JPH11317165A - Manufacture of flat-panel image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate slippage between a face plate and a rear plate by thermal expansion by setting both plates to a size protruded from an outer frame, and fixing an auxiliary member to the protruded part to fix the opposed positions of both plates through the outer frame. SOLUTION: A face plate 271 and a rear plate 273 are set to a size protruded from an outer frame 212. Auxiliary members of thin plates 1a, 1c are fixed to one protruded part of the plates by a heat resistant adhesive. The outer frame 212 having a thermally melting adhesive applied thereto is put on this plate. Further, the other plate is put on the outer frame 212 to position the opposed surfaces of both plates 271, 273. The auxiliary members are fixed to the latter plate to fix the positions of the opposed surfaces of both plates 271, 273. The thermally melting adhesive is then melted by heating, and an external force is added to both plates 271, 273 to closely fit both plates 271, 273 to the outer frame 272, whereby a vacuum vessel is manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flat panel display, and more particularly to a method for sealing upper and lower glass plates with frit glass during a process of assembling the device.

[0002]

2. Description of the Related Art Image display devices using electron beams include:
For example, an electron emission source for generating an electron beam is provided in a vacuum vacuum vessel sandwiched between a glass face plate (substrate) and a glass rear plate (substrate), and the electron beam emitted from the electron emission source is accelerated to produce a phosphor. A thin flat-panel image display device for displaying an image by irradiating the phosphor with a fluorescent material has been developed. Such an electron-emitting device will be described below.

Conventionally, two types of electron-emitting devices, a hot cathode device and a cold cathode device, are known. Among them, the cold cathode device includes, for example, a surface conduction type emission device, a field emission device (hereinafter referred to as FE type), and a metal / insulating layer / metal type emission device (hereinafter referred to as MIM type).

[0004] As the surface conduction type emission element, for example, M.
I. Elinsom, Radio Eng. ElectronPhys., 10 ,. 1290,
(1965) and other examples described later.

[0005] The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current flows in a small-area thin film formed on a substrate in parallel with the film surface. As this surface conduction type emission element, Sn described by Elinson et al.
In addition to those using O ₂ thin films, those using Au thin films [G.
Dittmer: “Thin Solid Films” 9, 317 (1972)]
n ₂ O ₃ / SnO ₂ thin film [M. Hartwell and
CG Fonstad: “IEEETrans. ED Conf.”, 519 (1975)]
And those using a carbon thin film [Hisashi Araki et al .: Vacuum, Vol. 26, No. 1, p. 22 (1983)] and the like have been reported.

As a typical example of the device configuration of these surface conduction electron-emitting devices, FIG. 9 is a plan view of the device by M. Hartwell et al. Described above. In the figure, 3001 is a substrate,
Reference numeral 3004 denotes a conductive thin film made of a metal oxide formed by sputtering. The conductive thin film 3004 is H
It is formed in the shape of a letter. This conductive thin film 30
An electron emission portion 3005 is formed by performing an energization process called energization forming described below on 04. The interval L in the figure is 0.5-1 [mm], w is 0.1 [mm].
Is set with Note that, for convenience of illustration, the electron emission unit 3
Although 005 is shown in a rectangular shape at the center of the conductive thin film 3004, this is a schematic shape, and does not faithfully represent the actual position or shape of the electron-emitting portion.

In the above-described surface conduction electron-emitting device including the device by M. Hartwell et al., An electron emission portion 3005 is formed by applying an energization process called energization forming to the conductive thin film 3004 before electron emission. Was common. That is, energization forming means that a constant DC voltage is applied to both ends of the conductive thin film 3004,
Alternatively, a current is applied by applying a DC voltage that increases at a very slow rate, for example, about 1 V / min, and locally destroys, deforms, or alters the conductive thin film 3004;
This is to form the electron-emitting portion 3005 in a state of being electrically high in resistance. After the energization forming, the conductive thin film 30
A crack occurs in a part of the conductive thin film 04, and when an appropriate voltage is applied to the conductive thin film 3004, electrons are emitted in the vicinity of the crack.

As an example of the FE type, for example, WP Dyke
& WW Dolan, “Field emission”, Advance in Elect
ron Physics, 8, 89 (1956) or CA Spind
t, “Physical properties of thin-film field emissi
on cathodes with molybdenium cones ”J. Appl. Phy
s., 47, 5248 (1976) and the like.

