JP2001237081A - Organic thin film light emission display panel and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an organic thin film light emission display which realizes high definition display by surely separating a second electrode. SOLUTION: The organic thin film light emission display panel comprises a first electrode 2 in two or more sequences arranged in a rectangular shape and a second electrode 5 in two or more sequences arranged in a rectangular shape in the direction which intersects perpendicularly with the first electrode 2 on a substrate 1. And, at least an organic light emission layer is formed by sandwiching between the first electrode 2 and the second electrode 5, and the intersection points of both the electrodes constitute pixels respectively, and by impressing voltage among both the electrodes constituting a desired pixel, an electroluminescence can be taken out and the high definition display is carried out. Moreover, partitions 3 of electric insulation in two or more sequences which are projected on the above substrate are formed. The partition 3 constitutes the side part of the second electrode 5 which is formed on the first electrode 2 in the direction which intersect perpendicularly with the first electrode 2. The adjacent second electrodes 5 are separated from each other by the partition 3 that has two or more holes 4 in the substrate direction from the upper surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting device used as a display, and more particularly, to a passive matrix type organic thin film light emitting display panel having high definition and high reliability, and a method of manufacturing the same.

[0002]

2. Description of the Related Art As one of organic thin film light emitting display panels utilizing electroluminescence of an organic compound material, there is a passive matrix type (simple matrix type) display panel as shown in FIG.

The passive matrix type display panel includes a plurality of first electrodes 32 on a transparent substrate 31, a plurality of second electrodes 34 orthogonal to the first electrodes 32, and an organic light emitting layer sandwiched therebetween. 33. The light emitting portion at the intersection area between the first electrode 32 and the second electrode 34 is 1
One pixel is formed as a unit, and a display portion is formed by arranging a plurality of pixels. This display part,
An image display device is formed by connecting an anode and a cathode to an external drive circuit through a connection portion formed by extending the periphery of the substrate.

In recent years, research on a high-definition passive matrix type color display utilizing the high light emission response speed of an organic light emitting element has been advanced, and a low cost, high quality display for information equipment such as full color display and moving image display has been developed. Expectations are rising for the realization of.

In order to manufacture a high-definition display complying with the demands in the market, the stripe width of the first electrode and the second electrode must be several hundred μm or less, and the gap between adjacent stripes must be several tens μm. It must be:

However, in general, the patterning of the organic light emitting layer and the second electrode by the photolithography technique significantly deteriorates the display performance and life characteristics of the device due to the low heat resistance and solvent resistance of the organic light emitting layer. However, it is difficult to form a precise pattern.

[0007] As a method for solving the above-mentioned problems relating to the fine patterning method of the organic light emitting layer and the second electrode, for example, Japanese Patent Application Laid-Open Nos. 5-275172, 5-2585959 and 5-25859 There is a technique described in 258860. In these techniques, a plurality of partition walls having a height higher than the thickness of the organic light emitting layer in a direction orthogonal to the first electrodes are formed on a substrate on which a plurality of first electrodes are formed, and on this substrate, Further, patterning is performed by vapor-depositing an organic light-emitting layer or a second electrode material from a direction perpendicular to the partition walls and a direction oblique to the substrate surface.

The technique described in Japanese Patent Application Laid-Open No. 8-315981 is a technique according to the technique described in the above-mentioned publication, in which an organic light emitting layer or a second electrode material is deposited from a direction oblique to the substrate surface. This makes it possible to form a film from a direction perpendicular to the substrate surface.

According to this technique, an electrically insulating partition having an overhang portion projecting in a direction parallel to the substrate surface is formed in a direction orthogonal to a plurality of first electrodes, and then an organic light emitting layer and an organic light emitting layer are formed. By sequentially forming the second electrode, the second display electrode is divided by the overhang portion of the partition, and the second display electrodes on both sides of the partition are electrically insulated.

[0010] The problem of this technique described in Japanese Patent Application Laid-Open No. 8-315981 is that the separation of the second electrode is performed very close to the light-emitting portion, so that moisture and the like in the atmosphere cause the second electrode to be separated. This is because the light-emitting portion easily enters the light-emitting portion from the end portion, whereby the non-light-emitting portion advances with time.

Further, in this technique, particles and the like generated in the step of forming the partition and the step of forming the organic light emitting layer and the second electrode adhere to the substrate, so that foreign matters are deposited on the side of the partition, and There is also a problem that the electrode separating function is lost.

