JP2001217220A - Wafer treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer treating device which can evenly treat a wafer by preventing the occurrence of uneven treatment caused by the supported state of the wafer, by rotating the wafer in a state where the wafer is slipped relatively to a rotating member, such as a turntable, etc. SOLUTION: In this wafer treating device, a wafer holding mechanism 1 provided with three supporting member 17 which come into contact with the lower surface of a wafer W and support the wafer W in a horizontal attitude, and three regulating members 19 which regulate the large horizontal movement of the wafer W by supporting the marginal edge of the wafer W, is installed to the turntable 3 so that gaps (g) may be produced between the regulating members 19 and marginal edge of the wafer W. Since the gaps (g) are provided between the members 19 and marginal edge of the wafer W, the wafer slips against the members 19 due to the resistance of a treating liquid, and a difference is produced between the numbers of revolutions of the wafer W and turntable 3, resulting in the relative rotation of the wafer W. Consequently, the occurrence of uneven treatment caused by the supported state of the wafer W can be prevented, because the members 19 do not come into contact continuously with the same position on the marginal edge of the wafer W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for performing processing by supplying a processing liquid to a circular semiconductor wafer or glass substrate (hereinafter, simply referred to as a substrate). The present invention relates to a technique for supplying a liquid and performing processing on a substrate.

[0002]

2. Description of the Related Art As a conventional substrate processing apparatus of this type, for example, there is an apparatus provided with a turntable on which a plurality of support pins are provided upright to support the edge of a substrate. These support pins are urged toward the center of rotation, and are located inside the outer diameter of the substrate when the substrate is not supported. When supporting the substrate, the substrate is placed after being expanded larger than the outer diameter of the substrate, and is held by a plurality of support pins.

In processing a substrate, a processing liquid is discharged from a nozzle disposed near the center of the turntable toward the lower surface of the substrate while rotating the substrate together with the turntable. The treatment liquid that has passed down the lower surface is wrapped around the upper surface. Thus, only the peripheral portion of the upper surface of the substrate is processed by the processing liquid. As a specific example of the processing, there is a processing target of a substrate having a copper plating on the entire upper surface, and removing only the entire lower surface and a peripheral portion of the upper surface, for example, about 1 to 7 mm.

[0004]

However, the prior art having such a structure has the following problems.

That is, during the processing, the processing liquid does not reach a portion of the peripheral portion of the upper surface of the substrate which is located in the vicinity of the substrate because the edge of the substrate is sandwiched by the plurality of support pins. . Therefore, there is a problem that the peripheral portion of the upper surface of the substrate cannot be uniformly processed.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has been made in view of the fact that a substrate caused by supporting a substrate is slid relative to a rotating member such as a turntable and rotated. An object of the present invention is to provide a substrate processing apparatus capable of preventing unevenness and performing uniform processing.

[0007]

The present invention has the following configuration in order to achieve the above object. That is, a substrate processing apparatus according to claim 1 is a substrate processing apparatus that performs a predetermined processing on a substrate by supplying a processing liquid from a lower surface of the substrate while rotating the substrate, wherein the substrate processing apparatus is disposed on the lower surface side of the substrate, A lower surface of the substrate, a rotatable rotating member, a plurality of support members for supporting the substrate in contact with the lower surface of the substrate, and supporting and supporting an edge of the substrate in a substantially horizontal direction of the substrate. A plurality of regulating members for regulating movement,
A substrate holding mechanism provided on the rotating member, wherein when the substrate is held by the substrate holding mechanism, a gap is generated between the plurality of regulating members and an edge of the substrate. It is a feature.

[0008] Further, the substrate processing apparatus according to claim 2 is
2. The substrate processing apparatus according to claim 1, wherein the rotating member includes a movable member capable of moving forward and backward toward a rotation center of the rotating member, and an advance / retreat driving unit configured to advance / retreat the movable member toward an edge of the substrate. 3. The movable member is advanced to the edge side of the substrate by the advance / retreat driving means to restrict the rotation of the substrate.

