JP2001332371A - Terminal board and its manufacturing method - Google Patents

Terminal board and its manufacturing method

Info

Publication number
JP2001332371A
JP2001332371A JP2000151247A JP2000151247A JP2001332371A JP 2001332371 A JP2001332371 A JP 2001332371A JP 2000151247 A JP2000151247 A JP 2000151247A JP 2000151247 A JP2000151247 A JP 2000151247A JP 2001332371 A JP2001332371 A JP 2001332371A
Authority
JP
Japan
Prior art keywords
terminal
mold
terminal plate
base
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000151247A
Other languages
Japanese (ja)
Inventor
Takashi Sawada
尚 澤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2000151247A priority Critical patent/JP2001332371A/en
Publication of JP2001332371A publication Critical patent/JP2001332371A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve a junction in the case of wire bonding. SOLUTION: A pair of lugs 28 is projected and formed from right and left side edges of a rear face 26B side in a flat plate part 26 of a terminal plate 25, and a bending part 27 is installed at the tip end. A fixed lower die 41 and an elevating upper die 42 are equipped, and a fitting groove 45 is formed at a lower molding surface 44 of lower the die 41, and a clearance groove 49 is formed at a vertical molding surface 48 of the upper die 42. A flat plate part 26 of the terminal plate 25 is reversed with front and rear, and fitted from the fitting groove 49 over to the clearance groove 49. The flat plate part 26 is supported by the lug 28 in a hanging state, and a front surface 26A is made to be floating from groove bottom of the fitting groove 45. The dies are closed and synthetic resin are filled between the both dies 41, 42, and when the molding product is taken out and top and bottom are reversed, the installed terminal board is obtained in the state that the terminal plate 25 is installed in parallel at the upper face of the base board made by synthetic resin in the state that the surface 26A is exposed. Because the die is not hit at the surface 26A to which the wire bonding is applied, a damage and tilting are avoided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プリント配線基板
の端子等とワイヤボンディングにより接続される端子台
及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal block connected to terminals and the like of a printed wiring board by wire bonding and a method of manufacturing the same.

【0002】[0002]

【従来の技術】この種の端子台の構造は、例えば図10
に示されるように、合成樹脂製の基台1の一面に、複数
の端子板2がインサート成形によりその表面を露出させ
た状態で並設されている。より具体的には、各端子板2
はその表面を下に向けた姿勢で固定の金型上に載置さ
れ、可動の金型を閉じてその間に合成樹脂材を充填して
固化させることによって、上記のように基台1の一面に
各端子板2の表面が面一で露出した端子台3が形成され
る。そして、各端子板2の表面が、端子台3の近傍に配
置されたプリント配線基板上の端子と、ワイヤボンディ
ングによって接続される。ここでワイヤボンディングと
は、アルミニウム線等の金属ワイヤの端末を高周波振動
を付与しつつ端子板に押し付けることで、金属同士を接
合させるものである。なお、この種の端子台は、例えば
特開平11−273769号公報に記載されている。
2. Description of the Related Art The structure of this type of terminal block is shown in FIG.
As shown in FIG. 1, a plurality of terminal boards 2 are juxtaposed on one surface of a synthetic resin base 1 with their surfaces exposed by insert molding. More specifically, each terminal board 2
Is placed on a fixed mold with its surface facing downward, and the movable mold is closed, and a synthetic resin material is filled and solidified between the molds, thereby solidifying the base 1 as described above. A terminal block 3 in which the surface of each terminal plate 2 is exposed flush is formed. Then, the surface of each terminal board 2 is connected to a terminal on a printed wiring board arranged near the terminal block 3 by wire bonding. Here, the wire bonding is to join the metals by pressing a terminal of a metal wire such as an aluminum wire against a terminal plate while applying high-frequency vibration. This type of terminal block is described, for example, in Japanese Patent Application Laid-Open No. H11-27369.

【0003】[0003]

【発明が解決しようとする課題】ところで、ワイヤボン
ディングが施される端子板2の表面は、平滑度や、基台
1の表面との平行度について厳しい基準が要求され、そ
れらが欠如すると、接合力が低下して接触不良を招くと
いう事情がある。しかるに従来のものでは、端子台3を
成形するに際して、端子板2の表面に直接に金型が当て
られるようになっているため、どうしても表面に傷が付
いたり、姿勢が傾いたりする嫌いがあり、接合力が低下
する事態を招きやすいという問題があった。本発明は上
記のような事情に基づいて完成されたものであって、そ
の目的は、ワイヤボンディングする際の接合性能を向上
させるところにある。
By the way, the surface of the terminal plate 2 on which wire bonding is performed is required to have strict standards for smoothness and parallelism with the surface of the base 1. There is a situation where the force is reduced and a contact failure is caused. However, in the conventional device, when the terminal block 3 is formed, the mold is directly applied to the surface of the terminal plate 2, so that there is a dislike that the surface is inevitably damaged or the posture is inclined. However, there has been a problem that a situation in which the joining strength is reduced is easily caused. The present invention has been completed based on the above circumstances, and an object of the present invention is to improve the bonding performance when performing wire bonding.

