JP2001219533A - Solder paste printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder paste printer capable of improving an efficiency of a solder paste printing work by reducing a time required for a replacing stage of a metal mask. SOLUTION: This solder paste printer is previously provided with a plurality of types of solder supply heads respectively mounting different types of metal masks in response to the type of a printed board in the solder supply heads for supplying solder paste in a casing to the board via the masks mounted at a lower end of a casing. In this case, the head having the metal mask in response to the type of the board intended to print the paste is elected and the head is replaced. The metal mask in response to the type of the board intended to be printed with the paste is selected for the supply head for supplying the paste in the casing to the board via the mask disposed replaceably at the lower end of the casing, and the mask is replaced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a solder paste printing apparatus for printing a solder paste (cream solder) on a land of a printed circuit board.

[0002]

2. Description of the Related Art When electronic components for surface mounting are mounted on a printed circuit board, first, a solder paste is printed on a land of the printed circuit board. Thereafter, electronic components such as surface mounting resistors, capacitors, and ICs are placed on the printed solder paste and heated in a reflow furnace to solder the electronic components.

Conventionally, as a method of printing a solder paste on a printed circuit board, a method as shown in FIG. 16 is generally used. That is, as shown in the figure, first, on the lower surface side of the metal mask 3 having a plurality of openings 3a that are precisely opened in accordance with the position and size of each land 2 printed and wired on the printed circuit board 1. Each opening 3a of the metal mask 3 and each land 2 of the printed circuit board 1
The printed circuit board 1 is arranged so that the printed circuit board 1 is opposed to the printed circuit board 1.

In this state, the solder paste 4 is supplied to the upper surface of the metal mask 3 and the squeegee 5 is moved in the direction of arrow A on the upper surface side of the metal mask 3 so that the solder paste 4 is pressed against the upper surface of the metal mask 3. Mask opening 3
The solder paste 4 is printed on the land 2 of the printed circuit board 1 through a (a solder paste printed with 4a in FIG. 16). After that, the metal mask 3 and the printed circuit board 1 are separated.

[0005]

However, the above-mentioned conventional method is a general method. However, when there are a plurality of types of printed boards having different land arrangements and the like, a plurality of types corresponding to each type of printed board are required. Each time a solder paste is printed on a different type of printed board, it is necessary to replace the metal mask with a type corresponding to the printed board.

[0006] The changeover of the metal mask takes, for example, two to three hours, and it is necessary to stop the apparatus until the changeover is completed. Therefore, as the number of types of printed circuit boards increases, the changeover is required accordingly. The time increases and the efficiency of the solder paste printing operation decreases.

Japanese Patent Application Laid-Open No. 9-24600 discloses that
A casing for containing the solder paste, a metal mask provided at the bottom of the casing and having an opening through which the solder paste can pass, a piston sliding in the casing to push out the solder paste from the opening of the metal mask, and a metal. A screen printer including a cutter that separates a solder paste body in a casing from a solder paste body which is moved in contact with a mask inner surface of a mask and extruded by a predetermined amount from an opening of a metal mask is shown. Even in such a case, when solder printing is performed on a different type of printed circuit board, it takes a lot of time to change the metal mask.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a solder paste printing apparatus capable of reducing the time required for changing a metal mask and improving the efficiency of a solder paste printing operation. .

[0009]

Means for Solving the Problems A first method for solving the above problems is described below.
The solder paste printing apparatus according to the present invention is a solder supply head configured to supply a solder paste in a casing to a printed board via a metal mask attached to a lower end of the casing, wherein different types of metal according to the type of the printed board are used. A configuration in which a plurality of types of solder supply heads each having a mask attached thereto are provided in advance, and a solder supply head having a metal mask corresponding to a type of a printed circuit board on which a solder paste is to be printed is selected and a head exchange is performed. It is characterized by.

