JP2001261059A - Parts feed tape and packing method and unpacking method for the parts feed tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a parts feed tape easily fitting and removing a top tape and a carrier tape and also easily fitting and removing parts, generating no damages to the parts and tapes and to be reused. SOLUTION: The parts feed tape is constituted of a belt-shaped carrier tape 1a with storage sections 5 storing the parts 6 and a belt-shaped top tape 2a to be fitted and removed on the carrier tape 1a covering the surface of the storage sections 5 and extended along the longitudinal direction of the carrier tape 1a. The carrier tape 1a is provided with a slit 3 formed in the direction crossing the longitudinal direction of the carrier tape 1a. The top tape 2a is provided with wings 4 engage with slits 3 of the carrier tape 1a extended along longitudinal direction of the carrier tape 1a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply tape used for supplying electronic components to a component supply device of an automatic mounting machine.

[0002]

2. Description of the Related Art A component supply tape is composed of a band-shaped carrier tape in which a storage portion for storing components is formed, and a band-shaped top tape covering the surface of the storage portion in order to prevent the stored components from jumping out. You.

In the longitudinal direction of the carrier tape, feed holes are formed at equal pitches. When the component supply tape is set in the component supply device, the teeth of the wheel engage with the feed holes and the component supply tape is moved. The carrier tape is conveyed to the component supply position at an equal pitch, and the carrier tape is peeled off at the component supply position, and the component is taken out from the storage portion that has been opened.

As such a component supply tape, for example, a component supply tape for packaging a semiconductor device as described below can be mentioned. Embossing (extrusion) is performed on a carrier tape made of vinyl chloride resin, and a plurality of storage sections are formed along the long side direction. A plurality of transport feed holes are formed on one side in the longitudinal direction of the carrier tape.

A semiconductor device is housed in a housing formed by embossing, and PET is applied so as to cover the upper surface of the housing.
(Polyethylene Tele-Phatarate) A top tape having a two-layer structure of a resin and a polyethylene resin is disposed.

Then, the top tape and the carrier tape are bonded by thermocompression bonding or an adhesive by a taping device, and the semiconductor device is packed with the carrier tape and the top tape, and a component supply tape for packing the semiconductor device is obtained.

The component supply tape is wound on a take-up reel and set in the component supply device as described above.
It is transported while peeling off the top tape from the carrier tape. At the component supply position, the semiconductor device that can be taken out is taken out and mounted on a mounting board.

[0008]

However, in the above-mentioned component supply tape, it is necessary to fix the carrier tape and the top tape by thermocompression bonding or an adhesive at the time of packing the semiconductor device. Since it is necessary to peel off the tape, the packaging and unpacking steps of the semiconductor device are complicated, and it is difficult to attach and detach the semiconductor device.

In addition, since the top tape and the carrier tape are fixed by thermocompression bonding or an adhesive, variations in the adhesive force may cause damage to the component supply tape when peeling off the top tape or hinder removal of the semiconductor device. There is.

Further, when the carrier tape and the top tape are fixed with an adhesive, a composition change occurs in an adhesive portion, and when the top tape is peeled off, the top tape or the carrier tape is formed due to stringing or uneven bonding of the adhesive. The parts supply tape cannot be reused because the parts are torn.

An object of the present invention is to solve the above-mentioned problems, and to provide a component supply tape which is easy to attach and detach between a top tape and a carrier tape and to attach and detach components, without damage to components and tapes, and which can be reused. And

[0012]

The component supply tape according to the present invention is characterized in that the configuration of the engaging portion between the carrier tape and the top tape is special.

According to the present invention, the top tape and the carrier tape can be easily attached and detached, and the components can be easily attached and detached, and there is no damage to the components and the tape itself, and a reusable component supply tape can be realized. .

