JP2001284791A - Method for inspecting soldering onto printed board to be inspected - Google Patents
Method for inspecting soldering onto printed board to be inspectedInfo
- Publication number
- JP2001284791A JP2001284791A JP2000098086A JP2000098086A JP2001284791A JP 2001284791 A JP2001284791 A JP 2001284791A JP 2000098086 A JP2000098086 A JP 2000098086A JP 2000098086 A JP2000098086 A JP 2000098086A JP 2001284791 A JP2001284791 A JP 2001284791A
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- Japan
- Prior art keywords
- light
- reflected light
- light receiving
- solder
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Image Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Image Analysis (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はレーザ光を半田部分
に照射し、該半田部分からの反射光を受光して半田付け
状態を検査する方法において、前記半田材料の表面が鏡
面となる鉛半田ではなく、表面が粗面である、例えば、
ビスマス半田であっても反射光から半田付け状態を正確
に検出できるようにした被検査プリント基板の半田付け
検査方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of irradiating a laser beam to a solder portion, receiving reflected light from the solder portion and inspecting a soldering state, wherein the solder material has a mirror-finished surface. Rather, the surface is rough, for example,
The present invention relates to a soldering inspection method for a printed circuit board to be inspected, which is capable of accurately detecting a soldering state from reflected light even with bismuth solder.
【０００２】[0002]
【従来の技術】従来、レーザ光を半田部分に照射し、該
半田部分からの反射光を受光して半田付け状態を検査す
る検査装置として、例えば、本出願人会社が出願した特
開平４−１９０１４５号（特公平７−８６４６９号）公
報に開示されているものがある。その開示技術は、半田
付け部分からの反射光を複数に分割した受光面（箱状の
内面を複数に領域分割した受光面）で受光することによ
り、該受光面の位置から反射光の角度（反射角）を検出
して半田付け状態の良否を判定するといったものであっ
た。2. Description of the Related Art Conventionally, as an inspection device for irradiating a laser beam to a solder portion and receiving reflected light from the solder portion to inspect a soldering state, for example, Japanese Patent Application Laid-Open No. There is one disclosed in Japanese Patent Publication No. 190145 (JP-B-7-86469). According to the disclosed technology, the reflected light from the soldering portion is received by a light receiving surface divided into a plurality of portions (a light receiving surface obtained by dividing a box-shaped inner surface into a plurality of regions) so that the angle of the reflected light ( (Reflection angle) to determine the quality of the soldered state.
【０００３】すなわち、前記箱状の受光面を下から２，
４，６と言うように３分割し、前記半田付け部分からの
予め設定した閾値レベル以上の反射光が２の受光面２で
受光した時には反射光を２の数列を割り当て、一方、反
射光が４の受光面４で受光した時には反射光を４の数列
を割り当て、さらに、反射光が受光面２，４で受光した
場合には反射光を２と４の間である３（実際には３の受
光面はない）の数列を割り当てていた。[0003] That is, the box-shaped light-receiving surface is placed at
When the reflected light from the soldered portion is equal to or greater than a predetermined threshold level and is received by the two light receiving surfaces 2, the reflected light is assigned a numerical sequence of 2 and the reflected light is divided into three. When the light is received on the light receiving surface 4 of the light receiving surface 4, the reflected light is assigned a numerical sequence of 4, and when the reflected light is received on the light receiving surfaces 2 and 4, the reflected light is between 2 and 4 (actually 3). (There is no light receiving surface).
【０００４】そして、半田の材料として鉛半田を利用し
ていたが、鉛半田は半田付けした状態において表面が鏡
面状態となっているので、比較的反射光が正反射して拡
散することがなく、従って、レーザ光の光量が機種によ
って多少ことなっていても受光素子が受光する光量の差
が大きいため、閾値レベルを一定に設定しても、各受光
面２，４，６および各受光面の間である３，５の数値を
割り当て、反射光による半田形状を確認することができ
た。Although lead solder is used as a material for the solder, since the surface of the lead solder is mirror-finished in a soldered state, the reflected light is relatively regularly reflected and is not diffused. Therefore, even if the amount of laser light varies slightly depending on the model, the difference in the amount of light received by the light receiving element is large. Therefore, even if the threshold level is set to be constant, each of the light receiving surfaces 2, 4, 6 and each light receiving surface Numerical values of 3, 5 between them were assigned, and the shape of the solder due to the reflected light could be confirmed.
