JP2001304835A - Illuminating device for measuring unevenness, unevenness measuring device, illuminating device for inspecting defect, defect inspection device and illuminating method therefor - Google Patents
Illuminating device for measuring unevenness, unevenness measuring device, illuminating device for inspecting defect, defect inspection device and illuminating method thereforInfo
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- JP2001304835A JP2001304835A JP2000126087A JP2000126087A JP2001304835A JP 2001304835 A JP2001304835 A JP 2001304835A JP 2000126087 A JP2000126087 A JP 2000126087A JP 2000126087 A JP2000126087 A JP 2000126087A JP 2001304835 A JP2001304835 A JP 2001304835A
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、被検査物をセンサ
カメラで撮像し、その撮像信号に基づいて凹凸、欠陥を
検査する凹凸測定装置、欠陥検査装置、およびそれらに
使用される照明装置及びその照明方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an unevenness measuring device for detecting an unevenness and a defect based on an image of an object to be inspected by a sensor camera and inspecting the unevenness and the defect based on the imaged signal, a lighting device used therefor, It relates to the lighting method.
【０００２】図３は従来の欠陥検査装置の一例を示す全
体構成図である。この欠陥検査装置は、コンベア１によ
り搬送されるＣＣＬ（Ｃｏｐｐｅｒ Ｃｌａｄ Ｌａｍ
ｉｎａｔｅ：銅張積層版）２のピット（小さな窪み）、
デンツ（なだらかな窪み）を検査する装置であり、ＣＣ
Ｌの撮像面３を撮像するラインセンサカメラ４と、撮像
面３を照明する照明装置５と、ラインセンサカメラ４か
らの撮像信号を処理して欠陥を検出するための画像処理
装置６とを備えて構成されている。FIG. 3 is an overall configuration diagram showing an example of a conventional defect inspection apparatus. This defect inspection apparatus uses a CCL (Copper Cad Lam) conveyed by the conveyor 1.
inate: copper-clad laminate) 2 pits (small depressions),
This is a device for inspecting dents (gentle dents).
A line sensor camera 4 for imaging the L imaging surface 3, an illumination device 5 for illuminating the imaging surface 3, and an image processing device 6 for processing an imaging signal from the line sensor camera 4 to detect a defect. It is configured.
【０００３】以上の構成において、照明装置５は撮像面
３に対して常時所定の一つの照明配位で照明を行い、ラ
インセンサカメラ４は照明装置５により照明された撮像
面３を撮像する。画像処理装置６は得られた撮像信号よ
り、撮像面の輝度（明るさ）の違いに基づいて所望の欠
陥の有無等を検出する。In the above configuration, the illumination device 5 always illuminates the imaging surface 3 in one predetermined illumination configuration, and the line sensor camera 4 images the imaging surface 3 illuminated by the illumination device 5. The image processing device 6 detects the presence or absence of a desired defect based on a difference in brightness (brightness) of the imaging surface from the obtained imaging signal.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
照明装置により、ＣＣＬのような検査物表面を照明した
場合、撮像信号には、上述したピットやデンツのように
三次元的な欠陥に基づく明暗部分の他に、検査物表面に
存在する汚れ等に起因する反射率の違い、照明角度等に
基づく明暗部分が生じ、これらを区別して所望のピット
やデンツのような三次元的欠陥を検出することが困難で
あった。However, when the surface of the inspection object such as CCL is illuminated by the conventional illuminating device, the image signal contains light and shade based on three-dimensional defects such as the pits and dents described above. In addition to the parts, differences in reflectivity due to dirt and the like existing on the surface of the inspection object, light and dark parts based on the illumination angle, etc. are generated, and these are distinguished to detect desired three-dimensional defects such as pits and dents. It was difficult.