A solder paste printing apparatus according to a second aspect of the present invention is the solder paste printing apparatus according to the first aspect, wherein the board detecting means for detecting the type of a printed board on which the solder paste is to be printed, And a head replacement means for selecting a solder supply head having a metal mask corresponding to the type of the printed circuit board on which the solder paste is to be printed based on the detection signal and performing head replacement.

A solder paste printing apparatus according to a third aspect of the present invention provides a solder supply head configured to supply a solder paste in a casing to a printed circuit board via a metal mask exchangeably disposed at a lower end of the casing. The present invention is characterized in that a metal mask corresponding to the type of a printed circuit board on which a solder paste is to be printed is selected and the mask is replaced.

A solder paste printing apparatus according to a fourth aspect of the present invention is the solder paste printing apparatus according to the third aspect of the present invention, wherein the board detecting means for detecting the type of a printed board on which the solder paste is to be printed, Mask replacement means for selecting a metal mask corresponding to the type of printed circuit board on which the solder paste is to be printed based on the detection signal and performing mask replacement is provided.

The solder paste printing apparatus according to a fifth aspect of the present invention is the solder paste printing apparatus according to the third or fourth aspect, wherein the metal mask is formed on a thin metal plate formed in a belt shape at various intervals by various printed circuit boards. The openings are respectively formed in the lands.

A solder paste printing apparatus according to a sixth aspect of the present invention is the solder paste printing apparatus according to the third, fourth or fifth aspect of the present invention, wherein the solder supply head is provided with a lower end of the casing by sucking through a ventilation hole provided in the casing. And a seal mechanism for adsorbing the metal mask.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<First Embodiment> FIG. 1 is a perspective view of a solder paste printing apparatus according to a first embodiment of the present invention, FIG. 2 is a front view of the solder paste printing apparatus, and FIG. FIG. 4 is a plan view, FIG. 4 is a perspective view extracting and showing a solder supply head of the solder paste printing apparatus, and FIG. 5 is a sectional view of the solder supply head. FIG. 6 is a view showing another attaching / detaching mechanism of the solder supply head, and FIGS. 7 and 8 are views showing a cutting mechanism of the solder paste provided in the solder supply head. Also,
FIG. 9 is a flowchart showing the steps of solder paste printing by the solder paste printing apparatus.

As shown in FIGS. 1, 2 and 3, the solder paste printing apparatus 10 according to the first embodiment has a head housing 12 beside an apparatus main body 11. Device body 1
1 has a U-shape when viewed from the side, has a head mounting portion 13 at an upper portion, and has a solder printing portion 14 at a lower portion.

The head mounting section 13 has a head storage 12
The solder supply heads 15, 16, 17 or 18 stored in the storage device are appropriately selected and detachably attached by attachment / detachment means described later. In the illustrated example, the solder supply head 16 is mounted on the head mounting section 13. In the head mounting section 13, the mounted solder supply heads 15, 16, 17 are mounted.
Or 18 can be moved back and forth, right and left, and up and down as indicated by arrows X, Y and Z by driving means such as a motor or a cylinder (not shown). Instead of moving the head side, the printed circuit board side may be movable back and forth and right and left and up and down using an XY table or the like.

A pair of rails 20 are provided in the solder printing section 14 along the width direction of the apparatus main body 11. The printed circuit boards 21, 22, 23, 2 are guided by the rails 20.
4 are sequentially conveyed to a predetermined position of the solder printing unit 14 (a position below the solder supply head) as shown by an arrow B by a conveyor (not shown) such as a conveyor composed of an electric motor or the like. In the illustrated example, a state when the printed circuit board 22 is transported to the solder printing unit 14 is shown. In addition, the printed circuit boards 21, 22, 23, 24 on which solder printing has been completed.
Is again guided by the rail 20 and is carried out of the solder printing unit 14 by the transfer device as shown by an arrow B.

