JP2001300855A - Diamond saw blade - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure the long life of a tool while maintaining excellent grinding speed and good machining precision, in a diamond saw blade having the outside diameter of 200 to 400 mm and a grinding wheel part of the thickness of 3.0 mm or more and to be used for cutting or grinding a hard and brittle material such as a stone, a tile or the like. SOLUTION: This diamond saw blade having the outside diameter D of 200 to 400 mm is formed by continuously fixing a grinding wheel part 2 formed by taking diamond abrasive grains and bond as main components and having the thickness (t) of 3.0 mm or more on the outer peripheral edge of a metallic circular base 1. Cutout grooves 3 are alternately provided on the right and left side surface parts 5 of the grinding wheel part 2 with the width of 1/2 in proportion to the thickness (t) of the grinding wheel part 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond saw blade suitably used for cutting and grinding hard and brittle materials such as stones and tiles used as building materials.

[0002]

2. Description of the Related Art As a tool for cutting or grinding hard and brittle materials such as stones and tiles, usually formed on the outer peripheral edge of a metal circular substrate with diamond abrasive grains and a bond made of metal powder or the like as main components. A diamond saw blade to which a grindstone portion called a chip is fixed is widely used.

The diamond saw blade has been variously improved in order to efficiently machine a hard and tough work material. For example, in order to sharpen diamond abrasive grains into the work material, the hardness of the bond material is lowered to promote the spontaneous cutting action of the abrasive grains, or to reduce the resistance of the grindstone, the work material A device has been devised to make the area of the whetstone part to be contacted extremely small.

[0004] However, when the grinding speed is improved as described above, the wear of the grinding wheel portion becomes remarkable, and as a result, the life of the diamond saw blade is shortened. Also,
The precision of the work surface such as the cut surface of the work material is extremely reduced,
In some cases, a so-called chipping phenomenon that causes chipping on the surface to be processed often occurs.

[0005] Stones and tiles are work materials that are particularly prone to chipping phenomena due to the properties of the materials.
As a tool used for performing high-precision cutting, a diamond saw blade having a soft touch to the work material is selected even if the grinding speed is sacrificed to some extent.

A typical example of such a diamond saw blade is a continuous slim type blade, in which a straight ring-shaped (annular) grindstone portion is integrally formed on an outer peripheral edge of a metal circular substrate. This type of blade does not have a zigzag cutout groove or a slit like the segment type in the grindstone, so when the grindstone comes into contact with the work material, it is smooth and has very little impact. A highly accurate processed surface can be obtained.

[0007] When the workpiece is small and cuts a relatively shallow groove, or when a small workpiece having a diameter of less than 180 mm is cut, the thickness of the grindstone portion is 3.0 mm.
Since there is no particular problem because it is possible to use a thin blade continuous type blade, the work material becomes large, a relatively deep groove is cut, and the diameter is 200 m.
When cutting a work material of m or more, it is an essential requirement that the thickness of the metal circular substrate be 2.5 mm or more in order to prevent the deflection of the diamond blade.
Therefore, it is an essential requirement that the thickness of the grindstone portion be 3.0 mm or more.

[Problems to be solved by the invention]

[0008] However, when the thickness of the grindstone portion of the diamond saw blade exceeds 3.0 mm, the resistance of the grindstone portion to the work material increases in a continuous slim type blade, and the grinding speed decreases significantly. The unsolved problem was left. In such a situation, the object of the present invention is to provide an outer diameter of 200 to 400 mm.
When grinding a hard and brittle material such as a stone or a tile using a diamond saw blade with a grindstone part thickness of 3.0 mm or more, the chipping phenomenon occurs while maintaining an excellent grinding speed. Another object of the present invention is to provide a diamond saw blade capable of achieving excellent machining accuracy and achieving a long tool life.

[0009]

SUMMARY OF THE INVENTION The present invention for solving the above-mentioned problems mainly comprises diamond abrasive grains and a bond on the outer peripheral edge of a metal circular substrate having a mounting hole for a power tool or the like at the center. An outer diameter of 200 to 400 mm formed by continuously fixing a grindstone having a thickness of 3.0 mm or more formed as a component.
Characterized in that a notch groove is provided with a width of not more than 1/2 in proportion to the thickness of the whetstone part, alternately on the left and right side parts of the whetstone part. Located on a diamond saw blade.

In the diamond saw blade according to the present invention, the notch groove provided in the grindstone portion is perpendicular to the center of the metal circular substrate, or is inclined radially with respect to the rotation direction of the diamond saw blade. It is also one of the preferable embodiments that the notch groove is formed with a depth of 1/2 or less in proportion to the thickness of the grindstone portion.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a diamond saw blade (hereinafter sometimes simply referred to as a "blade") according to an example of the present invention will be described below with reference to the drawings. FIG.
FIG. 2 is a front view of a diamond saw blade according to an example of the present invention, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIG.

