 arranged between the rear plate 71 and the front plate 83
9 is provided. The back plate 71 is made of soda-lime glass, and has tens of thousands of surface conduction electron-emitting devices 74 corresponding to the electron-emitting portions of FIG. 15 as electron sources, and a pair of surface conduction electron-emitting devices 74. It has an X-directional wiring 72 and a Y-directional wiring 73 connected to the element electrode. Front panel 83
Is made of soda-lime glass, and has an image forming member 86 such as a fluorescent film 84 and a metal back 85 for forming an image by irradiating an electron beam emitted from the electron emitting element 74. The support frame 82 is formed by cutting a blue sheet glass substrate into a hollow square shape. The spacer 89 is formed by polishing a blue sheet glass.

Between the front plate 83 and the support frame 82 and between the back plate 71 and the support frame 82, a sealing material 75 is formed on the periphery. The material of the sealing material 75 is frit glass manufactured by Nippon Electric Glass Co., Ltd., product number: LS3081. As in the first embodiment, the rear plate 7 is provided on the upper surface of the front plate 83.
An alignment mark (not shown) for adjusting the positional relationship with the reference numeral 1 is formed by a vapor deposition method. Similarly, an alignment mark is formed on the back plate 71. The front plate 83 and the rear plate 71 use this alignment mark, and in the horizontal direction (x, y, θ directions) so as to have a predetermined positional relationship in the same manner as in the first embodiment.
To be accurately positioned.

FIG. 8 is a perspective view showing a connecting member used in this embodiment. 180 is a connecting member, which is a connecting member portion 181 connected to the front plate 83 and the rear plate 71.
And a connecting member portion 184 connected to the connecting member. Several fixing devices 183 for fixing the connecting member portion 181 to the front plate 83 are provided on the connecting member portion 181. The connecting member portion 184 is provided with a convex portion 186 with which one surface of the connecting member 181 contacts, and several fixing devices 185 for fixing the connecting member portion 184 to the back plate 71.
All parts of the connecting member 180 are made of ceramics having the same thermal expansion coefficient as soda lime glass forming the front plate 83, the back plate 73 and the support frame 82.

To construct the image display device shown in FIG. 7, first, the front plate 83 and the rear plate 71 which have been positioned first are
The connecting member 184 is attached to the end of the rear plate 71 by the fixing device 18.
5 is attached. Next, one surface of the connecting member 181 is
The front plate 8 is contacted with the projection of the connecting member portion 184.
The connecting member part 181 is attached to the end of the third part by the fixing device 183. By connecting the connecting members 180 at two places in this manner, a work is formed. FIG.
Is a perspective view showing the work 190. FIG. 10 shows FIG.
It is FF 'sectional drawing of.

Next, the work 190 is put into the firing furnace shown in FIG. 5, and the same processing as in the first embodiment is performed. However, a weight 31 of about 40 kg is used.
The temperature is increased at a rate of 0 ° C./min so that the sealing material (frit glass) 75 is melted at a temperature in the firing furnace of 410 ° C.
During this time, the front plate 83 and the back plate 71 undergo thermal expansion, but are not displaced because they are restrained in the horizontal direction (x, y, θ) by the connecting member 180 having the same thermal expansion coefficient. After the sealing material 75 is melted, the pressing weight 31 is lowered onto the front plate 83 by the lifting device 32, and
3 and the back plate 71 are pressurized. By pressing, the sealing material 75
Is crushed. As a result, the sealing material 75 is moved between the front plate 83 and the support frame 82 and between the back plate 71 and the support frame 8.
2, the peripheral surface is evenly covered.

At this time, the connecting member 18 is
In the case of 0, the connecting member portion 181 descends smoothly along the convex portion 186 of the connecting member portion 184 and is displaced in the vertical (Z) direction. Specifically, a gap ΔZ2 (about 1 m
m) disappears, and the spacer 89 comes into contact with the upper surface of the rear plate 71. Thereafter, the temperature of the baking furnace 30 is lowered to about room temperature at a rate of 10 ° C./min.
Operating the fixing device 183 and the fixing device 185 of the 80,
The connecting member 180 is removed.

Next, in order to make the inside a prescribed vacuum state, a vacuum is drawn through an exhaust pipe (not shown) provided on the front plate 83, the rear plate 71 and the support frame 82, and then the exhaust pipe is sealed. After stopping, a driving circuit and the like are provided according to the method disclosed in JP-A-6-342636, and the creation of the image display device is completed.