【0004】[0004]

【課題を解決するための手段】上記の目的を達成するた
めの手段として、請求項1の発明は、合成樹脂製の基台
の一面には、複数の端子板がインサート成形によりその
表面を露出させた状態で並設され、各端子板の表面が、
プリント配線基板等に配された相手側の各端子とワイヤ
ボンディングによって接続されるようにした端子台の製
造方法において、前記端子板の表面側を受けかつ前記基
台の前記一面を形成する金型の成形面には、前記端子板
の表面の中央部と対応する位置に凹部が形成され、前記
端子板の表面の端縁部のみに前記金型の成形面が当てら
れた状態で前記基台が成形されるところに特徴を有す
る。
Means for Solving the Problems As means for achieving the above-mentioned object, the invention of claim 1 is directed to a synthetic resin base having a plurality of terminal plates exposed on one surface by insert molding. It is installed side by side in a state where
In a method of manufacturing a terminal block configured to be connected by wire bonding to each terminal of a counterpart arranged on a printed wiring board or the like, a mold for receiving the front side of the terminal plate and forming the one surface of the base On the molding surface of the base plate, a concave portion is formed at a position corresponding to the center portion of the surface of the terminal plate, and the base is placed in a state where the molding surface of the mold is applied only to the edge of the surface of the terminal plate. Is characterized by where it is molded.

【0005】請求項2の発明は、請求項1に記載のもの
において、前記端子板の端縁には耳部が張り出し形成さ
れ、この耳部のみが前記金型の成形面に当てられるとこ
ろに特徴を有する。請求項3の発明は、請求項2に記載
のものにおいて、前記耳部が裏面側に向けて下がった段
付き状に形成され、前記端子板の表面における前記耳部
を設けた箇所以外の部分が、前記金型の成形面における
前記凹部内にほぼ緊密に嵌合されるところに特徴を有す
る。請求項4の発明は、請求項1ないし請求項3のいず
れかに記載のものにおいて、前記端子板の表面側を受け
る前記金型に対して接離可能な相手金型が設けられ、型
閉じした両金型間のキャビティに合成樹脂材を充填する
ことで前記基台が成形されるようになっており、前記端
子板には裏面側に屈曲された屈曲部が設けられ、前記相
手金型が型閉じした場合にこの相手金型に設けられた押
さえ部が前記屈曲部を押さえるようになっているところ
に特徴を有する。
According to a second aspect of the present invention, in the first aspect, a lug portion is formed so as to protrude from an edge of the terminal plate, and only the lug portion is applied to a molding surface of the mold. Has features. The invention according to claim 3 is the device according to claim 2, wherein the ear portion is formed in a stepped shape lowered toward the back surface side, and a portion other than a portion where the ear portion is provided on the surface of the terminal plate. However, it is characterized in that it is almost tightly fitted in the concave portion on the molding surface of the mold. According to a fourth aspect of the present invention, in any one of the first to third aspects of the present invention, there is provided a counterpart mold which can be brought into contact with and separated from the mold which receives the surface side of the terminal plate, and the mold is closed. The base is formed by filling the cavity between the two molds with a synthetic resin material, and the terminal plate is provided with a bent portion bent on the back side, and the mating mold is provided. Is characterized in that when the mold is closed, the pressing portion provided on the mating die presses the bent portion.

【0006】請求項5の発明は、合成樹脂製の基台の一
面には、複数の端子板がインサート成形によりその表面
を露出させた状態で並設され、各端子板の表面が、プリ
ント配線基板等に配された相手側の各端子とワイヤボン
ディングによって接続されるようにした端子台におい
て、前記端子板の端縁には耳部が張り出し形成されてお
り、前記端子板の表面側を受けかつ前記基台の前記一面
を形成すべく金型が前記耳部のみに当てられて前記基台
が形成されているところに特徴を有する。請求項6の発
明は、請求項5に記載のものにおいて、前記耳部が裏面
側に向けて下がった段付き状に形成されているところに
特徴を有する。
According to a fifth aspect of the present invention, a plurality of terminal boards are juxtaposed on one surface of a base made of synthetic resin with their surfaces exposed by insert molding, and the surface of each terminal board is printed wiring. In a terminal block that is connected to each terminal on the other side arranged on a substrate or the like by wire bonding, an edge portion is formed to protrude at an edge of the terminal plate, and a front side of the terminal plate is received. The present invention is characterized in that a mold is applied only to the ears to form the one surface of the base, thereby forming the base. The invention according to claim 6 is characterized in that, in the invention according to claim 5, the ear portion is formed in a stepped shape that is lowered toward the back surface side.

