JP2001320010A - Packaging structure of semiconductor device, optoelectronic device, liquid crystal device, and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the packaging structure of an IC that uses an anisotropy conductive film to increase mechanical strength at a packaging part by improving the structure of a terminal for IC packaging, an optoelectronic device, a liquid crystal device, and electronic equipment. SOLUTION: In an IC packaging region 70 of a substrate 20 for composing the liquid crystal device, by a slit 96 consisting of the non-formation part of an ITO film for composing a wiring pattern 9 and a first terminal 91, the first terminals 91A, 91B, and 91C are divided into a plurality of terminals 911A, 912A, 913A, 914A, 921B, 922B, 921C, and 922C. As a result, when the first terminal 91 is electrically and mechanically connected to a first electrode 71 by an anisotropy conductive film (an adhesive), resin that is contained in the anisotropy conductive film (adhesive) bonds an IC 7 for driving onto a second transparent substrate (second substrate) 20 for fixing while the resin enters the slit 96, thus improving the fixing strength of the IC 7 since an area where resin 61 of the anisotropy conductive film (adhesive) comes into contact with the first terminal 91 is wide.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a semiconductor device (hereinafter, referred to as an IC), an electro-optical device using the mounting structure, a liquid crystal device, and an electronic apparatus using the electro-optical device as a display unit. It is. More specifically, the present invention relates to a terminal structure in a mounting structure using an anisotropic conductive film.

[0002]

2. Description of the Related Art A typical example of an electro-optical device is a liquid crystal device. In this liquid crystal device, for example, in a simple matrix type liquid crystal device 1 shown in FIGS. 1, 2 and 3, a first transparent substrate 10 made of glass or the like is used.
And a second transparent substrate 20 also made of glass or the like.
Are bonded and fixed at a predetermined gap with the sealant 30 interposed therebetween. First transparent substrate 10 and second transparent substrate 20
The liquid crystal 5 is sealed in the liquid crystal sealing region 300 defined by the sealant 30 between the two. Driving electrode patterns 15 and 25 for applying a voltage to the liquid crystal are formed on the first transparent substrate 10 and the second transparent substrate 20 in directions orthogonal to each other.

In this liquid crystal device, the second transparent substrate 2
Since 0 is larger than the first transparent substrate 10, a part of the second transparent substrate 20 protrudes from the edge of the first transparent substrate 10. An IC mounting area 70 for mounting the driving IC 7 for outputting a driving signal to the electrode patterns 15 and 25 is provided on the overhanging portion 200 of the second transparent substrate 20.
And a flexible wiring board connection area 80 for connecting a flexible wiring board 8 that supplies various signals and voltages to the driving IC 70.

Here, the electrode pattern 25 formed on the second transparent substrate 20 extends from the IC mounting area 70 and is supplied with a signal directly from the driving IC 7 mounted thereon. On the other hand, the electrode pattern 15 formed on the first transparent substrate 10 is
When the second transparent substrate 20 is bonded to the transparent substrate 20 with the sealant 30, the end of the inter-substrate conduction wiring pattern 94 extending from both ends of the IC mounting area 70 in the second transparent substrate 20 is included in the sealant 30. They are electrically connected via a conductive material between the substrates.

In this embodiment, the IC mounting area 70 and the flexible board connection area 80 are generally configured as partially enlarged in FIG. In the IC mounting area 70, electrical connection between the driving IC 7 and the wiring pattern 25 and electrical connection between the driving IC 7 and the wiring pattern 94 for inter-substrate conduction are performed. FIG. 9 shows only a portion of the IC mounting area 70 where the driving IC 7 and the wiring pattern 25 are electrically connected, and FIG. 9 shows the driving IC 7 and the wiring pattern 94 for inter-substrate conduction. The illustration and description of the parts that electrically connect are omitted.

In FIG. 9, an IC mounting area 70 and a flexible board connection area 80 are formed by a driving electrode pattern 2.
5 are connected by a wiring pattern 9 formed simultaneously.
Of both ends of the wiring pattern 9, the IC mounting area 70
The number of the first terminals 91 (first
Are formed on the active surface of the drive IC 7 with respect to the first terminals 91.
Electrodes 71 (first electrode group) are connected. Further, a large number of second terminals 92 (second terminal groups) are formed by the ends of the wiring pattern 9 located in the flexible wiring board connection region 80, and these second terminals 92 are
A second electrode group (not shown) formed on the flexible wiring board 8 (see FIGS. 1, 2 and 3) is connected.

Here, a plurality of wiring patterns 9 (9A, 9A)
B, 9C, 9D), the wiring patterns 9A, 9B, 9C for supplying voltages such as the ground potential Vss and the high voltage potential Vdd from the flexible wiring board 8 to the driving IC 7.
In the IC mounting area 70, solid first terminals 91A, 91B and 91C which are considerably wider than the first terminals 91D formed at the end of the wiring pattern 9D are formed. A plurality of first electrodes 71 of the driving IC 7 are electrically connected to one of the electrodes 91A, 91B, and 91C. Similarly, the wiring patterns 9A, 9B, and 9C are
0, solid second terminals 92A, 92B and 92C which are considerably wider than the second terminals 92D formed at the end of the wiring pattern 9D are formed, and these terminals 92A, 92B, A plurality of second electrodes of the flexible wiring board 8 are electrically connected to one of the 92C collectively.