The printed circuit boards 21, 22, 23, 24
Printed wiring lands 21a, 22a, 23a, 2
There are four types of printed circuit boards having different arrangements of 4a.
The types of these printed boards 21, 22, 23, 24 can be detected by the board detecting means. That is, the printed circuit boards 21, 22, 23, 2
4 is a bar code 21b, 22 representing each type.
b, 23b, 24b are provided, and a bar code reader 25 for reading bar codes 21b, 22b, 23b, 24b is provided in the solder printing unit 14. The substrate detection signal a of the bar code reader 25 is sent to the head storage 12 which is a mask exchange means.

The head housing 12 is provided with a rotary 26 whose rotation is controlled by an electric motor or the like (not shown).
6, 17, 18 are detachably attached by attaching / detaching means described later. In the illustrated example, the solder supply heads 15, 17, and 18 are mounted on the rotary 26, and the
The solder supply head 16 selected by the
Indicates a state in which is mounted.

A linear guide 27 is provided on the head mounting portion 13 of the apparatus main body 11.
The solder supply head 15, 16, 17 or 18 is moved from the rotary 26 to the mounting position of the head mounting section 13 by a moving device such as an electric motor or a cylinder (not shown).

As shown in FIG. 4, the solder supply heads 15,
In 16, 17, and 18, metal masks 31, 32, 33, and 34 are fixed to the lower end of the casing 51 by tapes 35, respectively. Metal masks 31, 32, 33,
Numeral 34 designates different types according to the types of the printed circuit boards 21, 22, 23 and 24.
2, 23, 24 lands 21a, 22a, 23a, 24
a corresponding opening portions 31a, 32a, 33a,
34a are provided.

Also, as shown in FIG.
Reference numerals 5, 16, 17, and 18 each accommodate the solder paste 36 in a casing 51, and are detachably attached to the head mounting portion 11 by a mechanical chucking 37 as attachment / detachment means. Although not shown, the solder supply head 1 is also mechanically chucked in the rotary 26.
5, 16, 17, and 18 are detachably attached.

The attachment / detachment means is not limited to mechanical chucking, and other mechanisms may be used. For example, air chucking as shown in FIG. 6 may be used. That is, the air holes 38 are formed in the head mounting portion 13 and the air holes 3
8, a seal ring 39 is provided around the lower end opening 38a, and the compressor 40 sucks the air from the vent hole 38 to make the upper surface side of the casing of the solder supply head a negative pressure, so that the solder supply head 15, 16, 17, or 18 is provided. May be adsorbed.

Also, as shown in FIG.
When the solder supply heads 15, 16, 17 or 18 are mounted on the head mounting portion 13,
8, a piston 41 attached to the head mounting portion 13 is inserted into the casing 51. The piston 41 is connected to a driving device 43 such as an electric motor or a cylinder via a piston rod 42, and is driven by the driving device 43 to
The slider 51 slides up and down in the casing 51 of 16, 17, or 18 as shown by the arrow C.

The solder supply heads 15, 16, 1
It is also possible to provide a configuration in which pistons are individually provided in each of the tires 7 and 18 and these pistons are pressed by rods provided in the driving device.

When the piston 41 is slid downward, the casing 51 of the solder supply head 15, 16, 17, or 18 is moved.
The solder paste 36 inside the metal masks 31, 32, 33
Or 34 are extruded from the openings 31a, 32a, 33a or 34a. The extruded solder paste 36 and the solder paste 36 remaining in the casing are shown in FIG.
And a cutter 44 shown in FIG.

That is, the cutter 44 is connected to the solder supply head 1.
5, 16, 17 or 18 inserted into the casing 51,
The extruded solder paste 36 and the inside of the casing are moved by a moving device such as an electric motor or a cylinder (not shown) so as to be in contact with the upper surface of the metal mask 31, 32, 33 or 34 in parallel with the upper surface as shown by an arrow D as shown by an arrow D. Is cut off with the solder paste 36 remaining on the substrate. Note that the cutter 44 is not limited to a plate-shaped cutter as shown in FIG. 7, but may be a linear wire cutter as shown in FIG.