FIG. 10 shows a cross-sectional view of a device by CA Spindt et al. As a typical example of the FE device configuration. In the figure, 3010 is a substrate, 3011 is an emitter wiring made of a conductive material, 3012 is an emitter cone, 3013 is an insulating layer, and 3014 is a gate electrode.
This device comprises an emitter cone 3012 and a gate electrode 301
By applying an appropriate voltage during the period 4, field emission is caused from the tip of the emitter cone 3012.

As another element structure of the FE type, there is an example in which an emitter and a gate electrode are arranged on a substrate almost in parallel with the plane of the substrate, instead of the laminated structure as shown in FIG.

Examples of the MIM type include, for example, CA M
ead, “Operation of Tunnel-Emission Devices”, J. A
ppl. Phys., 32, 646 (1961) and the like are known. MI
FIG. 11 shows a typical example of an M-type element configuration. The figure is a sectional view, in which 3020 is a substrate, 3021 is a lower electrode made of metal, 3022 is a thin insulating layer having a thickness of about 100 Å, and 3023 is a thickness of 80 to 300.
The upper electrode is made of a metal having a thickness of about Å. M
In the IM type, by applying an appropriate voltage between the upper electrode 3023 and the lower electrode 3021, the upper electrode 3023
Causes electron emission from the surface of the substrate.

The above-described cold cathode device can emit electrons at a lower temperature than the hot cathode device, and thus does not require a heater for heating. Therefore, the structure is simpler than that of the hot cathode element, and a fine element can be produced. Also,
Even if a large number of elements are arranged on a substrate at a high density, problems such as thermal melting of the substrate hardly occur. Also, unlike the case where the hot cathode element has a low response speed for operating by heating the heater, the cold cathode element has an advantage that the response speed is high. For this reason, research for applying the cold cathode device has been actively conducted.

For example, the surface conduction electron-emitting device has the advantage that a large number of devices can be formed over a large area because the structure is particularly simple and the production is easy among the cold cathode devices. Therefore, for example, Japanese Patent Application Laid-Open No.
As disclosed at 32, methods for arranging and driving a large number of elements are being investigated.

As for applications of the surface conduction electron-emitting device, for example, image forming apparatuses such as image display apparatuses and image recording apparatuses, charged beam sources, and the like have been studied.

In particular, as an application to an image display device, for example, as disclosed in US Pat. No. 5,066,883, JP-A-2-257551, and JP-A-4-28137 by the present applicant, a surface conduction type emission device is used. An image display device using a combination of a phosphor that emits light by irradiation with an electron beam has been studied. An image display device using a combination of a surface conduction electron-emitting device and a phosphor is expected to have better characteristics than other conventional image display devices. For example, compared to a liquid crystal display device that has become widespread in recent years, it can be said that it is excellent in that it is a self-luminous type and does not require a backlight and has a wide viewing angle.

A method of arranging and driving a large number of FE types is disclosed, for example, in US Pat. No. 4,904,895 by the present applicant. As an example of applying the FE type to an image display device, for example, a flat panel display device reported by R. Meyer et al. Is known. [R Meyer: “Recent Developme
nt on Microtips Display at LETI ”Tech. Digest of4
th Int.Vacuum Microelectronics Conf., Nagahama, p
p. 6-9 (1991)].

An example in which a number of MIM types are arranged and applied to an image display device is disclosed in, for example, Japanese Patent Application Laid-Open No.
5738.

Among the image forming apparatuses using the above-described electron-emitting devices, a flat display device having a small depth has been attracting attention as a replacement for a cathode ray tube display device because of its space saving and light weight. .

Next, an image display device having the above-described electron-emitting device will be described. FIG. 12 is an exploded view showing the configuration of the image display device, and FIGS. 13 (a) and 13 (b)
13A and 13B are views showing a state in which the configuration shown in FIG. 12 is assembled into an image display device, FIG. 13A is a perspective view, and FIG.
Is a side view.

In FIG. 12, the image display device is a glass face plate 2 having red, blue, and green luminous bodies 271c for displaying an image formed on a surface facing an electron emission source.
71, a glass rear plate 273 on which the electron emission source 273c is formed, a glass face plate 271, and an outer frame made of hollow glass, for example, to constitute a vacuum vessel sandwiched between the glass rear plate 273. 2
72. In order to prevent the vacuum vessel from being destroyed due to the atmospheric pressure applied to the vacuum vessel, a spacer 74 shown in FIG.

