JP2001251142A - Piezo-oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezo-oscillator in which a terminal for adjustment can be arranged at the right place where defect does not take place when the terminal for adjustment is mounted on a printed wiring board while thinning an insulating substrate constituting a packet base plate and making the overall height of the package small. SOLUTION: The piezo-oscillator 21 is equipped with an insulation package 22 provided with a package main body 23 having a recessed part on the top face and a cover 24 closing the opening of the recessed part, a piezoelectric vibrator 28 mounted on a wiring pattern on the bottom in the recessed part of the package main body, an electric component 29 and respective terminals 35 arranged on the bottom of the package main body in an exposed way. The piezoelectric vibrator, the electronic component and the respective terminals on the bottom of the package main body are connected conductively, and the terminal 36 for adjustment of each electronic component that is adjusted from the outside is arranged at the right place of the package main body in an exposed way. The package main body is provided with at least one window 30 at the right place on a side wall surrounding the recessed part, and terminals for adjustment are arranged exposedly on the bottom in the recessed part exposing from the window.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a piezoelectric oscillator, and more particularly, to an adjustment terminal extending from a circuit component constituting an oscillation circuit, a temperature compensation circuit and the like mounted in a package, which can be adjusted by an operation from outside the package. The present invention relates to a piezoelectric oscillator that, when configured, prevents an adjustment terminal from causing various problems when the piezoelectric oscillator is mounted on a printed circuit board.

[0002]

2. Description of the Related Art With the rapid spread of cost reduction and miniaturization accompanying the spread of mobile communication devices such as mobile phones, the price of piezoelectric oscillators such as crystal oscillators used in these communication devices has also been reduced. There is an increasing demand for miniaturization and thinning. In response to such demands, not only are crystal oscillators packaged, but also oscillation circuits including frequency adjustment circuits and frequency temperature compensation circuits are integrated and integrated into ICs to reduce the number of components. FIG. 6A is a perspective view showing an external structure of a crystal oscillator as an example of a conventional piezoelectric oscillator, and FIG.
Sectional view, (c) is a bottom view. The piezoelectric oscillator 1 is mounted on a package 2 including a package body 3 and a lid 4 and a wiring pattern 7 formed on an upper surface of an insulating substrate 3a constituting an inner bottom surface of a concave portion 6 on the upper surface of the package body 3 by soldering or the like. The crystal resonator 8 and the electronic component 9 packaged in an IC package, the side wall 3b forming an outer frame erected along four sides of the insulating substrate 3a of the package body 3, and the upper surface of the outer frame formed of four side walls 3b And the lid 4 fixed to close the recess 6. As shown in FIG. 6C, a terminal group 10 such as a power supply terminal, an output terminal, and a ground terminal is brought into contact with a bottom surface of the insulating substrate 3a and a probe terminal or the like of an adjustment device from outside the package body. And an adjustment terminal 11 for receiving a signal for adjusting a set value of the electronic component 9 constituting the temperature compensation circuit, the amplifier and the like via the probe terminal and the like. FIG. 7 is an equivalent circuit diagram of the crystal oscillator. The crystal resonator 8 is connected to an oscillation circuit 17 (an electronic component 9 formed into an IC) including a temperature compensation circuit 15, an amplifier 16, and the like. The adjustment terminals 11 are led out from the temperature compensation circuit 15 and the amplifier 16, respectively, and are exposed on the bottom surface of the insulating substrate 3a.

