JP2001319988A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device that has a simple configuration applying the structure of a package with a conventional chip size and a small packaging area, and can be vertically packaged for the semiconductor device where a package is vertically arranged to a packaging substrate for reducing the packaging area. SOLUTION: A semiconductor chip 6 is mounted onto a first surface 4a where the wiring pattern of a flexible circuit substrate 4 is formed. A solder ball 8 is formed on a second surface 4b at a side opposite to the first surface. The semiconductor chip 6 is resin-sealed to form a sealing part 10. The side of the surface 4a where the soldering ball 8 is formed is resin-sealed to form a sealing part 12. The circuit substrate 4 is bent for bonding the sealing part 12 to the sealing part 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a mounting structure of the semiconductor device, and more particularly to a semiconductor device and a mounting structure of the semiconductor device in which a mounting area is reduced by arranging a package perpendicularly to a mounting substrate.

[0002]

2. Description of the Related Art A semiconductor device in which a package is arranged perpendicular to a mounting surface is generally called a vertical mounting semiconductor device. As a conventional vertical mounting semiconductor device, a plastic package using a metal lead frame,
A so-called SVP (Surface Vertical Package) has been commercialized as a memory application.

[0003] SVP can be manufactured by the same assembling process as TSOP (Thin Small Outline Package), which is the same plastic package. Leads for connection are provided on one side of the package, and the tip of the lead is fixed to the mounting surface. In this case, the package is arranged so as to be perpendicular to the mounting surface. In addition, a dummy lead having a configuration similar to that of an actual lead is provided to prevent tipping when mounting on a motherboard.

[0004] Japanese Patent Application Laid-Open No. 10-150065 discloses a chip size package that can be vertically arranged. In this chip size package, a semiconductor chip is mounted on a flexible printed board, and a wiring pattern is formed on a surface opposite to a semiconductor chip mounting surface. In the semiconductor chip mounting area of the flexible printed board, through holes are formed at positions corresponding to the electrodes of the semiconductor chip, and the pads formed on the surface on which the wiring pattern is provided and the electrodes of the semiconductor chip are connected to the through holes. Through a bonding wire.

[0005] In the above configuration, mounting solder balls are formed collectively on one side of the flexible printed circuit board.
This portion is bent toward the semiconductor chip, so that the mounting surface of the semiconductor chip is perpendicular to the surface on which the solder balls for mounting are formed. That is,
The semiconductor device can be fixed vertically to the mounting surface. Therefore, in the semiconductor device disclosed in this patent publication, in addition to the sealing of the semiconductor chip, the surface opposite to the mounting surface of the semiconductor chip, that is, the surface on which the circuit pattern is formed is also resin-sealed. The above-mentioned solder balls are formed on the portion of the flexible printed board extending from the resin sealing portion, and are bent. Therefore, the flexible printed circuit board is bent at a right angle with its circuit forming surface outside.

[0006]

In the above-described SVP, in order to ensure the reliability of joining of the lead to the motherboard, a portion parallel to the mounting surface is provided on the lead by bending the tip of the lead or the like. It is necessary to secure the same lead bonding area as TSOP. For this reason, the manufacturing process of the semiconductor device becomes complicated, and the manufacturing cost is increased.

[0007] Further, when mounting, it is necessary to provide supporting leads in order to prevent overturning, and there is a problem that the size of the semiconductor device becomes large. Furthermore, since external connection leads can be provided only on one side of the package, there is a problem that a semiconductor device having a large number of terminals has a larger mounting area than a TSOP. On the other hand, the semiconductor device disclosed in Japanese Patent Application Laid-Open No. H10-150065 requires resin sealing not only on the chip mounting surface side but also on the opposite side, resulting in a complicated structure and increased manufacturing cost. There is a problem. Also, since the portion of the flexible printed circuit board on which the mounting solder balls are formed is bent and is in contact with the sealing portion of the semiconductor chip and the heat sink for heat radiation provided on the sealing portion, the semiconductor chip is mounted on the mounting portion. Is easily transmitted, and there is a problem that mounting reliability is reduced due to thermal expansion.

