JP2001298300A - Method and device for attaching electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for attaching an electronic part for improved operation rate by reducing a gap between a sucking nozzle and an electronic part for stable part supply, as well as for improved part recognition precision and stable part attaching even with a narrow pitch electronic part. SOLUTION: A supplied part is taken from a part supply position by a sucking nozzle 5 fitted to a rotary table 2, and it is moved to a part recognizing position by rotating the rotary table 2 where a recognizing camera 7 is provided which images the part sucked to the sucking nozzle 5 from under it for part recognition. A part attaching device is provided which attaches the part held by the sucking nozzle 5 to a board, based on the part recognition at a part attaching position where a focal point adjusting means 10 for adjusting a focal point of the recognizing camera 7 is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method and apparatus.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus which has been widely used, a supplied electronic component can be taken out at a high speed and accurately without erroneous suction. There is a demand for a high electronic component mounting device. In particular, in recent years, there has been a demand for an electronic component mounting apparatus that can mount electronic components with high precision as the lead pitch becomes narrower.

FIGS. 2 to 4 show a conventional electronic component mounting apparatus. As shown in FIG. 2, the electronic component mounting apparatus is configured to take out the electronic component supplied from the component supply unit 1 by the suction nozzle 5 of the turntable 2 and mount the electronic component on the circuit board positioned at the component mounting position. Have been.

[0006] As shown in FIG. 3, the suction nozzle 5 is attached to the rotary table 2 via a mounting head 4, and is driven vertically when the mounting head 4 sucks and mounts the electronic component 3. A drive section 9 and a drive section 6 for positioning the angle of the suction nozzle 5 are provided.

[0005] A plurality of mounting heads 4 are mounted on the outer periphery of the turntable 2 at equal intervals, and as shown in FIG.
The stop position of the mounting head 4 shown in S1 to S8 is intermittently driven to rotate in the direction of arrow a.

In the component supply section 1, a plurality of component supply means accommodating various electronic components 3 are arranged in parallel, and the component supply means accommodating necessary components is placed in a component supply position B indicated by S1. It is configured to move to.

The circuit board 11 on which the electronic components 3 are mounted is transported in the direction of arrow b, and is positioned at a predetermined mounting position on the XY table 12. When the required electronic component 3 is supplied to the component supply position B, the mounting head 4 stopped at the position S1 is lowered by the driving unit 9 and sucks the electronic component 3 by the suction nozzle 5.

When the electronic component 3 is lifted by the drive unit 9 while being sucked, the mounting head 4 sequentially moves to the stop positions S1 and S2 and arrives at the component recognition position C indicated by S3.
At the component recognition position C, a recognition camera 7 for imaging the electronic component 3 sucked by the suction nozzle 5 from directly below is disposed, and the recognition camera 7 recognizes the external shape and lead of the electronic component 3 sucked. Then, the positional relationship between the center of the suction nozzle 5 and the center of the sucking electronic component 3 is calculated from the recognition result of the suction nozzle 5 and each lead, and the correction amount of the electronic component 3 is measured.

Next, the mounting head 4 moves to the component thickness measurement position D shown in S4. At the component thickness measurement position D, a recognition camera 8 that captures an image of the electronic component 3 sucked by the suction nozzle 5 from right beside is arranged, and the thickness of the electronic component 3 is measured. Then, the measurement result of the thickness of the electronic component 3 is compared with the thickness input data of the electronic component input in advance, and the thickness of the electronic component 3 is checked.

Thereafter, the mounting head 4 moves to the component mounting position E shown in S5, descends to the side of the circuit board 11 positioned on the XY table 12, and mounts the electronic component 3 at a predetermined position. .

The mounting head 4 on which the electronic component 3 has been mounted is S6
Move to the suction nozzle return position A indicated by. Here, the position of the suction nozzle 5 is set to 0 ° by the driving unit 6.

In this state, the suction nozzle 5 sequentially moves from the stop position indicated by S7 and S8 to the component supply position B indicated by S1, and repeats the above operation. In the electronic component mounting apparatus configured as described above, the component supply position B
In the above, the height of the mounting head 4 descending by the drive unit 9 is obtained by the following formula.