Further, the cutter 44 is connected to the solder supply head 15,
As a structure to be inserted into the casing 51 of the soldering head 16, 17, or 18, as shown in FIG.
A part of the casings 51, 6, 17, 18 is
The opening 45 is formed by raising and lowering the part when the cutter 44 is inserted, and the cutter 44 is inserted from the opening 45. Alternatively, an opening 45 that is always open may be formed, and the cutter 44 may be disposed so as to close the opening 45, and the cutter 44 may be moved by a moving device (not shown) when cutting the solder paste 36. Good.

Here, the solder paste printing step by the solder paste printing apparatus 10 will be described with reference to the flowchart of FIG. 9 (each step is denoted by reference numerals S1 to S10). Hereinafter, a case where a solder paste is printed on the printed circuit board 22 as shown in FIG. 1 will be described as an example. Similar steps are repeated when printing solder paste on other types of printed circuit boards 21, 23, and 24.

(1) After the printed circuit board 21 on which solder paste printing has been performed is carried out to the component mounting step, the next printed circuit board 22 is carried into the solder printing section 14 of the solder paste printing apparatus 10 (S1). . (2) The board is detected by reading the bar code 22b of the printed board 22 with the bar code reader 25 (S2). (3) Select the metal mask 32 corresponding to the printed circuit board 22. That is, the solder supply head 16 including the metal mask 32 is selected (S3).

(4) The selected solder supply head 16 is taken out of the rotary 26 and mounted on the head mounting section 13. That is, from the solder supply head 15 corresponding to the printed board 21 to the solder supply head 1 corresponding to the printed board 22
6 is performed (S4). Note that head replacement (detachment) may be performed manually. (5) The solder supply head 16 is moved back and forth and right and left, and the land 22a and the metal mask 32 provided on the printed circuit board 22 are provided.
The position of the opening 32a provided in (2) is adjusted (S5). The alignment may be performed by moving the printed circuit board side.

(6) The solder supply head 16 is moved downward to bring the tip (metal mask portion) of the solder supply head 16 into close contact with the printed circuit board 22 (S6). The printed circuit board side may be moved upward. As a result, the lands 22a of the printed circuit board 22 and the openings 32a of the metal mask 32 are formed.
And overlap. (7) By pressing the solder paste 36 in the solder supply head 16 with the piston 41, the metal mask opening 3
2a, the solder paste 36 is extruded from the printed circuit board 2
Print (apply) the solder paste 36 on the second land 22a
(S7).

(8) Solder paste 3 by piston 41
6, after the pressing of the solder paste 36 is stopped,
And the solder paste 36 remaining inside the cutter 4
4 (S8). (9) Move the solder supply head 16 upward to separate the metal mask 32 of the solder supply head 16 from the printed circuit board 22. The printed circuit board side may be moved downward. (10) The printed circuit board 22 on which the solder paste printing has been performed is carried out to the next component mounting step (S10). In the component mounting step, the electronic components for surface mounting are mounted on the printed circuit board 22 while switching the program according to the identification of the printed circuit board 22.

As described above, according to the solder paste printing apparatus 10 of the first embodiment, the solder supply head configured to supply the internal solder paste to the printed circuit board via the metal mask attached to the lower end of the casing. A plurality of types of solder supply heads 15, 16, to which different types of metal masks 31, 32, 33, 34 corresponding to the types of the printed circuit boards 21, 22, 23, 24 are respectively mounted.
Solder supply head 15, 16, 17 or 17 provided in advance with metal masks 31, 32, 33 or 34 corresponding to the type of printed circuit board 21, 22, 23 or 24 on which solder paste 36 is to be printed. Since the head replacement is performed by selecting No. 18, the time required for the setup change of the metal mask is greatly reduced.