In a display production process in which a photolithography process and the like are repeated, generation of particles is an unavoidable problem. In particular, the substrate is easily charged because it is made of an insulator, and adsorbs particles during the process. The adsorption of particles before and after the partition wall forming step greatly affects the production yield of the display because it is difficult to remove the particles from the substrate.

As a technique for avoiding this problem and reliably separating the second electrode, a technique of forming a set of partitions composed of a plurality of partitions to supplement the separation function is disclosed in Japanese Patent Laid-Open No. 11-27.
3871.

[0014]

However, this technique is disclosed in the above-mentioned JP-A-5-275172 and JP-A-5-25.
8859, JP-A-5-258860 and JP-A-8
No. 3,159,981 are simply arranged to form a set of partition walls, and a plurality of partition walls are formed. For example, JP-A-5-275172 and JP-A-5-25885.
No. 9, Japanese Patent Application Laid-Open No. 5-258860, issues such as the occurrence of an in-plane distribution of light emission characteristics due to the film thickness distribution of the second electrode and the lack of flexibility in the arrangement of the evaporation source and the substrate. Has not been solved at all.

Further, the problem in the technology disclosed in Japanese Patent Application Laid-Open No. 8-315981 that the non-light-emitting region proceeds due to entry of moisture and the like in the atmosphere from the organic light-emitting layer and the end of the second electrode is also solved. Not.

In general, it is desirable to reduce the luminance per pixel by increasing the aperture ratio to increase the luminance half-life of the display panel. The width of the portion where the partition wall is formed becomes smaller. When multiple partitions are arranged in parallel in the horizontal direction within this limited dimension, the aspect ratio of the partitions increases,
When the strength is reduced, a problem occurs that the partition walls collapse and malfunction occurs. In particular, in the case of the inverted tapered shape exemplified in the publication, the dimension of the base of the partition wall is smaller than that of the upper portion, so that it is considered that the strength is further reduced and the frequency of occurrence of such malfunctions increases.

Accordingly, an object of the present invention is to provide an organic thin-film light-emitting display which can solve the above-mentioned problems in the prior art, and in particular, realizes high-definition display by reliably separating the second electrode. Is to do.

[0018]

In order to solve the above-mentioned problems, an organic light-emitting thin-film display according to the present invention comprises a plurality of rows of first electrodes arranged in a strip shape on a transparent substrate. A plurality of rows of second electrodes arranged in a strip shape in a direction orthogonal to the electrodes, and at least an organic light emitting layer is sandwiched between the first electrodes and the second electrodes. An intersection of the two electrodes constitutes a pixel, an organic thin-film light emitting display panel for displaying information by applying a voltage between the two electrodes constituting a desired pixel to extract electroluminescence, On the electrode, a plurality of rows of electrically insulating partitions projecting on the transparent substrate are formed in a direction orthogonal to the first electrode and constituting a side of the second electrode, and Has a plurality of holes in the direction from the upper surface to the substrate. The partition wall, is characterized in that said second electrode adjacent to each other are separated from each other. The holes provided in the partition walls make it easy to separate and form the second electrode even with a vapor flow perpendicular to the substrate.

In the present invention, the aspect ratio of the hole is preferably 1.0 or more.

It is preferable that the plurality of holes are provided so as to communicate with each other at least partially between adjacent holes.

Further, an electric insulating film exposing at least a part of the first electrode is provided on the first electrode,
It is preferable that the partition is formed on the electric insulating film. Thereby, a short circuit between the second electrode and the first electrode below the hole can be reliably prevented.

The method of manufacturing an organic thin film light emitting display panel of the present invention is the method of manufacturing a passive matrix organic thin film light emitting display panel of the first aspect of the present invention, wherein a plurality of rows of first electrodes are formed on a substrate. Patterning step, and forming a plurality of rows of electrically insulating partitions projecting on the substrate in a direction perpendicular to the first electrode, and forming a plurality of holes in the partitions in the direction of the substrate from the upper surface thereof. And a patterning step of sequentially forming an organic light emitting layer and a second electrode.