【0007】[0007]

【発明の作用及び効果】<請求項1の発明>端子板の表
面側が金型の成形面で受けられた場合に、表面の中央部
は成形面の凹部と対応していて端縁部のみが金型に当て
られた状態で成形がなされる。その結果、実際にワイヤ
ボンディングに供される端子板の表面の中央部では、傷
が付いたり、傾いたりすることが防止され、ワイヤボン
ディングを行う際の接合性能を向上させることができ
る。もって、良好な接続状態を担保することが可能とな
る。
<Operation and effect of the invention><Invention of claim 1> When the front side of the terminal plate is received by the molding surface of the mold, the center of the surface corresponds to the concave portion of the molding surface, and only the edge portion is formed. The molding is performed in a state where it is applied to the mold. As a result, at the center of the surface of the terminal plate actually used for wire bonding, scratching or tilting can be prevented, and the bonding performance when performing wire bonding can be improved. As a result, it is possible to secure a good connection state.

【0008】<請求項2及び請求項5の発明>端子板を
押さえるのに耳部を利用するようにしたから、端子板の
大型化を最小限に抑えた上で、ワイヤボンディングに適
した面を広範囲にわたって確保することができる。 <請求項3及び請求項6の発明>耳部を設けた箇所以外
の部分を凹部に嵌めることで、樹脂圧を受けて端子板が
移動すること、特に表面と平行な方向に位置ずれするこ
とを防止できる。 <請求項4の発明>型閉じした際に両金型の間で屈曲部
が挟持され、特に端子板が表裏方向に位置ずれすること
が防がれる。
<Inventions of Claims 2 and 5> Since the lugs are used to hold the terminal plate, the size of the terminal plate is minimized and the surface suitable for wire bonding is minimized. Can be secured over a wide range. <Inventions of Claims 3 and 6> By fitting a portion other than the portion where the ear portion is provided into the concave portion, the terminal plate is moved by receiving the resin pressure, and is particularly displaced in a direction parallel to the surface. Can be prevented. <Invention of Claim 4> When the mold is closed, the bent portion is sandwiched between the two dies, and in particular, the terminal plate is prevented from being displaced in the front and back directions.

【0009】[0009]

【発明の実施の形態】以下、本発明の一実施形態を図1
ないし図9に基づいて説明する。図1は、本発明に係る
端子台20を備えた電子制御ユニット10を示してい
る。このユニット10は、上面開口の方形の箱形をなす
ケース11を備え、隅部等に設けられた取付部12によ
って車両等の所定位置に取り付けられるとともに、上面
開口にはパッキン13を介して蓋板(図示せず)が被着
されて、内部が密閉されるようになっている。ケース1
1の一側面からはコネクタ15が突設されているととも
に、内部には各種電子部品が収容可能であって、これら
と接続されること等に使用されるバスバー16が複数箇
所にわたって配されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG.
This will be described with reference to FIG. FIG. 1 shows an electronic control unit 10 including a terminal block 20 according to the present invention. The unit 10 includes a case 11 having a rectangular box shape with an upper surface opening. The unit 11 is attached to a predetermined position of a vehicle or the like by an attachment portion 12 provided at a corner or the like. A plate (not shown) is attached so that the inside is sealed. Case 1
A connector 15 protrudes from one side, and various electronic components can be accommodated therein, and bus bars 16 used for connection with the components are arranged at a plurality of locations. .

【0010】ケース11内における図1の右下隅に寄っ
た位置には、左右方向に細長い端子台20が形成され、
その手前にプリント配線基板22の収納領域が設けられ
ている。端子台20は、詳しくは後記するように、合成
樹脂製の基台21の上面に、複数の端子板25が間隔を
開けて並んで設けられている一方、その手前に、プリン
ト配線基板22が基台21の上面とほぼ同じ高さ位置に
載置され、各端子板25が、プリント配線基板22上の
対応する端子23と、ワイヤ(ボンディングワイヤ)2
4によって接続されている。
A terminal block 20 elongated in the left-right direction is formed at a position in the case 11 near the lower right corner of FIG.
A storage area for the printed wiring board 22 is provided in front of this. As will be described in detail later, the terminal block 20 has a plurality of terminal boards 25 arranged side by side on the upper surface of a synthetic resin base 21, while a printed wiring board 22 is provided in front thereof. The terminal board 25 is placed at a position substantially at the same height as the upper surface of the base 21, and each terminal board 25 is connected to a corresponding terminal 23 on the printed wiring board 22 and a wire (bonding wire) 2.
4.

