JP2001200385A - Method and apparatus for automatically delivering base plate - Google Patents
Method and apparatus for automatically delivering base plateInfo
- Publication number
- JP2001200385A JP2001200385A JP2000011053A JP2000011053A JP2001200385A JP 2001200385 A JP2001200385 A JP 2001200385A JP 2000011053 A JP2000011053 A JP 2000011053A JP 2000011053 A JP2000011053 A JP 2000011053A JP 2001200385 A JP2001200385 A JP 2001200385A
- Authority
- JP
- Japan
- Prior art keywords
- mother plate
- plate
- detected
- motherboard
- automatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Investigating And Analyzing Materials By Characteristic Methods (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、母板を使用した電
解操業において、問題を生じている母板を払出すための
母板自動払出方法及び装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic motherboard dispensing method and apparatus for dispensing a motherboard having a problem in an electrolytic operation using the motherboard.
【０００２】[0002]
【従来の技術】従来、例えば、銅種板電解においては、
電解槽の中に、母板を陰極として、陽極（アノード）に
は粗銅（９９％Ｃｕ）を用いて、一昼夜電解精製を行な
い、電解により得られた陰極の母板上の電着銅（９９．
９９％Ｃｕ）の薄板を剥ぎ取ることにより種板が製造さ
れる。2. Description of the Related Art Conventionally, for example, in copper seed plate electrolysis,
In the electrolytic cell, electrolytic purification was carried out for 24 hours using the base plate as a cathode and crude copper (99% Cu) as an anode, and the electrodeposited copper (99%) on the base plate of the cathode obtained by electrolysis was obtained. .
A seed plate is produced by stripping a thin plate of 99% Cu).
【０００３】更に説明すると、図１に種板を作製するた
めの銅電解用母板１００の一例を示す。母板１００は、
例えば、厚さ３．１ｍｍ、幅（Ｗ０）９８６ｍｍ、高さ
（Ｈ０）１０８５ｍｍとされるＴｉ薄板にて作製され、
両側部に絶縁材からなるエッジワイズプロテクタ１０１
が設けられ、上端部に母板ビーム１０２が取付けられ
る。More specifically, FIG. 1 shows an example of a copper electrolysis mother plate 100 for producing a seed plate. The mother plate 100
For example, it is made of a Ti thin plate having a thickness of 3.1 mm, a width (W0) of 986 mm, and a height (H0) of 1085 mm.
Edgewise protector 101 made of insulating material on both sides
Is provided, and the mother plate beam 102 is attached to the upper end.
【０００４】種板電解槽にて母板１００の両表面に種板
が電着されると、母板１００は、クレーンにてビーム１
０２を持ち上げることによって電解槽から引き揚げら
れ、図４に示すように、電解槽１１０に隣接して配置さ
れた受入ラインＡＬｉｎ、ＢＬｉｎへと搬送される。母
板１００は、洗浄後それぞれ、オーバーヘッドコンベア
２００を備えた種板剥ぎ取りラインＬ（Ｌ１、Ｌ２）へ
と送入される。母板１００は、ビーム１０２をオーバー
ヘッドコンベア２００のフック２１１（図５）に係止し
て、懸吊されながら搬送される。母板１００は、先ず、
口付装置２０１へと送入され、種板の上部をハンマリン
グして剥がれ易くする。その後、口開装置２０２へと送
入し、吸盤にて吸引して種板の上部のみが母板１００か
ら剥がされた状態とされる。次いで、種板は、剥ぎ取り
装置２０３へと送入し、剥がされた種板上部に剥ぎ取り
アームを差し込み、アームを下降することにより、母板
１００から剥ぎ取られる。When the seed plates are electrodeposited on both surfaces of the base plate 100 in the seed plate electrolytic cell, the base plate 100 is
02 is lifted from the electrolytic cell by being lifted, and is conveyed to receiving lines ALin and BLin arranged adjacent to the electrolytic cell 110 as shown in FIG. After the cleaning, the mother plates 100 are respectively sent to the seed plate stripping lines L (L1, L2) including the overhead conveyor 200. The mother plate 100 is conveyed while being suspended by locking the beam 102 to a hook 211 (FIG. 5) of the overhead conveyor 200. First, the mother plate 100
It is fed into the spouting device 201 and the upper part of the seed plate is hammered to make it easy to peel off. After that, it is fed into the mouth opening device 202, sucked by the suction cup, and only the upper portion of the seed plate is peeled off from the mother plate 100. Next, the seed plate is fed into the stripping device 203, the stripping arm is inserted into the upper part of the separated seed plate, and the arm is lowered to be stripped from the mother plate 100.