For this reason, especially in the case where the metal mask is frequently changed in small-lot production of many kinds, the ratio of the changeover time in the solder paste printing operation time is greatly reduced. The efficiency of the printing operation can be greatly improved.

As an example of high-mix low-volume production, MCM (multi-chip module) whose demand will increase in the future
There is a small substrate such as In this case, multiple types of MC
Since M is produced and provided on one large substrate, the metal mask needs to be frequently changed, so that it is effective to apply the solder paste printing apparatus 10 of the present invention. In addition, since the MCM is a small substrate, the size of the solder supply head (metal mask) can be reduced accordingly. Therefore, even if a plurality of solder supply heads are provided, the apparatus does not become too large.

As the board detecting means for detecting the type of the printed board on which the solder paste is to be printed, bar codes 21b,
22b, 23b, and 24b, and the solder printing unit 14
Is provided with a barcode reader 25, and based on a board detection signal a of the board detection means, a printed board 21, 22, 23 or 2 on which solder paste is to be printed.
Solder supply head 15, 16, 17 or 18 provided with metal masks 31, 32, 33 or 34 corresponding to four types
By automatically replacing the head by providing a head replacement means such as a rotary 26 for performing the head replacement by selecting the above, the efficiency of the solder paste printing operation can be further improved.

<Second Embodiment> FIG. 10 is a front view of a solder paste printing apparatus according to a second embodiment of the present invention, and FIG. 11 is a plan view of the solder paste printing apparatus.

As shown in FIGS. 10 and 11, in the solder paste printing apparatus 110 according to the second embodiment, the rotary 26 is provided in the head mounting section 13 of the apparatus main body 11. Other configurations are the same as those in the first embodiment, and thus are denoted by the same reference numerals, and description thereof will not be repeated. Also, the solder paste printing process is the same as in the first embodiment, and the description is omitted here (see FIG. 9).

Accordingly, the solder paste printing apparatus 110 according to the second embodiment can obtain the same operation and effects as those of the solder paste printing apparatus 10 according to the first embodiment.

<Third Embodiment> FIG. 12 is a front view of a solder paste printing apparatus according to a third embodiment of the present invention.
(A) is a plan view of the solder paste printing apparatus, FIG.
(B) is a plan view extracting and showing a metal mask of the solder paste printing apparatus, and FIG. 14 is an enlarged cross-sectional view taken along line FF of FIG.

As shown in FIG. 12 and FIG. 13, in the solder paste printing apparatus 210 of the third embodiment,
The solder supply head 211 is mounted on one head mounting section 13. This solder supply head 211 is a casing 51
A hook 213 is provided at a lower end of the casing 5.
A metal mask 214 is inserted between the lower end of the first and the hook 213.

The metal mask 214 is formed on a thin metal plate formed in a belt shape at appropriate intervals by using the printed circuit boards 21, 22, and 2.
Openings 214a-1, 214b-1, 2 corresponding to lands 21a, 22a, 23a, 24a of 3 and 24, respectively.
14c-1 and 214d-1.
That is, the metal mask 214 includes a metal mask (region) 214a having an opening 214a-1 and a metal mask (region) 214a having an opening 214b-1.
-1 and a metal mask (region) 214c having an opening 214c-1
And a metal mask (region) having an opening 214d-1
214d is continuous.

Then, the metal mask 214 is horizontally slid as shown by an arrow G by a driving device such as a motor or a cylinder (not shown) based on the substrate detection signal a of the bar code reader 25, so that the solder supply head 214 is Printed circuit board 2 on which solder paste is to be printed
The metal replacement is performed by selecting the metal mask 214a, 214b, 214c or 214d corresponding to the type of 1, 2, 23 or 24. Note that the mask may be replaced by manually sliding the metal mask 214.

The solder supply head 211 is provided with a seal mechanism as shown in FIG. That is, FIG.
As shown in FIG.
A through-hole 215 is formed in the through-hole 215.
Seal ring 2 inside and outside the lower end opening 215a
16 are provided. The upper end side of the through hole 215 communicates with a through hole 217 provided in the head mounting portion 13,
The through hole 217 communicates with the compressor 218.

