JP2001332829A - Printed circuit board and the same for camera - Google Patents

Abstract

PROBLEM TO BE SOLVED: To minimize dead space for connecting a flexible substrate and packaging a chip. SOLUTION: An interface IC is subjected to bare-chip packaging to the rear of a main substrate 201 that is made of a hard substrate, and a flexible board (FPC) connector 203J is packaged to the front. A mirror frame FPC 203 is withdrawn from the outer end of the main substrate 201, is bent there, and is inserted into and connected to the FPC connector 203J. The chip packaging part of the interface IC or a wire connection part on the main substrate 201 for receiving wire from such a chip is arranged on a rear at a position that nearly overlaps with the passage of the mirror frame FPC 203, thus sharing an area where no parts can be packaged in terms of the convenience of bare chip packaging, and an area where no parts can be packaged since the mirror frame FPC 203 needs to be inserted into and connected to the FPC connector 203J.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board provided with a flexible board connector to which a bare chip is mounted and to which a flexible board is connected, and a printed board for a camera.

[0002]

2. Description of the Related Art Various proposals have been made for miniaturization of various small consumer devices including a camera.

[0003] For example, Japanese Patent Application Laid-Open No. H11-212163 discloses that a connector used for connection to another electric mount component is attached to at least one of a plurality of electric mount components so as not to face the inner wall surface of the exterior plate. Accordingly, a technology for reducing the size of a camera is disclosed and introduced. That is, in the camera disclosed in this publication, a connection substrate is attached to a flexible printed circuit (FPC) connected to a rigid printed circuit board, which is a main substrate of the camera, and arranged on the front surface of a main body base, and provided on the connection substrate. The FPC connected to the electric component in the lens frame is inserted and connected to the connector. in this case,
The FPC connected to the electrical component in the lens frame is pulled out substantially perpendicularly to the connection board on which the connector is mounted, and then bent by about 90 degrees to be substantially parallel to the connection board. Is to be inserted. That is, since the bent portion of the FPC connected to the electric component in the lens frame is not close to the end surface of the connection substrate on which the connector is mounted, the FPC connected to the electric component in the lens frame is connected to the end of the connection substrate. Can be placed in

[0004] Bare chip mounting is not performed on the connection board on which the connector is mounted.

[0005]

By the way, the lens frame has been increased in size due to the recent increase in the zoom ratio of the camera. On the other hand, in such a camera, particularly, since the entire length of the lens frame is extended, a space near the front surface of the grip tends to be provided, which is suitable for installing the main board.

However, even if the main board is disposed there, it is desired that the area of the main board be made as large as possible due to the complexity of the electric circuit. Must be pulled out from the outer edge of the main board and bent there to establish connection with the main board. In this case, the FPC connector must be installed somewhere inside the end of the board,
Can not be inserted. In addition, it is not preferable to mount a chip component or the like in a portion where the FPC passes over the main board in order to prevent the FPC from being caught at the time of insertion.

On the other hand, in recent years, in order to reduce the cost of ICs, cases where bare chips are mounted instead of being packaged are increasing. In this case, especially COB with aluminum wire
(Chip On Bord) Mounting is a method in which a chip or a substrate is bonded to a wire by ultrasonic waves. Therefore, if the lower surface of the substrate of the chip mounting portion is not firmly held, the attachment of the wire becomes poor. For this reason, it is not preferable to mount the chip components, especially when performing COB mounting after mounting other chip components.

For these reasons, a dead space in which components cannot be mounted tends to occur in recent boards such as cameras.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and minimizes a dead space in connecting a flexible substrate and mounting a chip, thereby improving the efficiency and cost of the printed circuit board and camera. It is intended to provide a substrate.

[0010]

In order to achieve the above object, a printed circuit board according to the present invention has a bare chip mounted thereon, is pulled out substantially perpendicular to the printed circuit board, and is mounted on the printed circuit board. A flexible board bent by about 90 degrees near the outer edge includes a flexible board connector inserted substantially parallel to the printed board, and at least a part of the bare chip or a joint portion of the printed board with a bare chip is the flexible board connector. The flexible substrate is arranged on the back surface of a portion through which the flexible substrate inserted into the flexible substrate connector passes.

That is, according to the printed circuit board of the present invention, at least a part of the bare chip or the joint portion of the printed circuit board with the bare chip is arranged on the back surface of the portion through which the flexible board inserted into the flexible board connector passes. Like that.