The glass face plate 271 is formed with alignment marks 271a and 271b for adjusting the positional relationship between the luminous body 271c and the electron emission source 273c, and the glass rear plate 273 is also formed with alignment marks 273a and 273b. ing. Note that these alignment marks are formed at positions where they do not interfere with the light emitter 271c and the electron emission source 273c.

Fused surface 2 of outer frame 272 in contact with glass face plate 271 and glass rear plate 273
72a and 272b have low melting point glass 272 in advance.
c, 272d are applied and pre-baked. Further, the glass face plate 271, the outer frame 272, and the glass rear plate 273 are manufactured from the same sheet of blue glass having the same coefficient of thermal expansion.

[0023]

In such a configuration, as shown in FIGS. 13A and 13B, a glass face plate 271 and a glass rear plate 273 are provided.
Is a low-melting glass 272 applied to both sides of the outer frame 272.
c, 272d to form a sealed container. At this time, the glass face plate 27
1 alignment mark 271a and the alignment mark 273a of the glass rear plate 273, and the alignment mark 271b of the glass face plate 271 and the alignment mark 273 of the glass rear plate 273.
The positions of b are arranged so as to have a predetermined positional relationship, and the relationship between the light emitting body 271c and the electron emission source 273c is accurately positioned. This prevents color shifts and uneven brightness of characters and images. In general, low-melting glass is in a solidified state at normal temperature (room temperature),
It is in a state of melting above ℃. Therefore, in order to fuse each glass with the low-melting glass, a temperature cycle of raising and lowering the temperature is required.

In order to ensure airtightness as a vacuum container, frit glass 272c applied to outer frame 272,
272d needs to be crushed by applying a load while being melted at 400 ° C. The airtightness will be described below with examples of dimensions.

FIG. 14 shows a state at room temperature before frit glass melting.

The frit glass 272c, 2
When 72d is applied and pre-baked, the frit glasses 272c and 272d are raised about 1.5 mm in a convex state. Therefore, the lower end of spacer 74 and 27
The upper surface of the rear plate 3 has a gap ΔZ. ΔZ is about 2 mm. The height H of the outer frame 272 is 3 mm.
Is about 1 mm from the height Hs of the spacer 74 = 4 mm.
It is getting shorter.

In this state, the temperature is raised to 400 ° C.
It is necessary to crush the frit glass by applying a load between the glass plates 271 and 273 in a state where the frit glass of c and 272d is molten (the frit glass does not become watery but has viscosity even when melted). By crushing about 2 mm, the lower end of the spacer 74 hits the upper surface of the rear plate 273 and stops. Frit glass 27
The portions 2c and 272d extend to the upper and lower surfaces 272a and 272b of the outer frame, and are in the state shown in FIG. 13B to ensure airtightness. In this case, the position in the horizontal direction (X, Y, θ) of the glass face plate 271 and the glass rear plate 273 is reduced by about 2 mm downward squashing.
For example, it must be kept strictly at about ± 0.03 mm.

A conventional method of manufacturing an image display device in which a plurality of plates are aligned and assembled is described in, for example,
There is a method proposed in JP-A-8-214245. This publication discloses a method for aligning a plurality of plates constituting a flat-panel image display device with holes formed in the plates and positioning pins. However, in the method of performing alignment using the positioning pin, due to the hole of the plate and the accuracy of the positioning pin,
There was a problem that the alignment accuracy was deteriorated.

Further, there is a drawback that the sliding between the pin and the hole is poor, and the Z cannot be lowered for crushing the frit.

As another method, the position of the rear plate on which the electron emission source is formed and the face plate as the display surface are aligned using a microscope or the like such that the alignment marks formed outside the effective surface of the image display are aligned. A method of performing alignment while watching is conceivable. In the method of performing alignment using an alignment mark, the alignment is performed at room temperature using a microscope or the like and then sealed (adhered) with frit glass. When heated to 450 ° C., the glass plates 271 and 273 have no means for fixing in the horizontal direction (X, Y, θ).
There is a problem that the position shift occurs due to m).

An object of the present invention is to solve the above-mentioned problems and to provide a method for maintaining a hermetic seal without causing a positional shift between a face plate and a rear plate.

[0032]

The present invention to achieve the above object is as follows.