【0011】続いて、端子台20の構造ならびにその製
造方法を詳細に説明する。端子板25の形状は、図2な
いし図5に示すように、その一端側に所定長さの平板部
26を有しており、その平板部26の幅を異にした2種
類が備えられている。平板部26の先端には、裏面26
B側に直角曲げされた屈曲部27が全幅にわたって形成
されている。平板部26の左右の側縁には、長さ方向の
中央部において、左右一対の耳部28が張り出し形成さ
れている。この耳部28は、プレス機で圧潰する等によ
って平板部26のほぼ半分の板厚とされ、かつ平板部2
6の裏面26Bと面一に形成されている。言い換える
と、耳部28は、平板部26の表面26Aから一段下が
った段付き状に形成されている。
Next, the structure of the terminal block 20 and a method of manufacturing the same will be described in detail. As shown in FIGS. 2 to 5, the terminal plate 25 has a flat plate portion 26 having a predetermined length at one end thereof, and two types of the flat plate portion 26 having different widths are provided. I have. At the tip of the flat plate portion 26, a back surface 26
A bent portion 27 bent at a right angle to the B side is formed over the entire width. A pair of left and right ears 28 project from the left and right side edges of the flat plate 26 at the center in the length direction. The lug 28 is made approximately half the thickness of the flat plate 26 by crushing with a press machine or the like.
6 and is formed flush with the back surface 26B of the sixth. In other words, the ear portion 28 is formed in a stepped shape one step lower than the surface 26A of the flat plate portion 26.

【0012】端子台20を成形するために、図5に示す
成形金型40が備えられている。成形金型40は、固定
の下型41と、可動の上型42とを備えている。下型4
1には、水平な下成形面44が設けられており、この下
成形面44には、上記した端子板25の配設位置と対応
して、嵌合溝45が形成されている。この嵌合溝45
は、各端子板25の平板部26が緊密に嵌まる幅と、少
なくとも平板部26の板厚の半分よりも大きい深さ、言
い換えると端子板25の平板部26を表裏反転して嵌合
溝45に嵌めた場合に、溝底が平板部26の表面から離
間するだけの深さを有している。
A molding die 40 shown in FIG. 5 is provided for molding the terminal block 20. The molding die 40 includes a fixed lower die 41 and a movable upper die 42. Lower mold 4
1 is provided with a horizontal lower molding surface 44, and a fitting groove 45 is formed on the lower molding surface 44, corresponding to the arrangement position of the terminal plate 25 described above. This fitting groove 45
Is a width at which the flat plate portion 26 of each terminal plate 25 fits tightly, and a depth larger than at least half of the plate thickness of the flat plate portion 26. In other words, the flat plate portion 26 of the terminal plate 25 is turned upside down to fit into the fitting groove. The groove bottom has such a depth that the groove bottom is separated from the surface of the flat plate portion 26 when it is fitted to the groove 45.

【0013】一方の上型42には、上記した下型41の
下成形面44と対向した上成形面47と、下型41の背
面に当接した縦成形面48とを有しており、縦成形面4
8を下型41の背面に摺接させつつ上下方向に移動可能
とされている。上型42の縦成形面48には、下型41
の嵌合溝45と対応した位置ごとに、縦向きの逃がし溝
49が形成されている。この逃がし溝49は、端子板2
5の屈曲部27が緊密に嵌まる幅と深さとを有してい
る。また、この逃がし溝49の上縁が押さえ部50とな
っていて、上型42が型閉じ位置に下降した場合に、押
さえ部50が屈曲部27の先端に当接する設定となって
いる。
The upper mold 42 has an upper molding surface 47 facing the lower molding surface 44 of the lower mold 41, and a vertical molding surface 48 in contact with the back surface of the lower mold 41. Vertical molding surface 4
8 can be moved up and down while sliding on the back surface of the lower mold 41. On the vertical molding surface 48 of the upper mold 42, the lower mold 41
A vertical relief groove 49 is formed at each position corresponding to the fitting groove 45. The relief groove 49 is provided in the terminal plate 2.
5 have a width and a depth that allow the bent portion 27 to fit tightly. Further, the upper edge of the relief groove 49 is a pressing portion 50, and the pressing portion 50 is set to come into contact with the tip of the bent portion 27 when the upper die 42 is lowered to the die closing position.

【0014】次に、上記の成形金型40により端子台2
0を成形する手順を説明する。まず、図5に示すよう
に、上型42を型開き位置に上昇させた状態において、
各端子板25の平板部26を表裏反転した姿勢として、
対応する嵌合溝45から逃がし溝49にわたって嵌めら
れる。平板部26は、図6に示すように、耳部28を嵌
合溝45の側縁に当てて吊り下げ状に支持され、その表
面26Aは、嵌合溝45の溝底から浮いた状態にある。
また、図8に示すように、屈曲部27が逃がし溝49の
溝底に当てられる。
Next, the terminal block 2 is formed by the molding die 40 described above.
The procedure for molding 0 will be described. First, as shown in FIG. 5, in a state where the upper mold 42 is raised to the mold opening position,
With the flat plate portion 26 of each terminal plate 25 turned upside down,
The fitting groove 45 is fitted over the escape groove 49 from the corresponding fitting groove 45. As shown in FIG. 6, the flat plate portion 26 is supported in a hanging manner with the ear portion 28 abutting against the side edge of the fitting groove 45, and its surface 26 </ b> A is floated from the bottom of the fitting groove 45. is there.
In addition, as shown in FIG. 8, the bent portion 27 is applied to the groove bottom of the escape groove 49.