In such an electrical connection, since the distance between adjacent electrodes is considerably short, generally, an anisotropic conductive film (A
CF: Anisotropic conductive
film). In the mounting method using this anisotropic conductive film, first, as shown in FIG.
After the anisotropic conductive adhesive is applied to the IC mounting region 70 to form the anisotropic conductive film 6, or after the IC mounting region 70 is covered with the sheet-like anisotropic conductive film 6, the second transparent Substrate 2
0 to the first terminal 91 formed at
The first electrode 71 of C7 is aligned, and in this state, as shown in FIG.
C7 is pressed against the second transparent substrate 20 while heating. As a result, as shown in FIG. 10C, the resin component 61 contained in the anisotropic conductive film 6 is melted, and the anisotropic between the first terminal 91 and the first electrode 71 is caused. Conductive film 6
Is crushed. Therefore,
The first terminal 91 and the first electrode 71 are electrically connected to each other via the conductive particles 62, and the second transparent portion is formed in a state where the resin component 61 included in the anisotropic conductive film 6 is cured. The driving IC 7 is fixed to the substrate 20.

As shown in FIG. 9, an electrode pattern 25 for supplying a signal output from the driving IC 7 to each pixel is formed on the second transparent substrate 20, and these electrode patterns 25 A large number of third terminals 93 (third terminal group) are formed by the ends located in the mounting area 70. Many third electrodes 73 (third electrode group) formed on the active surface of the driving IC 7 are electrically connected to these third terminals 93. The electrical connection method in this part is performed simultaneously with the process described with reference to FIG.
The situation is the same as that described with reference to FIG. 9, and a description thereof will be omitted. Also, the method of electrically connecting the flexible wiring board 8 to the flexible wiring board connection region 80 of the second transparent substrate 20 is substantially the same as the method described with reference to FIG. .

[0010]

In the mounting structure using such an anisotropic conductive film 6, the mechanical strength of this portion is governed by the adhesive force of the resin component 61 contained in the anisotropic conductive film 6. However, in the conventional mounting structure, the second transparent substrate 20
When the first terminal 91 formed in the first embodiment or the first electrode 71 formed in the driving IC 7 is reduced in size, there is a problem that the mechanical strength of this portion is significantly reduced.

In view of the above problems, an object of the present invention is to improve the mechanical strength of a mounting portion using an anisotropic conductive film by improving the structure of a terminal for mounting an IC. IC mounting structure, electro-optical device,
A liquid crystal device and an electronic device are provided.

[0012]

According to the present invention, there is provided a semiconductor device mounting structure in which a semiconductor device is mounted on a semiconductor device mounting area of a substrate. A first terminal group, wherein the semiconductor device includes a first electrode group electrically connected to the first terminal group by an anisotropic conductive film; Is characterized by including at least a divided terminal group divided into a plurality of parts by a slit formed of a non-formed portion of the conductive film constituting the first terminal group.

In the present invention, since the first terminal is divided into a plurality of terminals (divided terminals) by being divided into comb-like shapes by slits, the first terminals are formed with irregularities by the slits. I have. For this reason, when the first terminal and the first electrode are electrically and mechanically connected to each other by the anisotropic conductive film (adhesive), the resin contained in the anisotropic conductive film (adhesive) is removed. Is to bond and fix the IC to the substrate in a state of entering the recess (in the slit). For this reason, compared with the conventional mounting structure, the area where the resin contacts the first terminal is larger by the area corresponding to the side surface of the first terminal. Therefore, since the bonding area is substantially expanded, the IC
The adhesive strength to the substrate is improved.

In the present invention, for example, predetermined electrodes in the first electrode group are electrically connected to the respective terminals constituting the divided terminal group in a state of one-to-one overlap.

In the present invention, a flexible wiring board connection region having a second terminal group is formed on the substrate, and the second electrode group of the flexible wiring board is formed on the second terminal group. A second division, which is electrically connected by an anisotropic conductive film and is divided into a plurality of parts by a slit formed of a non-formed portion of the conductive film constituting the second terminal group, It is preferable that at least a terminal group is included.

As described above, in the present embodiment, even in the connection region between the substrate and the flexible wiring board, the second terminal is divided into a comb-like shape by the slit and formed as a plurality of terminals (second divided terminals). Therefore, irregularities are formed in the second terminal by slits. For this reason, when the second terminal and the second electrode are electrically and mechanically connected to each other by the anisotropic conductive film (adhesive), the resin contained in the anisotropic conductive film (adhesive) is removed. Affixes the flexible wiring board to the board while being inserted into the recess (into the slit). For this reason, the area where the resin contacts the second terminal is large by the area corresponding to the side surface of the second terminal. Accordingly, since the bonding area is substantially expanded, the bonding strength of the flexible wiring board to the board is improved.

In the present invention, for example, predetermined electrodes in the second electrode group are electrically connected to the respective terminals constituting the second divided terminal group in a one-to-one manner. You.

An IC mounting structure to which the present invention is applied can be applied to, for example, an electro-optical device. In this electro-optical device, a plurality of electrode patterns for supplying a drive signal to each pixel from the IC mounted on the IC mounting area are extended on the substrate. Such an electro-optical device can be used, for example, as a display unit of various electronic devices.

According to the electro-optical device of the present invention, in the electro-optical device in which a semiconductor device is mounted on a substrate, a wiring pattern having an end is provided on the substrate, and the end has a plurality of portions. The semiconductor device is provided with an electrode, the electrode is connected to the end of the wiring pattern, and an adhesive is disposed between the end of the wiring pattern and the electrode. Features.

Since the electro-optical device of the present invention has such a configuration, the end of the wiring pattern is divided into a comb-like shape by slits, so that the end has irregularities. For this reason, when the end of the wiring pattern and the electrode are electrically and mechanically connected by an anisotropic conductive film (adhesive), the resin contained in the anisotropic conductive film (adhesive) An IC (semiconductor device) is bonded and fixed to the substrate in a state of entering the recess (the slit). For this reason, compared with the conventional mounting structure, the area where the resin portion contacts the end portion is larger by an area corresponding to the side surface portion of the end portion of the wiring pattern. Accordingly, since the bonding area is substantially expanded, the bonding strength of the IC (semiconductor device) to the substrate is improved. The substrate may include a flexible substrate.
COF mounting of a semiconductor device on a so-called substrate (Chi
p on FPC (flexible printed
circuit)).