Further, the substrate processing apparatus according to claim 3 is
3. The substrate processing apparatus according to claim 2, wherein the advance / retreat driving unit is an air cylinder disposed on the rotating member.

Further, the substrate processing apparatus according to claim 4 is
The substrate processing apparatus according to claim 3, wherein the air cylinder has a supply port formed at one portion of a rotation shaft connected to a lower surface of the rotation member, and covers the supply port.
In addition, a driving gas is supplied via a fixed shaft seal disposed in a ring shape in plan view.

Further, the substrate processing apparatus according to claim 5 is
The substrate processing apparatus according to any one of claims 1 to 4, wherein the plurality of regulating members include a flange portion protruding toward a rotation center side of the substrate at an upper portion.

Further, the substrate processing apparatus according to claim 6 is
6. The substrate processing apparatus according to claim 1, wherein the substrate holding mechanism includes a plurality of rotating members on which the supporting member and the regulating member are formed, and the supporting member is configured to rotate the rotating member. The regulating member is formed at a position corresponding to the moving shaft center, and the regulating member is formed at a position distant from the rotating shaft center of the rotating member.

Further, the substrate processing apparatus according to claim 7 is
7. The substrate processing apparatus according to claim 6, wherein the substrate holding mechanism includes a link mechanism for interlocking one of the plurality of rotating members with another rotating member. It is characterized by the following.

Further, the substrate processing apparatus according to claim 8 is
8. The substrate processing apparatus according to claim 1, wherein the plurality of regulating members are urged by urging means toward a rotation center side of the rotating member. .

Further, the substrate processing apparatus according to claim 9 is
9. The substrate processing apparatus according to claim 1, wherein the substrate holding mechanism includes a stopper for restricting a plurality of restricting members from entering inside the outer diameter of the substrate. is there.

According to a tenth aspect of the present invention, in the substrate processing apparatus of the first aspect, the regulating member has a larger diameter than a notch formed in the substrate. It is characterized by the following.

[0017]

The operation of the first aspect of the invention is as follows. When the rotating member is rotated in a state where the substrate is supported by the supporting member and the edge is supported by the regulating member, the substrate is rotated at the same rotation speed as the rotating member. However, when the processing liquid is supplied from the lower surface, the processing liquid does not have rotational energy, so that the processing liquid that has reached the lower surface of the substrate acts as a resistance to slow down the rotation of the substrate.
Then, since there is a gap between the plurality of regulating members and the edge of the substrate, the substrate slides out with respect to the plurality of regulating members, and a difference occurs in the number of rotations of the substrate and the rotating member, and the substrate is rotated. Relative rotation. Therefore, the regulating member does not keep in contact with the same position of the substrate edge.

According to the second aspect of the present invention, when only the lower surface of the substrate is simply processed (for example, cleaning of the lower surface), the substrate is slid and rotated, causing variations in the processing. Inconvenience may occur. Therefore, by moving the movable member forward and backward by the forward and backward driving means,
Substrate slippage can be controlled.

Further, according to the third aspect of the present invention, the sliding of the substrate is controlled by moving the movable member forward and backward by the air cylinder.

According to the fourth aspect of the present invention, an annular shaft seal is provided so as to cover the supply port of the rotating shaft connected to the lower surface of the rotating member and is annular in plan view. Gas is supplied. Therefore, driving gas can be supplied from the fixed side to the air cylinder disposed on the rotating side.

According to the fifth aspect of the present invention, even if the rotating substrate disturbs the posture for some reason, the height position of the substrate is regulated by the flange of the regulating member. The substrate can be prevented from jumping upward.

According to the sixth aspect of the present invention, since the supporting member is formed on the rotation axis of the rotating member, the sliding of the lower surface of the substrate by the supporting member when supporting the substrate can be suppressed. .