【０００５】すなわち、図６（ａ），（ｂ）のように機
種による受光レベルの変化があっても閾値に対する受光
レベルはレーザ光が収束されているため、閾値を越えて
いることとなり、従って、反射光による半田形状を確認
することが可能である。なお、図６は後述する受光ボッ
クスを固定した状態で、レーザ光を掃引して半田部分か
らの３つの反射光を受光した場合の例を示したものであ
る。That is, as shown in FIGS. 6 (a) and 6 (b), even if there is a change in the light receiving level depending on the model, the light receiving level with respect to the threshold value exceeds the threshold value because the laser beam is converged. It is possible to confirm the shape of the solder by the reflected light. FIG. 6 shows an example in which a laser beam is swept and three reflected lights from the solder portion are received in a state where a light receiving box described later is fixed.
【０００６】[0006]
【発明が解決しようとする課題】近年、鉛が体内に入る
と神経障害、生殖機能障害、貧血、高血圧、発癌性等の
様々な害を及ぼす等によって鉛の使用が問題となってい
る。そして、半田の分野にも及び鉛半田の使用規制が叫
ばれている。In recent years, the use of lead has become a problem due to various harms such as neuropathy, reproductive dysfunction, anemia, hypertension and carcinogenicity when lead enters the body. Also, the use of lead solder is regulated in the field of solder.
【０００７】ところで、鉛に変わる半田付け材料として
は、ビスマス半田等の鉛フリー半田があるが、このビス
マス半田は表面の仕上がりが非常に粗くなり、正反射に
よる強い反射光（反射光の主成分）が得られないため、
従来のような反射光が受光面２，４にまたがった場合に
３の数値に割り当てるといったことができず、反射方向
を識別できない。As a soldering material instead of lead, there is a lead-free solder such as bismuth solder. However, this bismuth solder has a very rough surface finish, and is strongly reflected by regular reflection (the main component of reflected light). ) Is not available,
When the reflected light straddles the light receiving surfaces 2 and 4 as in the related art, it cannot be assigned to a numerical value of 3, and the reflection direction cannot be identified.
【０００８】すなわち、図５（ａ），（ｂ）に示すよう
に、機種によって受光レベルが（ａ）から（ｂ）に低下
すると、３，５が検出できなくなってしまう。そこで、
閾値を下げることが考えられるが、閾値を下げると反射
光が拡散されていることから波形の裾野が広がっている
ために、多くの受光素子が反射光を受光することとな
り、同じく、どの方向に反射光が集中しているかの判別
が行えなくなるといった問題が生じた。That is, as shown in FIGS. 5 (a) and 5 (b), if the light receiving level is lowered from (a) to (b) depending on the model, 3 and 5 cannot be detected. Therefore,
It is conceivable to lower the threshold, but when the threshold is lowered, the reflected light is diffused, and since the base of the waveform is widened, many light receiving elements will receive the reflected light, and in which direction There is a problem that it is not possible to determine whether the reflected light is concentrated.
【０００９】本発明は前記した問題点を解決せんとする
もので、その目的とするところは、各受光素子による受
光光量から反射光の反射方向を検出できるようにしたの
で、表面が粗面となるビシマス半田等の鉛フリー半田で
あっても反射方向を確実に検出することが可能な被検査
プリント基板の半田付け検査方法を提供せんとするにあ
る。An object of the present invention is to solve the above-mentioned problem. An object of the present invention is to detect the direction of reflected light from the amount of light received by each light-receiving element. It is an object of the present invention to provide a method for inspecting the soldering of a printed circuit board to be inspected, which can reliably detect the reflection direction even with lead-free solder such as bismuth solder.
【００１０】[0010]
【課題を解決するための手段】本発明の被検査プリント
基板の半田付け検査方法は前記した目的を達成せんとす
るもので、その手段は、内面に複数段の受光面を全面に
わたって形成した受光ボックスの前記複数の受光面が、
半田面からの反射光を受光した時に該レーザ光の光量か
ら反射光の方向を判断する半田付け検査方法において、
ビスマス等の鉛フリー半田よりの反射光を受光した全て
の受光面からの出力の合成ベクトルを求めることによ
り、反射光の方向を判断するようにしたことを特徴とす
る。SUMMARY OF THE INVENTION A solder inspection method for a printed circuit board to be inspected according to the present invention is intended to achieve the above-mentioned object. The plurality of light-receiving surfaces of the box,
In the soldering inspection method of determining the direction of the reflected light from the amount of the laser light when receiving the reflected light from the solder surface,
The direction of the reflected light is determined by obtaining a combined vector of outputs from all light receiving surfaces that have received reflected light from a lead-free solder such as bismuth.
