JP2001284805A - Multilayer wiring board and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer wiring board wherein manufacturing is easy, heat dissipating property and high density of wiring are realized and high precision wiring is enabled, and to provide a manufacturing method of the multilayer wiring board. SOLUTION: A core wiring board 8 is provided with a ceramics substrate 1 composed of ceramics capable of cutting, wiring patterns 5 formed on both surfaces of the substrate 1, and a through hole conductor 4 connecting parts of the wiring patterns 5 of both the surfaces. A build-up wiring layer 16 on the core wiring board 8 is provided with resin insulating layers 9 formed on the core wiring board 8, a wiring pattern 11 which is formed between the layers 9 or on the surface of the layer 9, and through hole conductor 13 connecting parts of the wiring patterns 5, 11 of both surfaces.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a core wiring board having a through-hole conductor provided on a ceramic substrate, and a build-up wiring layer having a resin insulating layer and a wiring pattern on the core wiring board. And a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, high-speed operation of semiconductor devices such as MPUs, chip sets, and video chips and high integration of semiconductor chips have been advanced. As a result, in the multilayer wiring board, the amount of heat generated by the mounted chip has been increased, the number of input / output terminals of the chip has been increased, and the number of bits has been reduced. For this reason, a multilayer wiring board on which a semiconductor element is mounted is required to have not only improved heat dissipation, but also a fine line formation technique and a multilayered board technique to cope with the increase in the number of pins and the narrow pitch of the semiconductor chip. It is rare.

Conventional wiring boards are mainly classified into glass cloth base epoxy multilayer printed wiring boards and ceramic multilayer wiring boards. 2. Description of the Related Art Epoxy multilayer printed circuit boards made of glass cloth are widely used mainly for consumer equipment because they are relatively inexpensive. A copper foil is stuck on a glass cloth base epoxy sheet having a thickness of about 100 to 200 μm, and a conductor layer serving as a wiring pattern is formed by using a photolithographic method or the like. A plurality of the sheets are laminated and pressed to obtain a multilayer wiring board. This glass cloth base epoxy multilayer printed wiring board has a line width of 50 μm and a line space of 50 μm.
This has an advantage that a minute wiring can be easily formed.

Further, in order to increase the mounting density of the glass cloth-based epoxy multilayer printed wiring board, an epoxy resin or polyimide containing no glass cloth is placed on the multilayer or single-layer glass cloth-based epoxy multilayer printed wiring board. There is a build-up wiring board in which a resin is applied or a sheet and a copper foil are alternately laminated and pressed, and one or more build-up wiring layers are added on the board. In the build-up wiring board having the glass cloth base epoxy printed wiring board as a core board, the conductor layer is formed by using a photolithographic method or the like, similarly to the glass cloth base epoxy multilayer printed wiring board.

[0005] The ceramic multilayer wiring substrate is a multilayer substrate obtained by printing a conductive paste such as W or Mo on a ceramic green sheet of alumina or the like, laminating the electrodes, and simultaneously firing the electrodes and ceramics. Further, in order to use Ag and Cu having lower resistance values as conductors, Ag,
A multilayer wiring board using low-temperature fired ceramics having a lower sintering temperature than the melting point of Cu has also been developed.

The thermal conductivity of an alumina-based multilayer wiring board is about 2
0 W / m · K, and the thermal conductivity of the low-temperature fired substrate is 2 to 5
W / m · K, which is at least one digit higher than the thermal conductivity of a resin-based substrate such as a glass cloth base epoxy multilayer printed wiring board. In the ceramic multilayer wiring board, an inner via hole (inner through-hole conductor) penetrating only a part of the inner insulating layer can be formed, and the wiring density of the inner layer can be increased. Therefore, the ceramic substrate is suitable for mounting a semiconductor chip which operates at high speed and generates a large amount of heat, and has been mainly used as a package material for a large-scale semiconductor.

Further, as a measure for improving the above-mentioned drawbacks of the ceramic multilayer wiring board, there is a build-up wiring board in which a resin-based build-up layer is formed on a multilayer or single-layer ceramic wiring board. In the build-up wiring board using the ceramic wiring board as a core substrate, heat radiation from the semiconductor chip is performed via heat-radiating through-hole conductors (heat-radiating via holes) connected to the ceramic substrate.