Therefore, the ventilation holes 2 provided in the casing 51
When suction is performed from 15 by the compressor 218, the pressure becomes negative and the metal mask 214 is adsorbed to the lower end of the casing 51. As a result, the metal mask 214 (metal mask 214a, 214b, 214c or 214d) is fixed, and the lower end of the casing 51 and the metal mask 214 when the solder paste 36 is extruded by the piston 41.
To prevent the solder paste 36 from leaking from the gap between the solder paste 36 and the solder paste 36.

Other configurations are the same as those in the first embodiment, and therefore are denoted by the same reference numerals, and description thereof will not be repeated. The solder paste printing process is performed in steps S3 and S4 in FIG. This embodiment differs from the first embodiment in that the mask replacement is performed by selecting one of the metal masks 214a, 214b, 214c or 214d. Other steps are the same as those in the first embodiment, and a description thereof will be omitted (see FIG. 9).

As described above, according to the solder paste printing apparatus 210 of the third embodiment, the metal mask 214 (the metal mask 21
4a, 214b, 214c, or 214d), the printed circuit boards 21, 22, 23 on which the solder paste 36 is to be printed on the solder supply head 211 configured to supply the solder paste in the casing to the printed circuit board.
Or metal masks 214a, 21 corresponding to 24 types
Since the mask replacement is performed by selecting 4b, 214c or 214d, the time required for the setup change of the metal mask is greatly reduced.

For this reason, especially in the case where metal masks are frequently changed in small-lot production of various products such as MCMs, the ratio of the changeover time in the solder paste printing work time is greatly reduced. Thus, the efficiency of solder paste printing can be greatly improved.

The printed circuit boards 21, 22, 23, and 24 have barcodes 21b, as board detecting means for detecting the type of the printed circuit board on which the solder paste is to be printed.
22b, 23b and 24b are provided, a bar code reader 25 is provided in the solder printing section 14, and the printed circuit boards 21, 22, 23 or 24 on which solder paste is to be printed based on the board detection signal a of the board detection means. By automatically selecting a metal mask 214a, 214b, 214c or 214d corresponding to the type and exchanging the mask with a mask exchanging means such as a motor for exchanging the mask, the efficiency of the solder paste printing operation is further improved. be able to.

The metal mask 214 is formed on a thin metal plate formed in a belt shape at various intervals at various printed circuit boards 2.
Lands 21a, 22a, 23 of 1, 22, 23, 24
a, 24a corresponding to opening portions 214a-1 and 214a-2, respectively.
14b-1, 214c-1 or 214d-1 (metal mask 214a, 214b, 214c or 214d) is formed, so that the mask can be easily replaced simply by sliding.

The metal mask 214 (metal masks 214a, 214a,
The provision of the sealing mechanism for adsorbing the metal mask 214 (214b, 214c or 214d) makes it possible to fix the metal mask 214 (metal mask 214a, 214b, 214c or 214d) and seal the solder paste 36 in the casing.

<Fourth Embodiment> FIG. 15 is a front view of a solder paste printing apparatus according to a fourth embodiment of the present invention. As shown in the figure, in the solder paste printing apparatus 310 of the fourth embodiment, a metal mask stocker 311 is provided beside the apparatus main body 11. A large number of metal masks such as metal masks 31, 32, 33, and 34 corresponding to the printed circuit boards 21, 22, 23, and 24 are stored in the metal mask stocker 311 so as to be vertically stacked.