【０００５】例えば、図４（ａ）（ｂ）はそれぞれ照明
配位が異なる照明装置を用いて同じ撮像面を撮像して得
られた撮像画像を示したもので、図４（ａ）では反射率
が大きい部分により生じた明るい部分７とデンツによる
明暗部分８が生じているが、図４（ｂ）では図４（ａ）
で明るい部分７として得られた画像が逆に暗い部分７ａ
となっており、一方、図４（ａ）で得られたデンツによ
る明暗部分８が図４（ｂ）では得られていない。For example, FIGS. 4 (a) and 4 (b) show captured images obtained by capturing the same imaged surface using illuminating devices having different illumination configurations, and FIG. Although a bright portion 7 caused by a portion having a large ratio and a light-dark portion 8 caused by a dentz occur, FIG. 4A shows FIG.
The image obtained as the bright part 7 in FIG.
On the other hand, the bright and dark portions 8 of the dentz obtained in FIG. 4A are not obtained in FIG. 4B.
【０００６】このように、従来の照明装置を用いた欠陥
検査装置や凹凸測定装置では、所望の三次元的な欠陥と
反射率の変動等に基づく二次元的な欠陥を区別できず、
また、所望の三次元的な欠陥自体を検出できない場合も
あるという問題点があった。As described above, the conventional three-dimensional defect and the unevenness measuring device using the conventional illumination device cannot distinguish a desired three-dimensional defect from a two-dimensional defect based on a change in reflectance.
There is also a problem that a desired three-dimensional defect itself may not be detected.
【０００７】そこで、本発明は、かかる従来の課題を解
決するためになされたものであり、ピットやデンツのよ
うな三次元的欠陥を反射率の変動等に基づく二次元的な
欠陥から区別できると共に、確実に検出することができ
る凹凸測定装置、欠陥検査装置、及びこれらに用いられ
る照明装置、並びに撮像面の照明方法を得ることを目的
としている。Accordingly, the present invention has been made to solve such a conventional problem, and it is possible to distinguish three-dimensional defects such as pits and dents from two-dimensional defects based on fluctuations in reflectance. In addition, an object of the present invention is to obtain an unevenness measuring device, a defect inspection device, an illuminating device used for these devices, and an illuminating method of an imaging surface, which can be reliably detected.
【０００８】[0008]
【課題を解決するための手段】上述した課題を解決する
ため、本発明に係る凹凸測定用照明装置は、対象物をセ
ンサカメラで撮像し、その撮像信号に基づいて凹凸を測
定するに際して、前記センサカメラにより撮像される撮
像面を照明する凹凸測定用照明装置であって、前記凹凸
測定用照明装置を複数の光源で構成すると共に、各光源
による照明配位が異なるように前記各光源を配置し、前
記各光源による照明を前記センサカメラの撮像タイミン
グに基づいて切り替えるようにしたことを特徴とするも
のである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, an unevenness measuring illumination device according to the present invention captures an image of an object with a sensor camera and measures the unevenness based on the imaged signal. An unevenness measuring illumination device that illuminates an imaging surface imaged by a sensor camera, wherein the unevenness measuring illumination device includes a plurality of light sources, and the light sources are arranged such that illumination configurations by the light sources are different. The illumination by each of the light sources is switched based on the imaging timing of the sensor camera.
【０００９】このような凹凸測定用照明装置によれば、
一つの撮像面について照明配位が異なった複数の撮像画
像が得られ、これらに含まれる情報から適宜処理を行う
ことにより、所望の凹凸を検出することができる。According to the illumination device for measuring unevenness,
A plurality of captured images having different illumination configurations are obtained for one imaging surface, and a desired unevenness can be detected by appropriately performing processing based on information contained therein.
【００１０】また、本発明に係る凹凸測定用照明装置に
おいて、前記複数の光源は、ＬＥＤで構成されることを
特徴とするものである。[0010] In the illumination device for measuring unevenness according to the present invention, the plurality of light sources are constituted by LEDs.