The suction height of the mounting head = the suction reference height-the component thickness data Here, the component thickness data is input as standard component thickness data of the target electronic component by the machine operator in a data input section (not shown). Value. The suction reference height is the height of the mounting head 4 when the lowermost surface of the suction nozzle 5 coincides with the component supply uppermost surface of the component supply unit 1.

[0014]

However, there is a slight difference between the standard component thickness data of the electronic component input by the operator and the thickness of the electronic component 3 actually sucked. Even if the manufacturer is different, the thickness of the component is often different if the manufacturer is different. Therefore, if the mounting head 4 is lowered based on the value obtained by the above equation, a gap is generated between the suction nozzle 5 and the electronic component 3. Thus, a suction error of the electronic component 3 is likely to occur.

In recent years, since the size of electronic components has become increasingly smaller, the suction nozzle 5
If a gap is generated between the electronic component 3 and the electronic component 3, a suction error is more likely to occur, and stable component supply becomes difficult.

In the electronic component mounting apparatus configured as described above, there is a problem not only when the electronic component is sucked as described above, but also when the electronic component is mounted on the circuit board 11. That is, when mounting the electronic component 3 with high precision with the recent reduction in the lead pitch, the recognition camera 7 can accurately recognize the component when the component having a different height is recognized at the component recognition position C. However, an error occurs in the recognition result, and the mounting accuracy on the board is reduced.

As described above, due to a decrease in the suction rate of the electronic component 3 and a decrease in the mounting accuracy on the substrate, the productivity of the electronic component mounting apparatus is reduced, and the operation rate cannot be improved. The present invention solves the above-mentioned problems, reduces the gap between the suction nozzle and the electronic component, performs stable component supply, and improves the recognition accuracy of the component even when a narrow-pitch electronic component is mounted. It is an object of the present invention to provide a method and an apparatus for mounting electronic components, in which the mounted components are mounted and the operation rate can be improved.

[0018]

An electronic component mounting apparatus according to the present invention is characterized in that a focus adjusting means is provided at a component recognition position.

According to the present invention, the recognition accuracy of the electronic component can be improved and the mounting rate on the substrate can be improved. An electronic component mounting method according to the present invention is characterized in that position control of a mounting head or focus control of a recognition camera is performed.

According to the present invention, the suction rate of the electronic component can be increased, and the mounting rate on the substrate can be increased.

[0021]

In the electronic component mounting apparatus according to the first aspect of the present invention, a component supplied from a component supply position is taken out by a suction nozzle attached to a rotary table, and the rotary table is rotated to rotate the component. The component picked up by the suction nozzle is moved to a component recognition position provided with a recognition camera for capturing an image of the component from below the suction nozzle, and component recognition is performed. A component mounting apparatus for mounting on a substrate based on recognition, wherein a focus adjusting unit for adjusting a focus of the recognition camera is provided at the component recognition position.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus according to the first aspect, wherein the focus adjusting means comprises a drive unit for driving the recognition camera up and down. According to a third aspect of the present invention, in the electronic component mounting apparatus according to the first aspect, a recognition camera is provided between the component recognition position and the component mounting position to image a component sucked by the suction nozzle from a side of the suction nozzle. The component thickness measurement position is provided, and the component thickness is measured from the height of the suction nozzle measured in a state where the component is suctioned by the camera for recognizing the component thickness measurement position and the height of the suction nozzle measured in a state where the component is not suctioned in advance. And a control unit that calculates the average value of the thickness of the component for each of the types, and executes the focus adjustment of the recognition camera at the component recognition position based on this value.

According to a fourth aspect of the present invention, there is provided a component mounting apparatus.
A recognition camera was provided for taking out components supplied from the component supply position with a suction nozzle attached to a rotary table, and rotating the rotary table to image the components suctioned by the suction nozzle from below the suction nozzle. A component mounting apparatus that performs component recognition by moving to a component recognition position, and mounts a component held by the suction nozzle at a component mounting position on a board based on the component recognition. A component thickness measurement position is provided between the component recognition position and the component mounting position, and a recognition camera is provided between the component recognition position and the component mounting position to capture an image of the component sucked by the suction nozzle from the side of the suction nozzle. Recognition of measurement position The height of the suction nozzle measured when the component is sucked by the camera, and the height of the suction nozzle when the component measured in advance is not sucked From seeking the thickness average value of the part for each type of component, characterized in that a control unit for executing a position adjustment of the mounting head in the component supply position based on this value.