According to the seventh aspect of the present invention, if one rotating member is rotated by the link mechanism, the other rotating members can be similarly rotated.

According to the eighth aspect of the present invention, since the regulating member is urged toward the center of rotation, when holding the substrate, the regulating member may simply be expanded toward the outer periphery. .

According to the ninth aspect of the present invention, a gap can be formed between the plurality of regulating members and the edge of the substrate only by providing the stopper.

According to the tenth aspect of the present invention,
The restriction member can be prevented from entering a notch provided for positioning the substrate.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view illustrating a schematic configuration of a substrate processing apparatus according to an embodiment, and FIG. 2 is a plan view illustrating a main part of a substrate holding mechanism.

The substrate W is supported in contact with the substrate holding mechanism 1 and placed in a horizontal posture on a turntable 3 corresponding to a rotating member. Above the turntable 3, a rectifying mechanism 5 configured to be able to move up and down and rotate is provided. The rectifying mechanism 5 includes a rectifying plate 7 having a diameter slightly larger than the substrate W, and is moved up and down over a standby position far away from the turntable 3 and a processing position close to the upper surface of the substrate W. Also,
The current plate 7 is rotated so as to synchronize with the rotation speed of the substrate W, and this rotation acts to discharge an airflow from the center of rotation on the upper surface of the substrate W to the surroundings.

The rectifying mechanism 5 need not be provided if the inconvenience described later does not occur.

The turntable 3 has an opening 3a formed in the center thereof, and a hollow rotation shaft 9 is mounted coaxially with the opening 3a. The rotating shaft 9 is driven to rotate by an electric motor (not shown), whereby the substrate W is rotated in a horizontal posture around the vertical axis together with the turntable 3. A nozzle 11 for supplying a processing liquid supplied from a processing liquid supply unit (not shown) toward the lower surface of the substrate W is inserted through the rotating shaft 9.

The substrate holding mechanism 1 is provided with movable holding mechanisms 13 at three positions at an equal angle in plan view. Each movable holding mechanism 13 is configured to be rotatable around the rotation axis P1. The rotation member 15 is formed in a shape such that the rotation axis P1 portion is a circular base in a plan view, and the members are respectively extended to opposite sides with respect to the rotation axis P1 so as to be balanced at the time of rotation. I have. These are shown as a first extension portion 15a and a second extension portion 15b, respectively, but the longer second extension portion 15b is pushed by an arm (not shown) when loading / unloading the substrate W. ing.

A support member 17 is provided upright on the rotation member 15 at the position of the rotation axis P1 so as to abut on the lower surface of the substrate W and hold it in a horizontal posture. This support member 17
Has an upper end portion tapered so as to make point contact with the lower surface of the substrate W. A restricting member 19 for restricting a large horizontal movement by contacting the edge of the substrate W is provided on the first extending portion 15a outside the supporting member 17. The regulating member 19 is formed wider than a notch formed on the substrate W. Specifically, it is preferable that the regulating member 19 be formed such that the shape of the rotating base 3 on the rotation center side is at least R10 or more. Further, a flange 19a extending toward the rotation center of the turntable 3 is formed at the upper end thereof.
Is prevented from jumping upward.

The above-mentioned three movable holding mechanisms 13 are configured so that the movement of one movable holding mechanism 13 is transmitted to the other movable holding mechanisms 13 and linked with each other by the link mechanism 21 built in the turntable 3. Have been. This link mechanism 21
A first arm 23 connected to the rotating member 15 and rotating around the rotation axis P1, a second arm 25 having one end connected to the distal end of the first arm 23, and a second arm 2
A third arm 27 having one end connected to the other end of the fifth arm 27 and rotating around the axis P2 near the center while maintaining a certain angle in the shape of a "-". A ring-shaped link member 29 having the other end connected thereto;
Is provided with a tension coil spring 31 (biasing means) for biasing the other end of the third arm 27 in a direction biased toward the center of the turntable 3.