【００１１】このような凹凸測定用照明装置によれば、
ＬＥＤは瞬時の発光、消光をシャープに行うことができ
るので、センサカメラの高速な撮像タイミングに追従し
て各光源を点滅させることができ、もって、ほぼ同一の
撮像面に対する各照明配位毎の撮像画像を得ることがで
きる。従って、例えばコンベア等により搬送されるＣＣ
Ｌ等を検査する場合において、ＣＣＬが所定の速度で搬
送されていても、センサカメラの高速な撮像タイミング
に合わせて照明配位を切替えることができるので、ほぼ
一つの撮像面について照明配位の異なった複数の撮像画
像が得られる。[0011] According to such an illumination device for measuring unevenness,
Since the LED can perform instantaneous light emission and extinction sharply, each light source can be made to blink following the high-speed imaging timing of the sensor camera. A captured image can be obtained. Therefore, for example, CC conveyed by a conveyor or the like
When inspecting L, etc., even if the CCL is being conveyed at a predetermined speed, the illumination configuration can be switched in accordance with the high-speed imaging timing of the sensor camera. A plurality of different captured images are obtained.
【００１２】また、本発明に係る凹凸測定装置は、撮像
面を撮像するセンサカメラと、前記撮像面を照明する照
明装置であって、複数の光源から構成されると共に、各
光源の照明配位が異なるように威嚇光源が配位された照
明装置と、前記各光源による照明を前記センサカメラの
撮像タイミングに基づいて切り替えるよう制御する切り
換え制御装置と、前記センサカメラにより撮像された撮
像信号と前記切替制御装置の切替信号とに基づいて画像
処理を行って撮像面の所望の凹凸を検出する画像処理装
置とを備えるものである。Further, the unevenness measuring apparatus according to the present invention is a sensor camera for picking up an image of an image pickup surface, and an illuminating device for illuminating the image pickup surface, comprising a plurality of light sources. A lighting device in which a threatening light source is arranged so as to be different, a switching control device that controls lighting of each light source based on an imaging timing of the sensor camera, an imaging signal captured by the sensor camera, and An image processing device that performs image processing based on the switching signal of the switching control device and detects desired unevenness on the imaging surface.
【００１３】このような凹凸測定装置によれば、一つの
撮像面について照明配位が異なった複数の撮像画像が得
られ、これらに含まれる情報から適宜処理を行うことに
より、所望の凹凸を検出することができる。According to such an unevenness measuring apparatus, a plurality of picked-up images having different illumination configurations can be obtained for one imaged surface, and a desired unevenness can be detected by appropriately processing the information contained therein. can do.
【００１４】また、本発明に係る撮像面の照明方法は、
センサカメラで撮像される撮像面を照明する撮像面の照
明方法において、前記センサカメラの撮像タイミングに
基づいて、前記撮像面を照明する照明装置の照明配位を
異ならせるようにしたことを特徴とするものである。[0014] The method for illuminating the imaging surface according to the present invention comprises:
In the method of illuminating an imaging surface that illuminates an imaging surface captured by a sensor camera, the illumination configuration of a lighting device that illuminates the imaging surface is made different based on the imaging timing of the sensor camera. Is what you do.
【００１５】このような照明方法によれば、一つの撮像
面について各照明配位が異なった複数の撮像画像が得ら
れ、これらに含まれる情報から適宜処理を行うことによ
り、所望の欠陥を検出することができる。According to such an illumination method, a plurality of images having different illumination configurations can be obtained for one imaging surface, and a desired defect can be detected by appropriately processing the information contained in these images. can do.
【００１６】また、本発明に係る欠陥検査用照明装置
は、被検査物をセンサカメラで撮像し、その撮像信号に
基づいて欠陥を検査するに際して、前記センサカメラに
より撮像される撮像面を照明する欠陥検査用照明装置で
あって、前記欠陥検査用照明装置を複数の光源で構成す
ると共に、各光源による照明配位が異なるように前記各
光源を配置し、前記各光源による照明を前記センサカメ
ラの撮像タイミングに基づいて切り替えるようにしたこ
とを特徴とするものである。Further, in the defect inspection lighting device according to the present invention, when an object to be inspected is imaged by a sensor camera and a defect is inspected based on the imaged signal, the imaged surface imaged by the sensor camera is illuminated. A defect inspection lighting device, wherein the defect inspection lighting device is composed of a plurality of light sources, and the light sources are arranged so that the illumination configurations of the light sources are different from each other. The switching is performed based on the imaging timing.