The electro-optical device is preferably an electro-optical device selected from the group consisting of a liquid crystal device, an electroluminescence device, a PDP, and an FED.

In the above-described electro-optical device according to the present invention, there is provided a wiring board on which a second electrode is provided, wherein the wiring pattern has a second end, and wherein the second end has a plurality of portions. The second electrode is connected to the second end of the wiring pattern, and a second adhesive is provided between the second end of the wiring pattern and the second electrode. Preferably, they are arranged.

As described above, in the present embodiment, the second end of the wiring pattern is divided into the comb-like shape by the slit even in the connection region between the substrate and the wiring board. Have irregularities formed by slits.
For this reason, when the second end and the second electrode are electrically and mechanically connected by an anisotropic conductive film (adhesive), they are included in the anisotropic conductive film (adhesive). The resin content is
The wiring board is bonded and fixed to the board in a state where the wiring board has entered the recess (the slit). For this reason, the area where the resin component contacts the second end is large by the area corresponding to the side surface of the second end. Therefore, since the bonding area is substantially expanded, the bonding strength of the wiring substrate to the substrate is improved.

The adhesive preferably contains an anisotropic conductive film. According to another aspect of the invention, there is provided an electronic apparatus including the electro-optical device as a display unit. Further, the liquid crystal device of the present invention is a liquid crystal device having a pair of substrates facing each other, wherein one of the substrates has an overhang portion protruding from an edge of the other substrate, and one of the substrates Is provided with a wiring pattern having an end portion, the end portion is divided into a plurality of portions, and a driving IC having electrodes is mounted on one of the substrates, and the electrode is the end portion of the wiring pattern. And an adhesive is disposed between the end of the wiring pattern and the electrode.

Since the liquid crystal device of the present invention has such a configuration, the end of the wiring pattern is divided into a comb-like shape by slits, so that the end has irregularities. For this reason, when the end of the wiring pattern and the electrode are electrically and mechanically connected by an anisotropic conductive film (adhesive), the resin contained in the anisotropic conductive film (adhesive) The substrate is inserted into the recess (in the slit)
C is adhesively fixed. Therefore, compared to the conventional mounting structure, only the area corresponding to the side surface at the end of the wiring pattern is reduced.
The area where the resin component contacts this end is large. Accordingly, since the bonding area is substantially expanded, the bonding strength of the IC to the substrate is improved. In the liquid crystal device of the present invention,
A flexible wiring board provided with a second electrode,
The wiring pattern has a second end, the second end is divided into a plurality of parts, the second electrode is connected to the second end of the wiring pattern, It is preferable that an adhesive is disposed between the second end of the first electrode and the second electrode.

As described above, in the present embodiment, the second end of the wiring pattern is divided into the comb-like shape by the slit in the connection region between the substrate and the flexible wiring board. Are formed with slits by slits. For this reason, when the second end and the second electrode are electrically and mechanically connected by an anisotropic conductive film (adhesive), they are included in the anisotropic conductive film (adhesive). The flexible wiring board is bonded and fixed to the board in a state where the resin component enters the recess (in the slit). For this reason, the area where the resin component contacts the second end is large by the area corresponding to the side surface of the second end. Accordingly, since the bonding area is substantially expanded, the bonding strength of the flexible wiring board to the board is improved.

In the liquid crystal device according to the present invention, a second wiring pattern is provided on one of the substrates, and the wiring pattern supplies a ground potential Vss or a high voltage potential Vdd to the driving IC. Is preferably wider than the width of the second wiring pattern.

The adhesive preferably contains an anisotropic conductive film.

Further, an electronic apparatus according to the present invention includes the above-mentioned liquid crystal device as a display unit.

According to a semiconductor device mounting structure of the present invention, in a semiconductor device mounting structure in which a semiconductor device is mounted on a semiconductor device mounting region of a substrate, a wiring pattern is formed on the substrate, and the wiring pattern is The semiconductor device has both ends, and a terminal is formed by the end located in the semiconductor device mounting region among the both ends of the wiring pattern, and the semiconductor device is anisotropic with respect to the terminal. An electrode electrically connected by a conductive film, wherein the terminal includes a divided terminal group divided into a plurality of parts by a slit including a non-formed portion of the conductive film forming the terminal; Is characterized in that predetermined electrodes in the electrode group are electrically connected to each other in a one-to-one manner.

Since the mounting structure of the semiconductor device of the present invention has such a structure, the terminal is divided into a plurality of comb-like shapes by slits, and thus the terminals are formed with irregularities by the slits. For this reason, when the terminal and the electrode are electrically and mechanically connected by the anisotropic conductive film (adhesive), the resin contained in the anisotropic conductive film (adhesive) is in the recess (slit). (Inside), an IC (semiconductor device) is bonded and fixed to the substrate. For this reason, compared with the conventional mounting structure, the area where the resin contacts the terminal is larger by the area corresponding to the side surface of the terminal. Accordingly, since the bonding area is substantially expanded, the bonding strength of the IC (semiconductor device) to the substrate is improved.