1. In a method for manufacturing a flat-panel image display device including a step of forming a vacuum container by bonding a face plate and a rear plate in parallel to both surfaces of a hollow outer frame, the face plate and the rear plate protrude from the outer frame. It can be joined to both plates in at least two places of the protruding part,
A plurality of auxiliary members capable of holding the two plates are provided outside the outer frame, which can be displaced by an external force in the direction of the distance between the plates, and first, the auxiliary members are provided at one protruding portion of the plate. After fixing with a heat-resistant adhesive, and then placing an outer frame coated with a hot-melt adhesive on the plate, further placing the other plate on the outer frame and aligning the surfaces of the two plates face-to-face, the auxiliary member Is fixed to the latter plate with a heat-resistant adhesive to fix the surface-to-face position of both plates by means of this auxiliary member, and then the temperature is raised to melt the hot-melt adhesive. A method for manufacturing a flat-panel image display device, comprising forming a vacuum vessel by bringing both plates and an outer frame into close contact with a molten adhesive.

2. 2. The method according to claim 1, wherein the auxiliary member is formed of a thin plate having a U-shaped or stepped shape.

3. The auxiliary member is composed of a pedestal block and a thin plate, and each of the pedestal block and the thin plate is bonded to one of the plates in advance with a heat-resistant adhesive, and after the plate alignment, the pedestal block and the thin plate are bonded with the heat-resistant adhesive. 2. The method of manufacturing a flat image display device according to the above item 1, wherein the two plates are fixed to each other by bonding.

4. 4. The method for manufacturing a flat image display device according to the above item 2 or 3, wherein the thin plate is made of a metal, a sealing alloy, or glass.

5. 4. The method of manufacturing a flat panel display according to the above item 3, wherein an ear portion corresponding to the thin plate is provided on a plate to be bonded to the thin plate instead of the thin plate.

6. 6. The method of manufacturing a flat image display device according to any one of the above items 1 to 5, wherein the hot-melt adhesive is frit glass, and the heat-resistant adhesive is a ceramic adhesive.

[0039]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to examples.

[0040]

1A and 1B are views showing a display according to the present invention, wherein FIG. 1A is a perspective view and FIG. 1B is a sectional view. 271 is a face glass plate, 273 is a rear glass plate, 272 is an outer frame, and 74 is a spacer.
Is the same as 1a, 1b, 1c, and 1d are thin metal plates (see FIG. 2 (a)) as an example of the dimensions.
It is a sealing alloy having a coefficient of thermal expansion of 0.05 to 0.2 mm, a width (d) of 10 to 20 mm, and a length (l) of 20 to 50 mm, and a stainless steel, phosphor bronze, or 271 glass plate. A glass plate of the same quality as 271 may be used.

The metal piece 1 is bonded to the outer periphery of the face plate 271 in advance at two to four places using a heat-resistant adhesive, for example, ceramic bonds 3a, 3b, 3c, and 3d. FIG. 2A shows the state. Reference numerals 2a, 2b, 2c and 2d denote pedestal blocks to which the metal piece 1 abuts. The metal piece having the above dimensions is 6 mm in height and is the same metal as glass or the above-mentioned thin plate. , 4
Adhesion in advance with the ceramic bond d (Fig. 2
(C)). FIG. 2 (a) shows a face plate + metal piece, FIG. 2 (b) shows an outer frame + (frit), FIG. 2 (c)
The rear plate + pedestal block indicated by is aligned with the alignment marks 271a, 271b, 273a, 273 shown in FIG.
The alignment is performed at room temperature according to b. FIG. 3 shows an apparatus for performing the alignment.

In FIG. 3, reference numeral 10 denotes an assembling / joining apparatus;
Is a gantry, and 12 is a Z table, which is installed on the gantry 11, and moves the vacuum hand 13 up and down. The vacuum band 13 vacuum sucks the face plate 271.
Reference numeral 14 denotes an x, y, and θ table which is installed on the gantry 11 and has an upper surface on which a rear plate 273 is placed. 1
5a, 15b are CCD cameras 271a, 271b,
The images of the alignment marks 273a and 273b are recognized. Reference numeral 16 denotes a ceramic bond application dispenser which is installed on a bar 17 and is mounted on an advance stage 18.

Next, the operation of the apparatus will be described. FIG. 2 (a)
Is manually sucked to the vacuum hand 13. The rear plate 273 of FIG.
On the x, y, θ table 14. Next, the outer frame 272 of FIG. 2B is placed on the rear plate 273 on the table 14. With this, the setting of the work is completed, and the 21 joining controllers are automatically operated.