【００１７】このような欠陥検査用照明装置によれば、
一つの撮像面について照明配位が異なった複数の撮像画
像が得られ、これらに含まれる情報から適宜処理を行う
ことにより、所望の欠陥を検出することができる。According to such a defect inspection lighting device,
A plurality of captured images having different illumination configurations are obtained for one imaging surface, and a desired defect can be detected by appropriately performing processing based on information contained therein.
【００１８】また、本発明に係る欠陥検査用照明装置に
おいて、前記複数の光源はＬＥＤで構成されることを特
徴とするものである。Further, in the illumination device for defect inspection according to the present invention, the plurality of light sources are constituted by LEDs.
【００１９】このような欠陥検査用照明装置によれば、
ＬＥＤは瞬時の発光、消光をシャープに行うことができ
るので、センサカメラの高速な撮像タイミングに追従し
て各光源を点滅させることができ、もって、ほぼ同一の
撮像面に対する各照明配位毎の撮像画像を得ることがで
きる。従って、例えばコンベア等により搬送されるＣＣ
Ｌ等を検査する場合において、ＣＣＬが所定の速度で搬
送されていても、センサカメラの高速な撮像タイミング
に合わせて照明配位を切替えることができるので、ほぼ
一つの撮像面について照明配位の異なった複数の撮像画
像が得られる。According to the illumination device for defect inspection,
Since the LED can perform instantaneous light emission and extinction sharply, each light source can be made to blink following the high-speed imaging timing of the sensor camera. A captured image can be obtained. Therefore, for example, CC conveyed by a conveyor or the like
When inspecting L, etc., even if the CCL is being conveyed at a predetermined speed, the illumination configuration can be switched in accordance with the high-speed imaging timing of the sensor camera. A plurality of different captured images are obtained.
【００２０】また、本発明に係る欠陥検査装置は、撮像
面を撮像するセンサカメラと、前記撮像面を照明する照
明装置であって、複数の光源から構成されると共に、各
光源の照明配位が異なるように各光源が配置された照明
装置と、前記各光源による照明を前記センサカメラの撮
像タイミングに基づいて切り替えるよう制御する切替制
御装置と、前記センサカメラにより撮像された撮像信号
と前記切替制御装置の切替信号とに基づいて画像処理を
行って撮像面の所望の欠陥を検出する画像処理装置とを
備えるものである。Further, the defect inspection apparatus according to the present invention is a sensor camera for imaging an imaging surface, and an illuminating device for illuminating the imaging surface, comprising: a plurality of light sources; A lighting device in which each light source is arranged so as to be different, a switching control device that controls lighting of each light source based on an imaging timing of the sensor camera, an imaging signal captured by the sensor camera, and the switching. An image processing device that performs image processing based on the switching signal of the control device and detects a desired defect on the imaging surface.
【００２１】このような欠陥検査装置によれば、一つの
撮像面について照明配位が異なった複数の撮像画像を得
ることができ、これら撮像画像に含まれる情報を適宜処
理することにより、所望の欠陥を検出することができ
る。According to such a defect inspection apparatus, a plurality of picked-up images having different illumination configurations can be obtained for one picked-up surface, and by appropriately processing information contained in these picked-up images, a desired image can be obtained. Defects can be detected.
【００２２】[0022]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して説明する。図１は、本発明の実施の形態に係
る欠陥検査装置を示す全体構成図である。実施の形態に
おける欠陥検査装置は、コンベア１により搬送されるＣ
ＣＬ（Ｃｏｐｐｅｒ Ｃｌａｄ Ｌａｍｉｎａｔｅ：銅
張積層版）２のピット（小さな窪み）、デンツ（なだら
かな窪み）等の凹凸を検査する装置であり、ＣＣＬの撮
像面３を撮像するラインセンサカメラ４と、撮像面３を
照明する照明装置５０と、ラインセンサカメラ４からの
撮像信号を処理して欠陥を検出するための画像処理装置
６Ａとを備えて構成されている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an overall configuration diagram showing a defect inspection apparatus according to an embodiment of the present invention. The defect inspection apparatus according to the embodiment has a C
This is a device for inspecting irregularities such as pits (small dents) and dents (gently dents) of a CL (Copper Clad Laminate) 2, a line sensor camera 4 for imaging the imaging surface 3 of the CCL, and an imaging system. The illumination device 50 includes an illumination device 50 that illuminates the surface 3 and an image processing device 6A that processes an imaging signal from the line sensor camera 4 to detect a defect.