Further, another method of manufacturing an organic thin film light emitting display panel of the present invention is the method of manufacturing a passive matrix organic thin film light emitting display panel of the second aspect of the present invention, wherein a plurality of rows of first electrodes are formed on a substrate. And a patterning step of forming an electrical insulating film on the first electrode to expose at least a part of the first electrode, in a direction orthogonal to the first electrode,
Forming a plurality of rows of electrically insulating partitions projecting on the substrate, and providing a plurality of holes in the partition in the direction of the substrate from the upper surface thereof, and sequentially forming an organic light emitting layer and a second electrode; And a patterning step.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. The organic thin film light emitting display panel of the present invention is a so-called passive matrix type display panel, and as shown in FIG. 1, a substrate 31, a first electrode 32 and a second electrode 32 formed orthogonally to each other on the substrate 31. It has a basic structure including an electrode 34 and an organic light emitting layer 33 sandwiched between both electrodes. A display section is formed by an array of pixels formed by intersections of the two electrodes, and displays information by extracting electroluminescence by applying a voltage between the two electrodes.

In the present invention, as shown in FIG. 2, a plurality of rows of first electrodes 2 formed on the substrate 1 project on the substrate 1 in a direction orthogonal to the first electrodes 2. A partition 3 made of an electric insulator is provided. Since the partition 3 has a plurality of holes 4 in the direction of the substrate 1 from its upper surface,
Adjacent second electrode (not shown) provided on this upper part
They will be separated from each other.

The shape of the hole 4 itself is not particularly limited, but it is particularly important that the aspect ratio is 1 or more. By forming the holes so that the aspect ratio is 1 or more, even when vapor deposition is performed from a vertical direction when forming the second electrode, separation of the second electrode by the holes can be ensured. This is because, as shown in the microscopic view of FIG. 4, the film material is deposited at the entrance of the hole during vapor deposition,
This is to ensure that the inside of the hole is shadowed and the membrane is discontinuous inside the hole.

In the present invention, the aspect ratio is important for the shape of the hole. The shape of the opening of the hole is not limited as long as the aspect ratio is 1 or more.
For example, the shape may be an appropriate shape such as a circle, a square, and a triangle. Further, in the example shown in FIG. 4, the hole 4 is provided so as to penetrate the partition wall 3. However, if the aspect ratio is 1.0 or more, the effect of the present invention can be sufficiently obtained even with a non-through hole. it can.

Preferably, the plurality of holes 4 are provided at least partially in communication with the adjacent holes 4. The arrangement of the holes 4 is not particularly limited.
As shown in (a) to (f), they can be provided freely. In addition, by appropriately selecting the positions of the plurality of holes 4, the strength of the partition can be maintained.

Further, in the present invention, as shown in FIG. 6, the angle θ of the wall surface of the hole 4 to the substrate 1 is 90 ° or more, and the angle φ of the side surface of the partition wall 3 to the substrate 1 is less than 90 °. It is preferred that When the angle φ is less than 90 °, the organic light emitting layer and the second electrode material are continuously formed from the light emitting portion on the wall surface of the partition wall 3, thereby preventing a deterioration factor such as moisture from entering the light emitting layer. can do.

As the material of the partition walls 3, in addition to the negative type photoresist, a positive type photoresist, an organic film such as polyimide having no photosensitivity, or the like can be used. And a method in which holes are formed by irradiating a laser beam in a spot shape. In addition, SiO ₂
Or an inorganic film such as Si ₃ N ₄ may be used. In this case,
The partition wall can be formed by a method of patterning by etching or a lift-off method, a method of processing by laser light, or the like. The material of the partition wall material and the patterning method to be used are not limited to those illustrated.

As the substrate 1 used in the present invention, in addition to a glass substrate, a film-like substrate such as a polymer film or an organic film such as a color filter on a glass substrate can be used. In addition, as a material used for the first electrode 2, in the case of a transparent conductive film material, in addition to indium tin oxide (ITO), for example, indium zinc oxide, tin oxide, zinc oxide, aluminum tin oxide In the case where the second electrode is a transparent electrode, Al, Li, Mg, or an alloy thereof can be used as the first electrode. The first electrode 2 can be formed from a laminate of a plurality of materials. In this case, zinc oxide, aluminum tin oxide, or the like can be used.

Incidentally, a Mo film, for example, is provided as a metal film between the substrate 1 and the first electrode 2 so as to have a function as a bus line for reducing the resistance of the first electrode 2. Such a metal film is formed so as to maintain electrical contact with the first electrode 2.