The diamond saw blade according to the present invention is generally used when grinding stones, tiles and the like, and basically has a mounting hole 4 for a power tool or the like at the center as shown in FIG. A grindstone portion 2 formed mainly of diamond abrasive grains and bonds is continuously fixed to an outer peripheral edge of a metal circular substrate 1 having the same.

However, in the blade of the present invention, the outer diameter of the metal circular substrate 1 is at least 180 mm and the outer diameter (D) of the blade to which the height of the grindstone portion 2 is added is 2 mm.
The thickness (t) of the grindstone part 2 is 3.0 m from 00 to 400 mm.
m is a structural requirement. That is, in order to efficiently cut relatively large tiles and stones, etc., which are the object of the present invention, while maintaining high accuracy, or to construct a deep groove, the outer diameter of the blade is required to have a corresponding dimension. Accordingly, a thick substrate 1 is required.

That is, the outer diameter of the blade itself is 200 m
m, it becomes 6
When a rotation speed of 000 (revolutions / minute) or more is applied, the thinner the substrate, the more lateral deflection occurs, and the grinding accuracy is greatly reduced. Therefore, the diamond saw blade according to the present invention has an outer diameter (D) of 200 mm to 400 mm.
And it is assumed that the thickness (t ′) of the metal circular substrate (hereinafter simply referred to as “substrate”) 1 is 2.5 mm or more.

The circular metal substrate 1 according to the present invention is usually made of a steel substrate such as tool steel having a size satisfying the above requirements, and a mounting hole 4 for a power tool or the like is formed at the center of the substrate 1. Is provided. On the outer peripheral edge of the substrate 1, a grindstone portion 2 formed mainly of diamond abrasive grains and a bond as a matrix is formed in an annularly continuous state.

The bonding material forming the grindstone portion 2 of the present invention is:
Since the target work material is a material with relatively high hardness, such as tiles and stones, select a material with a softer property to prevent the cutting of chips and secure a constant grinding speed. It is preferable to use, for example, a cobalt-bronze-based metal powder. By selecting a soft bond as the matrix in this manner, the spontaneous cutting action of diamond abrasive grains in the grindstone portion 2 is promoted, and as a result, a constant grinding speed is secured.

The means for fixing the grindstone portion 2 to the outer peripheral edge of the metal circular substrate 1 is a mixed powder mainly composed of metal powder to be bonded and diamond abrasive grains. A co-sintering method in which the above-mentioned mixed powder is molded in a mold and sintered at a high temperature and a high pressure on the outer peripheral edge of the substrate 1 by using a conventionally known brazing method or a laser welding method. Can be appropriately selected.

It is essential that the thickness (t) of the grindstone portion 2 formed on the outer peripheral edge of the circular metal substrate 1 be 3 mm or more. On the other hand, it is preferable to provide a so-called set by providing at least a thick layer. This facilitates the discharge of cutting chips during the grinding operation to the outside of the system, and alleviates the problem of so-called cylinder displacement. The depth of the clam is not particularly limited, but is 0.5 mm.
It is desirable that this is the case.

In the diamond saw blade of the present invention, the notch grooves 3 having a width (w) of not more than 1/2 in proportion to the thickness (t) of the grinding wheel portion 2 are alternately formed on the left and right side surfaces of the grinding wheel portion 2. Being provided is a structural feature. The notch 3 is perpendicular to the center of the substrate 1 or, alternatively, with respect to the direction of rotation of the diamond saw blade.
It is preferable that the cutout groove 3 be provided radially inclined, and that the depth (f) of the notch groove 3 be less than or equal to 1/2 of the thickness (t) of the grindstone portion 2.

The point that the notch groove 3 acts to promote sharp biting into the work material and discharge of cutting chips to the outside of the system is the same as that of a conventionally known diamond saw blade. The saw blade has an outer diameter of 200 to 400 mm and a thickness (t) of the grindstone portion 2 of 3 mm.
It is different that the above is a prerequisite.

The thin diamond saw blade having such a large diameter and the thickness of the grindstone portion having the notch groove is less than 3 mm has a certain reputation in the art for its sharpness. (Life characteristics) and grinding accuracy were not always satisfactory. In the diamond saw blade according to the present invention, the width (w) of the notch grooves 3 provided alternately on the left and right side surfaces 5 of the grindstone portion 2 is set to the thickness (t) of the grindstone portion 2 under the above prerequisites.以下 or less, cutting and grinding of high-hardness materials such as tiles and stones, while maintaining excellent grinding speed and good processing accuracy,
It has also become possible to ensure constant life characteristics.

If the width (w) of the notch groove 3 is larger than １ ／ of the thickness (t) of the grindstone portion 2, the number of grooves is reduced, and the cut into the work material becomes unstable. This may cause chipping frequently and reduce the absolute volume of the grindstone portion, which may result in a decrease in life characteristics. Further, if the width (w) of the notch groove 3 becomes extremely narrow, the groove does not function as a groove and a remarkable reduction in grinding speed is caused.