In the semiconductor device disclosed in Japanese Patent Application Laid-Open No. H10-150065, wire bonding is performed in the mounting region of the semiconductor chip. There is also a problem that an area cannot be secured.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has a simple structure in which the structure of a conventional chip size package is applied, and has a small mounting area and a vertically mountable semiconductor device. It is an object to provide a mounting structure of a semiconductor device.

[0010]

Means for Solving the Problems In order to solve the above problems, the present invention is characterized by taking the following means.

According to a first aspect of the present invention, there is provided a semiconductor chip comprising:
A flexible circuit board having a first surface on which the semiconductor chip is mounted and a second surface opposite to the first surface, and having a wiring pattern formed on the second surface; A semiconductor device having an external connection protruding electrode formed on the second surface, wherein a portion where the external connection protruding electrode is formed is:
The semiconductor device is characterized by being bent at a predetermined angle in the direction of the semiconductor chip so that the external connection protruding electrode is on the outside.

According to a second aspect of the present invention, there is provided the semiconductor device according to the first aspect, wherein the first semiconductor chip is sealed.
And a second portion for sealing the wiring pattern formed on the first surface side of the portion where the external connection projection electrode is formed.
Wherein the portion on which the external connection projecting electrode is formed is bent, and the second sealing portion is fixed to the first sealing portion with an adhesive. Is what you do.

According to a third aspect of the present invention, in the semiconductor device according to the first or second aspect, an electrode for external connection is formed on a second surface of the circuit board on a side opposite to the first sealing portion. It is characterized by having been done.

Each of the above-mentioned means operates as follows.

According to the first aspect of the present invention, electrodes necessary for mounting on a mounting board such as a motherboard are collectively formed on a part of a circuit board, and the part of the circuit board is bent, for example, vertically. Then, the mounting area occupied by the semiconductor device on the mounting board is only the bent portion.
Therefore, the mounting area of each semiconductor device is reduced, and the mounting density of the mounting board can be increased.

The semiconductor chip and the external connection projecting electrode are electrically connected by a circuit pattern formed on the first surface of the circuit board. Therefore, the circuit pattern extends from the semiconductor chip side to the side where the protruding electrodes are formed, passing through the bent portion of the circuit board. In such a structure, the bending direction of the circuit board of the semiconductor device according to the present invention is such that the first surface on which the circuit pattern is formed is bent inward, which is a compression direction for the circuit pattern. Therefore, as compared with a configuration in which the circuit board is bent in a direction in which a tensile force is applied to the circuit pattern, the possibility of disconnection or damage of the circuit pattern due to the bending of the circuit board can be reduced.

According to the second aspect of the present invention, the circuit pattern formed on the portion of the circuit board where the external connection projecting electrode is provided is sealed and protected by the second sealing portion. Further, by bonding the second sealing portion to the first sealing portion in which the semiconductor chip is sealed, the portion of the circuit board provided with the external connection protruding electrodes can be easily fixed at a predetermined angle. can do. Further, since the circuit pattern is sealed by the second sealing portion, the effect of heat from the semiconductor chip during operation can be reduced.

According to the third aspect of the present invention, since the external connection electrode is formed on the second surface of the circuit board on the side opposite to the first sealing portion, another semiconductor is utilized by using this electrode. A configuration in which the devices are directly connected can be adopted. Therefore, the semiconductor device according to the present invention and another semiconductor device can be connected without the interposition of a mounting substrate, and high-speed operation can be performed. Further, for example, by using the semiconductor device according to the present invention as a memory and directly connecting a microprocessor to the memory, a system LSI can be easily constructed.

[0019]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a diagram of a semiconductor device according to a first embodiment of the present invention. FIG. 1A is a front view of the semiconductor device, and FIG. 1B is a side view thereof. First of the present invention
The semiconductor device according to the embodiment is a vertically mounted semiconductor device, and the semiconductor chip is mounted on a mounting substrate 2 such as a motherboard.
Is configured to be perpendicular to.