[0008]

In the above-mentioned glass cloth-based epoxy multilayer printed wiring board, conduction between the layers of the wiring pattern is determined by forming a through hole in the board with a drill or the like after pressing and integrating the board. This is performed by forming a through-hole conductor by a method such as electroless plating. Therefore, it is possible to form only a through-hole conductor penetrating all layers, and it is not possible to form an inner via hole (inner through-hole conductor) penetrating only a part of the inner insulating layer. For this reason, it is difficult to increase the wiring density of the inner layer. In order to cope with the multi-pin, narrow pitch of semiconductor chips, in addition to the ability to form fine wiring, the high density of the wiring in the inner layer is indispensable, and the conventional glass epoxy multilayer P board supports this Can not.

The thermal conductivity of the substrate material of the glass cloth base epoxy multilayer printed wiring board is 0.2 to 0.6 W / m.
-It is about K, which is lower than that of a ceramic substrate described later. For this reason, when a semiconductor chip operating at high speed is mounted, there is a problem that heat dissipation is poor and heat is easily stored.

Further, in the built-up wiring board using the above-mentioned glass cloth base epoxy printed wiring board as a core board, an inner through hole can be formed in the added wiring layer. Therefore, it is possible to increase the density of the inner layer wiring, which has been a problem of the glass cloth base epoxy multilayer printed wiring board, and it is possible to mount a semiconductor chip having a narrow pitch and multiple terminals at a high density. However, as in the case of an epoxy multilayer printed wiring board made of a glass cloth base material, there remains a problem that the thermal conductivity of the board material is low and the heat dissipation when a semiconductor chip operated at high speed is mounted is low.

On the other hand, a ceramic multilayer wiring board uses a conductive paste in which conductive particles are dispersed in an organic vehicle, prints this on a ceramic green sheet, laminates the green sheets, presses the green sheets, and forms a ceramic paste. It is obtained by simultaneously firing the conductive paste. For this reason, the internal wiring pattern after baking shrinks by about 15 to 20% as compared to when the conductive paste is printed. The shrinkage ratio varies about ± 0.3% even if the process conditions are strictly controlled. If the size of the substrate is 100 mm square, a dimensional error of ± 300 μm occurs. For these reasons, when mounting a multi-bin, narrow-pitch semiconductor on a ceramic multilayer wiring board, the board size is limited to about 50 mm square. In addition, since the ceramic-based multilayer substrate goes through the manufacturing process as described above,
The manufacturing cost is one order of magnitude higher than that of resin-based wiring boards, and is rarely used as wiring boards for consumer electronic devices.

Further, in the build-up wiring substrate using the above-mentioned ceramic substrate as a core substrate, since the semiconductor is not directly mounted on the ceramic substrate, the dimensional accuracy required for the wiring pattern in the inner layer portion of the ceramic substrate can be relaxed. However, the machinability of the ceramic material is poor, and it is necessary to perform through-hole processing in a green sheet state before firing. Therefore, the dimensional variation after firing is large. For this reason, a substrate having a size of about 100 mm square, which is about twice as large as the dimensional ratio of the ceramic multilayer wiring board, is a practical limit.

The present invention has been made in view of the above-mentioned problems in the conventional multi-layer wiring board, and has a multi-layer wiring board which is easy to manufacture, has good heat dissipation, and has high density of wiring, and which can achieve high-precision wiring, and a method of manufacturing the same. The purpose is to provide.

[0014]

According to the present invention, in order to achieve the above object, a wiring pattern 5 is formed on both surfaces of a ceramic substrate 1 and a part of the wiring pattern 5 is penetrated through the ceramic substrate 1. Formed through-hole conductor 4
What is connected by is referred to as a core wiring board 8. Further, on both surfaces of the core wiring board 8, the resin insulating layers 9, 9,..., The wiring patterns 11 formed on the resin insulating layers 9, 9,. Is provided with one or more built-up wiring layers 16 having through-hole conductors 13 that penetrate and connect through.

The ceramic substrate 1 is made of an easy-to-cut material made of glass ceramics or the like. After firing, the through holes 2 can be formed by drilling or the like. As a result, the wiring pattern 5 and the through-hole conductor 4 are formed on the fired ceramics substrate 1, and the precision of the wiring is improved.

Further, in the built-up wiring layer 16, a through-hole conductor 15 for heat radiation which reaches the core wiring board 8 from a surface portion of the built-up wiring layer 16 on which a heat-generating electronic component 18 such as a semiconductor chip is mounted is formed. . This allows
The heat generated in the heat-generating electronic component 18 is transferred to the ceramic substrate 1 having good heat conduction via the heat-radiating through-hole conductors 15 so as to release the heat.