【００２３】照明装置５０は、Ａ光源５１，Ｂ光源５
２，Ｃ光源５３の三つの光源から構成されている。各光
源５１〜５３はＬＥＤから構成され、その照明配位が互
いに異なるように配置されている。また、画像処理装置
６Ａは各光源５１〜５３を切り替えて照明させるための
制御信号を出力する制御装置を備えている。The lighting device 50 includes an A light source 51 and a B light source 5
2, and three C light sources 53. Each of the light sources 51 to 53 is composed of an LED, and is arranged such that its illumination configuration is different from each other. The image processing device 6A includes a control device that outputs a control signal for switching and illuminating each of the light sources 51 to 53.
【００２４】図２は各光源５１〜５３による照明時間を
示すタイミングチャートであり、各光源５１〜５３は２
０〜１００μｓｅｃの間隔で、順次切替えられて照明を
行う。この切り替えタイミングはラインセンサカメラ４
による画像取り込みタイミングに合わせられている。こ
の場合、ＣＣＬ２の搬送速度に対して、各光源の切替え
速度は極めて速いので、光源５１〜５３それぞれにより
照明されて、ラインセンサカメラ４により撮像されて取
り込まれる三つの撮像画面において、ピットやデンツの
位置はほぼ一致したものが得られる。FIG. 2 is a timing chart showing the illumination time of each light source 51-53.
Illumination is performed by being sequentially switched at intervals of 0 to 100 μsec. This switching timing is based on the line sensor camera 4
In accordance with the image capture timing. In this case, since the switching speed of each light source is extremely high with respect to the transport speed of the CCL 2, the pits and the dents are displayed on three imaging screens illuminated by the light sources 51 to 53 and captured by the line sensor camera 4. Are almost the same.
【００２５】従って、これら三つの画像を用いて、画像
処理装置６Ａは適当な処理、例えば、論理和や論理積、
または排他的論理和等の論理演算を適宜行って、明暗等
の二次元的欠陥を除いた三次元欠陥として、例えばピッ
トやデンツ等の凹凸による欠陥のみを検出することがで
きる。Therefore, using these three images, the image processing device 6A performs appropriate processing, for example, a logical sum, a logical product,
Alternatively, a logical operation such as an exclusive OR operation is appropriately performed, and only a defect due to unevenness such as a pit or dentz can be detected as a three-dimensional defect excluding a two-dimensional defect such as light and dark.
【００２６】例えば、図４（ａ）はＡ光源５１により得
られた画像であり、図４（ｂ）はＢ光源５２により得ら
れた画像であり、これらを用いて所望のデンツ８による
欠陥のみを抽出することができる。For example, FIG. 4A shows an image obtained by the A light source 51, and FIG. 4B shows an image obtained by the B light source 52. Can be extracted.
【００２７】以上の実施の形態においては、照明装置５
０は三つの光源５１〜５３で構成するようにしたが、二
つでも、更に四つ以上の光源で構成するようにしてもよ
い。また、被検査物として、ＣＣＬを例に採って説明し
たが、本発明はこれに限らず、壁紙、フィルム等の光沢
を有する平面状の検査物等に対して有効に適用させるこ
とができる。また、光源はＬＥＤに代えてレーザダイオ
ードを用いるようにしてもよい。さらに、実施の形態で
は、ピットやデンツによる欠陥を検査する装置について
説明したが、ピットやデンツ以外の凹凸を測定または検
査する装置に適用できることは言うまでもない。In the above embodiment, the lighting device 5
Although 0 is constituted by three light sources 51 to 53, it may be constituted by two light sources or four or more light sources. Further, although the CCL has been described as an example of the inspection object, the present invention is not limited to this, and can be effectively applied to a glossy flat inspection object such as a wallpaper or a film. Further, the light source may use a laser diode instead of the LED. Further, in the embodiment, the apparatus for inspecting defects due to pits and dents has been described. However, it is needless to say that the present invention can be applied to an apparatus for measuring or inspecting irregularities other than pits and dents.