The semiconductor device according to the first embodiment of the present invention includes a circuit board 4 having flexibility, a semiconductor chip 6 mounted on the circuit board 4, and a portion of the circuit board on which the semiconductor chip 6 is mounted. It is composed of a plurality of solder balls (protruding electrodes) 8 provided in a portion bent perpendicularly to the other.

A circuit pattern (not shown) is formed on the surface (first surface) 4a of the circuit board 4 on which the semiconductor chip 6 is provided, and the semiconductor chip 6 and the solder balls 8 are electrically connected. are doing. The semiconductor chip 6 includes a sealing portion 10 (first
A sealing portion 12 (second sealing portion) is also provided on the opposite side to the portion of the circuit board 4 on which the solder balls 8 are provided, which is resin-sealed by the sealing portion 12. The sealing portion 12 functions to seal the circuit pattern and reinforce the bent portion of the circuit board 4. That is, by forming the sealing portion 12 on the circuit board 4, the bent portion of the circuit board 4 can be maintained flat.

The sealing portion 10 and the sealing portion 12 are configured so as to abut each other when the circuit board 4 is bent. That is, when the sealing portion 10 and the sealing portion 12 come into contact with each other, the bending angle of the circuit board 4 becomes a predetermined angle. In the case of the present embodiment, the inclination of each side surface of the sealing portion 10 and the sealing portion 12 is 45 degrees with respect to the circuit board 4, whereby the sealing portion 10 and the sealing portion 12 When the contact is made, the circuit board 4 is bent at 90 degrees. That is, the portion of the circuit board 4 where the semiconductor chip 6 is provided and the portion of the circuit board 4 where the solder balls 8 are provided are perpendicular to each other.

The sealing portion 10 and the sealing portion 12 are fixed with an adhesive or the like in contact with each other, and the circuit board 4 is maintained in a bent state. It is preferable to use an epoxy-based or polyimide-based adhesive as the adhesive.

The circuit board 4 corresponds to an interposer of a chip size package, and is preferably formed of a polyimide film having flexibility in consideration of bending at 90 degrees.

As described above, the circuit pattern is formed on the surface 4a of the circuit board 4 on which the semiconductor chip 4 is mounted, and the circuit pattern extends to the side opposite to the portion where the solder ball 8 is formed. 8 is connected to a land. Therefore, the circuit pattern extends through the bent portion of the circuit board 4 and is folded together with the circuit board 4 when the circuit board 4 is bent.

If the circuit pattern is formed on the surface 4a of the circuit board 4,
When the circuit board 4 is bent, a tensile force acts on the circuit pattern at the bent portion. When the circuit board 4 is sharply bent at 90 degrees as in the present embodiment, a large tensile force acts on the circuit pattern, and the circuit pattern is disconnected or damaged.

However, in the present embodiment, the circuit pattern is formed on the surface 4a of the circuit board, and a compressive force acts on the circuit pattern when the circuit board 4 is bent. Therefore, even if the circuit board 4 is bent, the circuit pattern does not break.

If the circuit pattern extends perpendicularly to the bending line of the circuit board, the influence of the stress at the bent portion is large. Therefore, the circuit pattern acts on the circuit pattern by forming it into a waveform or zigzag shape. It can absorb or disperse stress.

In the present embodiment, the solder balls 8
The circuit board 4 is formed so as to be aligned in three rows along one side of the surface 4b of the circuit board 4, that is, the side opposite to the surface 6a on which the semiconductor chip 6 is mounted. The number of rows of the solder balls 8 is determined by the number of the solder balls 8 to be formed, and may be an arbitrary number.

FIG. 2 is a diagram showing a configuration in which the solder balls 8 are efficiently arranged. 2A is a front view of a part of the semiconductor device, FIG. 2B is a bottom view of the semiconductor device,
FIG. 2C is a side view of a part of the semiconductor device.

