JP2001298044A - Method for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent defective standing of a chip component. SOLUTION: A solder being used for connecting a component is fed, as a performed solid of a constant volume, to the vicinity of the component. According to the method, variation is eliminated in the volume of solder and defective standing of chip component can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device,
In particular, the present invention relates to a crystal oscillator using a crystal resonator.

[0002]

2. Description of the Related Art In recent years, among the demands for high-density mounting, a "crystal oscillator" in which a chip resonator and the like are mounted together with a semiconductor chip and a crystal resonator is mounted has attracted particular attention. The demand for crystal oscillators for electronic devices and electronic communication devices is increasing. Particularly in recent years, demand for mobile communication terminals such as mobile phones has been rapidly expanding.

Hereinafter, a conventional semiconductor device will be described with reference to the drawings. Hereinafter, a flip-chip method using solder for connecting a semiconductor chip will be described using a crystal oscillator using a chip capacitor as a component.

FIG. 1 shows a wiring board having a semiconductor chip connection pad 21 and a connection component connection pad 13 in a cavity portion. FIG. 2 is a sectional view taken along line AA ′ of FIG. The cream solder 15 is supplied onto the component connection pad 13. The cream solder 15 is a mixture of fine solder particles and flux. The flux is a liquid material having a role of removing a surface oxide film of the solder and preventing reoxidation of the solder. The method of supplying the cream solder 15 includes a dispense method and a transfer method.

[0005] Next, as shown in FIG.
7 is mounted on the component connection pad 13 after positioning. After mounting the chip capacitor 17, the wiring board 11 is heated in a reflow furnace, an oven, or the like to melt the solder and connect the chip capacitor 17 and the component connection pads 13.

Thereafter, although not shown, the semiconductor chip is connected to the semiconductor chip connection pads on the wiring board. The method of connecting the semiconductor chip includes a method using solder, a method using conductive adhesive, a method using insulating adhesive,
Examples thereof include those using an anisotropic conductive film, those using an anisotropic conductive paste, those using ultrasonic bonding, and the like. Then, sealing between the wiring board and the semiconductor chip is performed with a sealing resin as necessary. If the sealing resin is a thermosetting sealing resin, the sealing resin is cured by performing a heat treatment.

Further, a crystal oscillator connection pad is provided on an upper wall surface of the wiring board, and a connection material is supplied by a printing method, a dispensing method, a transfer method, or the like. Examples of the connection material include solder and conductive adhesive. After aligning the crystal unit, it is mounted on the crystal unit connection pad and heated in a reflow oven or oven to connect the crystal unit to the wiring board.

[0008]

In the conventional method for manufacturing a crystal oscillator, as shown in FIG. 3, solder for connecting a chip capacitor is supplied in a cream solder state by a dispense method or a transfer method. I was However, these methods use fluid cream solder, so that it is difficult to quantitatively supply the solder related to the connection of the chip capacitor. If the amount of the solder varies, a heating problem such as the Manhattan phenomenon shown in FIG.

Also, the supply of the solder by wedge bonding of the solder wire also causes a variation in the volume of the solder due to the length of the cut wire, which also tends to cause the Manhattan phenomenon.

[0010]

In order to achieve the above object, a method of manufacturing a semiconductor device according to the present invention employs the following method.

A semiconductor device according to the present invention is a wiring board having component connection pads for connecting components in a cavity portion, wherein the components are placed on the component connection pads, and the components are in contact with the component connection pads. It is characterized in that a fixed volume of conductive connecting material is supplied in the vicinity of the location.

[0012] The present invention is characterized in that the component and the component connection pad are electrically connected by melting the conductive connection material. More preferably, it is characterized in that solder is used as the conductive connecting material.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Instead of installing a conductive connecting material for connecting components between a component and a wiring board as in the present invention, instead of installing a component connecting pad component, By supplying a fixed volume of solder, the amount of solder is stabilized, and defects such as the Manhattan phenomenon can be eliminated.