By the way, only the link mechanism 21 described above operates as shown in FIG. 3A, and the regulating member 19 of the movable holding mechanism 13 moves to the center of the turntable 3. The three regulating members 19 enter inside the outer diameter of the substrate W. However, in the present embodiment, a stopper 33 is provided which abuts on the vicinity of the axis P2 of the third arm 27 and regulates rotation so that the three regulating members 19 are not located inside the outer diameter of the substrate W. Have been.

In FIG. 2, for the sake of illustration, the regulating member 19 appears to be located inside the outer diameter of the substrate W, but this is due to the two regulating members indicated by reference numeral (A). This is only apparent from the relationship between the state in which the substrate W is moved toward the member 19 and the flange 19 a of the regulating member 19. When the substrate W is thus placed and placed so that the edges of the substrate W are in contact with the two regulating members 19 of the symbol (A), the regulating member 19 of the symbol (B) and the substrate W A gap g is formed between the edge and the edge. This gap g is, for example, 0.
It is about 5 mm.

Since each movable holding mechanism 13 is linked by the link mechanism 21, only one stopper 33 may be provided without disposing three stoppers 33 as in this embodiment.

Next, a lock mechanism 35 for stopping the substrate W from rotating relative to the turntable 3 with the above configuration will be described with reference to FIGS.

The T-shaped member 37 having a T-shape in plan view is
It is attached to the turntable 3 so as to be rotatable around the axis P3. The movable holding mechanism 1 is located at the same position as the axis P3.
A support member 39 similar to the third support member 17 is formed. A pin-shaped movable member 41 is provided upright on the left arm side of the T-shaped member 37, and an elongated hole 43 is formed on the vertical bar side of the T-shaped member 37.

As shown in FIG. 4, a pin 49 of the air cylinder 45 buried in one part of the turntable 3 is gently inserted into the elongated hole 43 at the tip of the operating shaft 47. I have. Air, which is a gas for driving the air cylinder 45, is supplied to a side hole 51 cut toward the center of the turntable 3.
An opening hole 53 formed in the upper side surface of the rotating shaft 9 as shown in FIG. 1, a vertical hole 55 formed in the rotating shaft 9 and communicating with the opening hole 53, and a lower portion of the rotating shaft 9 below the vertical hole 55. It is supplied through a supply port 57 opened on the outer peripheral surface.

As shown in FIG. 1, the supply port 57 of the rotary shaft 9
An annular supply portion 59 having a shape surrounding the outer peripheral surface of the rotating shaft 9 is disposed on the fixed side located around the rotary shaft 9. The annular supply portion 59 is in contact with the outer peripheral surface of the rotating shaft 9 by a supply ring 61 formed by vertically aligning two shaft seals. The supply ring 61 has elasticity at the portion in contact with the rotating shaft 9, and can supply air to the supply port 57 without leakage even if the rotating shaft 9 is deflected.

In the lock mechanism 35 configured as described above, the air cylinder 45 is deactivated by discharging the air, and the movable member 41 is moved to the substrate W as shown in FIG.
Abuts the edge of On the other hand, when the air is supplied, the air cylinder operates to move the movable member 41 away from the edge of the substrate W as shown in FIG.

The above-described air cylinder 45 corresponds to the forward / backward drive means of the present invention.

Next, the operation of the substrate processing apparatus configured as described above will be described.

First, when the substrate W is carried in, as shown in FIG.
As shown in (b), the second extending portion 15b of the movable holding mechanism 13 is pushed toward the rotating shaft 9 by an arm (not shown). Thereby, the regulating member 19 moves outside the outer diameter of the substrate W.

The description will be made on the assumption that the substrate W is plated on its upper surface, and is intended to perform a process of etching and removing a few mm of a peripheral portion of the upper surface by this apparatus.