Then, based on the board detection signal a of the bar code reader 25 which reads the bar code 21b, 22b, 23b, 24b of the printed board 21, 22, 23 or 24, the printed board 21 on which the solder paste is to be printed. , 22, 23, or 24 are selected, and the transfer between the metal mask stocker 311 and the solder supply head 211 as indicated by an arrow H by a transfer device such as an electric motor or a cylinder (not shown). The metal mask 31, 32, 33 or 34 is conveyed between them, and inserted between the casing 51 and the hook 213, or the metal mask 31, 32, 33 or 34 is removed from between the casings 51 and 32, thereby exchanging the mask. Note that the metal masks 31, 32,
The mask exchange may be performed by inserting or extracting 33 or 34.

Other structures are the same as those in the third embodiment, and therefore are denoted by the same reference numerals, and description thereof is omitted. Also, regarding the solder paste printing process,
Since this is the same as the third embodiment, the description here is omitted.

Accordingly, the solder paste printing apparatus 310 according to the fourth embodiment can obtain the same operation and effects as those of the solder paste printing apparatus 210 according to the third embodiment.

[0059]

As described above in detail with the embodiments of the present invention, according to the solder paste printing apparatus of the first invention, the solder paste in the casing is printed via the metal mask attached to the lower end of the casing. A solder supply head that is configured to supply to a substrate and is provided in advance with a plurality of types of solder supply heads to which different types of metal masks are respectively attached according to the type of the printed circuit board, and that a solder paste is to be printed on the printed circuit board. The time required for the setup change of the metal mask is greatly reduced by selecting the solder supply head having the metal mask corresponding to the type and performing the head replacement.

For this reason, especially in the case where the setup of a metal mask is frequently changed in small-lot production of many kinds, the ratio of the setup change time in the solder paste printing operation time is greatly reduced. The efficiency of the printing operation can be greatly improved.

According to the solder paste printing apparatus of the second invention, in the solder paste printing apparatus of the first invention, a board detecting means for detecting a type of a printed board on which the solder paste is to be printed, and the board detecting means. Head replacement means for selecting a solder supply head having a metal mask corresponding to the type of printed circuit board on which the solder paste is to be printed based on the board detection signal of the present invention, and performing head replacement automatically. By doing so, the efficiency of the solder paste printing operation can be further improved.

Further, according to the solder paste printing apparatus of the fourth invention, the solder supply head configured to supply the solder paste in the casing to the printed circuit board via the metal mask exchangeably disposed at the lower end of the casing is provided. On the other hand,
Since the mask replacement is performed by selecting a metal mask corresponding to the type of the printed circuit board on which the solder paste is to be printed, the time required for the setup change of the metal mask is greatly reduced.

For this reason, especially in the case of frequently changing the setup of a metal mask in a high-mix low-volume production, the ratio of the setup change time in the solder paste printing work time is greatly reduced. The efficiency of the printing operation can be greatly improved.

According to the solder paste printing apparatus of the fourth invention, in the solder paste printing apparatus of the third invention, a board detecting means for detecting a type of a printed board on which the solder paste is to be printed, and the board detecting means. A mask exchange means for selecting a metal mask corresponding to the type of a printed circuit board on which the solder paste is to be printed based on the board detection signal and exchanging the mask. The efficiency of the paste printing operation can be improved.

Further, according to the solder paste printing apparatus of the fifth invention, in the solder paste printing apparatus of the third or fourth invention, the metal mask is formed on a thin metal plate formed in a belt shape at various intervals. Since the openings corresponding to the lands of the printed circuit board are formed, the mask can be easily replaced simply by sliding.

According to the solder paste printing apparatus of the sixth invention, in the solder paste printing apparatus of the third, fourth or fifth invention, the solder supply head is provided with a suction port through a ventilation hole provided in a casing. By providing a sealing mechanism for adsorbing the metal mask at the lower end of the casing, the metal mask can be fixed and the solder paste in the casing can be sealed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a solder paste printing apparatus according to Embodiment 1 of the present invention.

FIG. 2 is a front view of the solder paste printing apparatus.

FIG. 3 is a plan view of the solder paste printing apparatus.

FIG. 4 is a perspective view extracting and showing a solder supply head of the solder paste printing apparatus.