【０００５】母板１００より剥がされた種板は、コンテ
ナ２０４へと移送され、コンテナコンベア２０５にて所
定の工程へと送給される。[0005] The seed plate peeled from the mother plate 100 is transferred to a container 204 and fed to a predetermined process by a container conveyor 205.
【０００６】種板が除去された母板１００は、研磨装置
２０６にて母板表面を一様に研磨した後、膠散布を行
い、排出ラインＡＬｏｕｔ、ＢＬｏｕｔを介して電解槽
１１０へと送給され、繰り返し使用される。The mother plate 100 from which the seed plate has been removed is polished uniformly after the surface of the mother plate 100 is polished uniformly by the polishing device 206, and is fed to the electrolytic cell 110 via the discharge lines ALout and BLout. Is used repeatedly.
【０００７】従来、母板としては、ＳＵＳ板、或いは圧
延銅板などが使用されているが、近年、軽量で、丈夫で
あり、取り扱いが容易で作業性が良いという理由から、
上述のようなチタン（Ｔｉ）板が使用されている。Conventionally, a SUS plate or a rolled copper plate has been used as a base plate. However, in recent years, it has been used because it is lightweight, durable, easy to handle and has good workability.
A titanium (Ti) plate as described above is used.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、チタン
母板１００は、酸化しやすく、母板表面に酸化膜（Ｔｉ
Ｏ2）が形成され、この酸化膜は、銅の電着状態を悪化
させ、電着が網目状（穴あき）となったものが発生す
る。又、エッジワイズプロテクタ１０１が外れているな
どの問題を有した母板も生じる。However, the titanium base plate 100 is easily oxidized, and an oxide film (Ti) is formed on the surface of the base plate.
O 2 ) is formed, and this oxide film deteriorates the electrodeposition state of copper, and the electrodeposition becomes mesh-like (perforated). Further, a mother plate having a problem that the edgewise protector 101 is detached also occurs.
【０００９】そのために、従来においては、種板剥ぎ取
り装置２０３の下流側に母板払出部２０７を設け、作業
者が目視により母板の電着状態を監視し、問題のある母
板を見つけた場合には剥ぎ取りラインの運転を一旦停止
し、この母板を手作業にて種板剥ぎ取りラインＬ１、Ｌ
２より払出し、排出ラインＡＬｏｕｔ、ＢＬｏｕｔへと
送給されるのを阻止していた。For this purpose, conventionally, a mother plate dispensing section 207 is provided downstream of the seed plate stripping device 203, and an operator visually monitors the electrodeposition state of the mother plate to find a problematic mother plate. In this case, the operation of the stripping line is temporarily stopped, and the mother plate is manually removed from the seed plate stripping lines L1 and L1.
2, and was prevented from being supplied to the discharge lines ALout and BLout.
【００１０】このような、問題のある母板を払い出すた
めに剥ぎ取りラインＬの自動運転を停止することは、操
業の遅れをもたらし、作業効率の点で大きな問題となっ
ていた。又、一般に、種板剥ぎ取りラインＬは、図４に
示すように、複数（Ｌ１、Ｌ２）設けられており、払出
部２０７が作業者から見難い位置にある場合などには、
誤った母板を払い出してしまうこともあった。[0010] Stopping the automatic operation of the stripping line L in order to pay out a problematic mother plate causes a delay in operation, and has been a serious problem in terms of work efficiency. Generally, a plurality of seed plate stripping lines L (L1, L2) are provided as shown in FIG. 4, and when the payout unit 207 is located at a position that is difficult for an operator to see,
Sometimes the wrong motherboard was paid out.
【００１１】従って、本発明の目的は、種板剥ぎ取りラ
インの自動運転を停止させることなく、不良母板を払い
出すことができ、又、誤った母板を払い出してしまうこ
とを防止することのできる母板自動払出方法及び装置を
提供することである。Accordingly, it is an object of the present invention to provide a method of dispensing a defective mother plate without stopping automatic operation of a seed plate stripping line and preventing an incorrect mother plate from being dispensed. It is an object of the present invention to provide a method and an apparatus for automatically dispensing a mother plate.
【００１２】[0012]
【課題を解決するための手段】上記目的は本発明に係る
母板自動払出方法及び装置にて達成される。The above object is achieved by a method and apparatus for automatically dispensing a mother plate according to the present invention.