Next, the substrate W to be processed is carried in by the transfer arm and placed on the three support members 17 so that the lower surfaces of the substrates W abut. And the second extension part 1 by the arm
Release the pressing of 5b.

When the pressing of the second extension 15b is released, the regulating member 19 is moved by the tension coil spring 31 in the direction in which the regulating member 19 comes into contact with the edge of the substrate W as shown in FIG. However, when the substrate W is brought closer to the two support members 17 by the function of the stopper 33, the substrate W is held in a state where a gap g is generated. At this time, since the shaft core P1 and the support member 17 are formed coaxially, even if the rotation member 15 rotates, it is possible to prevent the support member 17 from scratching the lower surface of the substrate W.

After the rectifying plate 7 is lowered to the processing position, the turntable 3 is rotated to rotate the substrate W at a constant speed and synchronize the rectifying plate 7 with the rotation.
Next, when the processing liquid is supplied from the nozzle 11, the processing liquid traveling along the lower surface and heading toward the peripheral portion of the lower surface crawls on the upper surface of the substrate W to process the peripheral portion of the upper surface. At this time, the processing liquid from the nozzle 11, which is a fixed system, comes into contact with the lower surface of the rotating substrate W, causing resistance, and the substrate W, which is only loosely gripped, rotates with a delay with respect to the turntable 3. Become. That is, a difference occurs between the number of rotations of the substrate W and the turntable 3, and the substrate W rotates relative to the turntable 3. Therefore,
Since the regulating member 19 does not keep in contact with the same position of the edge of the substrate W, it is possible to prevent processing unevenness due to the support.

Further, since the current plate 7 is close to the substrate W, the air between the current plate 7 and the substrate W flows from the central portion to the peripheral portion. Therefore, even if mist of the processing liquid is generated during processing, the mist is discharged to the surroundings, so that the rotation center side of the substrate W can be prevented from being contaminated.

After supplying the processing liquid for a certain period of time as described above, the number of rotations is increased to shake off the processing liquid, the rotation is stopped, and then the processed substrate W is carried out in a procedure reverse to the above procedure. .

As described above, the processing unevenness is prevented by rotating the substrate W relative to the turntable 3. However, such rotation may be reversed depending on the processing contents such as simple cleaning processing. It may cause unevenness.

Therefore, for example, in the case of a simple cleaning process, the edge of the substrate W is gripped by the lock mechanism 35 as shown in FIG. As a result, the substrate W is strongly held,
The relative rotation with respect to the turntable 3 can be stopped, and unevenness can be prevented at the time of a cleaning process or the like.

As described above, the lock mechanism 35 shown in FIG.
Instead of completely fixing the substrate W as shown in FIG. 4A, the process of fixing the substrate W for a fixed time and then loosening it as shown in FIG. 4B may be repeated throughout the processing. Thereby, the relative rotation speed of the substrate W with respect to the turntable 3 can be controlled.

In this embodiment, the lock mechanism 35 as described above is used.
However, a lock mechanism 65 as shown in FIG. 5 may be employed.

That is, the rotating member 6 is provided around the turntable 3.
7 and a support member 6 is provided at the position of the axis P3.
The movable member 71 is provided upright on the rotating member 67 on the opposite side of the support member 69. Further, a rotating member 67 is provided at an upper end portion, and a magnet portion 75 is provided on a lower side surface of the rotating shaft 73 penetrating the rotating table 3.

On the side of the rotating shaft 9 close to the magnet 75, a magnet 77 is provided so as to be able to move up and down. This magnet part 77
, An operating shaft 79a of an air cylinder 79, which is fixedly arranged, is interlockingly connected.

Even with such a lock mechanism 65, as shown in FIGS. 6 (a) and 6 (b), when the air cylinder 79 is deactivated or activated, the magnet part 7 of the moving system can be moved.
The state where the substrate 5 does not grip the substrate W by repelling and attracting the magnetic force of the fixed magnet unit 77 (FIG. 6A)
And the state in which the substrate W is gripped (FIG. 6B), and performs the same function as the lock mechanism 35 described above.