According to this embodiment, there is provided a flat and thin image display device using a surface conduction electron-emitting device, in which there is no displacement between the electron-emitting device and the phosphor, and there is no luminance variation or color mixing due to the displacement. It can be manufactured while easily aligning the front plate 83 and the rear plate 71.

[0049]

As described above, according to the present invention,
The airtight envelope can be manufactured by aligning the plate-like body with high accuracy and easily. Therefore, it is possible to provide an airtight envelope that ensures vacuum airtightness. that time,
Since there is no need for an alignment device that can handle high temperatures,
Apparatus and steps can be simplified. Therefore, production can be performed at low cost due to high productivity.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a configuration of an airtight envelope according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the hermetic envelope of FIG. 1;

FIG. 3 is a perspective view showing a connecting member used for manufacturing the hermetic envelope of FIG. 1;

FIG. 4 is a perspective view showing a workpiece configured when manufacturing the hermetic envelope of FIG. 1;

FIG. 5 is a partially broken perspective view showing a firing furnace used for manufacturing the hermetic envelope of FIG.

FIG. 6 is a cross-sectional view showing the manufactured airtight envelope of FIG. 1;

FIG. 7 is a partially cutaway perspective view showing the configuration of an image display device according to a second embodiment of the present invention.

FIG. 8 is a perspective view of a connecting member used for manufacturing the image display device of FIG. 7;

FIG. 9 is a perspective view of a workpiece configured when the image display device of FIG. 7 is manufactured.

FIG. 10 is a sectional view taken along line F-F 'of FIG.

FIG. 11 is an exploded schematic view showing a configuration of an image display device having an airtight envelope structure.

FIG. 12 is a perspective view showing the assembled image display device of FIG. 11;

FIG. 13 is a sectional view showing the assembled image display device of FIG. 11;

FIG. 14 is a side view showing a state in which the image display device of FIG. 11 is assembled.

FIG. 15 is a schematic plan view illustrating a configuration of a surface conduction electron-emitting device.

FIG. 16 is a view showing a method of assembling a conventional image display device.

[Explanation of symbols]

21: electron source substrate, 24: conductive thin film, 25: electron-emitting device section, 30: firing furnace, 31: pressure weight, 32: lifting device, 33: chain, 34: controller, 71, 10
2, 202: back plate, 72: X-direction wiring, 73: Y-direction wiring, 74: electron-emitting device section, 75, 150, 272
c, 272d: sealing material, 82, 203: support frame, 83,
101, 201: front plate, 84: phosphor, 85: metal back, 86, 204: image forming member, 87, 205:
Electron-emitting device group, 89, 207: spacer, 160, 1
80: connecting member, 161: U-shaped member, 162: connecting portion, 163: fixing device, 164: connecting portion, 165: fixing device, 166: adjusting mechanism, 170, 190: work, 1
71a, 171b, 173a, 173b, 271a, 2
71b, 273a, 273b: alignment mark, 1
81: connecting member portion, 183: fixing device, 184: connecting member portion, 185: fixing device, 186: convex portion, 272
a, 272b: Adhesive surface.

Claims (6)

[Claims] 1. A method in which two plate-like members are opposed to each other, aligned in the plate surface direction, and a predetermined member is mounted and fixed from the surroundings, and the temperature of each fixed plate-like member is increased. The sealing material between the plate-like bodies is softened or melted, and then the temperature of each plate-like body is reduced while applying a force in a direction perpendicular to the plate surface from the outside to solidify the sealing material. Forming a hermetic space in the hermetic envelope. 2. The method according to claim 1, wherein the predetermined member is displaced in a direction perpendicular to the plate surface in the direction. 3. The method for manufacturing an airtight envelope according to claim 1, wherein the predetermined member has a thermal expansion coefficient substantially equal to that of each plate-like body. 4. The method for manufacturing an airtight envelope according to claim 1, wherein said predetermined member is made of metal, alloy, ceramics, or glass. 5. A method for manufacturing an image display device, comprising forming an airtight envelope of the image display device by the method according to claim 1. 6. The method according to claim 5, wherein the image display device is manufactured using a surface conduction electron-emitting device.