JP2001274583A - Shield structure of electronic apparatus case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem where, related to a conventional structure of an electronic apparatus case, a conductive buffer material is inserted between engaging one plate and the other plate to fill a gap for raised shield effect, however, in this method, the thickness of the buffer material must be equivalent to a gap between one plate and the other plate, or more, resulting in bad workability at inserting. SOLUTION: A step part 3a constitutes a protruding part while an upper side plate 2b together with an engagement fitting 2c constitutes a recessed part, and engagement between the protruding and recessed parts provides shield. An upper-side plate side projection 3c is provided on the upper surface of the step part 3a while a fitting side projection 3d is provided on the lower surface of the step part 3a while displaced from the position corresponding to the upper- side plate side projection 3c. Thus, at engagement, the step part 3a is pressurized at a position where the upper-side plate side projection 3c and the fitting side projection 3d are displaced each other. Since the upper-side plate side projection 3c and the fitting side projection 3d always contact the upper side plate 2b and the engagement fitting 2c for conductivity, a shield effect is always provided for improved workability at inserting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield structure of an electronic device housing, and more particularly to a shield structure of an electronic device housing which improves workability by eliminating the need for a conductive cushioning material at a fitting portion for shielding. .

[0002]

2. Description of the Related Art FIG. 5 is a configuration diagram of an electronic equipment housing using a conventional shield structure. In the figure, 1 is a base chassis, 2 is a front panel, 2a is a fastening screw for fixing the front panel 2 to the base chassis 1, and 2b is an upper plate.
Reference numeral 3 denotes an upper cover, 3a denotes a step bent portion that fits with the upper plate 2b, 3b denotes a fastening screw that fixes the upper cover 3 to the base chassis 1, and 4 denotes a step bent portion 3a that fits with the upper plate 2b.
This is a conductive cushioning material that eliminates a gap generated between them and enhances the shielding effect. FIG. 6 is a side sectional view of the electronic device housing shown in FIG.

[0003] In such a conventional shield structure of an electronic device housing, a gap is easily formed in a fitting surface between an upper plate 2 b of the front panel 2 and a step bending portion 3 a provided in front of the upper cover 3. Therefore, a conductive cushioning material 4 as shown in FIG. 5 is attached to the upper surface of the step bending portion 3a to enhance the shielding effect. Thus, when assembling the electronic device housing shown in FIG.
Is attached with the fastening screw 3b. Next, the front panel 2 is attached to the base chassis 1 with fastening screws 2a.

In this case, the stepped portion 3a to which the cushioning material 4 is attached is pressed down under the upper plate 2b. As a result, the upper plate 2b and the step bent portion 3a press the cushioning material 4 against each other, eliminating the gap between the upper plate 2b and the step bent portion 3a to enhance the shielding effect.

[0005]

The shield structure of a conventional electronic device housing is constructed as described above, and has the following problems. (1) As described above, the conductive cushioning material 4 is required on the fitting surface between the upper plate 2b of the front panel 2 and the step bent portion 3a of the upper cover 3 in order to enhance the shielding effect. In this case, since the cushioning material 4 having a thickness greater than the gap between the upper plate 2b and the step bending portion 3a is attached, the fitting becomes tight, and the workability in assembling / removing is poor.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the cover can be easily assembled and provided by providing a shielding effect on the fitting surface without using a conductive cushioning material. An object of the present invention is to provide a shield structure of an electronic device housing that can be removed.

[0007]

According to the present invention, there is provided a shield structure for an electronic device housing, comprising: a first protrusion provided on one of the fitting surfaces of a convex plate and a concave plate; A second projection provided on the other mating surface of the first projection so as to be displaced from the first projection.
And the convex plate is pressed from each of the first and second projections at the time of fitting.

Further, in the shield structure for an electronic device housing according to the next invention, at least one of the first projection and the second projection has a negative inclination with respect to the fitting direction.

Further, in the shield structure of the electronic device housing according to the next invention, at least one of the first projection and the second projection is a triangular projection in the fitting direction.

Further, in the shield structure for an electronic device housing according to the present invention, a hole is provided at a position opposite to the fitting direction of the convex plate to improve the flexibility of the convex plate.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of an electronic device housing using the shield structure shown in Embodiment 1 of the present invention, FIG. 2 is an enlarged view of a portion A shown in FIG. 1, and FIG. 3 is a side view of the electronic device housing shown in FIG. FIG. 4 is a cross-sectional view and FIG. 4 is a view taken along the line BB of FIG. 3, and the same reference numerals as those in FIG.

In the drawing, reference numeral 2c denotes a fitting provided inside the front panel 2 by spot welding in parallel with the upper plate 2b, 2d denotes a guide provided on the fitting 2c, and 3c denotes a step bent portion 3a. An upper plate-side protrusion provided on the upper surface (front surface) and in contact with the upper plate 2b, a metal-side protrusion 3d provided on the lower surface (back surface) of the step bending portion 3a and in contact with the fitting 2c;
3e is an elongated hole provided to improve the flexibility of the step bending portion 3a.