The present invention can be modified as follows.

(1) The substrate holding mechanism 1 may be configured so that its center is largely eccentric from the rotation axis of the turntable 3. For example, the substrate holding mechanism 1 is disposed so as to be largely displaced by about 1 to 3 mm from the axis of the turntable 3 while maintaining the gap g as described above.

As described above, since the center of the substrate holding mechanism 1 is largely eccentric from the rotation axis of the turntable 3, the edge of the substrate W is strongly pressed against the eccentric regulating member 19 during rotation, and Excessive slippage of W can be prevented. Therefore, it is possible to prevent an inconvenience in which the gap g changes for each apparatus and processing becomes unstable due to an assembly error or the like.

(2) In the embodiment, the example in which the substrate holding mechanism 1 includes three movable holding mechanisms 13 has been described, but the present invention is not limited to this number.

(3) If a substrate holding mechanism composed of a plurality of supporting members and regulating members is provided so as to hold the substrate W loosely enough to rotate relatively, the configuration is limited to the above configuration. Not something.

[0063]

As is apparent from the above description, according to the first aspect of the present invention, since a gap is provided between the plurality of regulating members and the edge of the substrate, The resistance causes the substrate to slide with respect to the plurality of regulating members, causing a difference in the number of rotations between the substrate and the turntable, and causing the substrate to rotate relative to the rotating member. Therefore, since the regulating member does not keep in contact with the same position of the edge of the substrate, it is possible to prevent processing unevenness due to the support of the substrate and to perform processing uniformly.

According to the second aspect of the present invention, the movable member is driven forward and backward by the forward and backward drive means,
It is possible to control whether the sliding of the substrate is increased or decreased or stopped. Therefore, it is possible to appropriately perform a process such as a mere cleaning process that is inconvenient for slipping, and to set an appropriate slip according to the process.

According to the third aspect of the invention, the sliding of the substrate can be controlled only by moving the movable member back and forth by the air cylinder, and the structure of the apparatus can be simplified.

According to the fourth aspect of the present invention, the driving gas can be supplied from the fixed side to the air cylinder disposed on the rotating side, and the air cylinder can be easily driven. it can.

According to the fifth aspect of the present invention, since the height position of the substrate is regulated by the flange of the regulating member, the substrate can be prevented from jumping upward. Therefore, there is no possibility that the substrate jumps out to the surroundings, and the processing can be performed safely.

According to the sixth aspect of the present invention, since the sliding of the lower surface of the substrate by the supporting member can be suppressed when supporting the substrate, the generation of particles during the holding can be suppressed, and the edge of the substrate can be suppressed. Even if the rim abuts, it can be reliably supported.

According to the seventh aspect of the present invention, if one rotating member is rotated, the other rotating member can be rotated in the same manner, and the supporting operation and the opening operation of the substrate can be performed. The structure of the substrate holding mechanism to be performed can be simplified.

According to the eighth aspect of the present invention, when holding the substrate, it is sufficient to simply expand the regulating member to the outer peripheral side, and the mechanism relating to the holding operation can be simplified.

According to the ninth aspect of the present invention, a gap for sliding the substrate can be created only by providing the stopper, so that the same effect can be obtained even if the stopper is provided in the conventional apparatus. Becomes possible.

According to the tenth aspect of the present invention,
The restriction member can be prevented from entering the notch, and the disadvantages such as the rotation of the substrate being stopped and the substrate being damaged by the impact when the notch enters can be prevented.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view illustrating a schematic configuration of a substrate processing apparatus according to an embodiment.

FIG. 2 is a plan view showing a main part of the substrate processing apparatus according to the embodiment.

FIG. 3 is an operation explanatory view of a substrate holding mechanism.

FIG. 4 is an explanatory diagram of an operation of a lock mechanism.