【0015】続いて、上型42が下降して型閉じされる
と、図7及び図9に示すように、上成形面47と下成形
面44との間隔が狭められるとともに、逃がし溝49の
上縁に設けられた押さえ部50が屈曲部27の先端を押
さえる。係る状態から、上下の金型42,41の間に形
成されたキャビティ内に、図示しないゲートを通して溶
融樹脂が充填される。このとき、端子板25には、合成
樹脂の充填圧が作用するが、平板部26が嵌合溝45内
に緊密に嵌まっていることで、平板部26の幅方向の移
動が規制され、また、耳部28が嵌合溝45の側縁に当
てられ、かつ屈曲部27の先端が押さえ部50で押さえ
られていることで、平板部26の板厚方向の移動も規制
される。
Subsequently, when the upper mold 42 is lowered and closed, as shown in FIGS. 7 and 9, the distance between the upper molding surface 47 and the lower molding surface 44 is reduced, and the clearance groove 49 is formed. The holding portion 50 provided on the upper edge holds the tip of the bent portion 27. From this state, the molten resin is filled into the cavity formed between the upper and lower molds 42 and 41 through a gate (not shown). At this time, the filling pressure of the synthetic resin acts on the terminal plate 25, but the flat plate portion 26 is tightly fitted in the fitting groove 45, so that the movement of the flat plate portion 26 in the width direction is restricted, Further, the movement of the flat plate portion 26 in the thickness direction is also restricted by the fact that the ear portion 28 is in contact with the side edge of the fitting groove 45 and the tip of the bent portion 27 is pressed by the pressing portion 50.

【0016】経時後に合成樹脂が固化すると、上型42
が上昇して型開きされ、成形品が取り出される。この成
形品を成形時とは上下並びに前後反転させると、図2に
示すように、合成樹脂製の基台21の上面に複数の端子
板25が間隔を開けて配された端子台20が得られる。
より詳細には、図3に示すように、端子板25の平板部
26は、その裏面26B側の板厚の半分が基台21中に
埋まり、耳部28の表面が基台21の上面と面一とな
る。また平板部26の表面26A側の板厚の半分が基台
21の上面から突出して、平板部26の表面26Aが外
部に露出した状態となる。さらに、図4に示すように、
屈曲部27が端子台20の手前側上部の角に掛止された
状態となる。そして、図1に示すように、端子台20の
手前側にプリント配線基板22が配置され、各端子板2
5が、プリント配線基板22上の対応する端子23と、
ワイヤ24によって接続される。
When the synthetic resin solidifies after a lapse of time, the upper mold 42
Rises to open the mold, and the molded product is taken out. When this molded product is turned upside down and back and forth from the time of molding, as shown in FIG. 2, a terminal block 20 in which a plurality of terminal plates 25 are arranged at intervals on the upper surface of a synthetic resin base 21 is obtained. Can be
More specifically, as shown in FIG. 3, in the flat plate portion 26 of the terminal plate 25, half of the plate thickness on the back surface 26 </ b> B side is buried in the base 21, and the surface of the ear portion 28 is Become flush. Also, half of the plate thickness on the surface 26A side of the flat plate portion 26 protrudes from the upper surface of the base 21, and the surface 26A of the flat plate portion 26 is exposed to the outside. Further, as shown in FIG.
The bent portion 27 is hooked on the upper front corner of the terminal block 20. Then, as shown in FIG. 1, a printed wiring board 22 is disposed in front of the terminal block 20, and each terminal board 2
5 is a corresponding terminal 23 on the printed wiring board 22;
They are connected by wires 24.

