JP2001311760A - Polishing jig for contact pin of semiconductor ic test socket and semiconductor device with polishing function - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing jig for a contact pin of a semiconductor IC test socket effectively removing the solder wastes stuck to the contact pin of the socket used in a final test for a correct judgment on the quality of a semiconductor IC to increase the reliability of the result of the final test, and easy to manufacture at a low cost. SOLUTION: This jig for polishing the contact pin of the socket used when conducting the final test of the semiconductor IC is provided with a terminal pin section 12 matched with the lead of the semiconductor IC. An abrasive grain face 13 for polishing the surface of the contact pin is formed on the portion of the terminal pin section 12 abutting on the contact pin by fixing cemented carbide grains 14 of diamond or the like by electrodeposition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing jig for polishing contact pins of a semiconductor IC test socket (hereinafter, simply referred to as a socket) used for performing a final test of a semiconductor IC. The present invention relates to a semiconductor device having a contact pin polishing function.

[0002]

2. Description of the Related Art Generally, in a final test of a semiconductor IC, a socket matched to the semiconductor IC is used to assist in assembling the semiconductor IC on a test board, and the socket is loaded with the semiconductor IC. ,
The contact pins of the socket make electrical contact with the leads of the semiconductor IC, and in this state, the program of a tester (not shown) is operated to determine the quality of the semiconductor IC.

By the way, the contact pins 2 of the socket 1
5 comes into contact with the lead 4 of the semiconductor IC 3 when the contact pin 2 contacts the lower surface of the lead 4 as shown in FIG. 5 and when the contact pin 2 comes into contact with the upper surface of the lead 4 as shown in FIG. May abut.

In any of the cases shown in FIGS. 5 and 6, when the semiconductor IC 3 is loaded into the socket 1,
After the lead 4 of C3 slides on the contact pin 2 of the socket 1 and is wiped, it is pressed against the contact pin 2.

At this time, if the surface of the lead 4 of the semiconductor IC 3 is plated with solder, the solder dust of the lead 4 adheres to the portion of the contact pin 2 which comes into contact with the lead 4. In particular, when the final test is repeated using the same socket 1, a large amount of solder dust accumulates on the contact pins 2. Contact pin 2
Since gold plating is performed on a copper alloy with nickel plating as a base to enhance conductivity, solder does not exist originally.

[0006] Since the solder dust generated by the contact with the lead 4 of the semiconductor IC 3 is a non-conductive oxide, when the solder waste is interposed between the contact pin 2 of the socket and the lead 4 of the semiconductor IC 3. Then, the contact resistance between the two 2 and 4 increases, and as a result, it becomes an open state. as a result,
Although the semiconductor IC 3 itself is originally a good product, there is a problem that the semiconductor IC 3 is erroneously determined to be a defective product.

Therefore, in the prior art, the following a, b, and c are periodically performed in order to avoid erroneous determination of the semiconductor IC 3 at the time of the final test due to the adhesion of the solder dust to the contact pins 2. We are taking such measures. A. Take out the socket 1 and clean it,
Remove solder dust adhering to the. b. A thin polishing plate on which abrasive grains such as diamond, alumina, and sapphire are adhered to the leads 4 of the semiconductor IC 3, and the abrasive grain surface of the polishing plate is brought into contact with the contact pins 2 a plurality of times to polish the surface. Then, the solder dust adhering to the contact pins 2 is removed. c, a resin-made polishing sheet on which abrasive grains such as diamond, alumina, sapphire, etc. are adhered to the leads 4 of the semiconductor IC 3, and the abrasive grain surface of this polishing sheet is contacted with the contact pins 2 several times in the same manner as in b. Then, the surface is polished to remove solder dust adhering to the contact pins 2.

[0008] In this manner, by removing the solder dust adhering to the contact pins 2 of the socket 1, electrical continuity with the leads 4 of the semiconductor IC 3 can be achieved, and the final test can be correctly evaluated. It becomes possible.