【００１３】第１の本発明によると、電解槽より引き上
げた母板に問題がある場合には、この母板のビームの所
定の位置に被検出部材を設置し、母板払出部に設置した
検出手段にて前記被検出部材を検出し、前記被検出部材
が設置された母板をライン外へと払出すことを特徴とす
る母板自動払出方法が提供される。According to the first aspect of the present invention, when there is a problem with the mother plate pulled up from the electrolytic cell, the member to be detected is installed at a predetermined position of the beam of the mother plate and is installed at the mother plate dispensing section. There is provided an automatic motherboard dispensing method, characterized in that the detected member is detected by a detecting means, and the motherboard on which the detected member is installed is paid out of a line.
【００１４】本発明の一実施態様によると、前記被検出
部材は、可視光線或いは赤外光線を反射する反射部材で
あり、前記検出手段は、前記反射部材に可視光線或いは
赤外光線を投射し、前記反射板からの反射光を受光し、
信号を発する光電管である。According to one embodiment of the present invention, the detected member is a reflecting member that reflects visible light or infrared light, and the detecting means projects visible light or infrared light onto the reflecting member. Receiving reflected light from the reflector,
Photoelectric tube that emits a signal.
【００１５】本発明の他の実施態様によると、前記反射
部材は、母板のビームの端部に装着し得る細長Ｕ字形状
のキャップであり、可視光線或いは赤外光線を反射する
表面を有している。他の実施態様によると、前記反射部
材は、母板のビームに装着し得る細長Ｕ字形状のキャッ
プと、該キャップの表面に貼り付けられる反射板とを有
する。According to another embodiment of the present invention, the reflecting member is an elongated U-shaped cap that can be attached to the end of the beam of the mother plate, and has a surface that reflects visible light or infrared light. are doing. According to another embodiment, the reflecting member has an elongated U-shaped cap that can be attached to the beam of the mother plate, and a reflecting plate that is attached to a surface of the cap.
【００１６】第２の本発明によると、母板ビームに取り
付けた被検出部材を検知する検出手段と、前記検出手段
からの信号により作動する駆動手段と、前記駆動手段に
よりオーバーヘッドコンベアにて搬送されている母板の
ビームに係合し、ビームをオーバーヘッドコンベアのフ
ックより上方へと持上げる受取り腕手段と、前記受取り
腕手段により担持された前記母板ビームを集積するため
のレール支持手段と、を有することを特徴とする母板自
動払出装置が提供される。According to the second aspect of the present invention, detecting means for detecting a member to be detected attached to the mother plate beam, driving means operated by a signal from the detecting means, and conveyed by the driving means on an overhead conveyor. Receiving arm means that engages with the beam of the mother plate, and lifts the beam above the hook of the overhead conveyor, rail support means for accumulating the mother plate beam carried by the receiving arm means, An automatic motherboard dispensing device is provided.
【００１７】本発明の一実施態様によると、前記オーバ
ーヘッドコンベアに隣接して配置された基台と、前記基
台の上端に取付けられた支持フレームと、前記支持フレ
ームに対し水平方向に移動自在に支持された可動支持台
と、を有し、前記駆動手段及び受取り腕手段は、前記可
動支持台に設置される。According to one embodiment of the present invention, a base arranged adjacent to the overhead conveyor, a support frame attached to an upper end of the base, and a movable member horizontally movable with respect to the support frame. And a driving support and a receiving arm are mounted on the movable support.
【００１８】[0018]
【発明の実施の形態】以下、本発明に係る母板自動払出
方法及び装置を図面に則して更に詳しく説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method and apparatus for automatically dispensing a mother plate according to the present invention will be described in more detail with reference to the drawings.
【００１９】本発明の母板自動払出方法は、一実施例に
よれば、例えば、図４を参照して説明した銅種板電解に
おける種板剥ぎ取りラインＬ（Ｌ１、Ｌ２）にて実施す
ることができる。種板剥ぎ取りラインＬの全体構成につ
いては上述した通りであり、又、剥ぎ取りラインＬに沿
って設置された口付装置２０１、口開装置２０２、剥ぎ
取り装置２０３、研磨装置２０６などは当業者には周知
であるので、詳しい説明は省略する。According to one embodiment, the mother plate automatic dispensing method of the present invention is implemented, for example, on the seed plate stripping line L (L1, L2) in the copper seed plate electrolysis described with reference to FIG. be able to. The overall configuration of the seed plate stripping line L is as described above, and the splicing device 201, the mouth opening device 202, the stripping device 203, the polishing device 206, etc., which are installed along the stripping line L, are the same. The details are omitted because they are well known to traders.