A printed board of a camera according to the present invention has a bare chip mounted thereon, and a flexible board mounted with electric components in a lens frame to be connected to the printed board is provided on an upper surface of the printed board. Characterized in that the bare chip is mounted on the back surface of the portion passing through.

That is, according to the printed circuit board of the camera of the present invention, the flexible substrate, which is to be connected to the printed circuit board and on which the electric components in the mirror frame are mounted, is provided on the back surface of the portion passing through the upper surface of the printed circuit board. A bare chip is mounted.

Here, the bare chip is preferably an interface IC that performs at least one of sensor processing for position / displacement detection and drive control of the actuator.

In the printed circuit board or the printed circuit board of the camera, it is preferable that no part is mounted on a portion where the flexible substrate passes.

The printed circuit board of the camera according to the present invention has a bare chip mounted thereon, and a flexible board connector to be connected to the printed circuit board, into which a flexible board mounted with an electric component in a mirror frame is inserted. And a plurality of flexible board connectors including the bare chip mounting surface and the mounting surface of all the flexible board connectors are opposite surfaces.

That is, according to the printed circuit board of the camera of the present invention, all the bare chip mounting surfaces are opposite to the mounting surfaces of all the flexible substrate connectors including the flexible substrate connector.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1A is a diagram showing a configuration of a camera having a printed circuit board according to the present embodiment.

In FIG. 1, reference numeral 101 denotes an exterior of the camera, and a lens barrier 103 is attached to the front of the camera. When the lens barrier 103 is changed from the closed state to the open state, the camera shifts from the power saving state to the operating state, and the lens barrel is extended from the retracted state.

A release button 1 is provided on the top of the camera.
04 is arranged, and when this button is pressed, a photographing operation is performed. Further, on the upper surface of the camera, a zoom up switch 105, a zoom down switch 106, a photographing mode set switch 107, a strobe mode set switch 10
8, etc., and an external display LCD window 109
Is arranged.

A strobe 110 is provided on the front of the camera. Further, a known passive type A is provided at a position where the lens barrier 103 is exposed when the lens barrier 103 is opened.
F sensor 111, finder 112, photometric sensor 11
3. The remote control sensor 114 and the like are arranged. In addition,
Reference numeral 115 denotes a lens barrel unit and a lens barrel,
Reference numeral 116 denotes a photographing lens installed on a mirror frame.

FIG. 1B is a view showing a state in which the exterior 101 is removed from such a camera.

In FIG. 1, reference numeral 201 denotes a main board of a camera which is a printed board according to the present embodiment, which is formed of a hard board. The main board 201 includes a main CPU, an interface IC,
Power transistors and many other chip components are mounted. Also, flexible printed circuit (FPC) connectors 202J, 203J, and 204J are mounted, and the FPCs 202, 203, and 204 are respectively connected thereto.

That is, the upper surface FPC 202 connected to the FPC connector 202J has an LCD CPU for display control mounted thereon, and the external display LCD 207 is connected to the upper surface FPC 202 by the flexible connection board 208.

The lens frame FPC 203 connected to the FPC connector 203J is provided with signal lines and actuator drive lines inside the lens frame, and connects the electric components of the lens frame to the main board 201. Is configured.

As shown in the figure, since the lens frame unit and the lens barrel 115 are large and the main substrate 201 requires a considerable amount of wiring, the lens frame FPC 203 is required to secure the maximum area. Is pulled out from the outer edge of the main board 201 and bent there, and
It is configured to take a connection with. Therefore, in order to enable the insertion operation to the FPC connector 203J, the FPC connector 203J is disposed at a position slightly inside from the outer edge of the main board 201, and a portion from the outer edge to the FPC connector 203J is provided. The above mirror frame FP
C203 is covered.

Note that chip parts and the like are not mounted on the portion where the lens frame FPC 203 passes, so that the lens frame FPC 203 and the mounted components on the main substrate 201 are not caught when inserted and damaged.

The lower FPC 204 connected to the FPC connector 204J is a line to which signal lines for film control and the like and actuator drive lines are wired.

FIG. 2A is a diagram showing the details of the main board 201. As shown in FIG. That is, on the front surface of the main board 201, the FPC connectors 202J, 203J, 20
4J are respectively mounted.

On the back surface of the main board 201, that is, on the surface opposite to the object direction, a main operation control circuit (MC
PU) 251 and interface IC (IFIC) 2
52 are mounted on a bare chip. Where IFIC
As shown in FIG. 2B, the bare chip 252 is approximately the main board 2 with the lens frame FPC 203 inserted.
It is located behind the area that overlaps 01.