That is, the multilayer board according to the present invention has the core wiring board 8 and at least one or more build-up wiring layers 16 formed on the core board 8. The core wiring board 8 includes a ceramic substrate 1 made of sintered ceramics capable of being cut and processed, a wiring pattern 5 formed on both surfaces thereof, and a wiring penetrating the ceramic substrate 1, and wiring on both surfaces thereof. And a through-hole conductor 4 for connecting a part of the pattern 5. The build-up wiring layer 16 includes a resin insulating layer 9 formed on the core wiring substrate 8, a wiring pattern 11 formed between or on the surfaces of the resin insulating layer 9, and the resin insulating layer 9. And the wiring patterns 5, 1 on both surfaces thereof.
1 and a through-hole conductor 13 for connecting a part of the through hole conductor 13.

In the resin insulating layer 9, a through-hole conductor 15 for heat radiation which penetrates the resin insulating layer 9 and reaches from the surface of the build-up wiring layer 16 to the core wiring board 8 is formed. The heat-radiating through-hole conductor 15 has a build-up wiring layer 16.
At a position where the heat-generating electronic component 18 is mounted on the surface of the device. As a result, heat released from the heat-generating electronic components 18 such as semiconductor chips mounted on the surface of the build-up wiring layer 16 is smoothly transferred to the ceramic substrate 1 having good heat conduction through the heat-radiating through-hole conductors 15. Will be released.

In order to manufacture such a multilayer board, first, a core wiring board 8 is obtained. The step of obtaining the core wiring board 8 includes a step of obtaining the ceramic substrate 1, a step of forming the through hole 2 in the ceramic substrate 1, and a step of forming the wiring pattern 5 on both surfaces of the ceramic substrate 1 and the through hole 2. Forming a through-hole conductor 4. Next, a build-up wiring layer 16 is formed on the core wiring board 8. This build-up wiring layer 1
6, a step of forming a resin insulating layer 9 on the core wiring board 8, a step of forming through holes 12 and 14 in the resin insulating layer 9, a step of forming a surface of the resin insulating layer 9 and Forming a wiring pattern 11, a through-hole conductor 13, and a heat-dissipating through-hole conductor 15 in the through holes 12, 14, respectively.

In the step of obtaining the core wiring substrate 8, a sintered ceramic that can be machined, such as a glass-based ceramic, is used as the ceramic substrate 1. Then, a through-hole 2 of the ceramic substrate 1 is formed by making a hole in the ceramic substrate 1 made of sintered ceramics that can be cut. Thereby, the wiring pattern 5 and the through-hole conductor 4 after firing can be formed, and the precision of the wiring is improved.

By performing the step of forming the build-up wiring layer 16 a plurality of times, a plurality of build-up wiring layers 16 are formed on the core wiring board 8. Through this step, the wiring pattern 11 can be formed inside the build-up wiring layer 16, and the through-hole conductor 13 (so-called single-layer conductor) penetrating only the single-layer resin insulating layer 9 and conducting the wiring pattern 11 can be formed. Via holes) can also be formed.

[0022]

Embodiments of the present invention will now be described specifically and in detail with reference to the drawings.
To manufacture the multilayer wiring board according to the present invention, first, FIG.
The core wiring board 8 is manufactured by the procedure shown in FIG. For this purpose, a fired ceramic substrate 1 as shown in FIG. 3A is prepared.

As the ceramic substrate 1, which is the main component of the core wiring substrate 8, fired and easy-to-cut ceramic is used. For example, alumina (Al ₂ O ₃ ), silica (SiO
₂ ) and a glass-mica-based ceramics substrate in which mica particles are dispersed in glass mainly containing B ₂ O ₃ , CaO, and MgO, alumina (Al ₂ O ₃ ), silica (SiO ₂ )
And glass containing B ₂ O ₃ , CaO and MgO as main components,
A glass ceramic substrate in which gSiO ₃ or CaSiO ₃ particles are dispersed is suitable.

Such an easily-cuttable ceramic substrate 1
As shown in FIG. 3B, a through hole 2 having a size of about 0.4 mmφ is formed at a predetermined position of the ceramic substrate 1 as a pilot hole of the through hole conductor 4 by using an electrodeposited diamond drill or the like. Can be perforated.

Next, a conductive paste such as an Ag paste is printed on the surface of the ceramic substrate 1 according to a predetermined pattern by a screen printing method, and a conductive paste is applied to a peripheral surface of the through hole 2. Baking is performed to form the wiring pattern 5 and the through-hole conductor 4.