[0014]

In the component supply tape according to the first aspect of the present invention, the surface of the accommodating portion of the strip-shaped carrier tape having the accommodating portion for accommodating components can be attached to and detached from the carrier tape. A component supply tape covered with a band-shaped top tape extending along the longitudinal direction of the carrier tape, wherein the carrier tape has a slit formed in a direction crossing the longitudinal direction of the carrier tape, Is characterized in that blades extending along the longitudinal direction of the carrier tape and engaging with the slits of the carrier tape are formed.

According to a second aspect of the present invention, in the component supply tape according to the first aspect of the present invention, the surface of the accommodating portion of the strip-shaped carrier tape having an accommodating portion for accommodating components can be detachably attached to the carrier tape. A component supply tape covered with a band-shaped top tape extending along the longitudinal direction of the carrier tape, wherein the carrier tape has a cut formed in a direction intersecting the longitudinal direction of the carrier tape, and the leading end is formed in the longitudinal direction of the carrier tape. Forming a tongue portion elastically deformed along the top tape so that a portion of the top tape is engaged with the tongue portion while the top tape covers the surface of the storage portion of the carrier tape. I do.

According to a third aspect of the present invention, in the component supply tape according to the second aspect, the top tape extends along a direction intersecting the longitudinal direction of the carrier tape and engages with the tongue piece of the carrier tape. A convex portion is formed.

According to a fourth aspect of the present invention, there is provided a method for packing a component supply tape, comprising: a carrier tape formed with a storage portion for storing a component and having a slit formed in a direction intersecting the longitudinal direction; When packing electronic components with a top tape formed with blades that engage with the slits of the extended carrier tape, electronic components are put into the storage portion of the carrier tape, and the surface of the storage portion storing the components is cleaned by a carrier. The electronic component is packed by covering the tape with a top tape, covering the tape, engaging the blades of the top tape with the slits of the carrier tape, connecting the carrier tape and the top tape.

According to a fifth aspect of the present invention, there is provided a method for unpacking a component supply tape, wherein when the electronic component packaged as described above is taken out, one end of the top tape is pulled up in a direction away from the surface of the carrier tape. An electronic package that has been packed by elastically deforming the blades of the top tape engaged with the slits of the carrier tape, releasing the connection between the carrier tape and the top tape, and opening the surface of the storage portion of the carrier tape. It is characterized in that parts can be taken out.

According to a sixth aspect of the present invention, there is provided a method for packing a component supply tape according to the present invention. When packing an electronic component, a carrier tape having a deformable tongue piece and a top tape that extends along the longitudinal direction and a part of which engages with the tongue piece of the carrier tape are used for carrier tape. Putting electronic components in the storage part, covering the surface of the storage part storing the parts by covering the carrier tape with a top tape, and engaging a part of the top tape with the tongue piece of the carrier tape. The electronic component is packed by connecting the carrier tape and the top tape.

According to a seventh aspect of the present invention, there is provided a method for unpacking a component supply tape, wherein when the electronic component packaged as described above is taken out, one end of the top tape is pulled up in a direction away from the surface of the carrier tape. A part of the top tape engaged with the tongue piece of the tape was elastically deformed, the connection between the carrier tape and the top tape was released, and the surface of the storage portion of the carrier tape was opened to be packed. The electronic component can be taken out.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 5 based on specific examples. (Embodiment 1) FIGS. 1 to 3 show (Embodiment 1) of the present invention.

FIGS. 1 and 2 show a component supply tape.
2 is a plan view of the component supply tape, and FIG. 2 is a cross-sectional view taken along line AB. Here, a component supply tape for packaging semiconductor devices will be described as a specific example of the component supply tape.

The component supply tape can be attached to and detached from a strip-shaped carrier tape 1a having a storage portion 5 for storing components and a carrier tape 1a covering the surface of the storage portion 5, and can be attached and detached along the longitudinal direction of the carrier tape 1a. And a belt-shaped top tape 2a extending.