[0009]

However, the above a
In the above measure, the socket 1 must be moved to a cleaning device to perform a separate cleaning operation, which lowers the throughput of the final test. Further, in the measures b and c, the polishing plate or the polishing sheet must be attached to an extremely narrow region at the tip of the lead 4, which makes the attaching operation difficult and troublesome. In particular, as shown in FIG. 5, in the type in which the contact pin 2 contacts the lower surface of the lead 4,
It is necessary to attach the polishing plate to the lower surface of the lead 4. However, when the semiconductor IC 3 is small and has a large number of pins (for example, 48 pins and a pitch of 0.5 mm), it becomes extremely difficult to attach the polishing plate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has been made for a contact pin of a socket intended for a small semiconductor IC having a large number of leads. Regardless of the type of contact pin that contacts the upper or lower side of the lead, the foreign matter such as solder dust attached to the surface can be effectively removed, and the reliability of the final test result of the semiconductor IC It is an object of the present invention to provide a polishing jig and a semiconductor device with a polishing function that can be manufactured easily and can be easily manufactured.

[0011]

According to a first aspect of the present invention, there is provided a jig for polishing a contact pin of a socket used for performing a final test of a semiconductor IC, the jig being aligned with a lead of the semiconductor IC. In the portion of the terminal pin portion that comes into contact with the contact pin, an abrasive surface for polishing the surface of the contact pin is fixed by electrodeposition of ultra-hard particles such as diamond. Is formed.

According to a second aspect of the present invention, in the configuration of the first aspect, the leads of the semiconductor IC formed by shorting all pins of each lead are used as the terminal pin portions.

According to a third aspect of the present invention, in the configuration of the first aspect, a semiconductor IC having a defective circuit is used, and all pins of leads of the semiconductor IC are short-circuited to form the terminal pin portion.

According to a fourth aspect of the present invention, in the configuration of the first aspect, the semiconductor I is formed by bending a lead from a dummy frame and then shorting all pins via a package.
The lead of C is the terminal pin.

According to a fifth aspect of the present invention, there is provided an abrasive grain for polishing a surface of a contact pin of a semiconductor IC, which is in contact with a contact pin of a socket used for performing a final test of the semiconductor IC. The surface is formed by fixing ultra-hard particles such as diamond by electrodeposition to obtain a semiconductor device having a function of polishing contact pins of a semiconductor IC test socket.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 shows a first embodiment of the present invention, in which a polishing jig for polishing a contact pin of a socket used for performing a final test of a semiconductor IC is shown with a part thereof cut away. FIG. 2A is an enlarged view of part A of FIG. The polishing jig 10 of this embodiment includes a contact pin of a socket used for performing a final test of a semiconductor IC,
In particular, here, it is for polishing the contact pins 2 of the socket 1 of the type that comes into contact with the underside of the leads 4 of the semiconductor IC 3 as shown in FIG. Each contact pin 2 of socket 1
The number of terminal pin portions 12 corresponding to each of the contact pins 2 protrudes, and an abrasive grain for polishing the surface of the contact pin 2 is provided on a lower surface of a tip portion of each of the terminal pin portions 12 which contacts the contact pin 2. A surface 13 is formed.

The abrasive grain surface 13 has a plating layer 15 made of a metal such as nickel, chromium, copper, zinc, etc., together with ultra-hard grains 14 such as diamond, alumina, sapphire, etc., on the lower surface of the tip of the terminal pin portion 12. It is formed by electrodeposition to have an uneven shape.

In order to polish the contact pins 2 of the socket 1 using the polishing jig 10, the contact pins 2 are repeatedly pressed against the abrasive surface 13 of the terminal pin portion 12 a plurality of times. Accordingly, even when foreign matter such as solder dust is attached to the end surface of the contact pin 2, the foreign matter such as solder dust is polished and removed during the wiping operation of the contact pin 2 due to the uneven shape of the abrasive grain surface 13. Become like

As described above, the polishing jig 1 of this embodiment
0, foreign substances such as solder chips are effectively polished and removed when the abrasive grain surface 13 is pressed against the contact pins 2 of the socket 1.
The lead 4 and the contact pin 2 of the socket 1 are satisfactorily conducted, and the quality of the semiconductor IC 3 can be correctly determined. Further, since the contact pins 2 of the socket 1 which have become defective due to the solder dust can be repaired in a good state, the contact life of the socket 1 can be extended.

