JP2001291791A5 - - Google Patents
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- JP2001291791A5 JP2001291791A5 JP2000102429A JP2000102429A JP2001291791A5 JP 2001291791 A5 JP2001291791 A5 JP 2001291791A5 JP 2000102429 A JP2000102429 A JP 2000102429A JP 2000102429 A JP2000102429 A JP 2000102429A JP 2001291791 A5 JP2001291791 A5 JP 2001291791A5
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000102429A JP4626008B2 (ja) | 2000-04-04 | 2000-04-04 | 半導体装置 |
| US09/826,269 US6525424B2 (en) | 2000-04-04 | 2001-04-04 | Semiconductor device and its manufacturing method |
| US10/346,744 US6876077B2 (en) | 2000-04-04 | 2003-01-17 | Semiconductor device and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000102429A JP4626008B2 (ja) | 2000-04-04 | 2000-04-04 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010121666A Division JP2010183122A (ja) | 2010-05-27 | 2010-05-27 | 半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001291791A JP2001291791A (ja) | 2001-10-19 |
| JP2001291791A5 true JP2001291791A5 (ro) | 2007-05-10 |
| JP4626008B2 JP4626008B2 (ja) | 2011-02-02 |
Family
ID=34385896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000102429A Expired - Lifetime JP4626008B2 (ja) | 2000-04-04 | 2000-04-04 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4626008B2 (ro) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006041401A (ja) * | 2004-07-29 | 2006-02-09 | Sharp Corp | 半導体装置及びその製造方法 |
| JP2017050350A (ja) | 2015-08-31 | 2017-03-09 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP6784330B2 (ja) | 2017-06-20 | 2020-11-11 | 株式会社村田製作所 | モジュールおよびその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120230A (ja) * | 1992-10-06 | 1994-04-28 | Rohm Co Ltd | 半導体部品におけるバンプ電極の形成方法及びバンプ電極付き半導体部品 |
| JP3057130B2 (ja) * | 1993-02-18 | 2000-06-26 | 三菱電機株式会社 | 樹脂封止型半導体パッケージおよびその製造方法 |
| KR100246333B1 (ko) * | 1997-03-14 | 2000-03-15 | 김영환 | 비 지 에이 패키지 및 그 제조방법 |
| JP3516592B2 (ja) * | 1998-08-18 | 2004-04-05 | 沖電気工業株式会社 | 半導体装置およびその製造方法 |
| JP2001144204A (ja) * | 1999-11-16 | 2001-05-25 | Nec Corp | 半導体装置及びその製造方法 |
| JP3750468B2 (ja) * | 2000-03-01 | 2006-03-01 | セイコーエプソン株式会社 | 半導体ウエハーの製造方法及び半導体装置 |
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2000
- 2000-04-04 JP JP2000102429A patent/JP4626008B2/ja not_active Expired - Lifetime