Further, in the liquid crystal device of the present invention, the first substrate and the second substrate are bonded and fixed with a sealant interposed therebetween, and the second substrate projects from the edge of the first substrate. A liquid crystal device having a semiconductor device mounted in a semiconductor device mounting area of the overhang portion, wherein a wiring pattern is formed on the second substrate, and the wiring pattern has both ends. And a terminal is formed by the end located in the semiconductor device mounting region among the both ends of the wiring pattern,
The semiconductor device includes an electrode that is electrically connected to the terminal by an anisotropic conductive film, and the terminal is divided into a plurality of parts by a slit including a non-formed portion of a conductive film included in the terminal. Divided terminal group,
It is characterized in that predetermined electrodes in the electrode group are electrically connected to the respective terminals constituting the divided terminal group in a state of one-to-one overlap.

Since the liquid crystal device of the present invention has such a configuration, the terminals are divided into a plurality of comb-like shapes by slits, and thus the terminals are formed with irregularities by the slits. For this reason, when the terminal and the electrode are electrically and mechanically connected by the anisotropic conductive film (adhesive), the resin component contained in the anisotropic conductive film (adhesive)
The IC is inserted into the substrate in a state where it enters the recess (in the slit).
(Semiconductor device) is bonded and fixed. For this reason, compared with the conventional mounting structure, the area where the resin contacts the terminal is larger by the area corresponding to the side surface of the terminal. Accordingly, since the bonding area is substantially expanded, the bonding strength of the IC (semiconductor device) to the substrate is improved.

[0034]

Embodiments of the present invention will be described with reference to the accompanying drawings. Although the present invention can be applied to various uses, each embodiment described below is an example in which the present invention is applied to a liquid crystal device most typical as an electro-optical device.

Embodiment 1 (Overall Configuration) FIGS. 1, 2 and 3 are perspective views schematically showing the appearance of a liquid crystal device according to the present embodiment, respectively, and schematically show an exploded state of the liquid crystal device. FIG. 3 is a perspective view showing the liquid crystal device and a cross-sectional view of the liquid crystal device. The present invention relates to a semiconductor device (IC)
It is characterized by its mounting structure and connection structure of a flexible wiring board (wiring board). Since the configuration of a portion for displaying an image in a liquid crystal device is the same as that of a known liquid crystal device, it is formed on a substrate constituting the liquid crystal device The electrode patterns and the like are schematically shown in FIGS. 1 and 2, and detailed illustration thereof is omitted.

As shown in FIGS. 1, 2 and 3, in the simple matrix type liquid crystal device 1, a first transparent substrate (first substrate) 10 made of glass, quartz, plastic, or the like is used. Second transparent substrate (second substrate) 20 made of glass, quartz, plastic, or the like
Are bonded and fixed at a predetermined gap with the sealant 30 interposed therebetween. The sealant 30 is formed with a discontinuous portion as a liquid crystal injection port 301 when injecting liquid crystal, and the liquid crystal injection port 301 is formed with a sealant 302 made of an ultraviolet curable resin.
It is sealed with. First transparent substrate (first substrate) 10
The liquid crystal 5 is sealed in a liquid crystal sealing region 300 defined by the sealant 30 between the second transparent substrate (second substrate) 20 and the second transparent substrate 20. The first transparent substrate (first substrate) 10 and the second transparent substrate (second substrate) 20 have driving electrode patterns 15, 2 in directions orthogonal to each other.
5 is transparent ITO (Indium Tin Oxid)
e) It is formed in a stripe shape by a film or the like. A drive signal for driving the liquid crystal of each pixel is applied to these electrode patterns. When the liquid crystal device is a reflection type or a transflective type, one of these electrode patterns may be formed of a reflective metal film such as aluminum.

A first transparent substrate (first substrate) 10
And alignment films 101 and 201 are formed on the surface of a second transparent substrate (second substrate) 20.
Various kinds of liquid crystals such as a (Super Twisted Nematic) type can be used.

The pixel is composed of liquid crystal to which a voltage is applied from two electrode patterns at the intersection of the electrode patterns 15 and 25. In the present embodiment, since the liquid crystal device is a simple matrix liquid crystal device, the electrode patterns 15,
One of the electrodes 25 functions as a scanning electrode to which a scanning signal is applied, and the other functions as a signal electrode to which an image signal of an ON voltage or an OFF voltage is applied. Further, a first transparent substrate (first substrate) 1
Polarizing plates 19 and 29 are attached to the outer surfaces of the zero and second transparent substrates (second substrates) 20, respectively. Further, a retardation plate for eliminating coloring generated in the liquid crystal layer is interposed between the transparent substrates 10 and 20 and the polarizing plates 19 and 29 as necessary.

In the liquid crystal device 1 of the present embodiment, since the second transparent substrate (second substrate) 20 is larger than the first transparent substrate (first substrate) 10, the second transparent substrate (second substrate) Part of the substrate 20 is a first transparent substrate (first substrate) 1
It protrudes from the edge of zero. The flexible wiring board connection area (wiring board connection area) 80 along the edge of the second transparent substrate (second board) 20 in the protruding portion 200 of the second transparent board (second board) 20 An IC mounting area 70 is formed in a region inside the flexible board (wiring board) connection area 80 in parallel with the flexible wiring board connection area (wiring board connection area) 80. The IC mounting area 70 includes the electrode patterns 15 and 2
The flexible wiring board connection area (wiring board connection area) 80 is a flexible wiring for supplying various signals and power from the outside to the drive IC 7. Substrate (wiring board)
8 is a region for connecting 8 to a second transparent substrate (second substrate) 20. The drive IC 7 applies a drive signal to each electrode pattern in order to drive each pixel of the liquid crystal device. The drive IC 7 has a COG (Chip On) with the active surface facing the substrate in a chip state with respect to the transparent substrate. Glass)
It is implemented in a system.

The first transparent substrate (first substrate) 10
The electrode pattern 15 formed on the first transparent substrate (first substrate) 10 and the second transparent substrate (second substrate) 2
When the sealing material 30 is bonded to the end of the wiring pattern 94 extending from both ends of the IC mounting area 70 in the second transparent substrate (second substrate) 20,
The electrical connection is made via an inter-substrate conductive material included in “0”.