【００２８】[0028]
【発明の効果】以上の説明より明らかなように、本発明
によれば、照明配位の異なる複数の画像を得ることがで
き、これに基づいて、所望の三次元的欠陥を二次元的欠
陥から区別して、的確に検出することができるという効
果を奏する。As is apparent from the above description, according to the present invention, a plurality of images having different illumination configurations can be obtained, and based on this, a desired three-dimensional defect can be converted to a two-dimensional defect. This has the effect of being able to accurately detect the signal.
【図１】本発明の実施の形態を示す全体構成図である。FIG. 1 is an overall configuration diagram showing an embodiment of the present invention.
【図２】各光源の照明切替タイミングを示すフローチャ
ートである。FIG. 2 is a flowchart showing illumination switching timing of each light source.
【図３】従来の欠陥検査装置を示す全体構成図である。FIG. 3 is an overall configuration diagram showing a conventional defect inspection apparatus.
【図４】所定の照明配位により得られる画像を示す図で
ある。FIG. 4 is a diagram showing an image obtained by a predetermined illumination configuration.
２ ＣＣＬ ３ 撮像面 ４ ラインセンサカメラ ６Ａ 画像処理装置 ５０ 照明装置（欠陥検査用照明装置） ５１〜５３ 光源 2 CCL 3 Imaging surface 4 Line sensor camera 6A Image processing device 50 Illumination device (illumination device for defect inspection) 51 to 53 Light source
───────────────────────────────────────────────────── フロントページの続き (72)発明者 板垣 忠司 神奈川県川崎市幸区堀川町66番２ 東芝エ ンジニアリング株式会社内 Ｆターム(参考） 2F065 AA49 BB01 CC00 DD04 FF04 FF41 GG06 GG07 GG08 HH12 HH14 HH18 JJ25 PP16 PP22 UU01 2G051 AA61 AB02 AB20 BA01 BA10 BA20 CA03 CA04 CD06 DA01 DA06 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Tadashi Itagaki 66-2 Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa F-term (reference) 2F065 AA49 BB01 CC00 DD04 FF04 FF41 GG06 GG07 GG08 HH12 HH14 HH18 JJ25 PP16 PP22 UU01 2G051 AA61 AB02 AB20 BA01 BA10 BA20 CA03 CA04 CD06 DA01 DA06
Claims (7)
像信号に基づいて凹凸を測定するに際して、前記センサ
カメラにより撮像される撮像面を照明する凹凸測定用照
明装置であって、 前記凹凸測定用照明装置を複数の光源で構成すると共
に、各光源による照明配位が異なるように前記各光源を
配置し、前記各光源による照明を前記センサカメラの撮
像タイミングに基づいて切り替えるようにしたことを特
徴とする凹凸測定用照明装置。1. An unevenness measuring illumination device that illuminates an imaging surface imaged by the sensor camera when an object is imaged by a sensor camera and the unevenness is measured based on the imaging signal. And the lighting device for a plurality of light sources, the light sources are arranged so that the illumination configuration by each light source is different, and the illumination by each light source is switched based on the imaging timing of the sensor camera. Characteristic illumination device for unevenness measurement.
おいて、 前記複数の光源は、ＬＥＤで構成されることを特徴とす
る凹凸測定用照明装置。2. The unevenness measuring illumination device according to claim 1, wherein the plurality of light sources are constituted by LEDs.