[0014]

(Embodiment 1) A method of manufacturing a semiconductor device according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, a flip chip method using a chip capacitor as a component and solder as a conductive connection material is used.

FIG. 5 shows a wiring board having semiconductor chip connection pads 21 and component connection pads 13 in a cavity portion used in the present embodiment. The component connection pad 13 is formed to be slightly larger, and the flux 16 is supplied to a location where the component is to be installed and a location where the solder is to be supplied by a dispensing method or a transfer method. The flux 16 serves to remove the surface oxide film of the solder 14 and prevent re-oxidation, which will appear later.
It also has a role of temporarily fixing the chip capacitor 17. Here, since the flux 16 is a uniform liquid,
The supply amount does not have to be so strictly controlled as in the case of supplying cream solder. Here, a slightly higher viscosity of the flux 16 is effective for temporarily fixing the solder 14 to be mounted later.

Here, the component connection pads are formed to be relatively large. However, the component connection pads may be formed in a normal size, and a solder supply pad for supplying solder may be formed at a position in contact with the component connection pad. The flux at the point where the solder is supplied is supplied at a distance slightly away from the position where the chip capacitor 17 is mounted, preferably at least a distance corresponding to the external dimensions of the solder having a fixed volume.

FIG. 6 is a sectional view taken along the line BB 'of FIG. A predetermined volume of solder 14 formed in advance is supplied to the component connection pads 13. Solder 14 having a fixed volume is temporarily fixed to component connection pad 13 by flux 16. The shape of the solder 14 having a fixed volume is not particularly limited. Solder 1
The composition of No. 4 includes tin, lead, silver, copper, bismuth, zinc, antimony, indium, and alloys of these metals.

Next, as shown in FIG. 7, a chip capacitor 17 is mounted on the component connection pad 13. The chip condenser 17 is temporarily fixed by the flux 16.
In this state, a fixed volume of the solder 14 is heated and melted by a reflow furnace or an oven, and the chip capacitor 17 is electrically connected to the component connection pad 13 as shown in FIG.

From the step of connecting the semiconductor chip to the wiring board to the step of connecting the crystal resonator to the wiring board, the same manufacturing method as in the above-mentioned conventional example can be used.

In the crystal oscillator manufactured in this manner, the amount of solder related to the connection of the chip capacitor was constant, and no chip standing failure such as the Manhattan phenomenon occurred.

In this embodiment, a chip capacitor is used as a component, but any other electronic component may be used. Although solder is used as the conductive connecting material, any conductive material can be used as long as it can be supplied in a fixed volume. For example, a conductive adhesive, a conductive paste, and the like can be given. In addition, in addition to heating, optical bonding, ultrasonic bonding, or the like may be used for connection.

[0022]

As is apparent from the above description, the component does not cause a chip standing defect by the method of manufacturing a semiconductor device according to the present invention.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a conventional wiring board.

FIG. 2 is a sectional view showing a conventional technique.

FIG. 3 is a sectional view showing a conventional technique.

FIG. 4 is a sectional view showing a conventional technique.

FIG. 5 is a diagram showing a configuration of a wiring board of the present invention.

FIG. 6 is a sectional view showing an embodiment of the present invention.

FIG. 7 is a plan view showing an embodiment of the present invention.

FIG. 8 is a sectional view showing an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Wiring board 13 Component connection pad 14 Solder of fixed volume 15 Cream solder 16 Flux 17 Chip capacitor 21 Semiconductor chip connection pad

Claims (2)

[Claims] 1. A wiring board having a component connection pad for connecting a component in a cavity portion, wherein the component is placed on the component connection pad, and a fixed volume of a conductive connection material is provided between the component and the component connection pad. A method of manufacturing a semiconductor device, comprising: supplying a semiconductor device in the vicinity of a portion where the semiconductor device contacts. 2. A component is placed on a component connection pad, a fixed volume of a conductive connection material is supplied near a position where the component and the component connection pad are in contact with each other, and the conductive connection material is melted. 2. The method for manufacturing a semiconductor device according to claim 1, wherein the component and the component connection pad are electrically connected.