In the present invention, preferably, as shown in FIG. 7, an electric insulating film 6 for exposing at least a part of the first electrode 2 is provided on the first electrode 2, and a partition wall is formed thereon. Form 3 By providing such an electrical insulating film 6, a short circuit between the second electrode and the first electrode below the hole can be reliably prevented. In addition, since the partition is provided on the first electrode not directly but via an electrical insulating film, the shape of the partition is stabilized by improving the adhesion and the baking state of the partition to the base, and the display of the display panel is improved. Good quality can be maintained. In the figure, reference numeral 7 denotes a terminal pad.

The electric insulating film 6 may be formed so that at least a part of the first electrode is exposed, and there is no particular limitation on the formation range. For example, the light emitting area of the display panel may be clearly defined in a range wider than the image display area and extended to the outside thereof. Preferably, the width of a portion orthogonal to the first electrode 2, that is, the width of a portion parallel to the partition 3 is formed wider than the width of the partition 3. For example, when the height of the partition is about 5 μm and the incident angle of the second electrode material is substantially perpendicular to the substrate surface, the width of the electric insulating film may be formed to be about 1 μm wider than the width of the partition. It is preferable, however, that the aperture ratio of the panel is reduced due to the presence of the electric insulating film. Therefore, it is necessary to appropriately select the element reflecting the element design and the reliability of the element. Further, the electric insulating film may be formed so as to cover each end of the first electrode, and the electric insulating film may be formed so as to cover the end of the first electrode in a direction parallel to the first electrode. When formed, the shape of the electrode end can provide a function of protecting a portion where electric field concentration is likely to occur, thereby preventing deterioration of the panel.

Examples of the inorganic material that can be used for the electrical insulating film 6 include inorganic oxides such as SiNx, AlOx, and TaOx. Examples of the method for forming the inorganic oxide film include a sputtering method and a vacuum deposition method. And the like. Examples of the patterning method include lift-off, wet etching, and dry etching, and it is preferable to select a method that causes less damage to the first electrode during pattern formation. Among these methods, in particular, the lift-off has an advantage that the pattern formation of the inorganic oxide film can be performed without depositing the inorganic oxide film on the portion of the first electrode surface where the charge is injected into the organic light emitting medium. . On the other hand, when the inorganic oxide film is removed by etching, the etching residue of the inorganic oxide film may remain on the first electrode surface, or the first electrode surface may be damaged. In addition, when used, the inorganic oxide film can be formed into a taper shape of about 5 ° because it is assumed that the inorganic oxide film has an adverse effect on image quality.

When an SiO ₂ film is used as the inorganic oxide film, the film may be immersed in a SiO ₂ solution or spin-on-glass. As a patterning method, for example, a method using a mixed solution of HF and NH ₄ F in wet etching,
In dry etching, a method of etching using a mixed gas of CF ₄ + O _{2 and} the like can be given. It is necessary that the inorganic oxide film has a dielectric strength required at the time of driving and has a thickness that reduces film defects such as pinholes. For example, when formed by a sputtering method, the thickness is preferably 100 nm or more.

The electric insulating film 6 may be made of an organic material, and examples of the organic material include a photoresist material, polyimide, and acrylic resin. In particular, when a negative-type photoresist material is used, the problem of residues remaining on the first electrode can be reduced because the unnecessary portion of the pattern maintains high solubility in a developing solution. In addition, by increasing the degree of crosslinking of the base resin at the time of exposure, it is possible to increase the resistance to the partition wall forming step in a later process. As a method of these patterning, for example, it is also possible to process the photomask into a tapered shape by changing the degree of cross-linking of the exposed portion by devising the photomask to wrap around the ultraviolet light. The thickness of such an organic film is approximately 500
〜1000 nm is preferred.

The material of the organic light emitting layer is not limited to, but is, for example, Cu phthalocyanine, N, N'-diphenyl-N, N'-bis (3-methylphenyl) -1,
1'-biphenyl-4,4'-diamine, tris (8-
(Quinolinol) aluminum or the like can be used.

The method of manufacturing an organic thin-film light emitting display panel of the present invention uses the above-described materials and forming method,
This is for producing the organic thin film light emitting display panel of the present invention, and is not particularly limited.

[0040]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in detail. Example 1 In order to confirm the aspect ratio of a hole, an ITO film as a first electrode 2 was formed with a thickness of 100 nm on a 50 × 50 mm glass substrate, and a negative photoresist was deposited thereon. The coating was applied at 5 μm, and circular holes 4 having opening diameters of 3 μm, 5 μm, and 7 μm, respectively, were formed by a photolithographic process to form partition walls 3. The aspect ratios at the edges of the substrate were 1.7, 1, and 0.7, respectively.

