JP2001334461A - 研磨装置 - Google Patents

研磨装置

Info

Publication number
JP2001334461A
JP2001334461A JP2000157006A JP2000157006A JP2001334461A JP 2001334461 A JP2001334461 A JP 2001334461A JP 2000157006 A JP2000157006 A JP 2000157006A JP 2000157006 A JP2000157006 A JP 2000157006A JP 2001334461 A JP2001334461 A JP 2001334461A
Authority
JP
Japan
Prior art keywords
polishing
polished
amount
dressing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000157006A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001334461A5 (enExample
Inventor
Naoki Nomichi
直樹 野路
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000157006A priority Critical patent/JP2001334461A/ja
Publication of JP2001334461A publication Critical patent/JP2001334461A/ja
Publication of JP2001334461A5 publication Critical patent/JP2001334461A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2000157006A 2000-05-26 2000-05-26 研磨装置 Pending JP2001334461A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000157006A JP2001334461A (ja) 2000-05-26 2000-05-26 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000157006A JP2001334461A (ja) 2000-05-26 2000-05-26 研磨装置

Publications (2)

Publication Number Publication Date
JP2001334461A true JP2001334461A (ja) 2001-12-04
JP2001334461A5 JP2001334461A5 (enExample) 2005-07-07

Family

ID=18661707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000157006A Pending JP2001334461A (ja) 2000-05-26 2000-05-26 研磨装置

Country Status (1)

Country Link
JP (1) JP2001334461A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004025413A (ja) * 2002-06-28 2004-01-29 Nikon Corp 研磨パッド等の寿命・良否判定方法、研磨パッドのコンディショニング方法、研磨装置、半導体デバイス及び半導体デバイス製造方法
JP2009131955A (ja) * 2004-11-01 2009-06-18 Ebara Corp 研磨装置
JP2010280031A (ja) * 2009-06-04 2010-12-16 Ebara Corp ドレッシング装置およびドレッシング方法
JP2012250309A (ja) * 2011-06-02 2012-12-20 Ebara Corp 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
US8845396B2 (en) 2004-11-01 2014-09-30 Ebara Corporation Polishing apparatus
CN107695860A (zh) * 2017-11-07 2018-02-16 佛山市南海富东机械设备有限公司 一种大理石板材抛光磨盘装置
JP2025503379A (ja) * 2022-10-27 2025-02-04 アプライド マテリアルズ インコーポレイテッド 音響キャリアヘッドモニタリング

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09285959A (ja) * 1996-04-18 1997-11-04 Hitachi Cable Ltd ウエハの研磨方法
JPH1086056A (ja) * 1996-09-11 1998-04-07 Speedfam Co Ltd 研磨パッドの管理方法及び装置
JPH10315118A (ja) * 1997-05-19 1998-12-02 Toshiba Corp 研磨布ドレッシング装置
JPH10315131A (ja) * 1997-05-23 1998-12-02 Hitachi Ltd 半導体ウエハの研磨方法およびその装置
JPH11198025A (ja) * 1997-07-11 1999-07-27 Tokyo Seimitsu Co Ltd ウェーハ研磨装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09285959A (ja) * 1996-04-18 1997-11-04 Hitachi Cable Ltd ウエハの研磨方法
JPH1086056A (ja) * 1996-09-11 1998-04-07 Speedfam Co Ltd 研磨パッドの管理方法及び装置
JPH10315118A (ja) * 1997-05-19 1998-12-02 Toshiba Corp 研磨布ドレッシング装置
JPH10315131A (ja) * 1997-05-23 1998-12-02 Hitachi Ltd 半導体ウエハの研磨方法およびその装置
JPH11198025A (ja) * 1997-07-11 1999-07-27 Tokyo Seimitsu Co Ltd ウェーハ研磨装置

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004025413A (ja) * 2002-06-28 2004-01-29 Nikon Corp 研磨パッド等の寿命・良否判定方法、研磨パッドのコンディショニング方法、研磨装置、半導体デバイス及び半導体デバイス製造方法
US10293455B2 (en) 2004-11-01 2019-05-21 Ebara Corporation Polishing apparatus
US10040166B2 (en) 2004-11-01 2018-08-07 Ebara Corporation Polishing apparatus
US11224956B2 (en) 2004-11-01 2022-01-18 Ebara Corporation Polishing apparatus
JP2009131955A (ja) * 2004-11-01 2009-06-18 Ebara Corp 研磨装置
US8845396B2 (en) 2004-11-01 2014-09-30 Ebara Corporation Polishing apparatus
US9724797B2 (en) 2004-11-01 2017-08-08 Ebara Corporation Polishing apparatus
JP2010280031A (ja) * 2009-06-04 2010-12-16 Ebara Corp ドレッシング装置およびドレッシング方法
US8517796B2 (en) 2009-06-04 2013-08-27 Ebara Corporation Dressing apparatus, dressing method, and polishing apparatus
US9302366B2 (en) 2011-06-02 2016-04-05 Ebara Corporation Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
US9943943B2 (en) 2011-06-02 2018-04-17 Ebara Corporation Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
US9156122B2 (en) 2011-06-02 2015-10-13 Ebara Corporation Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
JP2012250309A (ja) * 2011-06-02 2012-12-20 Ebara Corp 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
CN107695860A (zh) * 2017-11-07 2018-02-16 佛山市南海富东机械设备有限公司 一种大理石板材抛光磨盘装置
CN107695860B (zh) * 2017-11-07 2023-10-20 佛山市高明富东机械制造有限公司 一种大理石板材抛光磨盘装置
JP2025503379A (ja) * 2022-10-27 2025-02-04 アプライド マテリアルズ インコーポレイテッド 音響キャリアヘッドモニタリング

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