JP2001267404A - Substrate mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To hold a rear surface of a substrate in a non-contact state while maintaining planarity of the substrate. SOLUTION: A chuck main body 2 holds a substrate. A rim 3 is provided on the chuck main body 2 according to the shape of a substrate 50. Suction ports 31-33 are provided in the upper surface of the rim portion and suck support members 51-53 to hold the substrate 50. Air supply ports 71-76 spray the substrate 50 with air from below. Air exhaust ports 41-46, 91-96 discharge air from a space formed by the substrate 50, the chuck main body 2 and the rim 3. Since the substrate 50 is sprayed with air from the air supply ports 71-76, the rear surface of the substrate 50 is not brought into contact with the chuck main body 2. Since a pressure (air) in a predetermined amount is supplied to the space formed by the substrate 50, the chuck main body 2 and the rim 3 and then discharged, a predetermined air pressure is maintained in the space. This air pressure corrects bending due to a dead weight of the substrate 50. Thus, the bending of the substrate is reduced and the planarity is maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate mounting device for vacuum-holding and holding these substrates in a process of manufacturing semiconductor devices such as ICs and LSIs, liquid crystal display devices, and magnetic disks.

[0002]

2. Description of the Related Art In a process of manufacturing a semiconductor device, a liquid crystal display device, a magnetic disk, and the like, various processes are performed by holding a substrate by vacuum suction with a substrate mounting device. Conventional substrate mounting devices, for example, when the substrate is a wafer substrate,
A disk-shaped chuck main body, a ring-shaped rim provided along the outer periphery of the chuck main body, countless columnar projection pins provided inside the rim, a chuck main body, a rim, and a wafer substrate. And a vacuum path for evacuating the enclosed space. The rim has a shape equal to or slightly smaller than the outer peripheral shape of the wafer substrate. Further, the projecting pins are for maintaining the flatness of the wafer substrate on the chuck body, and are innumerably arranged on the chuck body in the rim at intervals of 2 to 4 mm, and are cylindrical pins having the same height as the rim. It is composed of

[0003]

In the conventional substrate mounting apparatus, since the rear surface of the wafer substrate comes into contact with the projection pins and the rim, the contacted portion is contaminated. Therefore, when the side surface of the wafer substrate is supported so as not to contact the back surface, the wafer substrate is bent by the weight of the wafer substrate itself, and the flatness of the substrate itself is impaired, which is an obstacle to various processes.

[0004] The present invention has been made in view of the above points, and has as its object to provide a substrate mounting apparatus capable of holding the back surface in a non-contact state while maintaining the flatness of the substrate.

[0005]

According to a first aspect of the present invention, there is provided a substrate mounting apparatus, comprising: a chuck body for holding a substrate; rim means provided on the chuck body in accordance with a shape of the substrate; and an upper surface of the rim means. Supporting means for supporting the side surface portion of the substrate, air supply means for blowing air from below to the substrate, and discharging air in a space formed by the substrate, the chuck body and the rim. And an air discharging means. The side surface of the substrate is supported by the supporting means and the rim means of the chuck body. When the substrate is supported only by the side portions, the vicinity of the center of the substrate is bent by its own weight. Therefore, an air gap is formed between the substrate and the chuck body by blowing air from the air supply means to the substrate so that the back surface of the substrate does not contact the chuck body. When the substrate is supported by the supporting means, a space is formed by the substrate, the chuck body, and the rim means. Since a predetermined amount of pressure (air) is supplied from the air supply means to the space and is sequentially discharged from the air discharge means, the inside of the space is maintained at a predetermined pressure. This pressure further corrects the deflection of the substrate due to its own weight, reduces the deflection of the substrate, and maintains the flatness.

According to a second aspect of the present invention, in the first aspect, one or more of the air exhaust means are provided on at least one of a side surface of the rim means and a lower surface of the chuck body. It is. The air exhaust means includes an opening provided on a side surface of the rim means and an opening provided on the chuck body. An appropriate number of openings are provided in the chuck body and the rim means to maintain the amount of air supplied from the air supply means and the pressure in the space at predetermined values.