The carrier tape 1a is formed, for example, by embossing a tape made of a vinyl chloride resin to form a plurality of storage portions 5 along the longitudinal direction for storing the semiconductor device 6 as a component. In addition, a plurality of feed holes 7 for conveyance are formed on one side in the longitudinal direction of the carrier tape 1a.

A plurality of slits 3 are formed in the carrier tape 1a in a direction intersecting the longitudinal direction of the carrier tape 1a. The slits 3 are arranged at intervals similar to or less than the intervals at which the storage units 5 are arranged, for example.

The top tape 2a is made of vinyl chloride, which has a higher mechanical strength than a two-layer top tape of PET resin and polyethylene resin so as to be elastically deformed. Blades 4 extending along the slits 3 of the carrier tape 2a are formed. The blades 4 are arranged at an interval similar to the arrangement interval of the slits 3.

Then, the blade 4 is inserted into the slit 3 so that the blade 4a is engaged with the slit 3, and the carrier tape 1a
The component supply tape is formed by covering and integrating the top surface with the top tape 2a.

The semiconductor device 6 is packed in a component supply tape by storing the semiconductor device 6 in the storage portion 5 and covering the surface of the storage portion 5 storing the semiconductor device 6 with the top tape 2a on the carrier tape 1a. The blades 4 formed on the top tape 2a need only be curved, inserted into the slits 3 of the carrier tape 1a, and engaged with the blades 4 and the slits 3.

As a method for engaging the blade 4 with the slit 3, for example, as shown in FIG. 3A, a roller 10 and a guide 11 are arranged in a tape transport path, and a carrier tape 1a and a top tape 2a Are integrated.

When the carrier tape 1a and the top tape 2a are transported along the tape transport direction [the direction of arrow C] and passed through the rollers 10, the rollers 10 press the carrier tape 1a against the top tape 2a. At this time, the blades 4 of the top tape 2a are bent at a steeper slope than the angle of the main body of the top tape 2a by the rod-shaped guide 11 disposed in front of the roller 10, so that the tip of the blade 4 is located on the slit 3 side. It is pressed to face.

In this state, when the tape is transported, the blades 4
The distance between the tip of the carrier tape 1a and the carrier tape 1a is reduced,
The top tape 2a is fixed to the carrier tape 1a so as to be sequentially inserted into the slit 3 from the tip of the carrier tape 1 so as to cover the storage section 5.

The semiconductor device 6 from the component supply tape
To unpack, the top tape 2a is pulled up above the carrier tape 1a, the blades 4 of the top tape 2a engaged with the slits 3 of the carrier tape 1a are elastically deformed, and the carrier tape 1a and the top tape 2a are Only need to be released to open the surface of the storage section 5 of the carrier tape 1a.

For example, as shown in FIG. 3 (b), when the component supply tape is being conveyed in the direction of arrow D, if the top tape 2a is pulled up in the direction of arrow E, the blades 4 come out of the slits 3 from the roots. Carrier tape 1a with very weak force
The top tape 2a comes off from the semiconductor device 6 in the storage section 5.
Can be taken out.

As described above, by fixing the carrier tape 1a and the top tape 2a by the hook method of the blades 4 and the slits 3, the carrier tape 1a and the top tape 2a can be easily fixed and separated, and the semiconductor device 6 can be easily attached and detached.

Further, since the top tape 2a is simply inserted into the carrier tape 1a, the top tape 2a can be peeled off more easily than by thermocompression bonding or bonding with an adhesive, and damage and deterioration of the component supply tape can be reduced. In addition, the semiconductor device 6 can be taken out smoothly.

Further, the component supply tape can be repeatedly reused until a faulty insertion of the blade 4 and the slit 3 occurs. Furthermore, since the carrier tape 1a and the top tape 2a are each made of a single material and do not use an adhesive or the like, they can be recycled, industrial waste can be reduced, and cost reduction can be realized.