First, the Z table 12 is lowered to the position where the metal piece 1 contacts the pedestal block 2, and the face plate 2
71 alignment marks 271a and 271b
It is read by the cameras 15a and 15b. Next, the alignment marks 273a and 273b on the rear glass plate 273 are read by the CCD cameras 15a and 15b. The displacement amount is calculated by the image controller 20, and the x, y, θ table 14 is moved by the joining controller 21 to align the face plate 271 and the rear plate 273. After the alignment is completed, the joining controller 21 issues a forward command to the predecessor stages 18a and 18b,
The tips of the ceramic bond dispensers 16a, 16b, 16c, and 16d advance near the metal pieces 1a, 1b, 1c, and 1d, and retreat after applying the ceramic bond. After a predetermined time, the ceramic bonds 5a, 5b,
5c and 5d are solidified and the fixing of the glass plates 271 and 273 is completed. FIG. 4 shows this state.

In FIG. 4, the metal piece 1 is bonded to the pedestal block 2 with an adhesive 5 (5a, 5c). Outer frame 272
Are formed with frit 272c, d applied in advance in a convex shape. The face plate 271 is in contact with the frit 272c, or is supported by one metal piece, and the protrusion of the frit 272c is
There is a gap in 1, but either is acceptable. Spacer 74
下端 Z is formed between the lower end of the rear plate 273 and the upper surface of the rear plate 273.

After the fixing is completed, the suction of the vacuum hand 13 of the apparatus 10 is stopped, and the Z-axis 12 is raised.

Next, the work 200 is taken out and shown in FIG. Put in firing furnace. Reference numeral 30 denotes a firing furnace main body, reference numeral 34 denotes a controller thereof, and reference numeral 31 denotes a pressurizing weight of 40 kg, which is supported by a lifting device 32 by a chain 33.

The work 200 previously taken out is put into the furnace 30 and heated at a rate of 10 ° C./min from room temperature. 4
At 00 ° C., the frit glasses 272c and 272d melt. During this time, the glass plates 271 and 273 thermally expand (about 1 mm), but the horizontal direction (x, y,
Since θ) is constrained, the position does not shift. After the frit glass is melted, the pressing weight 31 is lowered onto the face plate 271 by the elevating device 32 and pressurized.
By pressing, the flat glasses 272c and 272d are crushed and cover the upper and lower surfaces of the outer frame evenly. The state is shown in FIG.

At the time of pressurization, the metal piece 1 is elastically deformed upward and downward, the gap ΔZ shown in FIG. 4 is eliminated, and the spacer 74 comes into contact with the upper surface of the rear plate 273. Then, the temperature is lowered and returned to the greenhouse and taken out. In this way, the frit 272c, 272d is crushed while maintaining the positions of the upper and lower glass plates 271, 273, and a flat display with high vacuum tightness is manufactured.

FIG. 6 shows another embodiment.

Instead of the metal piece 1, 40 (40a, 40
b, 40c, and 40d) are used.

FIG. 7 shows an example in which 40 U-shaped metal pieces are used.

If these deformed metal pieces are used, the pedestal block 2 can be omitted.

FIG. 8 shows an example in which the face plate 271 is processed and formed into ear-shaped 42 (42a, 42b, 42c42d). Reference numeral 42 is a substitute for the metal piece 1. The above-mentioned movement amount in the Z direction is about 2 mm. Considering that 42 is made of glass, the length 1 of 42 is set to 50 to 100.
mm, or by thinning the portion 42.

In the furnace shown in FIG. 5 of the previous embodiment, the press weight 31 was lowered after the frit was melted.
71. Also, if a sealing alloy having the same coefficient of thermal expansion as glass is used as the material of one metal piece 1, the metal piece 1 and the face plate 271, or the pedestal block 2 may be separated due to a difference in thermal expansion. And increases the reliability of bonding.

[0056]

As described above, according to the present invention,
In sealing the upper and lower glass plates of the flat display, at room temperature, the upper and lower glass plates are accurately aligned and fixed with a heat-resistant adhesive, so even if heated to a frit melting temperature of 400 ° C., The position does not shift due to thermal expansion, and since the upper and lower glass plates are fixed with thin plates, it is possible to move up and down to crush the frit while maintaining the horizontal position. The sealing can be performed while ensuring the airtightness of the flat display in a high vacuum and maintaining the horizontal position with high accuracy.

[Brief description of the drawings]

FIGS. 1A and 1B are views showing a structure in which a pedestal block is used in a vacuum vessel including a face plate and a rear plate in a water surface type image display device of the present invention, wherein FIG. 1A is a perspective view and FIG. .