(Structure of mounting terminal) In this embodiment, the IC
The mounting area 70 and the flexible wiring board connection area (wiring board connection area) 80 are generally configured as partially enlarged in FIGS. 4 and 5.

FIGS. 4 and 5 respectively show an IC mounting area 70 in the liquid crystal device 1 according to the first embodiment of the present invention.
Perspective view showing a state in which the driving IC 7 is mounted on a flexible wiring board connection area (wiring board connection area) 80
FIG. 3 is a perspective view showing a state in which a flexible wiring board (wiring board) 8 is connected to the wiring board. In the IC mounting area 70, electrical connection between the driving IC 7 and the wiring pattern 25 and electrical connection between the driving IC 7 and the wiring pattern 94 for inter-substrate conduction are performed. 4 and FIG. 5, the IC mounting area 70
1 shows only a portion for electrically connecting the driving IC 7 and the wiring pattern 25, and illustration and description of a portion for electrically connecting the driving IC 7 and the wiring pattern 94 for inter-substrate conduction are omitted. .

In FIG. 4, the IC mounting area 70 and the flexible wiring board connection area (wiring board connection area) 80 are formed by ITO formed simultaneously with the driving electrode pattern 25.
They are connected by a wiring pattern 9 made of a film or a conductive film such as an aluminum film. A large number of first terminals 91 (first terminal group) are formed by the ends (first ends) located in the IC mounting area 70 among the both ends of the wiring pattern 9.
Are formed, and a large number of first electrodes 71 formed on the active surface of the driving IC 7 are provided for these first terminals 91.
(First electrode group) are connected. This first electrode 71 is
These are electrodes for inputting signals and voltages from the flexible wiring board 8. The first electrode 71 is usually formed as a bump electrode in a projection shape.

A second transparent substrate (second substrate) 20
In the electrode pattern 25, a large number of third terminals 93 are formed by ends located in the IC mounting area 70. Here, the third terminal 93 is a driving IC
7 are formed at the same pitch as the number of the third electrodes 73 formed on the active surface of the third terminal 73, so that each of the third terminals 73 is provided one by one to each of the third terminals 93. Electrical contact in the relationship. The third electrode 73 is an electrode that outputs a drive signal for driving the liquid crystal to the electrode pattern 25. The third electrode 73 is also usually formed in a projecting shape as a bump electrode.

Further, as shown in FIG. 5, the end (second end) of the wiring pattern 9 located in the flexible wiring board connection area (wiring board connection area) 80 has a large number of second terminals 92 ( A second terminal group is formed, and a large number of second electrodes 82 formed on the flexible wiring board (wiring board) 8 are provided for these second terminals 92.
(Second electrode group) are connected.

Referring again to FIG. 4, a plurality of wiring patterns 9
Among them, the wiring patterns 9A, 9B and 9C for supplying a voltage such as the ground potential Vss or the high voltage potential Vdd from the flexible wiring board 8 to the driving IC 7 are wiring patterns 9
Are extended to the IC mounting area 70 and the flexible wiring board mounting area (wiring board connection area) 80 while being formed wider than the other wiring pattern (second wiring pattern) 9D such as a wiring pattern for transmitting a signal in the above. ing. Therefore, a plurality of first electrodes 71 of the driving IC 7 are electrically connected to each of the wiring patterns 9A, 9B, and 9C. Similarly, wiring patterns 9A, 9A
A plurality of second electrodes 82 of the flexible wiring board (wiring board) 8 are electrically connected to each of B and 9C collectively.

Here, of the first terminals 91, the terminals 91A, 91B connected to the wiring patterns 9A, 9B, 9C,
In 91C, the conductive film forming the first terminal 91 and the wiring pattern 9 is not formed partially,
A slit 96 is formed by the non-formed portion of the conductive film. Therefore, the terminal 91A is divided into four terminals 911A, 912A, 913A, 914 by the slit 96.
A (divided terminal) into four teeth 911
A, 912A, 913A, and 914A are overlapped and electrically connected to the first electrodes 71 of the driving IC 7 in a one-to-one relationship. Similarly, the first terminal 91B is connected to the two terminals 911 by the slit 96.
B, 912B (divided terminal) in a comb shape, and drive I is applied to each of the two terminals 911B, 912B.
The first electrodes 71 of C7 overlap and are electrically connected in a one-to-one relationship. The first terminal 91C is also divided into two terminals 911C and 912C (divided terminals) by the slit 96 in a comb shape, and the two terminals 911C and 9C are separated.
The first electrodes 71 of the driving IC 7 overlap and electrically connect to each of 12C in a one-to-one relationship.

On the other hand, in the present embodiment, the ends of the wiring patterns 9A, 9B and 9C on the side of the flexible wiring board connection area (wiring board connection area) 80 are connected to the wiring pattern (second wiring pattern).
Solid second terminal 92 which is considerably wider than the second terminal 92D formed at the end of 9D.
A, 92B, and 92C are formed.
A plurality of second electrodes 82 of the flexible wiring board (wiring board connection region) 80 are electrically connected to one of A, 92B, and 92C collectively. Second terminal 92D of wiring pattern (second wiring pattern) 9D
Is one of the flexible wiring boards (wiring boards) 8
The size corresponds to the electrode 82 of FIG.

(Mounting Method) FIGS. 6 (A) to 6 (C) schematically show how a driving IC is mounted on the IC mounting area of the second substrate in the liquid crystal device according to the first embodiment of the present invention. It is a process sectional view shown in FIG. The cross section shown in FIG.
FIG. 2 is a cross-section when the IC mounting area is cut at a position corresponding to line BB ′ in FIG. 1.