Further, various other chip components are mounted on the front and back surfaces of the main board 201.

FIGS. 3A and 3B are views showing the state of COB mounting of a bare chip. That is, on the printed board (main board 201) of the present embodiment, COB mounting of a type in which the pad 260 of the bare chip (MPU 251 and IFIC 252) and the wire connection pattern 261 on the printed board are connected by the aluminum wire 262 is performed. Thereafter, a method of sealing with resin is adopted. In this case, the connection portion of the wire 262 is generally connected by applying ultrasonic waves or the like so as to crush the tip of the wire.
At this time, it is preferable that the bare chip and the wire connection portion of the printed circuit board be held as uniformly and stably as possible by pressing from above. Therefore, in the mounting of the bare chip on the printed circuit board according to the present embodiment, the pedestal 29
1 and the wire 262 is stretched.

In general, the method of mounting another chip component after the above-described bare chip mounting is performed, even when components are mounted on the back surface of the bare chip mounting portion, since the bare chip is mounted before the mounting. Regardless of the design, it is a flat surface, and the design (part arrangement) restrictions are small. On the other hand, it is necessary to perform cream solder printing to mount other chip components after bare chip mounting / sealing,
It is necessary to escape the sealing portion. For this reason, the cream solder printing process becomes difficult, and beside the sealing part,
There is a restriction that components cannot be placed because uniform cream solder printing cannot be performed.

On the other hand, if other chip components are mounted before the above-described bare chip mounting, the process is simple because there is no need to escape and print the bare chip mounting portion when printing cream solder before mounting other chip components. However, it is desirable that no component be mounted on the back surface of the wire connection part.

In the present embodiment, in order to reduce the above-mentioned restriction on the application of the cream solder, a method of mounting another chip component before performing the latter bare chip mounting is adopted.

FIG. 4 is a diagram showing an electric circuit configuration of a camera using a printed circuit board according to the present embodiment.

That is, the MCPU 2 for controlling the entire camera
Reference numeral 51 controls the strobe 110 via the strobe substrate 205. Also, via the communication line, the IFIC 25
2 is also controlled. Further, an external display LCD is provided via an LCD CPU 253 mounted on the upper surface FPC 202.
207 is driven.

The IFIC 252 has both signal processing for various sensors and a power control function for actuators. That is, the IFIC 252 performs pre-drive control of the power transistor 254 on the main substrate 201,
In addition to driving the lens frame unit and the actuator in the lens barrel 115 via the lens frame FPC 203, the lower FPC2
The film zoom drive unit 255 is also driven via the control unit 04. The IFIC 252 receives and processes signals from position and displacement sensors from the lens barrel unit, the lens barrel 115, and the film / zoom drive unit 255. further,
The IFIC 252 receives and processes a small photocurrent signal of the photometric sensor 113 provided via the upper surface FPC 202.

The output of the AF sensor 111 given through the upper surface FPC 202 is directly received by the MCPU 251 and processed.

In the present embodiment, as shown in FIGS. 2A and 2B, the chip of the IFIC 252 mounted on the back surface of the passing portion of the lens frame FPC 203 at the position substantially overlapping the passing portion. It is arranged on the back. In other words, the wire connection portion on the main board 201 that receives the wire 262 from the chip of the IFIC 252 mounted on the bare chip on the back surface of the passing portion of the lens frame FPC 203 is attached to the back surface at a position substantially overlapping the passing portion. Are located.

As described above, according to the present embodiment, the wire mounting portion on the main board 201 for receiving the wire 262 from the chip mounting portion of the IFIC 252 or the chip of the IFIC 252 as described above is used. FPC2
Since it is arranged on the back surface at a position substantially overlapping with the passage portion 03, that is, an area where components cannot be mounted due to bare chip mounting and an area where components cannot be mounted due to insertion and connection of the lens frame FPC 203 to the FPC connector 203J. Since they are also used, reliable chip mounting is possible, and there is no risk of damage to the components when connecting the lens frame FPC 203. In addition, since the space efficiency is high, the area of the substrate is minimized, which is advantageous in terms of cost. is there.

Further, since the IFIC 252 having various functions is generally located at the center of the camera body and behind the passing portion of the lens frame FPC 203 pulled out from the substantially central portion, the small signal system and the power system are arranged. Can be separated and routed, and it is also efficient in developing signal lines to the upper and lower surfaces of the camera.