The notch groove 3 is preferably provided perpendicular to the center of the metal circular substrate 1 or inclined radially in the direction of rotation of the blade. Is efficiently promoted to the outside of the system, and body displacement and wear under the neck caused by cutting chips can be avoided.

It is desirable that the depth (f) of the notch groove 3 is not more than 1/2 in proportion to the thickness (t) of the grindstone portion 2, but the depth (f) is not more than 1/2. If it is 2 or more, the biting surface of the grindstone portion 2 with respect to the work material increases, and the grinding speed increases, but there is a fear that the processing accuracy may decrease, or the life characteristics may decrease due to a decrease in the absolute volume. On the other hand, if the depth is extremely shallow, the function as a groove is not lost, sharp penetration into the work material is impaired, and the efficient discharge of cutting chips is not ensured.

[0025]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples. However, the diamond saw blade of the present invention is not specified by this, but can be freely designed within the scope of the components of the present invention. Changes are possible.

Example 1 As shown in FIG. 1, a diamond saw blade of this example has a steel (C) substrate having a thickness (t ') of 3.2 mm and an outer diameter of 291 mm. A grindstone portion 2 is formed by combining a mixed powder of a bronze-based bond and diamond abrasive grains with a binder. A mounting hole 4 having an inner diameter of 25.4 mm is provided at the center thereof, and is provided for fitting to a spindle such as a power tool.

The thickness (t) of the grindstone portion 2 is 4.8 mm, its height (h) is designed to be 7.0 mm, and the left and right side portions 5 have a width (w) of 2 mm and a depth (f). 2.) A 2.4 mm cutout groove 3 is formed vertically toward the center of the circular substrate 1. The grindstone portion 2 is set adjacent to the outer peripheral edge of the circular substrate 1 together with the mixed powder and the binder charged in the mold, and is charged into a sintering mold and pressure-sintered to form a circular substrate. 1 is formed by being fixed to the outer peripheral edge in a ring shape and integrally by sintering.

The diamond saw blade of the present example manufactured as described above was set in a stationary automatic cutting machine at a rotation speed of 3000 / min, and subjected to a wet cutting test of a 5 mm-thick glazed tile. The cutting chips are effectively discharged out of the system and show excellent sharpness.
500mm / min is possible, almost no glaze splashing or chipping of tiles, good processing accuracy is secured,
It takes about 6 to reach the life of the diamond saw blade.
It was confirmed that a cutting operation of 00M was possible.

Comparative Example 1 A diamond saw blade was manufactured in the same manner as in Example 1 except that the notch grooves 3 were not provided on the left and right side surfaces 5 of the grinding wheel portion 2. A cutting test was carried out under the same conditions. As a result, no glaze jumping or chipping of the tile was observed, and good processing accuracy was confirmed. However, the processing area on the work material in the grinding wheel portion 2 was large, and as a result, diamond Since the load on the saw blade increases and the cutting speed is at most 800 mm / min, and clogging of the cutting debris in the grindstone portion 2 is remarkable, grinding becomes impossible unless dressing by dressing is repeated. there were.

[0030]

As is clear from the examples and comparative examples, the diamond saw blade according to the present invention has an outer diameter of 200 to 400 mm and a thickness of the grindstone portion of 3.0 mm.
The above relatively large diameter diamond saw blade, by providing a notch groove of a specific size on the left and right side portions of the whetstone portion, for cutting or grinding hard and brittle materials such as stones and tiles. When performing machining, it has become possible to achieve a long tool life while maintaining excellent grinding speed and good machining accuracy.

[Brief description of the drawings]

FIG. 1 is a front view showing an example of a diamond saw blade of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a partially enlarged view of a plane of a grindstone portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal circular substrate 2 Whetstone part 3 Notch groove 4 Mounting hole 5 Side part D Outside diameter of diamond saw blade (mm) f Depth of notch groove (mm) h Height of whetstone part (mm) t Whetstone part Thickness (mm) t 'Thickness of metal circular substrate (mm) w Width of cutout groove (mm)

Claims (3)

[Claims] 1. A whetstone part having a thickness of 3.0 mm or more formed mainly of diamond abrasive grains and a bond is provided on an outer peripheral edge of a metal circular substrate having a mounting hole for a power tool or the like at a central part. Outer diameter of 200 to 400 mm, which is continuously fixed
Characterized in that notched grooves are provided alternately on the left and right side surfaces of the whetstone portion with a width of 1/2 or less in proportion to the thickness of the whetstone portion. . 2. A notch groove provided in a whetstone portion is formed so as to be perpendicular to a center portion of a metal circular substrate or to be radially inclined with respect to a rotation direction of a diamond saw blade. The diamond saw blade according to claim 1, wherein: 3. The diamond saw according to claim 1, wherein the notch groove provided in the grindstone portion is formed with a depth of 1/2 or less in proportion to the thickness of the grindstone portion. blade.