【0017】この実施形態では、端子板25の平板部2
6の表面26A側を、基台21の上面を形成すべく下型
41の下成形面44で受ける場合に、下成形面44に嵌
合溝45を形成しておき、嵌合溝45の側縁に耳部28
を当てつつ、平板部26の表面26Aが嵌合溝45の溝
底から浮いた首吊り状に支持している。言い換えると、
耳部28のみが下型41に当てられて平板部26の表面
26Aには下型41が当てられないから、平板部26の
表面26Aに傷が付いたり、平板部26の表面26Aが
基台21の上面に対して傾いたりすることなく成形され
る。そのため、平板部26の表面26Aにワイヤボンデ
ィングを施す際に、接合力が強固にでき、良好な接続状
態を得ることができる。
In this embodiment, the flat plate portion 2 of the terminal plate 25 is used.
6 is received by the lower molding surface 44 of the lower mold 41 to form the upper surface of the base 21, a fitting groove 45 is formed in the lower molding surface 44, and the side of the fitting groove 45 is formed. Ear 28 on the edge
, The surface 26A of the flat plate portion 26 is supported in a hanging manner floating from the groove bottom of the fitting groove 45. In other words,
Since only the ears 28 are applied to the lower mold 41 and the lower mold 41 is not applied to the surface 26A of the flat plate 26, the surface 26A of the flat plate 26 is damaged or the surface 26A of the flat plate 26 is 21 without being inclined with respect to the upper surface. Therefore, when wire bonding is performed on the surface 26 </ b> A of the flat plate portion 26, the bonding force can be increased, and a good connection state can be obtained.

【0018】なお、平板部26の両側縁に耳部28を張
り出し形成してこれを下型41に当てるようにしたか
ら、平板部26全体の大型化を最小限に抑えた上で、ワ
イヤボンディングに適した面を広範囲にわたって確保す
ることができる。特に、平板部26の幅が狭いものに有
効である。また、耳部28を裏面26B側に一段下げて
形成し、平板部26の板厚のほぼ半分を嵌合溝45内に
埋没させた状態で支持するようにしたから、成形時にお
いて樹脂圧を受けて端子板25が移動すること、特に平
板部26が幅方向に位置ずれすることが有効に防止され
る。
Since the ear portions 28 are formed on both side edges of the flat plate portion 26 so as to be applied to the lower mold 41, the size of the entire flat plate portion 26 is minimized, and the wire bonding is performed. Surface suitable for a wide range can be secured. In particular, it is effective for a flat plate 26 having a narrow width. Further, since the ear portion 28 is formed one step lower on the back surface 26B side, and approximately half of the plate thickness of the flat plate portion 26 is supported in a state of being buried in the fitting groove 45, the resin pressure during molding is reduced. The movement of the terminal plate 25 upon receipt, in particular, the displacement of the flat plate portion 26 in the width direction is effectively prevented.

【0019】<他の実施形態>本発明は上記記述及び図
面によって説明した実施形態に限定されるものではな
く、例えば次のような実施形態も本発明の技術的範囲に
含まれ、さらに、下記以外にも要旨を逸脱しない範囲内
で種々変更して実施することができる。 (1)端子板の平板部を金型内で位置決めすることが別
の手段で可能であれば、耳部は敢えて段付き状に形成す
る必要はない。 (2)端子板の平板部の幅が広い場合等、平板部の表面
にワイヤボンディングを施すための領域が広く確保され
ている場合には、耳部を設けることなく、平板部の表面
の側縁を金型で押さえるようにしてもよい。
<Other Embodiments> The present invention is not limited to the embodiments described above and illustrated in the drawings. For example, the following embodiments are also included in the technical scope of the present invention. In addition, various changes can be made without departing from the scope of the invention. (1) If it is possible to position the flat portion of the terminal plate in the mold by another means, it is not necessary to intentionally form the ear portion in a stepped shape. (2) When a wide area for wire bonding is secured on the surface of the flat plate portion, such as when the width of the flat plate portion of the terminal plate is large, the side of the flat plate portion surface is provided without providing the lug portion. The edge may be pressed by a mold.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態の端子台を備えた電子制御
ユニットの開蓋状態の平面図
FIG. 1 is a plan view of an electronic control unit having a terminal block according to an embodiment of the present invention in an open state;

【図2】端子台の部分平面図FIG. 2 is a partial plan view of a terminal block.

【図3】図2のX−X線断面図FIG. 3 is a sectional view taken along line XX of FIG. 2;

【図4】図2のY−Y線断面図FIG. 4 is a sectional view taken along line YY of FIG. 2;

【図5】成形金型の斜視図FIG. 5 is a perspective view of a molding die.

【図6】図2のX−X線における型開き状態の断面図FIG. 6 is a sectional view of the mold open state along the line XX in FIG. 2;

【図7】その型閉じ状態の断面図FIG. 7 is a sectional view of the mold closed state.

【図8】図2のY−Y線における型開き状態の断面図FIG. 8 is a cross-sectional view taken along line YY of FIG. 2 in a mold open state;

【図9】その型閉じ状態の断面図FIG. 9 is a sectional view of the mold closed state.

【図10】従来例の斜視図FIG. 10 is a perspective view of a conventional example.