【００２０】通常、銅種板の電解においては、電解精製
が終了すると、種板、即ち、母板１００が電解槽１１０
から引き揚げられ、上述したように、種板剥ぎ取りライ
ンＬへと送入されるが、電解槽１１０から母板１００を
引き揚げたときに電着状態が作業者により目視により検
査される。Normally, in the electrolysis of a copper seed plate, when the electrolytic refining is completed, the seed plate, that is, the mother plate 100 is placed in the electrolytic cell 110.
As described above, it is sent to the seed plate stripping line L. When the mother plate 100 is pulled up from the electrolytic cell 110, the state of electrodeposition is visually inspected by an operator.
【００２１】このとき、本発明によれば、例えば、網目
状（穴あき）電着となっている場合とか、エッジワイズ
プロテクタ１０１が外れているなどの問題を生じている
不良母板を見付けた場合には、作業者は、図１及び図２
に示すように、母板１００のビーム１０２の所定位置に
被検出部材１２０を取り付ける。この被検出部材１２０
が取り付けられる母板ビーム１０２の位置は、後で説明
するように、光電管などとされる検出手段１３０により
この被検出部材１２０を検知することができる位置なら
ば如何なる位置でも良いが、本実施例では、図１及び図
２に示すように、母板ビーム１０２の端部（耳部）に取
付けられる。At this time, according to the present invention, for example, a defective mother plate having a problem such as a case of a mesh-like (perforated) electrodeposition or a detachment of the edgewise protector 101 was found. In the case, the worker can use FIG. 1 and FIG.
As shown in (1), the detected member 120 is attached to a predetermined position of the beam 102 of the mother plate 100. This detected member 120
As will be described later, the position of the mother plate beam 102 to which is attached may be any position as long as the detected member 120 can be detected by the detecting means 130 such as a photoelectric tube. Then, as shown in FIG. 1 and FIG. 2, it is attached to the end (ear) of the mother plate beam 102.
【００２２】又、被検出部材１２０は、図３（Ａ）をも
参照すると理解されるように、一実施例では、母板ビー
ム１０２に上側より装着し得る細長Ｕ字形状のキャップ
とされる。このキャップ１２０は、検出手段１３０であ
る光電管から投射される可視光線を反射することのでき
る表面を有している。従って、このキャップ自体を反射
度の大きい色、例えば、白色などの明るい色の材料で作
製することができる。例えば、白色の塩化ビニル樹脂な
どで作製するのが好ましい。別法として、図３（Ｂ）に
示すように、細長Ｕ字形状のキャップ本体１２０ａの表
面に、可視光線を反射することのできる反射板１２０ｂ
を貼り付けて形成することもできる。所望に応じて、可
視光線の代わりに赤外光線を使用することもできる。As will be understood from FIG. 3A, the detected member 120 is, in one embodiment, an elongated U-shaped cap which can be mounted on the mother plate beam 102 from above. . The cap 120 has a surface capable of reflecting visible light projected from the photoelectric tube serving as the detecting means 130. Therefore, the cap itself can be made of a material having a high reflectivity, for example, a bright color material such as white. For example, it is preferable to make it from a white vinyl chloride resin. Alternatively, as shown in FIG. 3 (B), a reflecting plate 120b capable of reflecting visible light is formed on the surface of an elongated U-shaped cap body 120a.
Can also be formed by sticking. If desired, infrared light can be used instead of visible light.
【００２３】上述にて理解されるように、本発明によれ
ば、物質の光の反射度の差を利用する。即ち、検出手段
１３０としての光電管は、母板のビーム１０２には反応
しないが、被検出部材１２０には反応する。As will be appreciated, the present invention takes advantage of the difference in the reflectivity of light of a substance. That is, the photoelectric tube serving as the detecting unit 130 does not react to the beam 102 of the mother plate, but does react to the detected member 120.