ら構成されると共に、各光源の照明配位が異なるように
威嚇光源が配位された照明装置と、 前記各光源による照明を前記センサカメラの撮像タイミ
ングに基づいて切り替えるよう制御する切り換え制御装
置と、 前記センサカメラにより撮像された撮像信号と前記切替
制御装置の切替信号とに基づいて画像処理を行って撮像
面の所望の凹凸を検出する画像処理装置とを備える凹凸
測定装置。3. A sensor camera for imaging an imaging surface, and an illuminating device for illuminating the imaging surface, comprising a plurality of light sources, wherein a threatening light source is arranged so that the illumination arrangement of each light source is different. A lighting device, a switching control device that controls the illumination by each of the light sources to be switched based on an imaging timing of the sensor camera, and an imaging signal captured by the sensor camera and a switching signal of the switching control device. And an image processing device for performing image processing to detect desired irregularities on the imaging surface.
する撮像面の照明方法において、 前記センサカメラの撮像タイミングに基づいて、前記撮
像面を照明する照明装置の照明配位を異ならせるように
したことを特徴とする撮像面の照明方法。4. A method of illuminating an imaging surface for illuminating an imaging surface imaged by a sensor camera, wherein an illumination configuration of an illumination device for illuminating the imaging surface is made different based on an imaging timing of the sensor camera. A method for illuminating an imaging surface, comprising:
撮像信号に基づいて欠陥を検査するに際して、前記セン
サカメラにより撮像される撮像面を照明する欠陥検査用
照明装置であって、 前記欠陥検査用照明装置を複数の光源で構成すると共
に、各光源による照明配位が異なるように前記各光源を
配置し、前記各光源による照明を前記センサカメラの撮
像タイミングに基づいて切り替えるようにしたことを特
徴とする欠陥検査用照明装置。5. A defect inspection illuminating device which illuminates an imaging surface imaged by the sensor camera when an image of an object to be inspected is imaged by a sensor camera and a defect is inspected based on the image signal. The inspection lighting device is composed of a plurality of light sources, and the light sources are arranged so that the illumination configuration by each light source is different, and the illumination by each light source is switched based on the imaging timing of the sensor camera. A lighting device for defect inspection, characterized in that:
おいて、 前記複数の光源はＬＥＤで構成されることを特徴とする
欠陥検査用照明装置。6. The illumination device for defect inspection according to claim 1, wherein the plurality of light sources are constituted by LEDs.
ら構成されると共に、各光源の照明配位が異なるように
各光源が配置された照明装置と、 前記各光源による照明を前記センサカメラの撮像タイミ
ングに基づいて切り替えるよう制御する切替制御装置
と、 前記センサカメラにより撮像された撮像信号と前記切替
制御装置の切替信号とに基づいて画像処理を行って撮像
面の所望の欠陥を検出する画像処理装置とを備える欠陥
検査装置。7. A sensor camera for imaging an imaging surface, and an illuminating device for illuminating the imaging surface, wherein the illumination device includes a plurality of light sources, and each light source is arranged so that an illumination configuration of each light source is different. A lighting device, a switching control device that controls the lighting by each of the light sources to be switched based on an imaging timing of the sensor camera, and an imaging signal captured by the sensor camera and a switching signal of the switching control device. A defect inspection apparatus comprising: an image processing apparatus that performs image processing to detect a desired defect on an imaging surface.
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| JP2000126087A JP2001304835A (en) | 2000-04-26 | 2000-04-26 | Illuminating device for measuring unevenness, unevenness measuring device, illuminating device for inspecting defect, defect inspection device and illuminating method therefor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000126087A JP2001304835A (en) | 2000-04-26 | 2000-04-26 | Illuminating device for measuring unevenness, unevenness measuring device, illuminating device for inspecting defect, defect inspection device and illuminating method therefor |
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| JP2001304835A true JP2001304835A (en) | 2001-10-31 |
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| JP2000126087A Pending JP2001304835A (en) | 2000-04-26 | 2000-04-26 | Illuminating device for measuring unevenness, unevenness measuring device, illuminating device for inspecting defect, defect inspection device and illuminating method therefor |
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