As described above, in the fired easy-to-cut ceramic substrate 1, the through-hole 2 is formed in the sintered ceramic substrate 1 using an electrodeposited diamond drill, and the through-hole conductor 4 is formed together with the wiring pattern 5. Can be formed. Accordingly, there is an advantage that the core wiring substrate 8 can be manufactured with high accuracy and high yield without a decrease in dimensional accuracy due to shrinkage or the like during firing of the ceramic substrate 1.

Further, since the wiring pattern 5 and the through-hole conductor 4 can be formed with high precision, the core wiring board 8 having a larger size can be manufactured. For example, 2
Using the ceramic substrate 1 of about 00 mm to 500 mm, it is possible to obtain the core wiring substrate 8 on which pattern printing with high accuracy is performed.

Further, the ceramic substrate 1 as described above
Has a thermal conductivity of about 2.0 W / m · K, has better heat conductivity than a resin-based substrate, and has a high-speed heat-generating electronic component 18 such as a semiconductor chip, as described later. Also has excellent heat dissipation. In addition, even if the ceramic substrate 1 is thin, a large strength can be secured, and the thickness of the wiring substrate itself can be reduced. For example, a ceramic substrate 1 having a thickness of about 0.1 mm can be used. Finally, as shown in FIG. 3D, a sealing member 7 made of epoxy resin is embedded in the through hole 2 to obtain a core wiring board 8.

Next, using this core wiring board 8, FIG.
According to the procedure shown in (1), one or more build-up wiring layers 16 are formed thereon. FIG. 4 shows a step of forming two build-up wiring layers 16 on one surface of the core wiring substrate 8. First, a thermoplastic resin is applied to one surface of a metal foil 10 such as a Cu foil, and this thermoplastic resin is pressed onto one surface of the core substrate 8 as shown in FIG. The thermoplastic resin becomes the resin insulating layer 9 of the build-up wiring layer 16.

Next, as shown in FIG. 4B, after removing the metal foil 10 at positions where the through holes 12 and 14 are to be formed in the resin insulating layer 9, the resin insulating layer 9 is formed using a laser processing machine. Are formed at predetermined positions. Next, as shown in FIG. 4C, a conductive layer is formed in the through holes 12 and 14 by electroless plating, and the through hole conductor 13 and the heat dissipation through hole conductor 1 are formed.
5 are formed, and the first built-up wiring layer 16 is formed.
Was formed.

As shown in FIG. 4D, another built-up wiring layer 16 having a wiring pattern 11, a through-hole conductor 13 and a heat-radiating through-hole conductor 15 is provided on the built-up wiring layer 16. To form By repeating this as necessary, a plurality of built-up wiring layers 16 can be formed.

The heat-radiating through-hole conductors 15 of the upper and lower built-up wiring layers 16 are provided at the same position, and are formed so as to penetrate from the surface of the core wiring board 8 to the surface of the upper built-up wiring layer 16. . The heat-radiating through-hole conductor 15 is formed on the uppermost build-up wiring layer 1.
6 is provided at a position where a heat-generating electronic component 18 such as a semiconductor chip is mounted on the surface of 6.

FIG. 1 shows an example in which two layers of the build-up wiring layer 16 are provided on the other surface of the core wiring board 8 by the same process as described above. Thus, a multilayer wiring board is completed. FIG. 2 shows an example in which electronic components are mounted on both surfaces of the multilayer wiring board. In FIG. 2, a heat-generating electronic component 18 such as a semiconductor chip is mounted on the upper surface side together with a chip-shaped electronic component 17 which is a passive component. Have been. A heat-generating electronic component 18 such as a semiconductor chip is also mounted on the lower surface of the multilayer wiring board in FIG.

As described above, the through-hole conductor 1 for heat radiation
Reference numeral 5 is provided at a position where a heat-generating electronic component 18 such as a semiconductor chip is mounted on the surface of the uppermost built-up wiring layer 16. The heat generated from the heat-generating electronic component 18 is transmitted to the ceramic substrate 1 having good heat conductivity through the heat-radiating through-hole conductors 15 penetrating the resin insulating layers 9 having low heat conductivity, and is radiated. You. The thermal conductivity of the ceramic substrate 1 as described above is about 2.0 W / m · K, and is excellent in heat conductivity and heat dissipation.