FIG. 5 is a sectional view of the solder supply head.

FIG. 6 is another detachment mechanism diagram of the solder supply head.

FIG. 7 is a view showing a cutting mechanism of a solder paste provided in the solder supply head.

FIG. 8 is a view showing another solder paste cutting mechanism provided in the solder supply head.

FIG. 9 is a flowchart showing steps of solder paste printing by the solder paste printing apparatus.

FIG. 10 is a front view of a solder paste printing apparatus according to Embodiment 2 of the present invention.

FIG. 11 is a plan view of the solder paste printing apparatus.

FIG. 12 is a front view of a solder paste printing apparatus according to Embodiment 3 of the present invention.

FIG. 13A is a plan view of the solder paste printing apparatus, and FIG. 13B is a plan view extracting and showing a metal mask of the solder paste printing apparatus.

FIG. 14 is an enlarged cross-sectional view taken along line FF of FIG. 12;

FIG. 15 is a front view of a solder paste printing apparatus according to Embodiment 4 of the present invention.

FIG. 16 is an explanatory view showing a conventional solder paste printing method.

[Explanation of symbols]

10, 110, 210, 310 Solder paste printing device 11 Device main body 12 Head storage 13 Head mounting portion 14 Solder printing portion 15, 16, 17, 18, 211 Solder supply head 20 Rail 21, 22, 23, 24 Printed circuit board 21a, 22a, 23a, 24a Land 21b, 22b, 23b, 24b Barcode 25 Barcode reader 26 Rotary 27 Linear guide 31, 32, 33, 34, 214 (214a, 214)
b, 214c, 214d) Metal masks 31a, 32a, 33a, 34a, 214a-1, 21
4b-1, 214c-1, 214d-1 Opening 35 Tape 36 Solder paste 37 Mechanical chucking 38, 215, 217 Vent 38a, 215a Lower opening 39, 216 Seal ring 40, 218 Compressor 41 Piston 42 Piston rod 43 Drive device 44 Cutter 45 Opening 51 Casing 213 Hook 311 Metal mask stocker

Claims (6)

[Claims] 1. A solder supply head configured to supply a solder paste in a casing to a printed circuit board via a metal mask attached to a lower end of the casing, wherein different types of metal masks corresponding to types of the printed circuit board are provided. It is equipped with a plurality of types of solder supply heads attached in advance, and is configured to select a solder supply head equipped with a metal mask corresponding to the type of printed circuit board on which the solder paste is to be printed, and perform head replacement. Solder paste printing equipment. 2. A solder paste printing apparatus according to claim 1, further comprising: a board detecting means for detecting a type of a printed circuit board on which the solder paste is to be printed; A solder paste printing apparatus comprising: a solder supply head having a metal mask corresponding to a type of a printed circuit board to be printed; 3. A printed circuit board on which a solder paste is to be printed, to a solder supply head configured to supply the solder paste in the casing to the printed circuit board via a metal mask which is exchangeably disposed at a lower end of the casing. A solder paste printing apparatus characterized in that a metal mask corresponding to the type is selected and the mask is replaced. 4. A solder paste printing apparatus according to claim 3, wherein said board detection means detects a type of a printed circuit board on which the solder paste is to be printed, and said solder paste is applied based on a board detection signal of said board detection means. A solder paste printing apparatus, comprising: a mask changing means for selecting a metal mask corresponding to a type of a printed circuit board to be printed and performing mask replacement. 5. The solder paste printing apparatus according to claim 3, wherein the metal mask has openings corresponding to lands of various printed circuit boards at appropriate intervals on a thin metal plate formed in a belt shape. A solder paste printing apparatus characterized by being formed. 6. The solder paste printing apparatus according to claim 3, wherein the solder supply head has a seal mechanism that sucks the metal mask at a lower end of the casing by sucking through a ventilation hole provided in the casing. A solder paste printing apparatus, comprising: