JP2001334455A5 - - Google Patents

Download PDF

Info

Publication number
JP2001334455A5
JP2001334455A5 JP2000161520A JP2000161520A JP2001334455A5 JP 2001334455 A5 JP2001334455 A5 JP 2001334455A5 JP 2000161520 A JP2000161520 A JP 2000161520A JP 2000161520 A JP2000161520 A JP 2000161520A JP 2001334455 A5 JP2001334455 A5 JP 2001334455A5
Authority
JP
Japan
Prior art keywords
water
polishing pad
composition
soluble
matrix material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000161520A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001334455A (ja
JP3925041B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2000161520A external-priority patent/JP3925041B2/ja
Priority to JP2000161520A priority Critical patent/JP3925041B2/ja
Priority to DE60132399T priority patent/DE60132399T2/de
Priority to KR1020010029902A priority patent/KR100792102B1/ko
Priority to TW090113083A priority patent/TWI290575B/zh
Priority to EP01113173A priority patent/EP1164559B1/en
Priority to TW093131164A priority patent/TWI290576B/zh
Priority to US09/867,541 priority patent/US6790883B2/en
Publication of JP2001334455A publication Critical patent/JP2001334455A/ja
Priority to US10/868,353 priority patent/US7077879B2/en
Publication of JP2001334455A5 publication Critical patent/JP2001334455A5/ja
Publication of JP3925041B2 publication Critical patent/JP3925041B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2000161520A 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド Expired - Lifetime JP3925041B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000161520A JP3925041B2 (ja) 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド
DE60132399T DE60132399T2 (de) 2000-05-31 2001-05-30 Zusammensetzung für Polierkissen und Polierkissen das diese Zusammensetzung verwendet
KR1020010029902A KR100792102B1 (ko) 2000-05-31 2001-05-30 연마 패드용 조성물 및 이를 이용한 연마 패드
TW090113083A TWI290575B (en) 2000-05-31 2001-05-30 Composition for polishing pad and polishing pad using the same
EP01113173A EP1164559B1 (en) 2000-05-31 2001-05-30 Composition for polishing pad and polishing pad using the same
TW093131164A TWI290576B (en) 2000-05-31 2001-05-30 Composition for polishing pad and polishing pad using the same
US09/867,541 US6790883B2 (en) 2000-05-31 2001-05-31 Composition for polishing pad and polishing pad using the same
US10/868,353 US7077879B2 (en) 2000-05-31 2004-06-16 Composition for polishing pad and polishing pad using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000161520A JP3925041B2 (ja) 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006296711A Division JP4379462B2 (ja) 2006-10-31 2006-10-31 研磨パッド用組成物及びこれを用いた研磨パッド

Publications (3)

Publication Number Publication Date
JP2001334455A JP2001334455A (ja) 2001-12-04
JP2001334455A5 true JP2001334455A5 (enExample) 2004-12-16
JP3925041B2 JP3925041B2 (ja) 2007-06-06

Family

ID=18665534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000161520A Expired - Lifetime JP3925041B2 (ja) 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド

Country Status (6)