In the manufacturing process of the liquid crystal device 1 of the present embodiment,
In order to mount the driving IC 7 on the second transparent substrate (second substrate) 20, an anisotropic conductive film (adhesive) 6 is used as shown in FIG. This anisotropic conductive film (adhesive) 6
In the mounting method using the method, first, an anisotropic conductive film (adhesive) 6 is applied to the IC mounting region 70 or a sheet-like anisotropic conductive film (adhesive) 6 is put on the IC mounting region 70. After that, the first electrode 71 of the driving IC 7 is aligned with each of the first terminals 91 formed on the second transparent substrate (second substrate) 20, and in this state, 6 (B)
As shown in FIG. 5, the driving IC 7 is
The transparent substrate (second substrate) 20 is pressed while being heated. As a result, as shown in FIG. 6C, the resin component 61 contained in the anisotropic conductive film (adhesive) 6 is melted, and at the same time, the first terminal 91 and the first electrode 71 Thus, the conductive particles 62 contained in the anisotropic conductive film (adhesive) 6 are crushed. Therefore, the first terminal 91 and the first electrode 7
1 is electrically connected via conductive particles 62 and the resin component 6 contained in the anisotropic conductive film (adhesive) 6.
In a state where 1 is cured, the driving IC 7 is fixed to the second transparent substrate 20. At this time, the molten resin component 61
Penetrates into the slit 96 that divides the first terminal 91, and cures while being in contact with the side surface portion 910 of the first terminal 91.

The third area of the IC mounting area 70 shown in FIG.
The electrical connection between the terminal 93 and the third electrode 73 of the driving IC 7 is performed simultaneously with the process described with reference to FIG. 6, and the state is as described with reference to FIG. , The description of which is omitted. Also, a method for electrically connecting the second electrode 82 of the flexible wiring board (wiring board) 80 and the second terminal 91 of the second transparent substrate (second board) 20 shown in FIG. 6 is similar to the method described with reference to FIG.

(Effects of the present embodiment) As described above, in the present embodiment, the first terminals 91A, 91B and 91C are
911A, 912A, 913A, 9
14A, 911B, 912B, 921C, and 922C, the first terminals 91A, 91B, and 91C
Is in a state where irregularities are formed. Therefore, the first terminal 91 and the first electrode 71 are connected to the anisotropic conductive film (adhesive).
6, when electrically and mechanically connected to each other, the resin component 62 contained in the anisotropic conductive film (adhesive) 6 enters the recess (in the slit 96) and enters the second transparent substrate (in the slit 96). The IC 7 is bonded and fixed to the (second substrate) 20. Therefore, as compared with the conventional mounting structure described with reference to FIGS. 9 and 10, the terminals 911A, 912A, 913A,
The area where the resin portion 61 contacts the first terminal 91 is wide by an area corresponding to the side surface portion 910 of 14A, 911B, 912B, 921C, and 922C. Therefore, the resin component 61 and the second
Since the contact area with the transparent substrate (second substrate) 20 has been substantially expanded, the bonding strength of the IC 7 to the second transparent substrate (second substrate) 20 is improved.

[Second Embodiment] In the first embodiment, as shown in FIG. 5, a wiring pattern 9 is formed in a flexible wiring board connection area (wiring board connection area) 80.
The ends of A, 9B, and 9C are wide solid second terminals 92.
Although A, 92B and 92C are formed, as shown in FIG. 7, the second terminals 92A, 92B and 92C may be divided into a plurality of terminals.

That is, also in this embodiment, as shown in FIG. 7, of the plurality of wiring patterns 9 formed on the second transparent substrate (second substrate) 20, the ground potential Vss, the high potential Vdd, etc. Wiring pattern 9 for supplying voltage from flexible wiring board (wiring board) 8 to driving IC 7
Although A, 9B and 9C are formed to be considerably wide, slits 97 are formed at the ends (second terminals 92A, 92B and 92C) of these wiring patterns 9A, 9B and 9C by the portions where the conductive film is not formed. Are formed. Therefore, the second
Of the three terminals 92A
1A, 922A, and 923A (second divided terminals) are divided in a comb shape and are divided into three second divided terminals 921A and 922.
The second electrodes 82 of the flexible wiring board (wiring board) 8 overlap and electrically connect to each of A and 923A in a one-to-one relationship. Also, the second terminal 92B is
With the slit 97, three terminals 921B, 922B,
923B (second divided terminal) in a comb shape, and a pair of second electrodes 82 of a flexible wiring substrate (wiring substrate) 8 are provided for each of the three second divided terminals 921B, 922B, and 923B. Electrical connection is made by overlapping in one relationship. Further, the second terminal 92C is also divided into two terminals 921C and 922C (second divided terminal) by the slit 97.
Into two comb-shaped divided terminals 921C,
The second electrodes 82 of the flexible wiring board (wiring board) 8 overlap and electrically connect to each of the 922C in a one-to-one relationship. Other configurations are described in Embodiment 1.
Therefore, the description is omitted.

When the flexible wiring board (wiring board) 8 is connected to the flexible wiring board connecting area (wiring board connecting area) 80 of the second substrate 20 thus configured, the anisotropic conductive film (adhesive) 6 When a second adhesive of the same quality as that of the first embodiment is used, the second terminals 92A, 92B, and 92C are separated by the slit 97 into a plurality of second divided terminals 921A, 9A.
22A, 923A, 921B, 922B, 923B, 9
Since it is divided into 21C and 922C, the resin component 62 contained in the anisotropic conductive film (second adhesive) 6 enters the concave portion (in the slit 97) and enters the second transparent substrate. The flexible wiring board (wiring board) 8 is bonded and fixed to the (second board) 20. For this reason, the second terminals 921A, 922A, 923 are different from the first embodiment and the conventional example.
A, 921B, 922B, 921B, 921C, 922
The area where the resin component 61 is in contact with the second terminal 92 is large by an area corresponding to the side surface of C. Therefore, since the bonding area is substantially expanded, the bonding strength of the flexible wiring substrate (wiring substrate) 8 to the second transparent substrate (second substrate) 20 is improved.