Next, a second electrode was formed using Al as a vapor deposition material, and conduction between the first electrode on the substrate and the second electrode on the partition wall was confirmed. The second electrode was formed by setting an Al evaporation source immediately below the substrate in a vacuum chamber, setting the distance to the substrate to 500 mm, and setting the pressure in the vacuum chamber to 1.3 × 10 5 during vapor deposition. ^-5 Pa at a deposition rate of 2 nm / sec.
An Al film having a thickness of 200 nm was formed. Note that the substrate was not heated during the vapor deposition. FIG. 3 shows an outline of the manufactured substrate.

As a result, it was confirmed that there was no conduction on a substrate having a hole diameter of 5 μm or less, that is, a substrate having an aspect ratio of 1 or more. That is, it was confirmed that, even when the Al incidence on the hole was vertical, the Al film could be separated by forming the hole having the aspect ratio of 1 or more. In addition, as a result of observing the state of the hole with a microscope, as shown in FIG. 4, a vapor deposition material is deposited at the entrance of the hole, thereby blocking the vapor deposition material and making the film discontinuous inside the hole. I understood that.

Example 2 Next, in order to consider the influence of the arrangement of the holes, 50 ×
On a 50 mm glass substrate 1, a negative photoresist is applied with a thickness of 5 μm on the glass substrate 1, and a 30 μm wide, 40 mm long partition wall 3 is formed with a pitch of 3 μm by a photolithographic process.
100 pieces were formed at 30 μm. In this partition, circular holes 4 each having an opening having a diameter of 5 μm are provided, respectively, in FIG.
(F). Six substrates were produced respectively.

Next, Al was used as a vapor deposition material, and vapor deposition was performed using a vapor deposition mask having an opening of 300 × 300 mm to form a second electrode, and conduction between adjacent Al electrodes between the partition walls was confirmed. The formation of the second electrode was performed in the same manner as in Example 1. As a result, in each pattern, Al
Electrode insulation was confirmed. That is, it was found that the aspect ratio of the holes was important in the separation of the Al electrode, not the arrangement of the holes.

From the results of Examples 1 and 2, in order to enable the separation of the second electrode, the aspect ratio is most important in the shape of the hole, and the shape having the aspect ratio of 1 or more is important. For example, it was confirmed that the shape of the opening of the hole was not limited, regardless of the shape and arrangement of the holes.

Embodiment 3 Next, the number of pixels (320 × RGB) × 240 dots, the number of subdots 230, 40 with a pixel pitch of 110 × 330 μm
An example in which the present invention is applied to an organic thin-film light-emitting display panel of No. 0 will be described. The panel had a structure in which the data line formed by the first electrode was divided into two in the vertical direction of the panel.

First, a resistivity of 1.5 × 10 ⁻⁵ [Ω · cm] is formed on the glass substrate 1 as an auxiliary electrode portion of the first electrode 2.
Was formed with a thickness of 300 nm and a width of 20 μm.
A DC magnetron sputtering method was used for Mo film formation, and a normal photolithography method was used for patterning.

Next, as the first electrode 2, a resistivity of 2.0
× 10 ⁻⁴ [Ω · cm] indium-tin-oxide (IT
O) was formed with a thickness of 100 nm and a width of 100 μm.
A DC magnetron sputtering method was used for forming the first electrode, and a normal photolithography method was used for patterning.

Next, an electric insulating film 6 having a thickness of 1 μm was formed using a negative photoresist. This electrical insulating film was patterned in a direction orthogonal to the first electrode so as to cover the end of the transparent electrode. The angle of the end of the electric insulating film with respect to the substrate was formed to be an acute angle.

Next, a partition 3 having a thickness of 5 μm was formed using a negative photoresist. The width of the partition was 30 μm, and the pitch was 330 μm. Fig. 5
The holes were arranged in the shape shown in (a). The angle of the end of the partition wall with respect to the substrate was formed to be an acute angle.

Subsequently, an organic layer and a cathode as a second electrode were formed on this substrate, and sealing and connection were performed. In this procedure, first, a substrate is mixed with an oxygen / nitrogen mixed gas (20
% Oxygen, water content 20ppm or less) UV under purge environment
After performing irradiation cleaning, a vapor deposition device was immediately introduced. Next, an organic hole injection layer, an organic light emitting layer, an organic electron injection layer, and an Al cathode were continuously formed without breaking a vacuum of the order of 10 ⁻⁵ Pa. The resistance heating type evaporation method was used for all the film formation, and the film thickness was detected by a quartz oscillator type film thickness meter.