【００１１】[0011]
【発明の実施の形態】以下、本発明に係る被検査プリン
ト基板の半田付け検査方法の一実施の形態を図面と共に
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for inspecting soldering of a printed circuit board to be inspected according to the present invention will be described below with reference to the drawings.
【００１２】図１は中央断面図、図２は下面側から見た
底面図にして、１はトップ受光素子１１と、アップ受光
素子１２およびサイド受光素子１３とから構成された箱
状の受光ボックスにして、トップ受光素子１１は２段重
ね状態で水平に配置された受光素子１１ａと、垂直に配
置された受光素子１１ｂと、水平に配置された受光素子
１１ｃとより構成されている。なお、受光素子１１ｃの
中央にはレーザ光を通過させるための孔１１ｃ1 が形成
されている。FIG. 1 is a central sectional view, and FIG. 2 is a bottom view as viewed from below, and 1 is a box-shaped light receiving box composed of a top light receiving element 11, an up light receiving element 12, and a side light receiving element 13. The top light receiving element 11 is composed of a light receiving element 11a arranged horizontally in a two-tiered state, a light receiving element 11b arranged vertically, and a light receiving element 11c arranged horizontally. Incidentally, the hole 11c 1 for passing the laser light is formed in the center of the light receiving element 11c.
【００１３】前記アップ受光素子１２は前記受光素子１
１ａと垂直方向で一部において重なる状態で配置された
受光素子１２ａと、該受光素子１２ａと垂直方向で一部
において重なる状態で配置された受光素子１２ｂと、該
受光素子ｂと垂直方向で一部において重なる状態で配置
された受光素子１２ｃとより構成されている。The up light receiving element 12 is provided with the light receiving element 1.
1a, a light receiving element 12a arranged to partially overlap in the vertical direction, a light receiving element 12b arranged to partially overlap in the vertical direction with the light receiving element 12a, And a light receiving element 12c arranged in an overlapping state in the portion.
【００１４】前記サイド受光素子１３は前記受光素子１
２ｃと垂直方向で一部重なる状態で多数段配置された受
光素子１３ａで構成されている。そして、各トップ受光
素子１１、アップ受光素子１２およびサイド受光素子１
３は図２に示すように、底面から見て４分割されてい
る。The side light receiving element 13 is a light receiving element 1
The light receiving element 13a includes a plurality of light receiving elements 13a arranged in a plurality of stages so as to partially overlap with the light receiving element 2c in the vertical direction. Then, each top light receiving element 11, up light receiving element 12, and side light receiving element 1
3, as shown in FIG. 2, is divided into four when viewed from the bottom.
【００１５】このように構成した受光ボックス１の開口
面側と、被検査プリント基板２とは対向して配置され、
該被検査プリント基板２が載置されたＸ−Ｙステージ
（図示せず）がＸ，Ｙ軸方向に移動し、あるいは、被検
査プリント基板２が固定状態で受光ボックス１がＸ，Ｙ
軸方向に移動するようになっている。The opening side of the light receiving box 1 thus configured and the printed circuit board 2 to be inspected are arranged to face each other.
An XY stage (not shown) on which the inspection target printed circuit board 2 is mounted moves in the X and Y axis directions, or the light receiving box 1 is moved to the X and Y directions while the inspection target printed circuit board 2 is fixed.
It moves in the axial direction.
【００１６】そして、図３に示す被検査プリント基板２
上の被検査部品の半田付け部分２１が、受光ボックス１
における前記レーザ光を通過させる孔１１ｃ1 の真下に
来た状態で、受光ボックス１の上方に取付けられている
レーザ光発光素子（図示せず）より孔１１ｃ1 を介して
レーザ光を被検査部品の半田付け部分２１に照射する。The printed circuit board 2 to be inspected shown in FIG.
The soldered portion 21 of the component to be inspected is
In a state of coming directly below the hole 11c 1 passing the laser light in, parts for inspection laser light through a hole 11c 1 from the laser beam emitting device is mounted above the light-receiving box 1 (not shown) Irradiated on the soldering portion 21 of FIG.