According to a third aspect of the present invention, in the substrate mounting apparatus according to the first or second aspect, the air supply means has an island shape having a flat portion lower than the rim means provided near the center of the chuck body. And a plurality of air gap forming portions. The air supply means is provided in the vicinity of the center of the chuck main body, thereby blowing air to the portion of the substrate having the largest deflection, thereby preventing the back surface of the substrate from coming into contact with the chuck main body. Further, since the air gap forming portion is a flat portion lower than the rim means, air flows through this flat portion and an air gap is formed, so that the flatness of the substrate can be maintained.

According to a fourth aspect of the present invention, there is provided a substrate mounting apparatus according to the first, second or third aspect, wherein air spindle means for rotatably fixing the chuck body and rotational driving force are applied to the air spindle means. Motor means. This means that the chuck body is rotated at high speed by motor means, and the substrate surface is irradiated with laser light,
When the surface inspection is performed, the surface inspection can be effectively performed by maintaining the flatness of the substrate.
The substrate mounting apparatus according to the fifth aspect is characterized in that:
In any one of the above, the rim means, the upper surface of which is inclined toward the center of the chuck body,
It is configured to be in contact with only the side surface of the substrate. Even when the substrate is mounted on the rim means, since the upper surface of the rim means is inclined, the back surface of the substrate does not contact the rim means, and only the side surface thereof comes into contact with the upper surface of the rim means. .

According to a sixth aspect of the present invention, in the substrate mounting apparatus according to the fifth aspect, the support means is provided rotatably on an upper surface of the rim means and has a contact portion which comes into contact with a side surface of the substrate. A lever member made of a substantially rectangular plate material,
The lever member is configured to include a suction port for suctioning the lever member to the rim means, and a spring member that constantly applies a rotational force in a direction in which the lever member is separated from the chuck body. When the substrate is held by the supporting means, the contact portion of the lever member is pressed against the side surface of the substrate, and is suction-held at the position by the suction port. As a result, the substrate is pressed against the rim means, and only the semicircular side surface of the substrate is supported in contact with the contact portion and the upper surface of the rim means. When the suction operation of the suction port is stopped, the lever member returns to the original position by the rotational force of the spring member, and releases the substrate.

[0010]

An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a view showing a schematic configuration of a substrate mounting apparatus according to the present invention, and is a view of the substrate mounting apparatus as viewed from above. FIG. 2 is a sectional view of FIG.
2A is a cross-sectional view taken along a plane AA in FIG. 1, and FIG. 2B is a cross-sectional view taken along a plane BB in FIG. 1.

The substrate mounting apparatus 1 according to this embodiment is
The chuck body 2 includes a disk-shaped chuck body 2, a rotation motor 6, and an air spindle 5 that transmits the rotation driving force of the rotation motor 6 to the chuck body 2. The rotary motor 6 is provided with an encoder as a rotation detector, but is not shown here.

On the outer periphery of the chuck body 2, a wafer substrate 5
A ring-shaped rim 3 along the shape of 0 is provided.
On the upper surface side of the rim 3, suction ports 31 to 33 for vacuum suction of the support members 51 to 53 supporting the wafer substrate 50 are provided. Air is sucked from the suction ports 31 to 33 through a vacuum path 3D provided inside the chuck body 2 and a vacuum path 3E provided inside the air spindle 5. On the side surface of the rim 3, there are provided side surface exhaust ports 41 to 46 for discharging air in a space 4 formed by the chuck body 2 and the wafer substrate 50. The wafer substrate 50 is supported at three points only by the side members by the supporting members 51 to 53. In FIG. 1, illustration of the support members 51 to 53 is omitted.