The adjustment terminal 11 is used by a manufacturer of a crystal oscillator to supply an adjustment signal at an adjustment stage after the completion of assembly in order to adjust a set value of a temperature compensation circuit and an amplification factor of an amplifier. Are exposed on the bottom surface of the insulating substrate 3a, and after the adjustment is completed and the completed crystal oscillator is shipped, unnecessary terminals are used when the purchased assembly maker mounts and uses the crystal oscillator on a printed circuit board. It is. However, in the stage of mounting the crystal oscillator, the terminal group 10 necessary for the functioning of the oscillator is simply soldered to the land on the printed circuit board surface, and the adjustment terminals 11 exposed on the bottom surface of the insulating substrate 3a are connected to the printed circuit board surface. Leaving the terminal floating above causes a malfunction in the function of the oscillator. Therefore, it is usually necessary to solder a land dedicated to the adjustment terminal provided in advance on the printed circuit board to the adjustment terminal. However, the cumbersome work of soldering a large number of adjustment terminals that are originally unnecessary for the assembly maker on the printed circuit board not only causes a significant decrease in the workability of mounting electronic components on the printed circuit board, but also Since the number of wiring patterns on a printed circuit board increases, the result is contrary to the current situation where simplification of pattern layout is strongly required. Conversely, the presence of such a land dedicated to the adjustment terminal also hinders the routing of a useful wiring pattern that would have been possible without the adjustment terminal 11. If it is necessary to readjust the temperature compensation circuit or amplifier after mounting the piezoelectric oscillator on the printed circuit board, conventionally, lead terminals etc. are soldered to the adjustment terminals on the bottom of the package and then pulled out. In advance, an adjustment signal is input using the lead terminal. For this reason, complicated work accompanying the mounting of the piezoelectric oscillator increases, and improvement in this point has been demanded.

Therefore, as shown in the cross-sectional view of FIG. 8, a package structure is provided in which an adjusting terminal 11 is provided on a ceiling surface of a recess 12 formed on the bottom surface of an insulating substrate 3a constituting the bottom surface of the insulating package 2. A piezoelectric oscillator has been proposed. As described above, the adjusting terminal 11 is provided with the recess 12 having a sufficient depth.
By arranging them on the ceiling surface, a sufficient distance from the printed circuit board surface can be ensured during mounting, so that it is not necessary to provide a land dedicated to the adjustment terminals on the printed circuit board and solder them together. However, in order to form a recess having a sufficient depth in the insulating substrate 3a, it is necessary to set the insulating substrate formed of a laminated plate of ceramic or the like to a sufficient thickness.
The overall height of the package is increased, which contradicts the demand for lower electronic components. If the number of laminated ceramic plates constituting the insulating substrate 3a is reduced to solve this problem, the total thickness of the insulating substrate 3a becomes thinner, and the depth of the recess 12 cannot be sufficiently secured. The same problem as in the case of the package 2 having a flat bottom as shown occurs. Further, when readjustment is performed after the mounting of the piezoelectric oscillator, readjustment is impossible because there is no method for directly contacting the adjustment electrode with the adjustment terminal 11 arranged on the ceiling surface of the recess 12. there were. For this reason, a complicated operation of pulling out the lead terminal from the adjustment terminal 11 and leading it out of the package is required. As described above, piezoelectric oscillators capable of realizing a reduction in height in accordance with the demand for miniaturization and height reduction of various devices equipped with the piezoelectric oscillator and having no adjustment terminal exposed on the bottom surface have been proposed so far. Never had. Further, there has been no piezoelectric oscillator that can perform readjustment without connecting a lead terminal to the adjustment terminal after mounting.

[0005]