As a result, if the step bending portion 3a is a convex portion, a concave portion is formed by the upper plate 2b and the fitting 2c so as to fit with the convex portion. As shown in FIGS. 2 to 4, the upper plate-side protrusion 3 c and the metal-side protrusion 3 d are arranged so as to be shifted from each other. The upper plate side projection 3c and the metal fitting side projection 3d are formed as triangular projections having a negative inclination toward the fitting direction. Further, the elongated hole 3e is provided at a position opposite to the fitting direction, and enhances the flexibility of the step bending portion 3a.

In such a shield structure of the electronic device housing shown in FIG. 1, when the step bending portion 3a is inserted between the upper plate 2b and the fitting 2c as shown in FIG. The projection 3c comes into contact with the upper plate 2b, and the fitting side projection 3d
Contacts the fitting 2c. In addition, since the upper plate-side protrusion 3c and the metal-side protrusion 3d are arranged so as to be shifted from each other, as shown in FIG. 4, the upper plate 2b and the upper plate The side projections 3c and the fitting metal fittings 2c and the metal fitting side projections 3d surely come into contact with each other.

Further, when the flexibility of the step bending portion 3a is improved by the elongated hole 3e as described above, the step bending portion 3a bends in the direction of the mating projection with the mating projection as a fulcrum.
And upper plate side projection 3c and fitting metal fitting 2c and metal fitting side projection 3
d comes into contact more reliably.

Thus, the upper cover 3 and the front panel 2
The shield can be reliably formed without inserting a conductive cushioning material into the gap between the fitting portions, and a shield structure that can be easily assembled and removed can be obtained. The distance between the upper plate-side protrusion 3c or the metal-side protrusion 3d is set to be equal to or less than the wavelength of the electromagnetic wave to be shielded. Further, since the upper plate-side projection 3c and the metal-side projection 3d have a negative inclination toward the fitting direction, the pressing force gradually increases in the fitting direction, so that a smooth fitting is possible.

The upper plate-side projection 3c and the bracket-side projection 3d
Is formed by triangular projections, so that it can be easily formed.
Further, the fitting is further facilitated by the guide portion 2d provided on the fitting 2c. Further, in this embodiment, the upper plate-side protrusion 3c and the metal-side protrusion 3d are formed on the step bending portion 3a which is relatively easy to form, but the above-described protrusion may be provided on any of the fitting surfaces. Absent. Further, in this embodiment, the shield structure between the upper plate 2b and the step bending portion 3a is shown, but it goes without saying that the shield structure may be used in other places.

[0018]

According to the present invention, in a shield structure of an electronic device housing, a first protrusion is provided on one of the fitting surfaces of a convex plate and a concave plate, and a second protrusion is provided on the convex plate. The first protrusion is provided on the other fitting surface of the first and second concave portions so as to be shifted from each other, and the convex plate is pressed from each of the first and second protrusions at the time of fitting. Therefore, one fitting surface and the first protrusion and the other fitting surface and the second protrusion are surely in contact with each other, so that a conductive cushioning material is not inserted into the gap between the fitting surfaces. This also has the effect of improving workability.

Further, according to the next invention, in the shield structure of the electronic device housing, at least one of the first projection and the second projection has a negative inclination with respect to the fitting direction. Since the pressing force gradually increases in the fitting direction, there is an effect that smooth fitting is possible.

According to the next invention, the shield structure of the housing of the electronic device has a simple structure since at least one of the first projection and the second projection is a triangular projection in the fitting direction. There is an effect that can be formed.

According to the next invention, the shield structure of the electronic device housing has a hole at a position opposite to the fitting direction of the convex plate to improve the flexibility of the convex plate. There is an effect that the contact with the fitting surface becomes more reliable.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an electronic device housing using a shield structure according to a first embodiment of the present invention;

FIG. 2 is an enlarged view of a portion A shown in FIG.

FIG. 3 is a side sectional view of the electronic device housing shown in FIG. 1;

FIG. 4 is a view taken along a line BB in FIG. 3;

FIG. 5 is a configuration diagram of an electronic device housing using a conventional shield structure.

FIG. 6 is a side sectional view of the electronic device housing shown in FIG. 5;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base chassis 2 Front panel 2b Upper plate 2c Fitting metal fitting 2d Guide part 3 Top cover 3a Step bending part 3c Upper plate side protrusion 3d Metal side protrusion 3e Slot

Claims (4)

[Claims] 1. A shield structure of an electronic device housing which is made conductive by fitting a convex plate and a concave plate, wherein: a first protrusion provided on one of the fitting surfaces of the convex plate and the concave plate; A second protrusion provided on the other fitting surface of the convex plate and the concave plate so as to be displaced from the first protrusion, wherein the convex plate is provided with the first protrusion when fitted. A shield structure for an electronic device housing, wherein the shield structure is pressed from each of the first and second protrusions. 2. The electronic device housing according to claim 1, wherein at least one of the first protrusion and the second protrusion has a negative inclination with respect to the fitting direction. Shield structure. 3. The method according to claim 1, wherein at least one of the first projection and the second projection is a triangular projection toward the fitting direction. Electronic device housing shield structure. 4. The electronic device according to claim 1, wherein a hole is provided at a position opposite to a fitting direction of the convex plate to improve flexibility of the convex plate. Equipment housing shield structure