【符号の説明】[Explanation of symbols]

20…端子台 21…基台 22…プリント配線基板 23…端子 24…ボンディングワイヤ 25…端子板 26…平板部 26A…(平板部26の)表面 26B…(平板部26の)裏面 27…屈曲部 28…耳部 40…成形金型 41…下型 42…上型 44…下成形面 45…嵌合溝(凹部) 47…上成形面 48…縦成形面 49…逃がし溝 50…押さえ部 DESCRIPTION OF SYMBOLS 20 ... Terminal block 21 ... Base 22 ... Printed wiring board 23 ... Terminal 24 ... Bonding wire 25 ... Terminal board 26 ... Flat plate part 26A ... Surface (of flat plate part 26) 26B ... Back surface (of flat plate part 26) 27 ... Bending part 28 ... ear part 40 ... molding die 41 ... lower die 42 ... upper die 44 ... lower molding surface 45 ... fitting groove (recess) 47 ... upper molding surface 48 ... vertical molding surface 49 ... relief groove 50 ... holding part

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 合成樹脂製の基台の一面には、複数の端
子板がインサート成形によりその表面を露出させた状態
で並設され、各端子板の表面が、プリント配線基板等に
配された相手側の各端子とワイヤボンディングによって
接続されるようにした端子台の製造方法において、 前記端子板の表面側を受けかつ前記基台の前記一面を形
成する金型の成形面には、前記端子板の表面の中央部と
対応する位置に凹部が形成され、前記端子板の表面の端
縁部のみに前記金型の成形面が当てられた状態で前記基
台が成形されることを特徴とする端子台の製造方法。
1. A plurality of terminal boards are arranged in parallel on one surface of a base made of synthetic resin with their surfaces exposed by insert molding, and the surface of each terminal board is arranged on a printed wiring board or the like. In a method for manufacturing a terminal block, which is connected to each terminal on the mating side by wire bonding, a molding surface of a mold that receives the surface side of the terminal plate and forms the one surface of the base, A recess is formed at a position corresponding to the center of the surface of the terminal plate, and the base is molded in a state where the molding surface of the mold is applied only to the edge of the surface of the terminal plate. Manufacturing method of the terminal block.
【請求項2】 前記端子板の端縁には耳部が張り出し形
成され、この耳部のみが前記金型の成形面に当てられる
ことを特徴とする請求項1記載の端子台の製造方法。
2. The method according to claim 1, wherein a lug is formed on an edge of the terminal plate, and only the lug is applied to a molding surface of the mold.
【請求項3】 前記耳部が裏面側に向けて下がった段付
き状に形成され、前記端子板の表面における前記耳部を
設けた箇所以外の部分が、前記金型の成形面における前
記凹部内にほぼ緊密に嵌合されることを特徴とする請求
項2記載の端子台の製造方法。
3. The terminal portion is formed in a stepped shape which is lowered toward a back surface side, and a portion other than a portion where the ear portion is provided on a surface of the terminal plate is the concave portion on a molding surface of the mold. 3. The method according to claim 2, wherein the terminal block is fitted approximately tightly.
【請求項4】 前記端子板の表面側を受ける前記金型に
対して接離可能な相手金型が設けられ、型閉じした両金
型間のキャビティに合成樹脂材を充填することで前記基
台が成形されるようになっており、前記端子板には裏面
側に屈曲された屈曲部が設けられ、前記相手金型が型閉
じした場合にこの相手金型に設けられた押さえ部が前記
屈曲部を押さえるようになっていることを特徴とする請
求項1ないし請求項3のいずれかに記載の端子台の製造
方法。
4. A mating mold is provided which can be brought into contact with and separated from the mold for receiving the front side of the terminal plate, and a synthetic resin material is filled in a cavity between the molds with the mold closed. The base is to be molded, the terminal plate is provided with a bent portion bent to the back side, and when the mating mold is closed, the pressing portion provided in this mating mold is The method for manufacturing a terminal block according to claim 1, wherein the bent portion is pressed.
【請求項5】 合成樹脂製の基台の一面には、複数の端
子板がインサート成形によりその表面を露出させた状態
で並設され、各端子板の表面が、プリント配線基板等に
配された相手側の各端子とワイヤボンディングによって
接続されるようにした端子台において、 前記端子板の端縁には耳部が張り出し形成されており、
前記端子板の表面側を受けかつ前記基台の前記一面を形
成すべく金型が前記耳部のみに当てられて前記基台が形
成されていることを特徴とする端子台。
5. A plurality of terminal boards are arranged on one surface of a base made of a synthetic resin with their surfaces exposed by insert molding, and the surface of each terminal board is arranged on a printed wiring board or the like. In a terminal block that is connected to each terminal on the other side by wire bonding, an ear portion is formed to protrude at an edge of the terminal plate,
A terminal base, wherein the base is formed by receiving a surface of the terminal plate and applying a mold only to the ears to form the one surface of the base.
【請求項6】 前記耳部が裏面側に向けて下がった段付
き状に形成されていることを特徴とする請求項5記載の
端子台。
6. The terminal block according to claim 5, wherein the ear portion is formed in a stepped shape that is lowered toward the back side.
JP2000151247A 2000-05-23 2000-05-23 Terminal board and its manufacturing method Pending JP2001332371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000151247A JP2001332371A (en) 2000-05-23 2000-05-23 Terminal board and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000151247A JP2001332371A (en) 2000-05-23 2000-05-23 Terminal board and its manufacturing method