The polishing jig 10 shown in FIG.
As shown in FIG. 6, the contact pins 2 contacting the lower surfaces of the leads 4 of the semiconductor IC 3 are polished.
In the case of a polishing jig for polishing the contact pins 2 which are in contact with the upper surfaces of the leads 4 of the semiconductor IC 3 as shown in FIG.
As shown in FIG. 2, a similar abrasive grain surface 13 may be formed on the upper surface of the tip of the terminal pin portion 12.

Next, a procedure for manufacturing the polishing jig 10 shown in FIGS. 1 and 2 will be described with reference to a flowchart shown in FIG. In order to enable later-described electrodeposition, a semiconductor IC prepared by short-circuiting all pins of each lead is resin-molded, and then each lead is bent as it is without solder plating to form a terminal pin portion 12. And

Next, a composite electroplating process is performed to form an abrasive grain surface 13 at the tip of the terminal pin portion 12.
To this end, first, after removing dirt from the surface of the terminal pin portion 12, the cathode side 18 of the power supply is connected to the terminal pin portion 12 and the anode side 19 of the power supply is connected as shown in FIG. It is immersed in the metal plating bath 22 of the plating tank 21 together with the anode plate 20. In this case, the terminal pin portion 12 is immersed so that the surface on which the abrasive grain surface 13 is formed faces upward. That is, in order to polish the contact pins 2 of the socket 1 of the type shown in FIG. 5, for example, as shown in FIG.
2 immersion. Further, as the metal plating bath 22 used in this case, nickel, chromium, copper, zinc or the like is applied.

Subsequently, the ultra-hard particles 14 are put into the plating tank 21. In this case, as the ultra-hard particles 14, fine particles of about 15 μm, such as diamond, alumina, and sapphire, are used. Then, the composite electroplating process is performed while the metal plating bath 22 is stirred by the stirrer 23.
As a result, the metal plating layer 15 is electrodeposited on the upper surface side of the terminal pin portion 12 exposed in the metal plating bath 22, and the super-hard grains 14 are adhered to the polishing jig. 10 are formed.

Embodiment 2 FIG. In the above description, the lead of the semiconductor IC prepared by shorting all the pins of each lead is used as the terminal pin portion 12. However, for example, a semiconductor IC whose lead is sound but whose circuit is defective is prepared. After removing the solder plating on the surface of the lead of the semiconductor IC, all the pins of the lead are short-circuited by vapor-depositing a metal such as copper together with the resin mold from above.
The terminal pin portion 12 protrudes from the resin mold portion 11 as shown in FIG. 1 or FIG. 2, and this is subjected to a composite electroplating process as described above, and as shown in FIG. 1 or FIG. The polishing jig 10 can also be used.

Embodiment 3 Further, the dummy frame is collected, the leads are bent from the dummy frame, and all the pins are short-circuited via the package so that the terminal pin portion 12 protrudes from the resin mold portion 11 as shown in FIG. 1 or FIG. The polishing jig 10 as shown in FIG. 1 or FIG. 2 can also be prepared by subjecting this to a composite electroplating as described above.

As described above, the polishing jig 10 of the present invention
Instead of attaching a polishing plate or a polishing sheet to the leads 4 of the semiconductor IC 3 as in the prior art, the abrasive grain surface 1 having the super-hard grains 14 directly on the terminal pins 12 simulated on the leads.
Since the semiconductor IC 3 is formed integrally, the contact pins 2 of the socket 1 for testing a small semiconductor IC 3 having a large number of leads 4 and the leads of the semiconductor IC 3 shown in FIGS. A polishing jig 10 suitable for any type of contact pin 2 that contacts the upper or lower side of the polishing tool 4 can be easily and inexpensively manufactured.