【００１７】照射されたレーザ光は半田付け部分２１か
ら反射されるが、この半田はビスマス半田等の鉛フリー
半田であることから、反射光は拡散されて多数の受光面
で反射光を受光することとなる。そこで、本発明にあっ
ては、図３に示すように、例えば、反射光がトップ受光
素子１１、アップ受光素子１２およびサイド受光素子１
３の全てにおいて受光したとする。The emitted laser light is reflected from the soldering portion 21. Since this solder is a lead-free solder such as bismuth solder, the reflected light is diffused and the reflected light is received by a large number of light receiving surfaces. It will be. Therefore, according to the present invention, as shown in FIG. 3, for example, the reflected light is reflected by the top light receiving element 11, the up light receiving element 12, and the side light receiving element 1.
It is assumed that light is received in all three.
【００１８】なお、太線の実線矢印ａ，ｂ，ｃは各トッ
プ受光素子１１、アップ受光素子１２およびサイド受光
素子１３よりの出力（電圧）であり、長さが出力の大き
さを示している。そして、前記出力ａと出力ｂとの合成
ベクトルを求め１点鎖線のａｂを求め、また、前記出力
ｂと出力ｃとの合成ベクトルを求め一点鎖線のｂｃを求
める。The bold solid arrows a, b, and c are the outputs (voltages) from the top light receiving element 11, the up light receiving element 12, and the side light receiving element 13, and the length indicates the magnitude of the output. . Then, a combined vector of the output a and the output b is obtained to obtain a one-dot chain line ab, and a combined vector of the output b and the output c is obtained to obtain a one-dot chain line bc.
【００１９】さらに、前記合成ベクトルａｂ，ｂｃとの
合成ベクトルを求めると点線のｄが求められ、この合成
ベクトルｄの方向の反射光が最も強いものとなる。そこ
で、この合成ベクトルｄの方向であるアップ受光素子１
２が反射光を受光したと判断する。すなわち、半田付け
部分２１の反射光はアップ受光素子１２が受光したと結
果を出力するものである。Further, when a combined vector with the combined vectors ab and bc is found, a dotted line d is found, and the reflected light in the direction of the combined vector d is the strongest. Therefore, the up light receiving element 1 in the direction of the composite vector d
2 determines that the reflected light has been received. That is, the reflected light from the soldered portion 21 outputs a result when the up light receiving element 12 receives the light.
【００２０】なお、ベクトルの成分化は図４に示すよう
に、Ｚ方向のベクトル成分化Ｚは、 Ｚ＝Ｒｓｉｎθ Ｘ方向のベクトル成分化Ｘは、 Ｘ＝Ｒｃｏｓθ・ｓｉｎθ Ｙ方向のベクトル成分化Ｙは、 Ｙ＝Ｒｃｏｓθ・ｓｉｎθ となり、反射角を求めることができる。As shown in FIG. 4, the vectorization Z in the Z direction is as follows: Z = Rsinθ The vectorization X in the X direction is: X = Rcosθ · sinθ The vectorization Y in the Y direction Becomes: Y = Rcos θ · sin θ, and the reflection angle can be obtained.
【００２１】また、従来、反射光がサイド受光素子１３
より下側にある場合は求めることができなかったが、本
発明にあっては、アップ受光素子１２の受光出力よりも
図１に示すサイド受光素子１３における下側に配置され
ている受光素子の受光出力が非常に大きい場合には、反
射光はサイド受光素子１３がカバーしていない被検査プ
リント基板２と略平行な方向に合成ベクトルがあると判
断できる。Conventionally, the reflected light is transmitted to the side light receiving element 13.
However, in the present invention, the light-receiving output of the light receiving element arranged below the side light-receiving element 13 shown in FIG. If the received light output is very large, it can be determined that the reflected light has a combined vector in a direction substantially parallel to the printed circuit board 2 to be inspected, which is not covered by the side light receiving element 13.
【００２２】また、本実施の形態にあっては、垂直方向
の反射光検出範囲をトップ、アップ、サイドの３種類の
受光素子としたものについて説明したが、この垂直方向
の反射検出範囲は３種類のものに限定されるものではな
く、細分化することにより、より正確な反射光の反射角
を知ることができる。In this embodiment, the vertical reflected light detection range is described as three types of light receiving elements of top, up, and side. However, the vertical reflection detection range is three. The present invention is not limited to the type, and by subdividing it, a more accurate reflection angle of the reflected light can be known.