[0035]

Next, an example of the present invention will be described in detail with specific numerical values. (Example 1) As the ceramic substrate 1, 200 m in length and width
m, the crystallinity of 0.2mm thick tetrasilicon mica is 50%
Was used. When the thermal conductivity of the ceramic substrate 1 was measured by a laser flash method, it was 2.0 W / m · K.

By drilling using an electrodeposited diamond drill, a through hole 2 having a diameter of 0.4 mm was drilled at a predetermined position on the ceramic substrate 1 to form a pilot hole of the through hole conductor 4. The life of the drill at this time was about 10,000 holes / hole.

Next, an Ag paste is printed on the surface of the ceramic substrate 1 according to a predetermined pattern by a screen printing method, and the Ag paste is printed on the peripheral surface of the through hole 2.
A paste was applied, and the Ag paste was fired to form a wiring pattern 5 and a through-hole conductor 4. Then, a sealing member 7 made of epoxy resin is formed in the through hole 2.
Was embedded to obtain a core wiring board 8.

On the other hand, a thermoplastic resin was applied to one surface of a Cu foil as the metal foil 10, and the thermoplastic resin was pressed on one surface of the core substrate 8 to form a resin insulating layer 9. Next, the through hole 1 is formed in the resin insulating layer 9.
After removing the metal foil 10 at the positions where the metal foils 2 and 14 were to be formed, the through holes 12 and 14 were formed at predetermined positions of the resin insulating layer 9 using a laser processing machine. Next, a conductive layer was formed in the through holes 12 and 14 by electroless plating, a through hole conductor 13 and a heat dissipation through hole conductor 15 were formed, and a built-up wiring layer 16 was formed.

In the same manner as described above, the wiring pattern 11 and the through-hole conductor 1 are formed on the built-up wiring layer 16.
3 and another built-up wiring layer 16 having a heat-radiating through-hole conductor 15 are formed. The heat-radiating through-hole conductors 15 of the upper and lower built-up wiring layers 16 are provided at the same position. The through-hole was formed so as to reach the surface of the upper built-up wiring layer 16.

The thermal conductivity of the above ceramic substrate is 2 W
/ M · K, and has a higher heat radiation property than the resin-based substrate. In addition, since a large number of multilayer wiring boards can be collectively obtained from a large-sized board, a low-cost multilayer wiring board can be obtained.

(Example 2) As a ceramic substrate 1,
Glass-CaSiO with 300mm length and 0.2mm thickness
_{A 3} ceramic substrate was used. When the thermal conductivity of the ceramic substrate 1 was measured by a laser flash method, it was 2.0 W / m · K.

By drilling using an electrodeposited diamond drill, a through hole 2 of 0.4 mmφ was drilled at a predetermined position on the ceramic substrate 1 to form a pilot hole of the through hole conductor 4. The life of the drill at this time was about 3000 holes / piece. Hereinafter, a multilayer wiring board was manufactured in the same manner as in Example 1.

Example 3 As the ceramic substrate 1,
Glass-MgSi with vertical and horizontal 500mm, thickness 0.25mm
An O ₃ -based ceramic substrate was used. The thermal conductivity of the ceramic substrate 1 measured by a laser flash method was 2.7 W / m · K.

By drilling using an electrodeposited diamond drill, a through hole 2 of 0.4 mmφ was drilled at a predetermined position on the ceramic substrate 1 to form a pilot hole of the through hole conductor 4. The life of the drill at this time was about 2500 holes / hole. Hereinafter, a multilayer wiring board was manufactured in the same manner as in Example 1.

Comparative Example 1 As the ceramic substrate 1,
An alumina substrate (purity 98%) having a length and width of 300 mm and a thickness of 0.2 mm was used. The thermal conductivity of the ceramic substrate 1 was measured by a laser flash method.
W / m · K.

A through hole 2 having a diameter of 0.4 mm was drilled at a predetermined position on the ceramic substrate 1 by a drilling process using an electrodeposited diamond drill to form a pilot hole for the through hole conductor 4. However, the electrodeposited diamond was severely worn and the drill was broken when five holes were drilled. For this reason, a multilayer substrate could not be formed.

(Comparative Example 2) 300 mm in length and width, 0.2 in thickness
mm to obtain a ceramic substrate 1 made of alumina (purity: 98%). A through hole is formed in a ceramic green sheet using a laser processing machine, and the ceramic green sheet is heated at 1550 ° C. in air.
Was fired.