FIG. 2 is an exploded perspective view showing a configuration of the vacuum vessel of FIG. 1;

FIG. 3 is a perspective view showing an example of an apparatus for aligning a face plate and a rear plate of the vacuum vessel of FIG.

FIG. 4 is a cross-sectional view showing a state before firing in forming the vacuum vessel of FIG. 1;

FIG. 5 is a partially broken perspective view showing a state at the time of baking in forming the vacuum container of FIG. 1;

FIG. 6 is a perspective view when a step-like plate is used instead of the pedestal block of FIG. 1;

FIG. 7 is a perspective view when a U-shaped plate is used instead of the pedestal block in FIG. 1;

FIG. 8 is a perspective view in a case where a portion to be joined to the pedestal block in FIG. 1 is an ear of a plate.

FIG. 9 is a plan view showing an example of a device configuration of a surface conduction electron-emitting device.

FIG. 10 is a cross-sectional view illustrating an example of an FE-type element configuration.

FIG. 11 is a cross-sectional view illustrating an example of an MIM-type element configuration.

FIG. 12 is an exploded perspective view showing the configuration of the flat panel display.

13 (a) is a perspective view and FIG. 13 (b) is a cross-sectional view of the device obtained by assembling the configuration shown in FIG.

14 is a cross-sectional view showing a state before a heating and pressurizing process of a molten adhesive used for sealing of the apparatus of FIG. 12;

[Description of Signs]

 DESCRIPTION OF SYMBOLS 1 (a, b, c, d) Thin plate 2 (a, b, c, d) Pedestal block 3-5 (a, b, c, d) Heat-resistant adhesive 10 Assembly and joining device 11 Mount 12 Z table 13 Vacuum hand 14 x, y, θ table 15 (a, b) CCD camera 16 (a, b, c, d) heat-resistant adhesive application machine 17 (a, b) adhesive table 18 advance stage 19 (a, b) application controller Reference Signs List 20 image controller 21 assembly controller 30 firing furnace 31 weight 32 weight applying mechanism 33 chain 34 firing controller 40 stepped plate 41 U-shaped plate 74 spacer 200 work 271 face plate 271a, b alignment mark 271c light emitter 272 outer frame 272a , B Fused surface 272c Lift glass 272d Frit glass 273 Rear plate 273a b alignment marks 273c electron emission source 3001 substrate 3004 conductive thin film 3005 above the electron-emitting portion 3010 substrate 3011 emitter wiring 3012 emitter cone 3013 insulating layer 3014 gate electrode 3020 substrate 3012 under the electrode 3022 insulating layer 3023 electrodes

Claims (6)

[Claims] 1. A method of manufacturing a flat-panel image display device, comprising the steps of: adhering a face plate and a rear plate in parallel to both surfaces of a hollow frame to form a vacuum container;
The face plate and the rear plate are sized to protrude from the outer frame, can be joined to both plates at at least two locations of the protruding portion, and can be displaced by an external force in a direction of a distance between the plates,
A plurality of auxiliary members capable of holding the both plates outside the outer frame are prepared, first the auxiliary members are fixed to one protruding portion of the plate with a heat-resistant adhesive, and then a hot-melt adhesive is attached to the plate. After placing the outer frame coated with, the other plate is placed on the outer frame and the two plates are aligned face-to-face, and the auxiliary member is fixed to the latter plate with a heat-resistant adhesive and the auxiliary member is used. Fix the surface-to-face position of both plates, then raise the temperature to melt the hot-melt adhesive, apply an external force to both plates at this time, and bring both plates into close contact with the outer frame with the hot-melt adhesive to close the vacuum container. A method for manufacturing a flat-panel image display device, comprising: 2. The method according to claim 1, wherein the auxiliary member is formed of a thin plate having a U-shaped or stepped shape. 3. The auxiliary member includes a pedestal block and a thin plate, and the pedestal block and the thin plate are respectively bonded to one of the plates with a heat-resistant adhesive in advance, and after the plate is aligned, the pedestal block and the thin plate are bonded. 2. The method for manufacturing a flat panel display according to claim 1, wherein the surfaces of the two plates are fixed by bonding them with a heat-resistant adhesive. 4. The method according to claim 2, wherein the thin plate is made of a metal, a sealing alloy, or glass. 5. The method according to claim 3, wherein an ear portion corresponding to the thin plate is provided on a plate to be bonded to the thin plate instead of the thin plate. 6. The method according to claim 1, wherein the hot-melt adhesive is frit glass, and the heat-resistant adhesive is a ceramic adhesive.