The problem to be solved by the present invention is to provide a recess having a sufficient depth for disposing an adjusting terminal on the bottom surface of an insulating substrate constituting a package bottom plate of a piezoelectric oscillator. Adjustment terminals are placed in appropriate places where no problems occur when mounted on a printed circuit board, while reducing the overall height of the package by making the insulating board thinner without increasing the thickness of the insulating board to form it. It is an object of the present invention to provide a piezoelectric oscillator capable of performing the above. Another object of the present invention is to provide a piezoelectric oscillator capable of performing readjustment without connecting a lead terminal to an adjustment terminal after mounting the piezoelectric oscillator on a printed circuit board.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, an invention according to claim 1 includes an insulating package having a package body having a concave portion on an upper surface, a lid for closing an opening of the concave portion, and an insulating package. A piezoelectric vibrator mounted on the wiring pattern on the inner bottom surface of the concave portion of the package body, each electronic component constituting an oscillation circuit and a temperature compensation circuit, a power terminal, an output terminal, and a ground terminal exposed on the bottom surface of the package body; A piezoelectric oscillator in which the piezoelectric vibrator and each electronic component are electrically connected to each terminal on the lower surface of the package body, and an adjustment terminal of each electronic component that can be externally adjusted is exposed and arranged in a proper position of the package body. Wherein the package body has at least one window at an appropriate position on a side wall surrounding the recess, and the adjustment terminal is provided on an inner bottom surface of the recess exposed from the window. Wherein the output is arranged a.
According to a second aspect of the present invention, an insulating substrate having a wiring pattern on an upper surface, electronic components constituting an oscillation circuit and a temperature compensating circuit mounted on the wiring pattern on the upper surface of the insulating substrate, and an exposed portion are disposed on a bottom surface of the insulating substrate. A piezoelectric oscillator comprising a power supply terminal, an output terminal, and a ground terminal, wherein the electronic component and each terminal on the lower surface of the insulating substrate are electrically connected to each other. In the arrangement of the adjustment terminals, a plurality of pillar members provided with a conductive material are erected at appropriate positions on the upper surface of the insulating substrate, and the adjustment terminals are arranged on the upper surface of the insulating substrate exposed between the pillar members. The piezoelectric vibrator is supported by the upper part of each column member. According to a third aspect of the present invention, there is provided an insulating substrate provided with a wiring pattern on an upper surface, electronic components constituting a piezoelectric vibrator, an oscillation circuit, and a temperature compensation circuit mounted on the wiring pattern on the upper surface of the insulating substrate, and a bottom surface of the insulating substrate. Power terminals exposed to the
A piezoelectric oscillator comprising an output terminal and a ground terminal, wherein the piezoelectric vibrator and the electronic component are electrically connected to the respective terminals on the lower surface of the insulating substrate, and each electronic component can be externally adjusted to a proper position on the insulating substrate. In the arrangement of the adjustment terminals, the upper surface of the insulating substrate is fixed by covering with a lid having a recess on the lower surface, and the adjustment terminals are exposed and arranged on the outer wall surface of the piezoelectric oscillator. I do. According to a fourth aspect of the present invention, an insulating substrate having a wiring pattern on an upper surface, electronic components constituting an oscillation circuit and a temperature compensation circuit mounted on the wiring pattern on the upper surface of the insulating substrate, and an exposed portion are disposed on a bottom surface of the insulating substrate. A piezoelectric oscillator comprising a power supply terminal, an output terminal, and a ground terminal, wherein the electronic component and each terminal on the lower surface of the insulating substrate are electrically connected to each other. In an arrangement in which adjustment terminals are arranged, a piezoelectric vibrator having a concave portion on the lower surface is covered and fixed on the upper surface of the insulating substrate, and the adjustment terminals are exposed on the outer wall surface of the piezoelectric oscillator. And

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. 1 (a), (b), (c) and (d) are a perspective view showing a structure of a piezoelectric oscillator according to an embodiment of the present invention, a sectional view taken along the line BB, a bottom view, and an explanatory view of an adjustment operation. The piezoelectric oscillator 21 includes a package body 23 and a lid 24.
, A piezoelectric vibrator 28 such as a crystal vibrator mounted by soldering or the like on a wiring pattern 27 formed on an upper surface of an insulating substrate 23a constituting a bottom plate of the package body 23, and an electronic component formed into an IC package. 29
And a side wall 23b forming an outer frame erected along four sides of the insulating substrate 23a of the package body 23, and four side walls 2
3b, which is fixed to the upper surface of the outer frame made of 3b. Further, a window 30 for exposing the upper surface of the insulating substrate 23a is formed through at least one side wall 23b. In this example, the window 30 has two opposing side walls 2
3b. As shown in FIG. 1C, a terminal group 35 such as a power terminal, an output terminal, and a ground terminal is arranged on the bottom surface of the insulating substrate 23a. Further, by contacting the adjustment electrode 40 from the outside of the package body, adjustment for receiving a signal for adjusting a set value of the electronic component 29 constituting the temperature compensation circuit, the amplifier, or the like via the electrode 40 is performed. The terminal 36 is disposed on the upper surface of the insulating substrate 23a exposed from the window 30. 2 facing each other due to the layout of the wiring pattern on the insulating substrate 23a, etc.
If a sufficient space for disposing the adjustment terminal 36 cannot be secured on the insulating substrate exposed from the window 30 provided on one of the side walls 23b, a similar window 30 is formed on the other side wall as shown by the dotted line. The remaining adjustment terminals 36 may be arranged in the space on the insulating substrate exposed from the other window 30.