In the semiconductor device shown in FIG.
Are arranged in a zigzag pattern in three rows, thereby reducing the area required for mounting the semiconductor device. That is, by shifting the position of the solder ball 8 in the middle row of the three rows of solder balls 8 in the longitudinal direction of the row, the distance between the rows of solder balls 8 can be reduced while maintaining the distance from the solder ball 8 in the adjacent row. ing. Thereby, the area of the portion of the semiconductor device where the solder balls 8 are provided is reduced by the hatched portions in FIGS. 2B and 2C as compared with the case where the solder balls 8 are simply arranged in three rows. Can be. Therefore, a semiconductor device having a smaller mounting area can be achieved, and the mounting density on a mounting substrate can be increased. Next, a method for manufacturing the semiconductor device according to the present embodiment will be described with reference to FIG.

In the semiconductor device according to the present embodiment, a plurality of semiconductor chips are mounted on a polyimide-based film, and a plurality of semiconductor chips are manufactured at the same time. Finally, individual semiconductor devices are singulated.

First, as shown in FIG. 3A, a semiconductor chip 6 is mounted on a polyimide film as a circuit board 4. A circuit pattern (not shown) is formed on the semiconductor chip mounting surface 4a of the circuit board 4 in advance. The circuit pattern includes a pad connected to an electrode of the semiconductor chip 6. In the present embodiment, the pad is arranged around the semiconductor chip 6. The circuit pattern extends to a portion where the solder ball 8 is formed, and is connected to lands 14 corresponding to each of the solder balls 8.
A through hole 4c is formed in the circuit board 4 below the land 14, and a solder ball 8 is provided through the through hole 4c.

When the semiconductor chip 6 is mounted, FIG.
As shown in (b), the electrodes of the semiconductor chip 6 and the pads of the circuit board 4 are bonded by bonding wires 16. Next, as shown in FIG. 3C, the semiconductor chip 6 is sealed with a resin to form a sealing portion 10, and the circuit pattern of the portion where the solder balls 8 are provided is sealed with a resin. The part 12 is formed. Sealing part 10 and sealing part 12
Are formed to be inclined at approximately 45 degrees.

When the resin sealing is completed, a solder ball 8 is next formed as shown in FIG. The solder balls 8 are formed so as to be connected to the lands 14 via the through holes 4c. Therefore, each of the solder balls 8 is connected to the semiconductor chip 6 via the circuit pattern and the bonding wire 16.
Are electrically connected to the corresponding electrodes.

When the formation of the solder balls 8 is completed, FIG.
As shown in (e), the polyimide film is separated into individual semiconductor chips 6. Then, FIG.
As shown in (2), the portion of the circuit board 4 where the solder balls 8 are provided is bent perpendicularly to the portion where the semiconductor chip 6 is provided. That is, the sealing portion 12 of the circuit board 4
Is bent perpendicularly to the portion where the sealing portion 10 is formed.

At the time of this bending, the sealing portion 12 is simply bent in the direction of the sealing portion 10 until the side surface of the sealing portion 12 comes into contact with the side surface of the sealing portion 10. 10 can be arranged perpendicular to it. That is, the side surface inclined at 45 degrees of the sealing portion 12 is
The sealing portion 12 is disposed at 90 degrees with respect to the sealing portion 10 by contacting the side surface inclined at 45 degrees.

Therefore, the angle of the sealing portion 12 with respect to the sealing portion 10 is automatically set by the inclination angle of the side surface.
In the present embodiment, the sealing portion 12 is
Although it is configured to be disposed at an angle of 0 degrees (vertical), the angle is not limited to this angle, and can be set to an arbitrary angle within a range where the circuit board can be bent.

The semiconductor device according to the above-described embodiment is mounted on the mounting substrate 2 by bonding the solder balls 8 to the corresponding electrodes of the mounting substrate 2 such as a motherboard. Therefore, the semiconductor device according to the present embodiment is
The sealing portion 10 in which the semiconductor chip 6 is sealed is vertically arranged with respect to the mounting substrate 2 in a state where the semiconductor chip 6 is mounted.

FIG. 4 shows a conventional ball grid array (B
FIG. 3 is a diagram showing a state in which a GA) type semiconductor device is mounted on a mounting board. FIG. 4A is a plan view of a conventional BGA type semiconductor device, and FIG. 4B is a side view thereof. FIG. 5 is a diagram showing a state in which a plurality of semiconductor devices according to the present embodiment are mounted in the same area as the mounting area of the semiconductor device in FIG. FIG. 5A is a plan view of the semiconductor device according to the present embodiment, FIG. 5B is a front view thereof, and FIG. 5C is a side view thereof.