Country Link
US (2) US6790883B2 (enExample)
EP (1) EP1164559B1 (enExample)
JP (1) JP3925041B2 (enExample)
KR (1) KR100792102B1 (enExample)
DE (1) DE60132399T2 (enExample)
TW (2) TWI290576B (enExample)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
KR100905266B1 (ko) * 2000-12-01 2009-06-29 도요 고무 고교 가부시키가이샤 연마 패드
KR100429691B1 (ko) * 2001-06-13 2004-05-03 동성에이앤티 주식회사 미세기공 함유 연마패드 및 그 제조방법
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
DE60308946T2 (de) * 2002-06-03 2007-05-10 Jsr Corp. Polierkissen und Verfahren zur Herstellung eines Polierkissens
US6641630B1 (en) 2002-06-06 2003-11-04 Cabot Microelectronics Corp. CMP compositions containing iodine and an iodine vapor-trapping agent
TWI228768B (en) * 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
US20040063391A1 (en) * 2002-08-26 2004-04-01 Jsr Corporation Composition for polishing pad and polishing pad therewith
KR100495404B1 (ko) * 2002-09-17 2005-06-14 한국포리올 주식회사 임베디드 액상 미소요소를 함유하는 연마 패드 및 그 제조방법
US20040058623A1 (en) * 2002-09-20 2004-03-25 Lam Research Corporation Polishing media for chemical mechanical planarization (CMP)
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US20040224622A1 (en) 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
JP4292025B2 (ja) 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
EP1561541B1 (en) * 2004-02-05 2008-04-30 JSR Corporation Chemical mechanical polishing pad and polishing process
US7988534B1 (en) * 2004-05-19 2011-08-02 Sutton Stephen P Optical polishing pitch formulations
JP2005340271A (ja) * 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
US20060046064A1 (en) * 2004-08-25 2006-03-02 Dwaine Halberg Method of improving removal rate of pads
US20060099891A1 (en) * 2004-11-09 2006-05-11 Peter Renteln Method of chemical mechanical polishing, and a pad provided therefore
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
EP1637281B1 (en) 2004-09-17 2008-05-28 JSR Corporation Chemical mechanical polishing pad and chemical mechanical polishing process
JP4475404B2 (ja) 2004-10-14 2010-06-09 Ｊｓｒ株式会社 研磨パッド
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US8038752B2 (en) * 2004-10-27 2011-10-18 Cabot Microelectronics Corporation Metal ion-containing CMP composition and method for using the same
TW200709892A (en) * 2005-08-18 2007-03-16 Rohm & Haas Elect Mat Transparent polishing pad
TWI378844B (en) * 2005-08-18 2012-12-11 Rohm & Haas Elect Mat Polishing pad and method of manufacture
JP4868840B2 (ja) * 2005-11-30 2012-02-01 Ｊｓｒ株式会社 半導体装置の製造方法
KR100804275B1 (ko) * 2006-07-24 2008-02-18 에스케이씨 주식회사 고분자 쉘로 둘러싸인 액상 유기물 코어를 포함하는 ｃｍｐ연마패드 및 그 제조방법
CN100398579C (zh) * 2006-11-15 2008-07-02 济南大学 一种制备无色甲阶酚醛树脂的方法
JP4798103B2 (ja) * 2007-09-03 2011-10-19 Ｊｓｒ株式会社 研磨パッド
JP2008168431A (ja) * 2008-02-26 2008-07-24 Jsr Corp 研磨パッド
CN102083586B (zh) * 2008-04-29 2015-08-12 塞米奎斯特股份有限公司 抛光垫片组合物与制造和使用方法
JP5314329B2 (ja) * 2008-06-12 2013-10-16 富士フイルム株式会社 研磨液
TWI417169B (zh) * 2009-06-11 2013-12-01 Wei En Chen Cutting tools with the top of the complex cutting
KR101108880B1 (ko) * 2009-10-16 2012-01-30 대상 주식회사 전분계 연마 그릿
WO2012046183A1 (en) * 2010-10-05 2012-04-12 Basf Se Chemical mechanical polishing (cmp) composition
WO2012138705A2 (en) * 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
JP6078631B2 (ja) * 2012-03-20 2017-02-08 ジェイエイチ ローデス カンパニー， インコーポレイテッド セルフコンディショニング研磨パッドおよびその作製方法
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
WO2016060712A1 (en) 2014-10-17 2016-04-21 Applied Materials, Inc. Cmp pad construction with composite material properties using additive manufacturing processes
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
EP3892418B1 (en) 2018-12-03 2026-03-04 Kuraray Co., Ltd. Polyurethane for polishing layers, polishing layer and polishing pad
CN111320863A (zh) * 2018-12-14 2020-06-23 夏泰鑫半导体(青岛)有限公司 制备研磨垫之组合物
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102509973B1 (ko) 2021-05-07 2023-03-14 에스케이엔펄스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
US20240383096A1 (en) * 2023-05-16 2024-11-21 Taiwan Semiconductor Manufacturing Co., Ltd. Polish Apparatus and Methods for Use

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2701191A (en) * 1949-02-02 1955-02-01 American Optical Corp Polishing pads
JPS61111343A (ja) * 1984-11-06 1986-05-29 Bridgestone Corp 改良されたゴム組成物
JPH03266706A (ja) * 1990-03-15 1991-11-27 Yokohama Rubber Co Ltd:The 空気入りタイヤ
AU1548692A (en) * 1991-04-19 1992-11-17 Kabushikigaisha Asahi Rubber composition decayable in soil and binding article using said composition for soil in flowerpot
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6245861B1 (en) * 1997-09-10 2001-06-12 Hercules Incorporated Use of peroxides to crosslink rubber compositions containing high vinyl styrene-butadiene rubber
JP3668046B2 (ja) * 1998-05-11 2005-07-06 株式会社東芝 研磨布及びこの研磨布を用いた半導体装置の製造方法
JP3918359B2 (ja) * 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
US6080221A (en) * 1999-09-17 2000-06-27 Agri-Nutrients Technology Group, Inc. Vacuum coated particulate fertilizers
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6855034B2 (en) * 2001-04-25 2005-02-15 Jsr Corporation Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer

Similar Documents

Publication Publication Date Title
JP3925041B2 (ja) 研磨パッド用組成物及びこれを用いた研磨パッド
JP2002134445A5 (enExample)
JP3826702B2 (ja) 研磨パッド用組成物及びこれを用いた研磨パッド
JP3918359B2 (ja) 研磨パッド用重合体組成物および研磨パッド
CN100398598C (zh) 研磨垫用组合物以及使用它的研磨垫
JP4039214B2 (ja) 研磨パッド
JP3880028B2 (ja) 研磨パッド用重合体組成物及びそれを用いた研磨パッド
US7097550B2 (en) Chemical mechanical polishing pad
JP2001214154A (ja) 研磨パッド用組成物及びそれを用いた研磨パッド
KR101006648B1 (ko) 연마 패드
JP4379462B2 (ja) 研磨パッド用組成物及びこれを用いた研磨パッド
JP2004009156A (ja) 研磨パッド及び複層型研磨パッド
JP2007326217A (ja) 研磨パッド
JP2004034175A (ja) 研磨パッド及び複層型研磨パッド
TWI326706B (enExample)
JP6584114B2 (ja) 研磨用組成物
JP2002037926A (ja) タイヤ用ゴム組成物
JP2002018731A (ja) 研磨パッド及びその製造方法
JP2004083722A (ja) 研磨パッド用組成物及びこれを用いた研磨パッド
JP2004034174A (ja) 研磨パッド及び複層型研磨パッド
JP2004083723A (ja) 研磨パッド用組成物及びこれを用いた研磨パッド
JP2008168431A (ja) 研磨パッド
JP2008149458A (ja) 研磨パッド用組成物及びこれを用いた研磨パッド