As described above, according to the piezoelectric oscillator of the present invention,
A through window is formed in at least a part of the side wall of the package body to allow the upper surface of the insulating substrate 23a to communicate with the outside, and adjustment terminals are arranged at appropriate places on the upper surface of the insulating substrate. A signal for adjusting the set value of the electronic component 29 constituting the temperature compensation circuit, the amplifier, or the like can be supplied through the electrodes or the like. An assembly maker or the like who has purchased the completed piezoelectric oscillator after completing the adjustment of the set values of the electronic components may solder only the terminal group 35 on the bottom surface of the package to the land on the printed circuit board.
It is not necessary to connect the terminals by soldering, which not only improves the efficiency of the connection work, but also eliminates the need to provide extra wiring for soldering the adjustment terminals on the printed circuit board, which complicates wiring on the printed circuit board. Can be prevented. Furthermore, if there is an adjustment terminal on the bottom surface of the package, it is necessary to arrange a land dedicated to the adjustment terminal on the surface of the printed circuit board immediately below the adjustment terminal at the time of mounting, so other wiring patterns are wired. However, if the configuration is such that the adjustment terminals are not arranged on the bottom surface of the package as in the present embodiment, the wiring on the printed board immediately below the bottom surface of the package is free. Also, if there is an adjustment terminal on the bottom of the package as in the past, after mounting the piezoelectric oscillator on the printed circuit board, adjust the adjustment electrode to the adjustment terminal on the bottom of the package for readjustment. It was not easy to input a signal for adjustment by contact. On the other hand, in the present embodiment, since the adjustment terminal 36 is disposed on the insulating substrate exposed from the window provided on the side wall of the package main body, the probe electrode 40 of the adjustment device is mounted even after mounting. Into the adjustment terminal 36 through the window 30.
And it is easy to perform necessary adjustment work. It is preferable to use a material having a spring property as the probe electrode 40 and supply the adjustment signal while elastically pressing the tip of the probe electrode 40 to the adjustment terminal. In the above embodiment, the side wall 23b protrudes upward from the side of the insulating substrate 23a.
The side wall may be protruded downward from the fourth side.

Next, FIGS. 2A and 2B are a perspective view and a sectional view of a piezoelectric oscillator according to a second embodiment of the present invention.
The piezoelectric oscillator 50 has column members 5 at appropriate places on the upper surface, for example, at four corners.
An insulating substrate 51 is provided on which a plurality of piezoelectric vibrators 53 are mounted. The bottom of a packaged piezoelectric vibrator 53 is fixed on each pillar member 52. An electronic component 54 including a temperature compensation circuit, an amplifier circuit, and the like is mounted on a wiring pattern on the insulating substrate 51, and each wiring pattern is a connection conductor (conductive material) wired along the inside or outside of the pillar member 52. Are connected to the electrodes provided on the piezoelectric vibrator 53. In addition, adjustment terminals 55 are exposed at the edges of the insulating substrate 51 exposed in the windows 56 formed between the pillar members 51, and the adjustment electrodes are used to adjust the adjustment electrodes as in the embodiment of FIG. By pressing against terminal 55,
The set value of the circuit constituting the electronic component 54 can be adjusted. Therefore, it is convenient not only for adjustment at the piezoelectric oscillator manufacturing stage but also for readjustment after mounting on a printed circuit board. In addition, the pillar member 52 of this example is formed of the insulating substrate 5.
The same material as that of No. 1 is formed at the same time when the insulating substrate is manufactured. In the case of manufacturing by batch processing, a large-area sheet-like substrate in which a large number of insulating substrates 51 each having a column member 52 are connected in a plane is used, and electronic components are formed on wiring patterns formed on individual regions. After mounting, it is divided along the boundaries between the individual areas. Thereafter, the piezoelectric vibrator 53 is fixed on the column member 52 on each of the divided insulating substrates 51 by bonding or the like. The piezoelectric vibrator 53 has a crystal vibrating element (not shown) hermetically housed in a package, and leads drawn from excitation electrodes and the like formed on the crystal vibrating element are exposed and arranged on the outer surface such as the bottom surface of the package. Connected to the external electrode. still,
FIG. 2C shows a modified example. In this modified example, the insulating substrate 51 is formed in a flat plate shape, and the column members 52 are projected downward from the piezoelectric vibrator 53 side. Are fixed on the four corners. The configuration in which the adjustment terminals 55 are arranged on the upper surface of the insulating substrate exposed from the windows 56, other effects, and the like are the same as those in FIGS.