According to a fifth aspect of the present invention, in the electronic component mounting apparatus, the component supplied from the component supply position is taken out by a suction nozzle attached to a rotary table via a mounting head, and the rotary table is rotated. The component picked up by the suction nozzle is moved to a component recognition position provided with a recognition camera for imaging the component sucked by the suction nozzle from below the suction nozzle, and the component sucked by the suction nozzle is moved to the side of the suction nozzle. An electronic component mounting apparatus that measures a component thickness at a component thickness measurement position provided with a recognition camera that captures an image from a component, and mounts the component held by the suction nozzle on a substrate at a component mounting position, the electronic component mounting device comprising: Recognition of the thickness measurement position The height of the suction nozzle measured when the component is sucked by the camera, and the height of the suction nozzle when the component measured in advance is not sucked A control unit that calculates a thickness average value of the component for each type of component, and based on this value, executes a focus adjustment of the recognition camera at the component recognition position and a position adjustment of the mounting head at the component supply position. It is characterized by having.

According to a sixth aspect of the present invention, there is provided a component mounting method comprising:
A component supplied from the component supply position is taken out by a suction nozzle attached to a rotary table via a mounting head, and the rotary table is rotated to image the component suctioned by the suction nozzle from below the suction nozzle. Move to a component recognition position where a recognition camera is provided, perform component recognition, and then, at a component thickness measurement position provided with a recognition camera that captures the component sucked by the suction nozzle from the side of the suction nozzle, the thickness of the component. When mounting the component held by the suction nozzle at the component mounting position on the board based on the component recognition, the suction is measured in a state where the component is suctioned by the component thickness measurement position recognition camera. From the height of the nozzle and the height of the suction nozzle that has not suctioned the component measured in advance, calculate the average thickness of the component for each type of component. Based on, and executes at least one of position control of the mounting head in focus control or the component supply position of the recognition camera in the component recognition position.

Hereinafter, an electronic component mounting method using the electronic component mounting apparatus of the present invention will be described based on specific embodiments. Components similar to those in FIGS. 2 to 4 showing the above-described conventional example are denoted by the same reference numerals.

FIG. 1 shows an electronic component mounting apparatus according to the present invention. In FIG. 1, in order to improve the recognition accuracy and mounting accuracy of the electronic component, a focus adjustment unit for adjusting the focus of the recognition camera 7 is provided at the component recognition position C, and based on the value measured at the component thickness measurement position D. However, the difference is that a control unit 13 for adjusting the focus of the recognition camera 7 at the component recognition position C and the position of the mounting head 4 at the component supply position B is provided. This is almost the same as FIG.

More specifically, when the required electronic component 3 is supplied to the component supply position B, the mounting head 4 is lowered by the driving unit 9 and the electronic component 3 is sucked by the suction nozzle 5. When the suction nozzle 5 is lifted by the drive unit 9 while sucking the electronic component 3, the mounting head 4 sequentially moves to the stop positions S1 and S2 and arrives at the component recognition position C indicated by S3.

At the component recognition position C, a recognition camera 7 for picking up an image of the electronic component 3 sucked by the suction nozzle 5 from directly below is provided. A driving unit 10 for driving is provided.

Then, the external shape and the leads of the electronic component 3 being sucked are recognized by the recognition camera 7, and the center of the suction nozzle 5 and the center of the suction nozzle 5 are sucked based on the recognition result of each lead. Is calculated, and the correction amount of the electronic component 3 is measured.

Next, the mounting head 4 moves to the component thickness measurement position D shown in S4. At the component thickness measurement position D, a recognition camera 8 that images the electronic component 3 sucked by the suction nozzle 5 from right beside the suction nozzle 5 is provided.

The height of the suction nozzle 5 measured in a state where the electronic component 3 is sucked by the recognition camera 8 is measured, and the electronic component is measured based on the height of the suction nozzle 5 in a state where the electronic component 3 is not suctioned and measured in advance. The average value of the thickness of the part is determined for each of the three types.

The thickness of the electronic component 3 is checked by comparing the measurement result of the thickness of the electronic component 3 with the input thickness data of the electronic component which has been input in advance. 8, the height of the suction nozzle 5 alone in a state in which the electronic component 3 is not sucked, and the operation of continuously sucking, recognizing, and mounting the electronic component 3 in a state in which the electronic component 3 is sucked by the suction nozzle 5. From the result of the suction nozzle 5 height measured inside, the thickness of the electronic component 3 is obtained for each type of the sucked electronic component.