(Embodiment 2) FIGS. 4 and 5 show (Embodiment 2) of the present invention. In this (Embodiment 2),
The difference is that a tongue piece 8 and a projection 13 that are elastically deformed are provided instead of the blade 4 and the slit 3, but the other configuration is the same as the above (Embodiment 1).

As shown in FIG. 4 (a), the component supply tape comprises a strip-shaped carrier tape 1b having a storage section 5 for storing components, and And a strip-shaped top tape 2b that can be attached to and detached from the carrier tape 1b that covers the surface and extends along the longitudinal direction of the carrier tape 1b.

The carrier tape 1b is formed, for example, by embossing a tape made of a vinyl chloride resin to form a plurality of storage portions 5 along the longitudinal direction for storing the semiconductor device 6 as a component. Further, a plurality of feed holes 7 for conveyance are formed on one side in the longitudinal direction of the carrier tape 1b.

As shown in FIG. 4 (b), the carrier tape 1b has a cut 9a formed in a direction intersecting with the longitudinal direction of the carrier tape 1b, and the tip thereof is elastically deformed along the longitudinal direction of the carrier tape 1b. A tongue piece 8 is formed. The tongue pieces 8 are arranged at an interval similar to or less than the arrangement interval of the storage units 5, for example.

At the tip of the cut 9a, a cut 9b is formed along the longitudinal direction of the tape connected to the cut 9a so that the tongue piece 8 can obtain a desired elastic force.

The top tape 2b includes a carrier tape 1
A protrusion 13 is formed such that a part of the top tape 2b engages with the tongue piece 8 in a state where the surface of the storage portion 5 of the carrier tape 1b is covered. It is formed in a blade shape extending along a direction intersecting with the blade. The protrusions 13 are arranged at intervals similar to the arrangement of the cuts 9a.

The top tape 2b is composed of the projection 13 and the tongue piece 8
It is made of vinyl chloride, which has a higher mechanical strength than a two-layer top tape of, for example, PET resin and polyethene resin so that it is elastically deformed when it is attached and detached.

Then, the convex portion 13 and the tongue piece portion 8 are engaged with each other, and the surface of the carrier tape 1b is covered with the top tape 2b and integrated to form a component supply tape. The semiconductor device 6 is packed in a component supply tape by storing the semiconductor device 6 in the storage unit 5 and placing the surface of the storage unit 5 in which the semiconductor device 6 is stored on the carrier tape 1 b with the top tape 2.
It is only necessary to cover the carrier tape 1b and curve the tongue piece 8 formed on the carrier tape 1b to engage with the projection 13 formed on the top tape 2b.

As a method for engaging the tongue piece 8 and the cut 9a, for example, as shown in FIG. 5A, a roller 10 and a pushing guide 12 are arranged in a tape conveying path, and a carrier tape is used. 1b and the top tape 2b are integrated.

When the carrier tape 1b and the top tape 2b are transported in the tape transport direction [the direction of arrow C] and passed through the roller 10, the roller 10 presses the carrier tape 1a against the top tape 2a. afterwards,
When the projection 13 of the top tape 2b is pushed in the direction of arrow F by the pushing guide 12 arranged behind the roller 10, the tip 8a of the tongue piece 8 is elastically deformed, and the projection 13 passes through the cut 9a. The top tape 2b is fixed to the carrier tape 1b so as to enter the lower side of the tongue piece 8 so that the tongue piece 8 and the protrusion 13 engage to cover the storage section 5.

The semiconductor device 6 from the component supply tape
Unpacking, the top tape 2b is pulled up above the carrier tape 1b, and the protrusion 13 of the top tape 2b engaged with the tongue piece 8 of the carrier tape 1b is elastically deformed.
It is only necessary to release the connection between the carrier tape 1b and the top tape 2b and open the surface of the storage section 5 of the carrier tape 1b.