[Other Embodiments] Embodiments 1 and 2
Then, the driving IC 7 is mounted on the second transparent substrate (second substrate) 20 by COG (Chip on Glass).
Although the present invention is applied to a configuration in which the driving IC 7 is mounted on a flexible wiring board by COF (Chip on F
PC (flexible printed circuit)
it)) or TCP implementation (Tape Carrie
r Package / TAB; Tape Automa
The present invention may be applied to a configuration that performs ted bonding.

A first transparent substrate (first substrate) 10
Alternatively, the drive IC 7 may be configured to apply a drive signal to the electrode pattern 15 by COG mounting, COF mounting or TCP mounting, and in that case, the mounting of the first and second embodiments of the present invention may be performed. It is preferred to use a structure.

Further, in the first and second embodiments, the anisotropic conductive film is made of a thermosetting material, but may be of an ultraviolet curable type.

Further, in the first and second embodiments, an example is shown in which the present invention is applied to a simple matrix type liquid crystal device. However, the present invention can also be applied to an active matrix type liquid crystal device. Further, the present invention is not limited to such a liquid crystal device, and an electro-optical device using an organic electroluminescence element, a PDP (Plazma Display Panel).
nel / plasma display panel) or FED (Field
Emission Display / Field emission display device)
And the like.

[Specific Example of Electronic Apparatus] FIG.
(B) and (C) are external views of electronic equipment using the liquid crystal device 1 to which the present invention is applied.

FIG. 8A is an external view of a mobile phone. In this figure, reference numeral 1000 denotes a mobile phone main body,
Reference numeral 1001 denotes an image display device using the liquid crystal device 1 to which the invention is applied.

FIG. 8B is an external view of a wristwatch-type electronic device. In this figure, reference numeral 1100 denotes a watch body,
Reference numeral 1101 denotes an image display device using the liquid crystal device 1 to which the invention is applied.

FIG. 8C is an external view of a portable information processing apparatus such as a word processor or a personal computer. In this figure, reference numeral 1200 denotes an information processing device, 1202 denotes an input unit such as a keyboard, 1206 denotes an image display device using the liquid crystal device 1 to which the present invention is applied, and 1204 denotes an information processing device main body.

[0064]

As described above, according to the present invention, the first
Is divided into a plurality of terminals by slits, and when the first terminal and the first electrode are electrically and mechanically connected by the anisotropic conductive film, the anisotropic conductive film (adhesive The resin contained in () is in the recess (in the slit)
The IC is bonded and fixed to the substrate in a state where the IC has been inserted. For this reason, compared with the conventional mounting structure, the area where the resin contacts the first terminal is larger by the area corresponding to the side surface of the first terminal. Accordingly, since the bonding area is substantially expanded, the bonding strength of the IC to the substrate is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an appearance of a liquid crystal device.

FIG. 2 is a perspective view schematically showing a state in which the liquid crystal device shown in FIG. 1 is disassembled.

FIG. 3 is a cross-sectional view of the liquid crystal device taken along line AA ′ in FIG.

FIG. 4 is a perspective view showing a state where a driving IC is mounted in an IC mounting area in the liquid crystal device according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing a state in which a flexible wiring board (wiring board) is connected to a flexible wiring board connection area (wiring board connection area) of the second substrate in the liquid crystal device according to Embodiment 1 of the present invention; is there.

FIG. 6 is a process cross-sectional view schematically showing how a driving IC is mounted in an IC mounting area of the second substrate in the liquid crystal device according to Embodiment 1 of the present invention.

FIG. 7 is a perspective view showing a state in which a flexible wiring board (wiring board) is connected to a flexible wiring board connection area (wiring board connection area) of a second substrate in the liquid crystal device according to Embodiment 2 of the present invention. is there.

FIGS. 8A, 8B, and 8C are explanatory views of an electronic apparatus equipped with a liquid crystal device to which the present invention is applied.

FIG. 9 is a perspective view showing a state in which a driving IC is mounted in an IC mounting area of a second substrate in a conventional liquid crystal device.

FIG. 10 shows an IC of a second substrate in a conventional liquid crystal device.
FIG. 9 is a process cross-sectional view schematically illustrating a state where the driving IC is mounted in the mounting area.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal device (electro-optical device) 6 ... Anisotropic conductive film (adhesive) 7 ... Driving IC 8 ... Flexible wiring board 9, 9A, 9B, 9C ... 2nd 9D: second wiring pattern formed on the second substrate 10: first transparent substrate (first substrate) 15, 25: stripe shape 20 ... Second transparent substrate (second substrate) 30 ... Seal material 70 ... IC mounting area (semiconductor device mounting area) 80 ... Flexible wiring board connection area (wiring board connection) (Area) 61: Resin content contained in anisotropic conductive film (adhesive) 62 ... Conductive particles contained in anisotropic conductive film (adhesive) 71: To drive IC Formed first electrode 73... Formed on driving IC The electrodes 82 of the second electrode 91, 91A, 91B, 91C, 91D formed on the flexible wiring substrate (wiring substrate) are formed on the second transparent substrate (second substrate). First terminals 911A, 912A, 913A, 914A, 911B,
912B, 911C, 912C: terminals obtained by dividing the first terminal (divided terminals) 92, 92A, 92B, 92C, 92D: second terminals 921A, 922A formed on the second transparent substrate 923A, 921B, 922B,
923B, 921C, 922C: Terminal obtained by dividing the second terminal (second divided terminal) 96, 97: Slit