When the hole position accuracy was measured for 20 baked substrates, the variation was ± 0.4%, and the maximum value of the hole position deviation from the reference position was 1080 μm.
For this reason, the ceramic green sheets are laminated,
The ceramic substrate obtained by sintering it at 1550 ° C. in the air after pressure bonding cannot be used for exposure and screen printing with a mask, so that a multilayer wiring board cannot be manufactured.

[0049]

As described above, in the multilayer wiring board and the method of manufacturing the same according to the present invention, the build having the core wiring board 8 using the ceramic substrate 1 which is an easy-to-cut material and the resin insulating layer formed thereon is provided. With the up wiring layer 16, a multilayer wiring board can be easily manufactured. In addition, it is possible to obtain a multilayer wiring board that has good heat dissipation and enables high-density and high-precision wiring.

[Brief description of the drawings]

FIG. 1 is a vertical sectional side view showing an example of a multilayer wiring board according to the present invention.

FIG. 2 is a vertical sectional side view showing an example in which electronic components are mounted on the multilayer wiring board.

FIG. 3 is a vertical sectional side view showing a step of manufacturing a core wiring board of the multilayer wiring board according to a procedure.

FIG. 4 is a longitudinal sectional side view showing a step of forming a build-up wiring layer on a core wiring board of the multilayer wiring board according to a procedure;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 ceramic substrate 4 through-hole conductor 5 wiring pattern 8 core wiring board 9 resin insulating layer 4 wiring pattern 11 wiring pattern 12 through-hole 13 through-hole conductor 14 through-hole 15 heat-radiating through-hole conductor 16 build-up wiring layer 18

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 X 7/20 7/20 F F-term (Reference) 5E322 AA11 FA04 5E346 AA02 CC18 EE09 EE12 EE13 EE33 FF05 FF13 FF18 FF22 GG15

Claims (7)

[Claims] 1. A multilayer wiring board having a plurality of insulating layers, wherein a part of a wiring pattern formed between or on the surfaces of the insulating layers is connected via a through-hole conductor penetrating the insulating layers. , A core wiring board (8), and at least one or more build-up wiring layers (16) formed on the core board (8), and the core wiring board (8) can be cut. A ceramic substrate (1) made of sintered ceramics, a wiring pattern (5) formed on both surfaces thereof, and a wiring pattern (5) formed on the ceramic substrate (1) and penetrating the ceramic substrate (1). And a through-hole conductor (4) connecting the core wiring board (8) and the build-up wiring layer (16).
A resin insulating layer (9) formed thereon, a wiring pattern (11) formed between or on the surfaces of the resin insulating layer (9), and formed through the resin insulating layer (9); A multilayer wiring board comprising a through-hole conductor (13) for connecting a part of the wiring patterns (5) and (11) on both surfaces thereof. 2. A heat-radiating through-hole conductor (15) penetrating the resin insulating layer (9) and reaching the core wiring board (8) from the surface of the build-up wiring layer (16).
The multilayer wiring board according to claim 1, wherein is formed. 3. The multilayer wiring board according to claim 2, wherein the ceramic substrate is made of a glass-based ceramic. 4. The heat-dissipating through-hole conductor (15) is provided on the surface of the build-up wiring layer (16) at a position where the heat-generating electronic component (18) is mounted. The multilayer wiring board according to any one of claims 1 to 3. 5. A multilayer wiring board having a plurality of insulating layers, wherein a part of a wiring pattern formed between or between the insulating layers is connected via a through-hole conductor penetrating the insulating layers. In the manufacturing method, a step of obtaining a ceramic substrate (1), a step of forming a through hole (2) in the ceramic substrate (1), and a step of forming both sides of the ceramic substrate (1) and the through hole (2). A step of forming a wiring pattern (5) and a through-hole conductor (4) to obtain a core wiring board (8); a step of forming a resin insulating layer (9) on the core wiring board (8); A step of forming through holes (12) and (14) in the resin insulating layer (9); and forming a wiring pattern (11) on the surface of the resin insulating layer (9) and the through holes (12) and (14). Throughho Forming a conductor (13) and a through-hole conductor (15) for heat dissipation, and forming the build-up wiring layer (1).
6) forming a multilayer wiring board. 6. The ceramic substrate (1) according to claim 5, wherein the through holes (2) are formed by drilling a ceramic substrate (1) made of sintered ceramics. Of manufacturing a multilayer wiring board. 7. A core wiring board (8) by forming a step of forming a build-up wiring layer (16) a plurality of times.
7. The method for manufacturing a multilayer wiring board according to claim 5, wherein a plurality of build-up wiring layers (16) are formed thereon.