Further, since the main substrate 201 is a hard plate on the front surface of the grip and is disposed substantially perpendicular to the optical axis, the length of the lens frame is large, especially in a high-magnification zoom, so that a space can be provided on the front surface of the grip. It is an efficient arrangement for the camera. Also, the signals to the camera upper surface, lower surface, and lens frame can be separated and efficiently deployed.

Further, the main substrate 201 is a hard plate, and is easy to handle at the time of repair or assembling.

Furthermore, since the surface of the main substrate 201 on which the bare chip is mounted is the rear surface, there is little possibility that the wires 262 may be cut by damaging the sealing portion after the main substrate 201 is assembled.

Further, since the mounting surfaces of all the bare chips and the mounting surfaces of all the FPC connectors are opposite to each other, there is no stress due to the insertion of the FPC in the bare chip portion when the FPC is inserted.

Although the present invention has been described based on one embodiment, the present invention is not limited to the above-described embodiment, and various modifications and applications may be made within the scope of the present invention. It is possible.

For example, the device on which the printed circuit board is arranged may be a digital video camera, video, or other device other than the camera.

The chip to be bare mounted may be a CPU or an I / O.
The invention is not limited to the FIC, but may be other devices such as a digital image processor and a motor driver.

Further, the number of bare chips may be two or more.

Also, the FPC passing through the back surface of the bare chip
Has the same effect of increasing the space efficiency even with an FPC other than the mirror frame FPC.

The bonding wire of the chip is not limited to the aluminum wire but may be a gold wire, and the chip mounting method may be a flip-chip mounting such as a pressure bonding / adhesion type.

[0054]

As described in detail above, according to the present invention,
It is possible to provide a printed circuit board that can minimize the dead space in connecting a flexible board and mounting a chip, and that is efficient and as a result can be reduced in cost.

[Brief description of the drawings]

FIG. 1A is a diagram showing a configuration of a camera provided with a printed circuit board according to an embodiment of the present invention, and FIG. 1B is a diagram showing a state of the camera of FIG. is there.

FIGS. 2A and 2B are a plan view and a cross-sectional view of a main substrate, respectively.

FIG. 3 (A) and (B) show CO of bare chip, respectively.
It is the perspective view and sectional view for explaining B mounting.

FIG. 4 is an electric circuit configuration diagram of the camera shown in FIG.

[Explanation of symbols]

101 Exterior 103 Lens Barrier 104 Release Button 110 Strobe 111 AF Sensor 113 Photometry Sensor 115 Mirror Frame Unit and Lens Barrel 201 Main Board 202J, 203J, 204J Flexible Board (FPC) Connector 202 Top FPC 203 Mirror Frame FPC 204 Lower FPC 205 Strobe Substrate 207 LCD for external display 208 Flexible connection substrate 251 Main operation control circuit (MCPU) 252 Interface IC (IFIC) 253 LCDCPU 254 Power transistor 255 Film zoom drive unit 260 Pad 261 Wire connection pattern 262 Wire 291 Receiving stand

Claims (5)

[Claims] 1. A printed circuit board having a bare chip mounted thereon, wherein a flexible board pulled out substantially perpendicular to the printed circuit board and bent by approximately 90 degrees near an outer edge of the printed circuit board is substantially parallel to the printed circuit board. A flexible board connector to be inserted; at least a part of the bare chip or a joint portion of the printed board with the bare chip is arranged on a back surface of a portion through which the flexible board inserted into the flexible board connector passes; A printed circuit board, characterized in that: 2. A printed circuit board of a camera on which a bare chip is mounted, wherein a flexible substrate, which is to be connected to the printed circuit board and on which an electric component in a mirror frame is mounted, is provided on a back surface of a portion passing through an upper surface of the printed circuit board. A printed circuit board for a camera, wherein the bare chip is mounted. 3. The printed circuit board according to claim 2, wherein the bare chip is an interface IC that performs at least one of sensor processing for position / displacement detection and drive control of an actuator. 4. The device according to claim 1, wherein no component is mounted on a portion through which the flexible substrate passes.
A printed circuit board according to claim 1 or a printed circuit board for a camera according to claim 2. 5. A printed circuit board of a camera having a bare chip mounted thereon, wherein a plurality of flexible board connectors including a flexible board connector to be connected to the printed circuit board and to which a flexible board mounted with an electric component in a mirror frame is inserted. A printed circuit board for a camera, wherein all of the bare chip mounting surfaces are opposite to the mounting surfaces of all of the flexible substrate connectors.