Then, the average value of the obtained thickness of the electronic component 3 is calculated and registered in the internal controller as the thickness data of the electronic component 3 to be measured. The thickness data of the electronic component to be registered is obtained by the following equation.

Average value of thickness data = (height of suction nozzle with component sucked−height of suction nozzle without suctioning component) Based on the thickness data of the electronic component, in this embodiment, The controller adjusts the focus of the recognition camera 7 at the component recognition position C and adjusts the position of the mounting head 4 at the component supply position B.

The focus adjustment at the component recognition position C is performed based on the following equation. Recognition camera height = recognition reference height-registered component thickness data Here, the recognition reference height is the height of the mounting head 4 when the lowermost surface of the suction nozzle 5 coincides with the focal plane of the recognition camera 7. It is.

Based on the above values, the recognition camera 7 at the component recognition position C is driven up and down by the drive unit 10 to adjust the focus of the recognition camera 7. By having such a control unit 13, even when the electronic component 3 is a component having a narrow lead pitch and having a relatively large thickness, the focus of the recognition camera 7 is favorably adjusted by driving the recognition camera 7 up and down. Therefore, even when components having different heights are recognized, the accuracy of mounting on the substrate can be improved without causing an error in the recognition result.

The position adjustment of the mounting head 4 at the component supply position B is performed based on the following equation. Attachment height of mounting head = mounting reference height-registered component thickness data Here, the mounting reference height is the height of the mounting head 4 when the lowermost surface of the mounting nozzle 5 coincides with the uppermost surface of the circuit board 11. That's it.

Based on this value, the component supply position B
Is performed. When the position of the mounting head 4 is adjusted as described above, a gap is hardly generated between the suction nozzle 5 and the electronic component 3, suction errors are reduced, and stable component supply can be performed.

Thereafter, the mounting head 4 moves to the component mounting position E shown in S5, descends to the side of the circuit board 11 positioned on the XY table 12, and mounts the electronic component 3 at a predetermined position. .

The mounting head 4 on which the electronic component 3 has been mounted is S6
Move to the suction nozzle return position A indicated by. Here, the position of the suction nozzle 5 is set to 0 ° by the driving unit 6.

In this state, the suction nozzle 5 sequentially moves from the stop position indicated by S7 and S8 to the component supply position B indicated by S1, and repeats the above operation. Thus, by providing the focus control means for adjusting the focus of the recognition camera 7 at the component recognition position C and providing the control unit 13 for adjusting the focus of the recognition camera 7 and the position of the mounting head 4, the electronic component 3 As a result, the electronic component mounting apparatus with high productivity and high operation rate can be realized.

In the above embodiment, the focus adjustment means is provided at the component recognition position C, and the control unit 13 performs the focus adjustment at the component recognition position C and the position adjustment of the mounting head 4 at the component supply position B. Although configured, the present invention is not limited to this, and the control unit may be configured to perform only the focus adjustment at the component recognition position C.

Further, the control unit may be configured to perform only the position adjustment of the mounting head 4 without providing the focus adjustment means at the component recognition position C.

[0045]

As described above, according to the electronic component mounting apparatus of the present invention, by providing the focus adjusting means for adjusting the focus of the recognition camera at the component recognition position, even when mounting an electronic component with a narrow lead pitch, The recognition camera can accurately recognize the electronic components having different heights, thereby improving the recognition accuracy of the components and improving the mounting rate on the board.

According to the electronic component mounting method of the present invention, the height of the suction nozzle measured in a state where the component is suctioned by the camera for recognizing the component thickness measurement position and the height of the suction nozzle measured in a state where the component is not suctioned in advance are measured. From the height, the average thickness of the part is determined for each type of part, and based on this value,
By executing at least one of the focus control of the recognition camera at the component recognition position and the position control of the mounting head at the component supply position, the gap between the component and the mounting head at the component supply position is eliminated, and the suction error is reduced. It is possible to increase the rate of attachment of components to the board by increasing the suction rate of components.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a conventional electronic component mounting apparatus.

FIG. 3 is a sectional view of a conventional electronic component mounting apparatus.