Publications (1)

Publication Number Publication Date
JP2001332371A true JP2001332371A (en) 2001-11-30

Family

ID=18656838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000151247A Pending JP2001332371A (en) 2000-05-23 2000-05-23 Terminal board and its manufacturing method

Country Status (1)

Country Link
JP (1) JP2001332371A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102801012A (en) * 2012-07-26 2012-11-28 中航光电科技股份有限公司 Screw-stamped electrical contact piece and stamping piece thereof
JP2017157287A (en) * 2016-02-29 2017-09-07 住友電装株式会社 Resin molding
JP2017157286A (en) * 2016-02-29 2017-09-07 住友電装株式会社 Resin molding and manufacturing method therefor
JP2020004734A (en) * 2019-09-26 2020-01-09 住友電装株式会社 Resin molding
JP2021097050A (en) * 2019-06-07 2021-06-24 住友電装株式会社 Resin molding
JP2021180120A (en) * 2020-05-14 2021-11-18 Tdk株式会社 Terminal structure, and manufacturing method of terminal structure

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102801012A (en) * 2012-07-26 2012-11-28 中航光电科技股份有限公司 Screw-stamped electrical contact piece and stamping piece thereof
US11217957B2 (en) 2016-02-29 2022-01-04 Sumitomo Wiring Systems, Ltd. Resin molded product and method for producing same
JP2017157287A (en) * 2016-02-29 2017-09-07 住友電装株式会社 Resin molding
JP2017157286A (en) * 2016-02-29 2017-09-07 住友電装株式会社 Resin molding and manufacturing method therefor
WO2017150092A1 (en) * 2016-02-29 2017-09-08 住友電装株式会社 Resin molded product
WO2017150091A1 (en) * 2016-02-29 2017-09-08 住友電装株式会社 Resin molded product and method for producing same
CN108701917A (en) * 2016-02-29 2018-10-23 住友电装株式会社 Synthetic resin and its manufacturing method
CN112864646B (en) * 2016-02-29 2023-03-07 住友电装株式会社 Resin molded article
US10916867B2 (en) 2016-02-29 2021-02-09 Sumitomo Wiring Systems, Ltd. Resin molded product
CN112864646A (en) * 2016-02-29 2021-05-28 住友电装株式会社 Resin molded article
JP2021097050A (en) * 2019-06-07 2021-06-24 住友電装株式会社 Resin molding
JP2020004734A (en) * 2019-09-26 2020-01-09 住友電装株式会社 Resin molding
JP2021180120A (en) * 2020-05-14 2021-11-18 Tdk株式会社 Terminal structure, and manufacturing method of terminal structure
JP7331775B2 (en) 2020-05-14 2023-08-23 Tdk株式会社 TERMINAL STRUCTURE AND METHOD FOR MANUFACTURING TERMINAL STRUCTURE

Similar Documents

Publication Publication Date Title
JP5572350B2 (en) Wire ultrasonic bonding method
JP4742877B2 (en) Molded structure of resin molded product
JP4830321B2 (en) Semiconductor light emitting device
JP5276953B2 (en) Clamping device and injection molding machine
JP4848901B2 (en) Method for manufacturing insert molded product and mold
JP2001332371A (en) Terminal board and its manufacturing method
US10973137B2 (en) Circuit device, method for manufacturing circuit device and connector
JP4470116B2 (en) Molded structure of case with connector
US8056225B2 (en) Method for manufacturing electrical connectors for enhancing coplanarity
WO2018066696A1 (en) Molding machine
US5208117A (en) Battery and manufacturing method for battery cover
CN1169208A (en) Leadframe for encapsulated optocomponent
JP5907113B2 (en) Method for manufacturing waterproof electronic circuit unit and electronic circuit unit
CN101312112A (en) Chip packaging outer lead wire molding die
JP3274838B2 (en) Mold wiring board
JP2004140156A (en) Cutting method of lead terminal in packaged electronic part
JP4007137B2 (en) Molded structure of case with connector
JPH10264163A (en) Insert die and surface mounting type connector using the same
JP2992425B2 (en) Circuit board
JP2967906B2 (en) Structure to prevent warpage of housing
JPH04154056A (en) Terminal device
JP4369554B2 (en) Mold equipment for vendors
JPH10113948A (en) Outsert substrate
JPH05343151A (en) Terminal molding method
JP4406528B2 (en) Rubber press molding method