As shown in FIG. 4, in a conventional BGA type semiconductor device, the area of the entire semiconductor device is equal to the area required for mounting. On the other hand, as shown in FIG. 5, in the semiconductor device according to the present embodiment, the area where the solder ball 8 used for mounting is provided is the area of the part where the semiconductor chip 6 is sealed (the area of the sealing part 10). ) Is about 1/6. That is, the semiconductor device according to the present embodiment
Six semiconductor devices can be mounted with respect to the mounting area of the conventional semiconductor device, and the mounting density becomes six times.

The semiconductor device according to the present embodiment corresponds to FIG.
As shown in (a), a single unit may be mounted, or a plurality of units may be mounted adjacent to each other. When the mounting height cannot be secured, as shown in FIG. 6B, the height can be reduced by setting the bending angle to 60 degrees instead of 90 degrees, for example.

As shown in FIG. 6C, a vertical portion is provided on the mounting substrate, the semiconductor device according to the present embodiment is mounted on the vertical portion, and the conventional semiconductor device is mounted on the horizontal portion. Thus, a semiconductor device mounting structure with improved volumetric efficiency can be realized. In addition, as shown in FIG. 6D, a mounting structure with improved volumetric efficiency is realized by providing a vertical portion facing the mounting substrate and arranging the semiconductor device according to the present embodiment so as to face the mounting substrate. be able to.

FIG. 7 is a side view showing an example of a mounting structure in which a plurality of semiconductor devices according to the present embodiment are combined and integrated. In FIG. 7, eight semiconductor devices according to the present embodiment are arranged adjacent to each other, and each of the semiconductor devices is fixed by a holder 20. That is, the holder 20 is formed with eight slits into which the sealing portion 10 of each semiconductor device can be inserted, and the sealing portion 10 of each semiconductor device is inserted into the corresponding slit. After the sealing portion 10 of each semiconductor device is inserted into the slit of the holder 20, it may be fixed with an adhesive or the like. As a result, the eight semiconductor devices are integrally held by the holder 20, can be handled as if they were one semiconductor device, and can be mounted at one time.

By forming the holder 20 from a material having a high thermal conductivity, the holder 20 can be used as a heat radiating member of a semiconductor device. The number of semiconductor devices fixed to the holder 20 is not limited to eight, and may be any number. Further, when the holder 20 is provided, the weight of the holder is added to the solder ball 8 in addition to the weight of the semiconductor device. Therefore, it is preferable that the solder ball 8 has high compressive strength. For example, a eutectic solder ball is generally used as the solder ball 8. For example, by using a ball electrode in which a copper core is plated with solder, the compressive strength of the solder ball 8 can be increased, and Even if the weight is added, the solder ball does not collapse during mounting.

Next, an example of a mounting structure of the semiconductor device according to the present embodiment will be described.

FIG. 8 shows the semiconductor device according to the present embodiment and B
FIG. 8A is a diagram showing an example in which a GA type semiconductor device is combined to form an integrated structure. FIG. 8A is a front view, and FIG.
Shows a side view.

In the mounting structure of the semiconductor device shown in FIG.
In the semiconductor device according to the present embodiment, a land is provided on the circuit board below the semiconductor chip, connected to the electrode of the semiconductor chip, and a through hole is provided in the circuit board below the land. Then, the BGA type semiconductor device 22 is connected through the through hole.

For example, the semiconductor device according to the present embodiment is used as a memory device, and a BGA type semiconductor device 2 to be connected.
By using the microprocessor 2 as a microprocessor, a system LSI can be easily constructed. According to such a mounting structure, a mounting board does not intervene between the microprocessor and the memory device, and a signal path between these devices can be shortened. A fast system LSI can be constructed.

The semiconductor device according to the present embodiment and B
The protruding electrodes used for connection with the GA type semiconductor device 22 may be provided on the semiconductor device according to the present embodiment, or may be provided on the BGA type semiconductor device.