For example, as shown in FIG. 5B, when the component supply tape is being conveyed in the direction of arrow D, if the top tape 2b is pulled up in the direction of arrow G, the projection 13 of the top tape 2b will be Distorted and carrier tape 1
b, the tip 8a of the tongue piece 8 is elastically deformed and the top tape 2b comes off from the cutout 9a of the carrier tape 1b. It can be taken out.

In the packing / unpacking method described above, the degree of elastic deformation of the tip 8a of the tongue piece 8 is adjusted by the length L of the cut 9b. And the tongue piece 8 can be easily attached and detached.

As described above, the tongue piece 8 that is elastically deformed is formed on the side of the carrier tape 1b, and the top tape 2b is fixed to the top tape 2b by the hook type of the tongue piece 8 and the projection 13. 1b and the top tape 2b can be easily fixed and separated, and the semiconductor device 6 can be easily attached and detached.

Further, since the top tape 2b is merely pressed into the carrier tape 1b, the top tape 2b can be peeled off more easily than thermocompression bonding or adhesive fixing with an adhesive, and damage and deterioration of the component supply tape can be reduced. In addition, the semiconductor device 6 can be taken out smoothly.

The component supply tape can be reused repeatedly until a defective insertion of the tongue piece 8 and the projection 13 occurs.
Furthermore, since the carrier tape 1b and the top tape 2b are each made of a single material and do not use an adhesive or the like, the carrier tape 1b and the top tape 2b can be recycled, can reduce industrial waste, and can achieve low cost.

In Japanese Patent Application Laid-Open No. Hei 5-221474, a slit is formed in the longitudinal direction of the carrier tape, and a projection is formed in the top tape in a direction intersecting the longitudinal direction of the carrier tape. A technique is described in which a projection is inserted into a slit during packing to fix the carrier tape and the top tape.

However, in this method, the top tape is peeled off in the width direction when the semiconductor device is unpacked, so that it is difficult to easily peel off the top tape and the carrier tape.

On the other hand, in the present invention, as described above, the notch 9 is formed in a direction intersecting the longitudinal direction of the carrier tape 1b.
a is formed, and a notch 9b is formed at the tip of the notch 9a along the longitudinal direction of the tape so that a desired elastic force is obtained in the tongue piece 8. The top tape 2b is formed with a convex portion 13 having elasticity in a direction intersecting the transport direction.

Therefore, since both the tongue piece 8 and the convex portion 13 are elastically deformed, the convex portion 1 of the top tape 2b is packed at the time of packing.
The top tape 2b and the carrier tape 1b can be easily fixed simply by pushing the cutout 3 into the cutout 9a. At the time of unpacking, the convex portion 13 is deformed along the transport direction [the direction of the arrow D], and the tip of the tongue piece 8 is bent The top tape 2b can be easily peeled off due to elastic deformation.

[0057]

As described above, according to the component supply tape of the present invention, the slit is formed in the carrier tape in a direction intersecting the longitudinal direction of the carrier tape, and the slit is formed in the top tape along the longitudinal direction of the carrier tape. The blade extends to form a blade that engages with the slit of the carrier tape, or a cut is formed in the carrier tape in a direction that intersects the longitudinal direction of the carrier tape, and the tip elastically deforms along the longitudinal direction of the carrier tape. A tongue portion is formed, and a part of the top tape is formed so as to engage with the tongue portion in a state where the top tape covers the surface of the storage portion of the carrier tape, thereby fixing the carrier tape and the top tape. By using a hook type, attachment and detachment of parts can be easily realized.

Further, the peeling of the carrier tape and the top tape can be realized with a much weaker force than the thermocompression bonding or the adhesive fixing with an adhesive, so that breakage and deterioration of the component supply tape and the component can be reduced.

Further, the blade can be reused repeatedly until a defective engagement between the blade and the tongue piece occurs. In addition, since the carrier tape and the top tape are not fixed by thermocompression bonding or an adhesive, they can be separated into a carrier tape and a top tape each made of a single material, and can be recycled.