Near the center of the chuck body 2, there are provided air gap forming portions 61 to 66 having air supply ports 71 to 76. The air supply ports 71 to 76 are supplied with air from the outside via an air supply path 77 provided inside the chuck body 2 and an air supply path 78 provided inside the air spindle 5. . The air gap forming portions 61 to 66 have a fan shape having a flat portion lower than the rim 3. Central air exhaust grooves 81 to 86 for exhausting the air supplied from the air supply ports 71 to 76 toward the outer periphery are provided between the air gap forming portions 61 to 66. In addition, the air gap forming portions 61 to 66
Between the rim 3 and the rim 3, lower surface exhaust ports 91 to 96 are provided for discharging air in a space 4 formed by the chuck body 2 and the wafer substrate 5 from the back side of the chuck body 2. Therefore, the air blown out from the air supply ports 71 to 76 hits the back surface of the wafer substrate 50, and from the flat portions of the air gap forming portions 61 to 66 to the central air exhaust grooves 81 to 76.
It flows into 86. The air that has flowed into the central air exhaust grooves 81 to 86 flows toward the outer periphery through the central air exhaust grooves 81 to 86, and the side exhaust ports 41 to 46 and the lower exhaust ports 91 to 86.
Exhausted from 96. As a result, a predetermined amount of air gap is always formed between the air gap forming portions 61 to 66 and the wafer substrate 50, and the space 4 surrounded by the wafer substrate 50, the chuck body 2 and the rim 3 has a predetermined width. Atmospheric pressure will be maintained.

FIG. 3 is a view showing a detailed structure of the substrate supporting member 53 (51, 52). FIG.
FIG. 3 is a view of the device 3 as viewed from above, and FIG. 3B is a diagram showing a partial cross-sectional structure thereof. The substrate support member 53 includes a lever 55 made of a substantially rectangular plate material, and a cylindrical pin 56 attached to the lever 55.
Is rotatably attached to the rim 3 via a ball bearing 57. A retaining ring 59 is provided below the pin 56 so that the pin 56 does not come off. Although not shown, the lever 55 is provided with a spring member that constantly applies a rotational force in the direction of the arrow 58. The contact portion 60 comes into contact with the side surface of the wafer substrate 50 at two places in the lever 55. Also, rim 3
Is inclined toward the center of the chuck body 2, so that only the side surface of the wafer substrate 50 contacts the upper surface of the rim 3, and the back surface of the wafer substrate 50 does not contact the upper surface of the rim 3. I have. Therefore, when the wafer substrate 50 is held by the substrate support member 53, only the semicircular side surface of the wafer substrate 50 is supported by the contact portion 60 and the rim 3. The lever 55 is rotated in the direction opposite to the arrow 58 by a guide roller (not shown) provided near the outer periphery of the rim 3, and is pressed against the side surface of the wafer substrate 50. Also, lever 55
Is sucked and held by the suction port 33 at that position, and operates so as to press the wafer substrate 50 against the rim 3 side. Note that the lever 55 has a shape that functions to press the wafer substrate 50 against the rim 3 by centrifugal force when the chuck main body 2 is rotated by the force of the rotary motor 6, so that the wafer substrate 50 is more reliably held. Accordingly, when the rotation motor 6 stops and the chuck body 2 stops, when the vacuum suction operation of the suction port 33 is stopped, the lever 55 moves to the position of the lever 55a drawn by the one-dot chain line, and opens the wafer substrate 50. It is supposed to. Similarly, the suction port 31 suction-holds the substrate support member 51, and the suction port 32 suction-holds the lever 55 of the substrate support member 52.

The operation of the substrate mounting apparatus 1 according to this embodiment for correcting the deflection of the wafer substrate 50 will be described. When the wafer substrate 50 is supported by the substrate supporting members 51 to 53 and the upper surface of the rim 3, the vicinity of the center of the wafer substrate 50 is bent by its own weight. At this time, the air supply ports 71 to 71 of the air gap forming portions 61 to 66 are provided.
Since an appropriate amount of air is ejected from the air 76, the air causes the wafer substrate 50 to be separated from the air gap forming portions 61 to 66.
The predetermined air gap is maintained without contacting the air gap.