FIG. 9 is a side view showing a mounting structure in which two semiconductor devices according to the present embodiment are combined and joined. For example, when the semiconductor device according to the present embodiment is a memory device, two of them are combined, a common terminal is directly connected between the memory devices, and a terminal for exchanging signals from the outside is a terminal for external connection. If this is the case, a memory device with twice the memory capacity can be easily constructed.

The present applicant discloses the following invention in addition to the above-mentioned invention.

(Supplementary Note 1) A semiconductor chip, a first surface on which the semiconductor chip is mounted, and a second surface opposite to the first surface.
A flexible circuit board having a wiring pattern formed on the second surface, and an external connection projecting electrode formed on the second surface. A semiconductor device, wherein a portion on which a protruding electrode is formed is bent at a predetermined angle in the direction of the semiconductor chip so that the external connection protruding electrode is on the outside. (1) (Supplementary Note 2) The semiconductor device according to Supplementary Note 1, wherein a first sealing portion in which the semiconductor chip is sealed and a first surface side of a portion where the external connection projecting electrode is formed. And a second sealing portion for sealing the wiring pattern formed on the substrate, wherein a portion where the external connection protruding electrode is formed is bent, and the second sealing portion is bonded to the first sealing portion with an adhesive. A semiconductor device, wherein the semiconductor device is fixed to a sealing portion. (2) (Supplementary Note 3) The semiconductor device according to Supplementary Note 1 or 2, wherein
An external connection electrode is formed on a second surface of the circuit board opposite to the first sealing portion. (3) (Supplementary note 4) The semiconductor device according to supplementary note 3, wherein another semiconductor device is connected to the external connection electrode.

(Supplementary Note 5) A plurality of the semiconductor devices described in Supplementary Note 2 are aligned and mounted on a substrate, and the first sealing portion of each of the semiconductor devices is inserted into a receiving portion provided in a holding member. The mounting structure of the semiconductor device, wherein the plurality of semiconductor devices are integrally held.

(Supplementary Note 6) A semiconductor device, characterized in that another semiconductor device is connected to the circuit board of the first sealing portion of the semiconductor device according to supplementary note 2.

(Supplementary Note 7) The semiconductor device according to supplementary note 6, wherein the other semiconductor device is a semiconductor device of a different type from the semiconductor device described in supplementary note 2, and the semiconductor device described in supplementary note 2 and the other semiconductor device are different from each other. A semiconductor device wherein a system LSI is constructed in cooperation with the device.

(Supplementary Note 8) A method of manufacturing a semiconductor device in which a semiconductor chip is arranged perpendicular to a mounting surface, wherein the semiconductor chip is mounted on a circuit formation surface of a circuit board, and the semiconductor chip and the semiconductor chip are mounted on the circuit board. Connecting the lands to the lands by wire bonding, sealing the semiconductor chip to form a first sealing portion, and forming a second sealing portion adjacent to the first sealing portion; Manufacturing a semiconductor device, comprising: forming a protruding electrode on a circuit board side of a second sealing portion, bending the second sealing portion, and joining the bent portion to the first sealing portion. Method.

[0059]

According to the present invention as described above, the following various effects can be realized. According to the first aspect of the present invention, if electrodes necessary for mounting on a mounting board such as a motherboard are collectively formed on a part of a circuit board, and the part of the circuit board is vertically bent, for example, The mounting area occupied by the semiconductor device on the mounting board is only the bent portion. Therefore, the mounting area of each semiconductor device is reduced, and the mounting density of the mounting board can be increased.

The semiconductor chip and the external connection projection electrode are electrically connected by a circuit pattern formed on the first surface of the circuit board. Therefore, the circuit pattern extends from the semiconductor chip side to the side where the protruding electrodes are formed, passing through the bent portion of the circuit board. In such a structure, the bending direction of the circuit board of the semiconductor device according to the present invention is such that the first surface on which the circuit pattern is formed is bent inward, which is a compression direction for the circuit pattern. Therefore, as compared with a configuration in which the circuit board is bent in a direction in which a tensile force is applied to the circuit pattern, the possibility of disconnection or damage of the circuit pattern due to the bending of the circuit board can be reduced.