【００２３】[0023]
【発明の効果】本発明は前記したように、反射光を受光
した全ての受光面からの出力の合成ベクトルを求めるこ
とにより、反射光の方向を判断するようにしたので、表
面が粗面であるビシマス半田等の鉛フリー半田であって
も反射方向（角度）を確実に検出することが可能となっ
て、正確な半田付け状態の判断が行える等の効果を有す
るものである。As described above, according to the present invention, the direction of the reflected light is determined by obtaining the composite vector of the outputs from all the light receiving surfaces that have received the reflected light. Even with a lead-free solder such as a certain bismuth solder, it is possible to reliably detect the reflection direction (angle), and to have an effect that an accurate determination of a soldering state can be performed.
【図１】本発明の被検査プリント基板き半田付け検査方
法に使用する受光ボックスの縦断面図である。FIG. 1 is a longitudinal sectional view of a light receiving box used in a soldering inspection method for a printed circuit board to be inspected according to the present invention.
【図２】同上の受光ボックスを底面側から見た底図面で
ある。FIG. 2 is a bottom view of the light-receiving box as viewed from the bottom side.
【図３】原理を示す合成ベクトルの説明図である。FIG. 3 is an explanatory diagram of a synthetic vector showing a principle.
【図４】ベクトルの成分化を示す説明図である。FIG. 4 is an explanatory diagram showing componentization of a vector.
１ 受光ボックス １１ トップ受光素子 １２ アップ受光素子 １３ サイド受光素子 ２ 被検査プリント基板 ２１ 半田付け部分 DESCRIPTION OF SYMBOLS 1 Receiving box 11 Top light receiving element 12 Up light receiving element 13 Side light receiving element 2 Printed circuit board to be inspected 21 Solder part
─────────────────────────────────────────────────────
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【手続補正書】[Procedure amendment]
【提出日】平成１２年４月５日（２０００．４．５）[Submission date] April 5, 2000 (200.4.5)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００９[Correction target item name] 0009
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００９】本発明は前記した問題点を解決せんとする
もので、その目的とするところは、各受光素子による受
光光量から反射光の反射方向を検出できるようにしたの
で、表面が粗面となるビスマス半田等の鉛フリー半田で
あっても反射方向を確実に検出することが可能な被検査
プリント基板の半田付け検査方法を提供せんとするにあ
る。An object of the present invention is to solve the above-mentioned problem. An object of the present invention is to detect the direction of reflected light from the amount of light received by each light-receiving element. It made be a lead-free solder bicycloalkyl scan mass soldering in which St. provide soldering inspection method of objective printed circuit board capable of reliably detecting the reflected direction.
【手続補正３】[Procedure amendment 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１０[Correction target item name] 0010
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１０】[0010]
【課題を解決するための手段】本発明の被検査プリント
基板の半田付け検査方法は前記した目的を達成せんとす
るもので、その手段は、内面に受光面を全面にわたって
形成した受光ボックスの前記複数の受光面が、半田面か
らの反射光を受光した時に該レーザ光の光量から反射光
の方向を判断する半田付け検査方法において、ビスマス
等の鉛フリー半田よりの反射光を受光した全ての受光面
からの出力の合成ベクトルを求めることにより、反射光
の方向を判断するようにしたことを特徴とする。Soldering inspection method of the objective printed circuit board of the present invention, in order to solve the problems] intended to St achieve the object mentioned above, the means, the light-receiving box forming the entire surface of the light receiving surface to the inner surface In the soldering inspection method in which the plurality of light receiving surfaces determine the direction of the reflected light from the amount of the laser light when receiving the reflected light from the solder surface, all the reflected light from the lead-free solder such as bismuth is received. The direction of the reflected light is determined by calculating a composite vector of the output from the light receiving surface.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２３[Correction target item name] 0023
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００２３】[0023]
【発明の効果】本発明は前記したように、反射光を受光
した全ての受光面からの出力の合成ベクトルを求めるこ
とにより、反射光の方向を判断するようにしたので、表
面が粗面であるビスマス半田等の鉛フリー半田であって
も反射方向（角度）を確実に検出することが可能となっ
て、正確な半田付け状態の判断が行える等の効果を有す
るものである。As described above, according to the present invention, the direction of the reflected light is determined by obtaining the composite vector of the outputs from all the light receiving surfaces that have received the reflected light. and there be a lead-free solder bicycloalkyl scan mass soldering makes it possible to reliably detect the reflection direction (angle) and has the effect of such can be carried out determination of the precise soldering state.