FIGS. 3 (a), 3 (b) and 3 (c) are modified examples of FIG. 2. This embodiment is different from the example of FIG. In the configuration using a pin consisting of The column member 52 made of this pin is
A disk or other thin plate portion 52b is provided at the top of 2a, and the lower part of the rod-shaped body 52a is embedded and fixed on the upper surface of the insulating substrate 51. The top thin plate portion 52b is shown in FIG.
As shown in FIG. 3B, the piezoelectric vibrator 53 may be fixed to the metallized electrode 53a on the flat lower surface of the package.
As shown in (c), the piezoelectric vibrator 53 may be fixed in the metallized electrode 53a after being fitted into a recess 53b provided in the package. The fixing method is adhesion by a conductive adhesive, solder connection, or the like. The rod 52a is electrically connected to the wiring pattern on the insulating substrate 51, and the thin plate 52b is electrically and mechanically connected to the electrode 53a provided on the lower surface of the package of the piezoelectric vibrator 53 or on the inner surface of the recess 53b. As a result, the piezoelectric vibrator 53 is electrically connected to a not-shown lead portion or the like. The column member 52 is made of, for example, F
e-Ni-Co (Kovar) is used, and the upper surface of the thin plate portion 53b is plated with Ag-Cu. The procedure for manufacturing by batch processing is the same as in the case of FIG. Also in this embodiment, as in the case of FIG. 2, the adjustment terminals 55 are exposed on the upper surface of the insulating substrate 51 exposed in the window formed between the pillar members 52. Next, the side wall with a window, the insulating substrate provided with a column member and the like, and the piezoelectric vibrator (lid) provided with a column member as in the embodiments of FIGS. 1, 2 and 3 have complicated shapes. Therefore, it takes time and effort to produce each of them, and the cost is increased because the productivity is reduced. Also,
Since the adjustment terminal is located on the board that has entered inside through the window, the probe electrode that comes into contact with it needs to have a special configuration with spring properties, and it is not possible to use a general pin probe. The cost required for the adjustment cannot be increased. In addition, when the above-mentioned special probe is used, a contact failure may occur, and the production yield is reduced.