[Brief description of the drawings]

FIG. 1 is a plan view of a component supply tape according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AB shown in FIG.

FIG. 3 is a diagram illustrating a method of packing and unpacking a component supply tape according to the first embodiment of the present invention.

FIG. 4 is a plan view of a component supply tape according to the second embodiment of the present invention.

FIG. 5 is a diagram illustrating a method of packing and unpacking a component supply tape according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier tape 2 Top tape 3 Slit 4a, 4b Blade 5 Storage part 6 Semiconductor device 8a, 8b Tongue piece

Continued on front page F term (reference) 3E067 AA12 AB41 AC04 AC11 BA26A BC07A BC10A EE59 EE60 FA01 FC01 GD10 3E096 AA03 BA08 BB05 CA15 CB02 DA17 DC02 FA16 FA26 FA27

Claims (7)

[Claims] 1. A band-shaped top tape that is detachable from the carrier tape and that extends along the longitudinal direction of the carrier tape, the surface of the band-shaped carrier tape having a storage section for storing components therein. A component supply tape covered with the carrier tape, wherein a slit is formed in a direction intersecting a longitudinal direction of the carrier tape, and the top tape extends along a longitudinal direction of the carrier tape. A component supply tape formed with blades that engage with the slit. 2. A band-shaped top tape which is detachable from the carrier tape and extends along the longitudinal direction of the carrier tape, the surface of the band-shaped carrier tape having a storage portion for storing components therein. A component supply tape covered with the carrier tape, wherein the carrier tape has a notch formed in a direction intersecting the longitudinal direction of the carrier tape to form a tongue piece portion whose tip is elastically deformed along the longitudinal direction of the carrier tape. A component supply tape formed such that a part of the top tape is engaged with the tongue piece while the top tape covers a surface of the storage portion of the carrier tape. 3. The component supply tape according to claim 2, wherein the top tape has a convex portion extending along a direction intersecting the longitudinal direction of the carrier tape and engaging with the tongue portion of the carrier tape. 4. A carrier tape formed with a storage section for storing parts and having a slit formed in a direction intersecting the longitudinal direction, and a blade extending along the longitudinal direction and engaging with the slit of the carrier tape. When packing the electronic components with the top tape, the electronic components are put in the storage portion of the carrier tape, and the surface of the storage portion storing the components is covered with the top tape on the carrier tape, and the top tape is covered. A packing method for a component supply tape for packing electronic components by connecting a carrier tape and a top tape by engaging a blade with the slit of the carrier tape. 5. An electronic component packaged as in claim 4, wherein one end of the top tape is pulled up in a direction away from the surface of the carrier tape, and the top tape is engaged with the slit of the carrier tape. Elastically deform the blades of
An unpacking method for a component supply tape that releases a connection between a carrier tape and a top tape, opens a surface of the storage portion of the carrier tape, and allows a packed electronic component to be taken out. 6. A carrier tape in which a notch is formed in a direction intersecting with the longitudinal direction in a strip shape having a storage portion for storing components and a tongue portion whose tip is elastically deformed along the longitudinal direction. When packing electronic components with a top tape that extends along the top and a part of which engages with the tongue piece of the carrier tape, the electronic components were put into the storage portion of the carrier tape, and the components were stored. The surface of the storage section is covered with a top tape over a carrier tape, and a part of the top tape is engaged with the tongue piece of the carrier tape to connect the carrier tape and the top tape to pack the electronic component. Packing method in the part supply tape to be used. 7. When taking out the electronic component packaged as in claim 6, one end of the top tape is pulled up in a direction away from the surface of the carrier tape, and is engaged with the tongue piece of the carrier tape. A part of the top tape is elastically deformed to release the connection between the carrier tape and the top tape, thereby opening the surface of the storage portion of the carrier tape and opening the part supply tape that allows the electronic components packed therein to be taken out. Packing method.