FIG. 5 is a schematic configuration diagram showing a modification of the lock mechanism.

FIG. 6 is a diagram illustrating the operation of the lock mechanism.

[Explanation of symbols]

 W ... Substrate 1 ... Substrate holding mechanism 3 ... Rotating table (rotating member) 5 ... Rectifying mechanism 9 ... Rotating shaft 11 ... Nozzle 13 ... Movable holding mechanism 15 ... Rotating member 17 ... Supporting member 19 ... Regulating member 19a ... Flange 21 … Link mechanism 31… tension coil spring (biasing means) 33… stopper 35… lock mechanism 37… T-shaped member 39… support member 41… movable member 45… air cylinder (forward / backward drive means)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yukihiro Takamura 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori-Terauchi, Kamigyo-ku, Kyoto Dainippon Screen Mfg. Co., Ltd. (72) Inventor Mikio Masuichi Kyoto (1) Dai Nippon Screen Manufacturing Co., Ltd. (72) Inventor Takashi Kawamura 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori Terauchi, Kamigyo-ku, Kyoto F-term in Nippon Screen Manufacturing Co., Ltd. (reference) 4K057 WA01 WA11 WB04 WM11 WM20 WN01 5F043 DD30 EE07 EE08 EE35 EE40

Claims (10)

[Claims] 1. A substrate processing apparatus for performing a predetermined process on a substrate by supplying a processing liquid from the lower surface of the substrate while rotating the substrate, wherein an opposing surface disposed on the lower surface side of the substrate and facing the lower surface of the substrate is provided. A rotatable rotating member, a plurality of supporting members for supporting the substrate by contacting the lower surface of the substrate, and a plurality of restricting members for supporting and supporting an edge of the substrate to restrict the movement of the substrate in a substantially horizontal direction. And a substrate holding mechanism provided on the rotating member. When the substrate is held by the substrate holding mechanism, a gap is provided between the plurality of regulating members and an edge of the substrate. A substrate processing apparatus characterized by causing: 2. The substrate processing apparatus according to claim 1, wherein the rotating member includes a movable member capable of moving forward and backward toward a rotation center of the rotating member, and moving the movable member toward an edge of the substrate. A substrate processing apparatus, comprising: a moving unit that moves the movable member toward an edge of the substrate by the moving unit. 3. The substrate processing apparatus according to claim 2, wherein the advance / retreat driving means is an air cylinder disposed on the rotating member. 4. The substrate processing apparatus according to claim 3, wherein the air cylinder covers a supply port formed at one portion of a rotation shaft connected to a lower surface of the rotation member, and covers the supply port. A substrate processing apparatus for supplying a driving gas via a shaft seal fixed in position and disposed in an annular shape in plan view. 5. The substrate processing apparatus according to claim 1, wherein the plurality of regulating members include a flange portion protruding toward a rotation center side of the substrate at an upper portion. Substrate processing equipment. 6. The substrate processing apparatus according to claim 1, wherein the substrate holding mechanism includes a plurality of rotating members on which the supporting member and the regulating member are formed, and wherein the supporting member is A substrate processing apparatus, wherein the regulating member is formed at a position coinciding with the pivot axis of the pivot member, and the regulating member is formed at a position distant from the pivot axis of the pivot member. 7. The substrate processing apparatus according to claim 6, wherein the substrate holding mechanism is configured to link one of the plurality of rotating members with another rotating member. A substrate processing apparatus comprising: 8. The substrate processing apparatus according to claim 1, wherein the plurality of regulating members are urged by urging means toward a rotation center of the rotating member. Substrate processing apparatus. 9. The substrate processing apparatus according to claim 1, wherein the substrate holding mechanism includes a stopper for restricting a plurality of restricting members from entering inside the outer diameter of the substrate. Characteristic substrate processing equipment. 10. The substrate processing apparatus according to claim 1, wherein the regulating member has a diameter larger than a notch formed in the substrate.