FIGS. 4A and 4B show an embodiment for solving such a problem. This piezoelectric oscillator 60 has an inverted bowl-shaped cover 62 on an insulating substrate 61 and an outer wall 66. And the adjusting terminal 70 is exposed. That is, on the upper surface of the insulating substrate 61 located in the recess 62a of the lid 62, the piezoelectric vibrator 63 and the circuit components 6 forming the oscillation circuit
4 while the piezoelectric vibrator 63 and the circuit component 64 are mounted.
Is connected to the adjustment terminal 70. The adjustment terminal 70 is connected to the outer wall 66 as shown in FIG.
, And a lead portion 70b introduced into the inside from the joint surface between the insulating substrate 61 and the lid 62. The lead portion 70b is connected to the wiring pattern 65.
Specifically, the lead portion 70b is located on the insulating substrate or the cover 62.
The lead portion 70b and the adjusting terminal 7 are connected to each other when the lid is connected to the insulating substrate.
0 is electrically connected. In this example, the exposed portion 70a of the adjustment terminal 70 extends from the outer wall surface of the lid 62 to the side surface of the insulating substrate 61. However, this is merely an example, and only the outer wall surface of the lid or the side surface of the insulating substrate 61 is provided. The exposed portions 70a may be arranged only for the respective components. According to this embodiment, the lid 6
Since it is not necessary to form the second window or the like, the manufacturing cost can be reduced. Further, since the adjusting terminal 70 is merely formed on the flat outer wall 66, a general pin probe can be used. Adjustment costs can also be reduced.
Further, since the area of the adjustment terminal can be increased, the workability can be improved by using a thick probe. Note that, instead of the lid 62 shown in FIG. 4, a piezoelectric vibrator also serving as the lid 62 may be used. That is, the lid itself may be configured as a piezoelectric vibrator as in the embodiment of FIGS. next,
5A and 5B are a perspective view and a cross-sectional view of a modified embodiment of FIG. 4, in which the lid is also used as a piezoelectric vibrator. A piezoelectric vibrator 80 also serving as a lid is fixed on an insulating substrate 61 of the piezoelectric oscillator 60. An adjustment terminal 70 is formed on an outer wall of the piezoelectric vibrator 80. The adjustment terminal 70 is provided with a portion 70 a exposed on the outer wall and an insulating substrate 61.
And a lead portion 70 b introduced into the inside from the joining surface of the piezoelectric vibrator 80 and the lead portion 70 b is connected to the wiring pattern 65. Next, as shown in FIG. 5B, the piezoelectric vibrator 80 includes a package 81 having an H-shaped cross section and a lower concave portion 82 of the package 81, and the circuit component 6 on the insulating substrate.
4 is sealed, a piezoelectric vibrating element 84 such as a crystal vibrating element is accommodated in the upper recess 83, and the upper recess 83 is hermetically sealed by a metal lid 85. Also in this embodiment, since there is no need to form a window or the like on the side wall, the manufacturing cost can be reduced, and since the adjusting terminal 70 is merely formed on a flat outer wall, a general pin probe is used. And the cost required for adjustment can be reduced. Further, since the area of the adjustment terminal can be increased, the workability can be improved by using a thick probe.

[0012]

As described above, according to the present invention, in order to form a recess having a sufficient depth for disposing the adjusting terminal on the bottom surface of the insulating substrate constituting the package bottom plate of the piezoelectric oscillator. Without increasing the overall thickness by increasing the thickness of the insulating substrate, and reducing the overall height of the package by reducing the thickness of the insulating substrate, it is possible to use a suitable position where no trouble occurs when mounted on a printed circuit board. An adjustment terminal can be arranged. That is, when the adjustment terminals are arranged on the bottom surface of the insulating board, etc., it is necessary to connect the adjustment terminals to the dedicated lands on the printed circuit board, or use the adjustment terminals for readjustment after mounting. However, in the present invention, the adjustment terminals are arranged on the inner bottom surface (the upper surface of the insulating substrate) of the package body exposed from the window provided on the side wall of the package body. It is not necessary to connect the adjustment terminal after mounting on the printed circuit board, and the readjustment work after the mounting is completed is easy. Also,
Since the adjustment terminal is formed on the outer surface of the side wall of the piezoelectric oscillator, it is not necessary to form a window or the like on the side wall, and the manufacturing cost can be reduced. Moreover, since the adjustment terminal is formed only on the flat outer wall, a general pin probe can be used, and the cost required for adjustment can be reduced. Furthermore,
Since the area of the adjustment terminal can be increased, the workability can be improved by using a thick probe.

[Brief description of the drawings]

FIGS. 1A, 1B, 1C, and 1D are a perspective view, a cross-sectional view taken along the line BB, a bottom view, and an explanatory view of an adjustment operation showing a structure of a piezoelectric oscillator according to an embodiment of the present invention.

2A and 2B are a perspective view and a cross-sectional view of a piezoelectric oscillator according to another embodiment of the present invention, and FIG. 2C is a perspective view showing a modified example thereof.

FIGS. 3A, 3B, and 3C are explanatory diagrams of a piezoelectric oscillator according to another embodiment of the present invention.

FIGS. 4A and 4B are a perspective view and a sectional view showing a configuration of a piezoelectric oscillator according to another embodiment of the present invention.

FIGS. 5A and 5B are a perspective view and a sectional view showing a configuration of a piezoelectric oscillator according to another embodiment of the present invention.

6 (a), (b) and (c) are explanatory views of a conventional piezoelectric oscillator.

FIG. 7 is an equivalent circuit diagram of a conventional piezoelectric oscillator.

FIG. 8 is a sectional view showing the configuration of another conventional piezoelectric oscillator.

[Explanation of symbols]

Reference Signs List 21 piezoelectric oscillator, 22 insulating package, 23 package body, 23a insulating substrate, 23b side wall, 24
Lid, 27 wiring pattern, 28 crystal oscillator, 29 electronic components, 30 windows, 35 terminal group such as power supply terminal, output terminal, ground terminal, 36 adjustment terminal, 40 electrodes, 50 piezoelectric oscillator, 52 pillar member, 52a Rod-shaped body, 52b thin plate portion, 53 piezoelectric vibrator, 54 electronic components, 60 piezoelectric oscillator, 61 insulating substrate, 62 lid, 6
2a recess, 63 piezoelectric vibrator, 64 circuit parts, 65
Wiring pattern, 70 adjustment terminal, 70a exposed part, 70b lead part

Claims (4)

[Claims] A package having a package main body having a concave portion on an upper surface and a lid for closing an opening of the concave portion;
A piezoelectric vibrator mounted on the wiring pattern on the inner bottom surface of the concave portion of the package body, each electronic component constituting the oscillation circuit and the temperature compensation circuit, and a power terminal, an output terminal, and a ground terminal exposed on the bottom surface of the package body. A piezoelectric oscillator in which the piezoelectric vibrator and each electronic component are electrically connected to each terminal on the lower surface of the package body, and an adjustment terminal of each electronic component that can be adjusted from the outside is exposed at an appropriate position on the package body. The piezoelectric oscillator, wherein the package body has at least one window at an appropriate position on a side wall surrounding the concave portion, and the adjusting terminal is exposed on the inner bottom surface of the concave portion exposed from the window. . 2. An insulating substrate having a wiring pattern on an upper surface, electronic components constituting an oscillation circuit and a temperature compensation circuit mounted on the wiring pattern on the upper surface of the insulating substrate, and a power terminal exposed on a bottom surface of the insulating substrate. , An output terminal, and a ground terminal, wherein the piezoelectric component is electrically connected to the electronic component and each terminal on the lower surface of the insulating substrate, and is used for adjusting each electronic component that can be externally adjusted to an appropriate position on the insulating substrate. A plurality of pillar members having conductivity are erected at appropriate positions on the upper surface of the insulating substrate, and the adjusting terminals are exposed and arranged on the upper surface of the insulating substrate exposed between the pillar members. A piezoelectric oscillator, wherein a piezoelectric vibrator is supported by an upper part of a column member. 3. An insulating substrate provided with a wiring pattern on the upper surface, electronic components constituting a piezoelectric vibrator, an oscillation circuit, and a temperature compensation circuit mounted on the wiring pattern on the upper surface of the insulating substrate, and exposed on a bottom surface of the insulating substrate. A piezoelectric oscillator, comprising: a power supply terminal, an output terminal, and a ground terminal disposed therein, wherein the piezoelectric vibrator and the electronic component are electrically connected to the respective terminals on the lower surface of the insulating substrate. In a device in which adjustment terminals of each of the possible electronic components are arranged, a cover having a recess on the lower surface is covered and fixed on the upper surface of the insulating substrate, and the adjustment terminals are exposed on the outer wall surface of the piezoelectric oscillator. A piezoelectric oscillator characterized in that: 4. An insulating substrate provided with a wiring pattern on the upper surface, electronic components constituting an oscillation circuit and a temperature compensation circuit mounted on the wiring pattern on the upper surface of the insulating substrate, and a power terminal exposed on the bottom surface of the insulating substrate , An output terminal, and a ground terminal, wherein the piezoelectric component is electrically connected to the electronic component and each terminal on the lower surface of the insulating substrate, and is used for adjusting each electronic component that can be externally adjusted to an appropriate position on the insulating substrate. In the arrangement in which the terminals are arranged, a piezoelectric vibrator having a concave portion on the lower surface is covered and fixed on the upper surface of the insulating substrate, and the adjustment terminals are exposed and arranged on the outer wall surface of the piezoelectric oscillator. Piezoelectric oscillator.