On the other hand, the wafer substrate 50 is
53 and the rim 3, the wafer substrate 5
0, a space 4 surrounded by the chuck body 2 and the rim 3 is formed. Since a predetermined amount of air is supplied to the space 4 from the air supply ports 71 to 76 and discharged from the side exhaust ports 41 to 46 and the lower surface exhaust ports 91 to 96, the inside of the space 4 is maintained at a predetermined pressure. Dripping. This pressure causes the wafer substrate 5
The deflection caused by the weight of zero is corrected, the deflection of the wafer substrate 50 is reduced, and the wafer substrate 50 is maintained almost flat.

In the above embodiment, the case where one air supply port 71-76 is provided in each of the air gap forming portions 61-66 has been described. Needless to say, this is optional. The number of the air gap forming portions 61 to 66, the side exhaust ports 41 to 46 or the lower exhaust ports 91 to 96 is as follows.
The number is not limited to six, and any number may be provided. The shape of the air gap forming portions 61 to 66 may be an arbitrary shape such as a circle or a square other than the fan shape. Although the case where the shape of the chuck body is a disk is described, a substrate such as a square other than this (for example,
Needless to say, the shape can be appropriately changed according to the shape of a photomask, a glass substrate, a liquid crystal substrate, a color filter, and the like. Further, three or more support members may be provided.

[0018]

According to the substrate mounting apparatus of the present invention, there is an effect that the back surface can be held in a non-contact state while maintaining the flatness of the substrate.

[Brief description of the drawings]

FIG. 1 is a view showing a schematic configuration of a substrate mounting apparatus according to the present invention.

FIG. 2 is a cross-sectional view of FIG. 1, and FIG.
FIG. 2B is a cross-sectional view taken along a plane BB in FIG. 1.

FIG. 3 is a diagram illustrating a detailed configuration of a substrate supporting member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Board mounting apparatus 2 ... Chuck main body 3 ... Rim 31-33 ... Suction port 41-46 ... Exhaust port 5 ... Air spindle 50 ... Wafer substrate 51-53 ... Substrate support member 6 ... Rotary motor 61-66 ... Air gap formation Portions 71 to 76 Air supply ports 81 to 86 Central air exhaust grooves 91 to 96 Exhaust ports

Claims (6)

[Claims] A chuck body for holding a substrate; rim means provided on the chuck body in accordance with a shape of the substrate; supporting means for supporting a side portion of the substrate on an upper surface of the rim means; Air supply means for blowing air from below, and air discharge means for discharging air in a space formed by the substrate, the chuck body and the rim. Board mounting equipment. 2. The substrate mounting apparatus according to claim 1, wherein one or a plurality of the air exhaust units are provided on at least one of a side surface of the rim unit and a lower surface of the chuck body. 3. The air supply means according to claim 1, wherein the air supply means comprises a plurality of island-shaped air gap forming portions provided near the center of the chuck body and having a flat portion lower than the rim means. A substrate mounting device, characterized in that: 4. The air conditioner according to claim 1, further comprising: air spindle means for rotatably fixing the chuck body; and motor means for applying a rotational driving force to the air spindle means. Characteristic board mounting equipment. 5. The rim means according to claim 1, wherein an upper surface of the rim means is inclined toward a center of the chuck body and is in contact with only a side surface of the substrate. A substrate mounting apparatus characterized by the above-mentioned. 6. The lever member according to claim 5, wherein the support means is provided on a top surface of the rim means so as to be rotatable, and comprises a substantially rectangular plate member provided with a contact portion which comes into contact with a side surface of the substrate. A substrate mounting apparatus, comprising: a suction port for sucking the lever member to the rim means; and a spring member for constantly applying a rotational force in a direction in which the lever member is separated from the chuck body.