According to the second aspect of the present invention, the circuit pattern formed on the portion of the circuit board provided with the external connection protruding electrodes is sealed and protected by the second sealing portion. Further, by bonding the second sealing portion to the first sealing portion in which the semiconductor chip is sealed, the portion of the circuit board provided with the external connection protruding electrodes can be easily fixed at a predetermined angle. can do. Further, since the circuit pattern is sealed by the second sealing portion, the effect of heat from the semiconductor chip during operation can be reduced.

According to the third aspect of the present invention, since the external connection electrode is formed on the second surface of the circuit board on the side opposite to the first sealing portion, another semiconductor is utilized by utilizing this electrode. A configuration in which the devices are directly connected can be adopted. Therefore, the semiconductor device according to the present invention and another semiconductor device can be connected without the interposition of a mounting substrate, and high-speed operation can be performed. Further, for example, by using the semiconductor device according to the present invention as a memory and directly connecting a microprocessor to the memory, a system LSI can be easily constructed.

Further, according to the invention described in Appendix 4, the semiconductor devices can be connected to each other without the interposition of the mounting board, and the signal path can be shortened to enable high-speed operation. Further, by connecting different types of semiconductor devices, the system LS can be easily configured.
I can be constructed.

According to the invention described in Supplementary Note 5, a plurality of semiconductor devices can be handled collectively and integrally, and a plurality of semiconductor devices can be collectively mounted at once.

According to the invention described in Supplementary Note 6, the semiconductor devices can be connected to each other without the intervention of the mounting substrate, and the signal path can be shortened to enable high-speed operation.

According to the invention described in Supplementary Note 7, a system LSI can be easily constructed by connecting different kinds of semiconductor devices.

According to the eighth aspect of the invention, the same effect as the first aspect of the invention can be achieved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a modification of the semiconductor device according to the first embodiment of the present invention.

FIG. 3 is a view illustrating a manufacturing process of the semiconductor device according to the first embodiment of the present invention;

FIG. 4 is a diagram illustrating a mounting structure of a BGA type semiconductor device.

FIG. 5 is a diagram for explaining a mounting structure of the semiconductor device according to the first embodiment of the present invention.

FIG. 6 is a diagram for explaining a mounting structure of the semiconductor device according to the first embodiment of the present invention.

FIG. 7 is a diagram for explaining a mounting structure in which a plurality of semiconductor devices according to the first embodiment of the present invention are mounted together;

FIG. 8 is a diagram illustrating a configuration in which the semiconductor device according to the first embodiment of the present invention and another semiconductor device are combined;

FIG. 9 is a diagram illustrating a configuration in which two semiconductor devices according to the first embodiment of the present invention are combined.

[Explanation of symbols]

 Reference Signs List 2 mounting board 4 circuit board 4a, 4b surface 4c through hole 6 semiconductor chip 8 solder ball 10, 12 sealing portion 14 land 16 bonding wire 20 holder 22 semiconductor device

Claims (3)

[Claims] 1. A semiconductor device comprising: a semiconductor chip; a first surface on which the semiconductor chip is mounted; and a second surface opposite to the first surface, wherein a wiring pattern is formed on the second surface. A flexible circuit board, and a projection electrode for external connection formed on the second surface, and a portion where the projection electrode for external connection is formed, wherein the projection electrode for external connection is outside. Wherein the semiconductor device is bent at a predetermined angle in the direction of the semiconductor chip. 2. The semiconductor device according to claim 1, wherein a first sealing portion in which the semiconductor chip is sealed, and a first surface side of a portion where the external connection projecting electrode is formed. And a second sealing portion for sealing the formed wiring pattern,
A semiconductor device, wherein a portion where the external connection protruding electrode is formed is bent, and the second sealing portion is fixed to the first sealing portion with an adhesive. 3. The semiconductor device according to claim 1, wherein an external connection electrode is formed on the second surface of the circuit board on a side opposite to the first sealing portion. Semiconductor device.