The substrate on which film formation has been completed is transferred to a glove box under a nitrogen gas atmosphere without being exposed to the atmosphere.
Sealing was performed using a V-curing / thermo-curing combined sealant and a glass sealing plate. Nitrogen gas (water content 5 ppm or less, oxygen content 5 p
pm or less).

The completed substrate was taken out into the atmosphere and connected to the drive circuit terminals using an anisotropic conductive adhesive (ACF).

According to the above method, the number of pixels (320 × RG
B) An organic thin-film light-emitting display panel having 240 dots and a pixel pitch of 110 × 330 μm and having 230 and 400 subdots was manufactured. In this organic thin-film light-emitting display panel, it was confirmed that high-definition display is possible and that the organic EL device can be driven stably for a long period of time because the second electrode is formed separately.

[0055]

As described above, according to the organic thin-film light-emitting display panel and the method of manufacturing the same of the present invention, the separation of the second electrode can be reliably performed.
Stable driving can be performed for a long time by suppressing the expansion of the non-light emitting portion.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a passive matrix type organic thin film light emitting display panel.

FIG. 2 is a perspective view showing a preferred example of a passive matrix type organic thin film light emitting display panel of the present invention before forming a second electrode.

FIG. 3 is a perspective view showing a configuration of a substrate of the organic thin film light emitting display panel of Example 1.

FIG. 4 is a cross-sectional view illustrating a state of formation of a second electrode in a peripheral portion of a hole according to the present invention.

FIG. 5 is a schematic view showing an example of an arrangement of holes according to the present invention.

FIG. 6 is a cross-sectional view showing a shape of a side surface portion and a hole of a partition wall according to the present invention.

FIG. 7 is a perspective view showing an organic thin-film light emitting display panel of the present invention when an electric insulating film is provided.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 1st electrode 3 Partition wall 4 Hole 5 2nd electrode 6 Electric insulating film 7 Terminal pad

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3K007 AB18 BA06 BB00 BB01 BB04 BB06 CA01 CA06 CB01 DA00 DB03 EB00 EC02 EC03 EC04 FA01

Claims (6)

[Claims] 1. A semiconductor device comprising: a plurality of rows of first electrodes arranged on a substrate; and a plurality of rows of second electrodes arranged on the substrate in a direction perpendicular to the first electrodes. And, at least the organic light emitting layer is sandwiched between the first electrode and the second electrode, the intersection of the two electrodes each constitute a pixel, between the two electrodes constituting a desired pixel An organic thin-film light-emitting display panel for displaying information by applying voltage to take out electroluminescence, on the first electrode, a direction orthogonal to the first electrode and the second electrode A plurality of rows of electrically insulating partitions projecting above the substrate are formed on the substrate, and the second electrodes adjacent to each other are formed by the partitions having a plurality of holes from the upper surface in the direction of the substrate. Organic thin films characterized by being separated from each other Light display panel. 2. The organic thin-film light emitting display panel according to claim 1, wherein an aspect ratio of the holes is 1.0 or more. 3. The organic thin-film light emitting display panel according to claim 1, wherein the plurality of holes are provided so as to communicate with each other at least partially between adjacent holes. 4. An electric insulating film for exposing at least a part of the first electrode on the first electrode, wherein the partition is formed on the electric insulating film. 4. The organic thin-film light-emitting display panel according to any one of 3. 5. The method of manufacturing a passive matrix organic thin film light emitting display panel according to claim 1, wherein a patterning step of forming a plurality of rows of first electrodes on a substrate is performed. A step of forming a plurality of rows of electrically insulating partitions projecting on the substrate in a direction orthogonal to one electrode, and providing a plurality of holes in the partitions from the upper surface in the direction of the substrate; And a patterning step of sequentially forming a second electrode. 6. The method of manufacturing a passive matrix organic thin-film light emitting display panel according to claim 4, wherein a patterning step of forming a plurality of rows of first electrodes on a substrate is performed. A patterning step of forming an electrical insulating film that exposes a part of the first electrode, and forming a plurality of rows of electrically insulating partitions projecting on the substrate in a direction orthogonal to the first electrode; and Providing a plurality of holes in the partition wall from the upper surface thereof in the direction of the substrate; and a patterning step of sequentially forming an organic light emitting layer and a second electrode. .