FIG. 4 is a plan view showing a configuration of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 3 Component 4 Mounting head 5 Suction nozzle 7 Recognition camera 8 Recognition camera 10 Drive unit 13 Control unit B Component supply position C Component recognition position D Component thickness measurement position

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yoshiyuki Nagai 1006 Kadoma, Kazuma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. F term (reference) 5E313 AA01 AA11 CC03 CC04 CD06 EE01 EE02 EE03 EE05 EE24 FF24 FF29

Claims (6)

[Claims] 1. A recognition method in which a component supplied from a component supply position is taken out by a suction nozzle attached to a rotary table, and the rotary table is rotated to image the component sucked by the suction nozzle from below the suction nozzle. A component mounting device that performs component recognition by moving to a component recognition position provided with a camera, and mounts a component held by the suction nozzle at a component mounting position on a board based on the component recognition. An electronic component mounting apparatus provided with a focus adjusting means for adjusting the focus of the recognition camera at a component recognition position. 2. An electronic component mounting apparatus according to claim 1, wherein said focus adjusting means comprises a drive section for vertically driving said recognition camera. 3. A component thickness measurement position provided with a recognition camera for imaging a component sucked by a suction nozzle from a side of the suction nozzle between a component recognition position and a component mounting position. From the height of the suction nozzle measured when the component is picked up by the recognition camera and the height of the suction nozzle measured in advance when the component is not picked up, the average thickness of the component is calculated for each type of component. 2. The electronic component mounting apparatus according to claim 1, further comprising: a control unit that performs focus adjustment of the recognition camera at the component recognition position based on the control. 4. Recognizing that a component supplied from a component supply position is taken out by a suction nozzle attached to a rotary table, and the rotary table is rotated to image the component sucked by the suction nozzle from below the suction nozzle. A component mounting apparatus that performs component recognition by moving to a component recognition position where a camera is provided, and mounts a component held by the suction nozzle at a component mounting position on a board based on the component recognition. A mounting head is provided between the table and the suction nozzle,
A component thickness measurement position is provided between the component recognition position and the component mounting position, which is provided with a recognition camera that images a component sucked by the suction nozzle from a side of the suction nozzle, and the component is recognized by the component thickness measurement position recognition camera The thickness average of the component is determined for each type of component from the height of the suction nozzle measured in a state in which the component is suctioned and the height of the suction nozzle in a state in which the component is not previously measured, and the component based on this value is used. An electronic component mounting apparatus provided with a control unit for adjusting the position of a mounting head at a supply position. 5. A component supplied from a component supply position is taken out by a suction nozzle attached to a rotary table via a mounting head, and the rotary table is rotated to pick up the component suctioned by the suction nozzle. A component thickness measurement position provided with a recognition camera that moves to a component recognition position where a recognition camera that captures an image from below is provided, performs component recognition, and then captures the component sucked by the suction nozzle from the side of the suction nozzle. An electronic component mounting apparatus that measures the thickness of a component at a component mounting position and mounts the component held by the suction nozzle on a substrate at a component mounting position, wherein the component is suctioned by a recognition camera at the component thickness measuring position. From the height of the suction nozzle measured in the state and the height of the suction nozzle in the state where the part is not suctioned beforehand, the average thickness of the parts is calculated for each part type An electronic component mounting apparatus, comprising: a controller that performs focus adjustment of a recognition camera at a component recognition position based on the value and adjusts a position of a mounting head at the component supply position. 6. A component supplied from a component supply position is taken out by a suction nozzle attached to a rotary table via a mounting head, and the rotary table is rotated to remove the component sucked by the suction nozzle. A component thickness measurement position provided with a recognition camera that moves to a component recognition position where a recognition camera that captures an image from below is provided, performs component recognition, and then captures the component sucked by the suction nozzle from the side of the suction nozzle. The thickness of the component was measured at the time of mounting, and when mounting the component held by the suction nozzle at the component mounting position on the board based on the component recognition, the component was suctioned by the recognition camera of the component thickness measurement position. From the height of the suction nozzle measured in the state and the height of the suction nozzle in the state where the part is not suctioned in advance, the average thickness of the parts is calculated for each part type. An electronic component mounting method for performing, based on the obtained value, at least one of focus control of a recognition camera at a component recognition position and position control of a mounting head at the component supply position.