Embodiment 4 In the above-described embodiment, the case has been described where the dedicated polishing jig 10 for polishing the contact pins 2 of the socket 1 is manufactured.
The present invention is not limited to this.
An abrasive grain surface for polishing the surface of the contact pin 2 is formed on the portion of the lead 4 in contact with the contact pin 2 in the same manner as described above, to provide a semiconductor device with a polishing function for the contact pin 2. It is also possible.

[0028]

According to the first aspect of the present invention, foreign matter such as solder dust attached to the contact pins of the socket can be effectively removed to repair the contact failure. Therefore, the quality of the semiconductor IC is determined by the final test. Can be performed correctly, and the reliability of the test can be increased. Also,
It is possible to extend the contact life of the socket, and it is possible to save labor for maintenance and inspection such as cleaning of the socket and replacement of the socket. Furthermore, instead of attaching a polishing plate or a polishing sheet to the leads of a semiconductor IC as in the prior art, instead of integrally forming an abrasive grain surface having ultra-hard grains directly on the terminal pin portion, a small-sized having many leads is provided. Manufactured easily and inexpensively for contact pins of sockets that test semiconductor ICs and for contact pins of any type that contact the upper or lower side of semiconductor IC leads. can do.

In particular, if a semiconductor IC is diverted or an unusual item is effectively used as in the inventions of claims 2 to 4, a polishing jig can be easily and inexpensively manufactured.

Further, if the same abrasive grain surface is formed at the tip of the lead of a normal semiconductor IC as in the invention of claim 5,
It is also possible to provide a semiconductor device with a polishing function for the contact pins of the socket.

[Brief description of the drawings]

FIG. 1 is a side view (a) showing a polishing jig according to Embodiment 1 of the present invention with a part cut away, and an enlarged view (A) of an A portion thereof.

FIG. 2 is a side view of a polishing jig according to a second embodiment of the present invention, which is partially cut away.

FIG. 3 is a flowchart showing a procedure for manufacturing a polishing jig according to the embodiment of the present invention.

FIG. 4 is an explanatory diagram of a method of forming an abrasive grain surface by a composite electroplating process in a manufacturing procedure of the polishing jig according to the embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a state in which a contact pin of a socket used for a final test is in contact with a lower surface of a lead of a semiconductor IC.

FIG. 6 is a cross-sectional view showing a state where a contact pin is in contact with an upper surface of a lead.

[Explanation of symbols]

1 socket, 2 contact pins, 3 semiconductor IC,
4 Lead, 10 polishing jig, 11 resin mold part, 1
2 terminal pin part, 13 abrasive grain surface, 14 super hard grain, 15
Plating layer.

Claims (5)

[Claims] 1. A jig for polishing a contact pin of a socket used when a final test of a semiconductor IC is performed, the jig having a terminal pin portion aligned with a lead of the semiconductor IC. A semiconductor portion, wherein an abrasive grain surface for polishing the surface of the contact pin is formed by fixing an ultra-hard grain such as diamond by electrodeposition on a portion of the portion contacting the contact pin. Polishing jig for contact pins of IC test socket. 2. The polishing of contact pins of a semiconductor IC test socket according to claim 1, wherein the leads of the semiconductor IC prepared by shorting all pins of each lead are used as the terminal pin portions. jig. 3. The semiconductor IC according to claim 1, wherein a semiconductor IC having a defective circuit is used, and all the pins of the lead of the semiconductor IC are short-circuited to form the terminal pin portion.
Polishing jig for contact pin of test socket. 4. The terminal according to claim 1, wherein the lead of the semiconductor IC formed by bending a lead from the dummy frame and shorting all pins via a package is used as the terminal pin portion. Polishing jig for contact pin of socket for semiconductor IC test. 5. An abrasive grain surface for polishing the surface of a contact pin of a semiconductor IC, which is in contact with a contact pin of a socket used for performing a final test of the semiconductor IC, is formed of diamond. A semiconductor device having a function of polishing contact pins of a socket for semiconductor IC test, wherein the semiconductor device is formed by fixing ultra-hard particles such as particles by electrodeposition.