JP2001290272A5 - - Google Patents

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Publication number
JP2001290272A5
JP2001290272A5 JP2000105299A JP2000105299A JP2001290272A5 JP 2001290272 A5 JP2001290272 A5 JP 2001290272A5 JP 2000105299 A JP2000105299 A JP 2000105299A JP 2000105299 A JP2000105299 A JP 2000105299A JP 2001290272 A5 JP2001290272 A5 JP 2001290272A5
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JP
Japan
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group
general formula
con
embedded image
formula
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JP2000105299A
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English (en)
Japanese (ja)
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JP2001290272A (ja
JP4139548B2 (ja
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Priority to JP2000105299A priority Critical patent/JP4139548B2/ja
Priority claimed from JP2000105299A external-priority patent/JP4139548B2/ja
Priority to TW090108294A priority patent/TW591337B/zh
Priority to KR1020010018175A priority patent/KR100739423B1/ko
Priority to US09/826,850 priority patent/US6555289B2/en
Publication of JP2001290272A publication Critical patent/JP2001290272A/ja
Publication of JP2001290272A5 publication Critical patent/JP2001290272A5/ja
Application granted granted Critical
Publication of JP4139548B2 publication Critical patent/JP4139548B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000105299A 2000-04-06 2000-04-06 ポジ型フォトレジスト組成物 Expired - Fee Related JP4139548B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000105299A JP4139548B2 (ja) 2000-04-06 2000-04-06 ポジ型フォトレジスト組成物
TW090108294A TW591337B (en) 2000-04-06 2001-04-06 Positive photoresist composition
KR1020010018175A KR100739423B1 (ko) 2000-04-06 2001-04-06 포지티브 포토레지스트 조성물
US09/826,850 US6555289B2 (en) 2000-04-06 2001-04-06 Positive photoresist composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000105299A JP4139548B2 (ja) 2000-04-06 2000-04-06 ポジ型フォトレジスト組成物

Publications (3)

Publication Number Publication Date
JP2001290272A JP2001290272A (ja) 2001-10-19
JP2001290272A5 true JP2001290272A5 (https=) 2006-01-12
JP4139548B2 JP4139548B2 (ja) 2008-08-27

Family

ID=18618688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000105299A Expired - Fee Related JP4139548B2 (ja) 2000-04-06 2000-04-06 ポジ型フォトレジスト組成物

Country Status (4)

Country Link
US (1) US6555289B2 (https=)
JP (1) JP4139548B2 (https=)
KR (1) KR100739423B1 (https=)
TW (1) TW591337B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3895224B2 (ja) * 2001-12-03 2007-03-22 東京応化工業株式会社 ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法
DE10208754B4 (de) * 2002-02-28 2007-03-01 Infineon Technologies Ag Polymermaterial mit niedriger Glastemperatur für die Anwendung in chemisch verstärkten Fotoresists für die Halbleiterfertigung
US7232638B2 (en) * 2002-05-02 2007-06-19 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process
DE10246546B4 (de) * 2002-09-30 2006-10-05 Infineon Technologies Ag Verwendung eines Resistsystems und Lithographieverfahren zur Herstellung von Halbleiterbauelementen
US7285368B2 (en) * 2003-06-12 2007-10-23 Shin-Etsu Chemical Co., Ltd. Polymerizable ester having sulfonamide structure, polymer, resist composition and patterning process
JP2005031233A (ja) * 2003-07-09 2005-02-03 Tokyo Ohka Kogyo Co Ltd レジスト組成物、積層体、及びレジストパターン形成方法
KR100561842B1 (ko) * 2003-08-25 2006-03-16 삼성전자주식회사 단량체 광산발생제 조성물, 상기 조성물로 코팅된 기판,상기 단량체 광산발생제 조성물을 이용하여 기판상에서화합물을 합성하는 방법 및 상기 방법에 의하여 제조된마이크로어레이
US7488565B2 (en) * 2003-10-01 2009-02-10 Chevron U.S.A. Inc. Photoresist compositions comprising diamondoid derivatives
US7088010B2 (en) 2003-12-18 2006-08-08 Intel Corporation Chip packaging compositions, packages and systems made therewith, and methods of making same
JP4448705B2 (ja) * 2004-02-05 2010-04-14 富士フイルム株式会社 感光性組成物及び該感光性組成物を用いたパターン形成方法
US7947421B2 (en) * 2005-01-24 2011-05-24 Fujifilm Corporation Positive resist composition for immersion exposure and pattern-forming method using the same
TWI403843B (zh) 2005-09-13 2013-08-01 Fujifilm Corp 正型光阻組成物及使用它之圖案形成方法
US7566527B2 (en) * 2007-06-27 2009-07-28 International Business Machines Corporation Fused aromatic structures and methods for photolithographic applications
JP5212063B2 (ja) * 2007-12-27 2013-06-19 住友化学株式会社 感光性樹脂組成物
TWI816671B (zh) 2017-04-25 2023-10-01 德商馬克專利公司 用於產生底切圖樣輪廓之負型光阻調配物以及使光阻組合物成像之方法和用於使基板上之圖樣化光阻劑金屬化之剝離方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59108086D1 (de) 1990-12-20 1996-09-19 Siemens Ag Photoresist
KR100360395B1 (ko) * 1996-01-18 2003-03-06 삼성전자 주식회사 화학 증폭형 레지스트용 베이스 수지
KR100466301B1 (ko) * 1996-04-03 2005-09-28 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 포토레지스트조성물
KR19980026098A (ko) * 1996-10-07 1998-07-15 김광호 ArF용 실리콘 함유 포토레지스트 조성물
DE59808434D1 (de) 1997-11-28 2003-06-26 Infineon Technologies Ag Chemisch verstärkter Resist für die Elektronenstrahllithographie
US6159653A (en) * 1998-04-14 2000-12-12 Arch Specialty Chemicals, Inc. Production of acetal derivatized hydroxyl aromatic polymers and their use in radiation sensitive formulations
EP0952166B1 (de) * 1998-04-24 2003-06-25 Infineon Technologies AG Filmbildende Polymere
JPH11338151A (ja) * 1998-05-28 1999-12-10 Fuji Photo Film Co Ltd ポジ型感光性組成物
US6165682A (en) * 1999-09-22 2000-12-26 Arch Specialty Chemicals, Inc. Radiation sensitive copolymers, photoresist compositions thereof and deep UV bilayer systems thereof
KR20040040187A (ko) * 2002-11-06 2004-05-12 엘지전자 주식회사 전기압력밥솥의 오븐 잠금 장치

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