【手続補正５】[Procedure amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図面の簡単な説明[Correction target item name] Brief description of drawings
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の被検査プリント基板き半田付け検査方
法に使用する受光ボックスの縦断面図である。FIG. 1 is a longitudinal sectional view of a light receiving box used in a soldering inspection method for a printed circuit board to be inspected according to the present invention.
【図２】同上の受光ボックスを底面側から見た底図面で
ある。FIG. 2 is a bottom view of the light-receiving box as viewed from the bottom side.
【図３】原理を示す合成ベクトルの説明図である。FIG. 3 is an explanatory diagram of a synthetic vector showing a principle.
【図４】ベクトルの成分化を示す説明図である。FIG. 4 is an explanatory diagram showing componentization of a vector.
【図５】検査機種が異なった場合における鉛フリー半田
の閾値に対する反射光のレベルを示すグラフである。 FIG. 5: Lead-free solder for different inspection models
6 is a graph showing the level of reflected light with respect to the threshold value of FIG.
【図６】検査機種が異なった場合における鉛半田の閾値
に対する反射光のレベルを示すグラフである。 FIG. 6 shows a threshold value of lead solder for different inspection models .
6 is a graph showing the level of reflected light with respect to.
【符号の説明】 １ 受光ボックス １１ トップ受光素子 １２ アップ受光素子 １３ サイド受光素子 ２ 被検査プリント基板 ２１ 半田付け部分[Description of Signs] 1 light receiving box 11 top light receiving element 12 up light receiving element 13 side light receiving element 2 printed circuit board to be inspected 21 soldering part
【手続補正６】[Procedure amendment 6]
【補正対象書類名】図面[Document name to be amended] Drawing
【補正対象項目名】図５[Correction target item name] Fig. 5
【補正方法】追加[Correction method] Added
【補正内容】[Correction contents]
【図５】 FIG. 5
【手続補正７】[Procedure amendment 7]
【補正対象書類名】図面[Document name to be amended] Drawing
【補正対象項目名】図６[Correction target item name] Fig. 6
【補正方法】追加[Correction method] Added
【補正内容】[Correction contents]
【図６】 FIG. 6
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5B057 AA03 BA02 CA02 CA08 CA12 CA16 CB17 CC01 CG06 CH01 DA03 DB02 DB05 DB09 DC02 5E319 AC01 BB01 CC22 CD53 GG20 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 5B057 AA03 BA02 CA02 CA08 CA12 CA16 CB17 CC01 CG06 CH01 DA03 DB02 DB05 DB09 DC02 5E319 AC01 BB01 CC22 CD53 GG20
Claims (1)
形成した受光ボックスの前記複数の受光面が、半田面か
らの反射光を受光した時に該レーザ光の光量から反射光
の方向を判断する半田付け検査方法において、ビスマス
等の鉛フリー半田よりの反射光を受光した全ての受光面
からの出力の合成ベクトルを求めることにより、反射光
の方向を判断するようにしたことを特徴とする被検査プ
リント基板の半田付け検査方法。When a plurality of light-receiving surfaces of a light-receiving box having a plurality of light-receiving surfaces formed on the entire inner surface thereof receive reflected light from a solder surface, the direction of the reflected light is determined from the amount of the laser light. In the soldering inspection method, the direction of the reflected light is determined by obtaining a composite vector of the outputs from all the light receiving surfaces that have received the reflected light from the lead-free solder such as bismuth. Inspection Method of soldering inspection of printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000098086A JP2001284791A (en) | 2000-03-31 | 2000-03-31 | Method for inspecting soldering onto printed board to be inspected |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000098086A JP2001284791A (en) | 2000-03-31 | 2000-03-31 | Method for inspecting soldering onto printed board to be inspected |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001284791A true JP2001284791A (en) | 2001-10-12 |
Family
ID=18612616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000098086A Pending JP2001284791A (en) | 2000-03-31 | 2000-03-31 | Method for inspecting soldering onto printed board to be inspected |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001284791A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106296652A (en) * | 2016-07-25 | 2017-01-04 | 凌云光技术集团有限责任公司 | Profile and the extracting method of angle point information in a kind of pcb board design drawing |
-
2000
- 2000-03-31 JP JP2000098086A patent/JP2001284791A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106296652A (en) * | 2016-07-25 | 2017-01-04 | 凌云光技术集团有限责任公司 | Profile and the extracting method of angle point information in a kind of pcb board design drawing |
| CN106296652B (en) * | 2016-07-25 | 2018-09-18 | 凌云光技术集团有限责任公司 | The extracting method of profile and angle point information in a kind of pcb board design drawing |
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