Claims (19)

[Claims] In a semiconductor device mounting structure in which a semiconductor device is mounted in a semiconductor device mounting region of a substrate, the semiconductor device includes a first terminal group in the semiconductor device mounting region of the substrate. A first electrode group electrically connected to the one terminal group by an anisotropic conductive film; and the first terminal group is formed without a conductive film forming the first terminal group. A mounting structure of a semiconductor device, characterized by including at least a divided terminal group divided into a plurality of parts by slits formed of portions. 2. The device according to claim 1, wherein predetermined electrodes in the first electrode group are electrically connected to the respective terminals constituting the divided terminal group in a one-to-one manner. A mounting structure of a semiconductor device, characterized in that: 3. The substrate according to claim 1, wherein a flexible wiring board connection region including a second terminal group is formed on the substrate, and the second terminal group includes:
A second electrode group of the flexible wiring board is electrically connected by an anisotropic conductive film, and the first terminal group is formed by a slit formed of a non-formed portion of a conductive film forming the second terminal group. A mounting structure of a semiconductor device, comprising at least a second divided terminal group divided into a plurality. 4. The terminal according to claim 3, wherein predetermined electrodes in the second electrode group are electrically connected to the respective terminals constituting the second divided terminal group in a one-to-one manner. A mounting structure of a semiconductor device characterized by being performed. 5. An electro-optical device comprising the semiconductor device mounting structure according to claim 1.
An electro-optical device, wherein a plurality of electrode patterns for supplying a drive signal to each pixel from the semiconductor device mounted in the semiconductor device mounting area are extended on the substrate. 6. An electronic apparatus comprising the electro-optical device defined in claim 5 as a display unit. 7. An electro-optical device in which a semiconductor device is mounted on a substrate, wherein a wiring pattern having an end is provided on the substrate.
The end portion is divided into a plurality of portions, the semiconductor device includes an electrode, the electrode is connected to the end portion of the wiring pattern, and an adhesive is provided between the end portion of the wiring pattern and the electrode. An electro-optical device, wherein: 8. The electro-optical device according to claim 7, wherein the substrate includes a flexible wiring board. 9. The electro-optical device according to claim 7, wherein:
An electro-optical device, which is an electro-optical device selected from the group consisting of a liquid crystal device, an electroluminescent device, a PDP, and an FED. 10. A wiring board according to claim 7, further comprising a wiring substrate provided with a second electrode, wherein said wiring pattern has a second end, and wherein said second end is divided into a plurality of portions. The second electrode is connected to the second end of the wiring pattern, and a second adhesive is disposed between the second end of the wiring pattern and the second electrode. An electro-optical device, comprising: 11. The electro-optical device according to claim 7, wherein the adhesive includes an anisotropic conductive film. 12. An electronic apparatus comprising the electro-optical device according to claim 7 as a display unit. 13. A liquid crystal device comprising a pair of substrates opposed to each other, wherein one of the substrates has an overhang portion protruding from an edge of the other substrate, and one of the substrates has an end portion. Wherein the end portion is divided into a plurality of portions, a driving IC having electrodes is mounted on one of the substrates, and the electrode is connected to the end portion of the wiring pattern; A liquid crystal device, wherein an adhesive is disposed between the end of the wiring pattern and the electrode. 14. A circuit according to claim 13, further comprising a flexible wiring board provided with a second electrode, wherein said wiring pattern has a second end, and wherein said second end is divided into a plurality of portions. And the second electrode is the second electrode of the wiring pattern.
A liquid crystal device, wherein an adhesive is disposed between the second end of the wiring pattern and the second electrode. 15. The driving IC according to claim 13, further comprising a second wiring pattern on one of the substrates, wherein the wiring pattern sets a ground potential Vss or a high voltage potential Vdd.
Wherein the width of the wiring pattern is wider than the width of the second wiring pattern. 16. A liquid crystal device according to claim 13, wherein said adhesive includes an anisotropic conductive film. 17. An electronic apparatus comprising a liquid crystal device defined in any one of claims 13 to 16 as a display unit. 18. A mounting structure of a semiconductor device in which a semiconductor device is mounted on a semiconductor device mounting area of a substrate, wherein a wiring pattern is formed on the substrate, wherein the wiring pattern has both ends, A terminal is formed by the end located in the semiconductor device mounting region among the both ends of the wiring pattern, and the semiconductor device is electrically connected to the terminal by an anisotropic conductive film. The terminal, the terminal includes a divided terminal group divided into a plurality of by a slit formed of a non-formed portion of the conductive film constituting the terminal,
A semiconductor device mounting structure, wherein predetermined electrodes in the electrode group are electrically connected to the respective terminals constituting the divided terminal group in a state of one-to-one overlap. 19. A first substrate and a second substrate are bonded and fixed with a sealant interposed therebetween, and the second substrate has a projecting portion projecting from an edge of the first substrate;
In a liquid crystal device in which a semiconductor device is mounted in a semiconductor device mounting area of the overhang portion, a wiring pattern is formed on the second substrate, wherein the wiring pattern has both ends, A terminal is formed by the end located in the semiconductor device mounting region among the both ends of the semiconductor device, wherein the semiconductor device is an electrode electrically connected to the terminal by an anisotropic conductive film. Wherein the terminal includes a divided terminal group divided into a plurality by a slit formed of a non-formed portion of a conductive film constituting the terminal,
A liquid crystal device, wherein predetermined electrodes in the electrode group are electrically connected to respective terminals constituting the divided terminal group in a state of one-to-one overlap.