【００２４】本実施例によれば、本発明の母板自動払出
方法を実施するために、母板研磨装置２０６の下流側に
設置される母板自動払出装置に検出手段１３０が設置さ
れる（図５）。上述したように、本実施例では、検出手
段１３０の光電管としては、可視光線を使用したオムロ
ン株式会社製のアンプ内臓形の光電スイッチ（商品名：
Ｅ３Ｓ−ＡＤ／６６ 拡散反射形）を使用した。従っ
て、被検出部材１２０を形成するキャップ本体１２０ａ
に取付ける反射板１２０ｂとしては、アクリル樹脂板に
て作製されたオムロン株式会社製の反射板（商品名：形
Ｅ３９−ＲＳ３）が好適に使用され、この反射板１２０
を細長Ｕ字形状のキャップ本体１２０ａの表面に貼り付
けて使用した。According to the present embodiment, in order to carry out the automatic mother plate dispensing method of the present invention, the detecting means 130 is installed in the automatic mother plate dispenser installed downstream of the mother plate polishing device 206 (see FIG. 1). (Fig. 5). As described above, in the present embodiment, as the photoelectric tube of the detection means 130, an OMRON Corporation built-in amplifier-type photoelectric switch using visible light (trade name:
E3S-AD / 66 diffuse reflection type) was used. Therefore, the cap body 120a forming the detected member 120
A reflector (trade name: E39-RS3) manufactured by OMRON Corporation and made of an acrylic resin plate is suitably used as the reflector 120b to be mounted on the reflector 120b.
Was attached to the surface of an elongated U-shaped cap body 120a for use.
【００２５】光電管１３０が反応した場合、払出部２０
７に設置された母板自動払出装置が作動する。次に、母
板自動払出装置について説明する。When the phototube 130 reacts, the payout unit 20
The automatic motherboard dispensing device installed at 7 operates. Next, an automatic motherboard dispensing apparatus will be described.
【００２６】図５〜図７に、母板自動払出装置１の一実
施例を示す。本実施例によると、母板自動払出装置１
は、オーバーヘッドコンベア２００に隣接して設置され
たフレームワークからなる基台２を備えている。基台２
の上端には、母板持上げ移動装置４が配置される。FIG. 5 to FIG. 7 show an embodiment of the automatic motherboard dispensing apparatus 1. According to the present embodiment, the motherboard automatic dispensing device 1
Has a base 2 made of a framework installed adjacent to the overhead conveyor 200. Base 2
At the upper end of the base plate, a mother plate lifting moving device 4 is arranged.
【００２７】母板持上げ移動装置４は、基台２の上端に
取付けられた支持フレーム６を備え、この支持フレーム
６は、可動支持台６０を水平方向に移動自在に支持して
いる。The mother plate lifting / moving device 4 includes a support frame 6 attached to the upper end of the base 2, and the support frame 6 supports a movable support base 60 so as to be movable in the horizontal direction.
【００２８】つまり、本実施例では、支持フレーム６は
ガイドシャフト６１を有しており、可動支持台６０が軸
受け６２を介してガイドシャフト６１に沿って摺動自在
に担持されている。That is, in this embodiment, the support frame 6 has the guide shaft 61, and the movable support 60 is slidably supported along the guide shaft 61 via the bearing 62.
【００２９】又、支持フレーム６と可動支持台６０との
間には親ねじ機構６３が設置されている。即ち、支持フ
レーム６には、ガイドシャフト６１と平行に且つ回転自
在に親ねじ６３ａが設けられ、支持フレーム６に設置さ
れた駆動モータＭ及びチェーン６４を介して回転駆動さ
れる。一方、可動支持台６０には、親ねじ６３ａに螺合
したナット部材６３ｂが取り付けられている。従って、
駆動モータＭを付勢することにより、可動支持台６０
は、図５にて矢印方向に、つまり、オーバーヘッドコン
ベア２００に離接して往復運動することができる。A lead screw mechanism 63 is provided between the support frame 6 and the movable support 60. That is, the support frame 6 is provided with a lead screw 63 a rotatably in parallel with the guide shaft 61, and is rotatably driven via the drive motor M and the chain 64 installed on the support frame 6. On the other hand, a nut member 63b screwed to the lead screw 63a is attached to the movable support base 60. Therefore,
By energizing the drive motor M, the movable support 60
5 can reciprocate in the direction of the arrow in FIG.
【００３０】更に、可動支持台６０には、駆動手段とし
てのエアシリンダ１０を取付けた垂直支持板１２が固定
されている。エアシリンダ１０の下方へと延在したピス
トン１１の下方端には、斜め方向へと延在した受取り腕
２０の上端部２１が軸２２を介して取付けられる。この
受取り腕２０の上端部２１には、引き掻き部材３０が軸
３１を介して回転自在に取付けられている。引き掻き部
材３０は、図５にて、ばね手段（図示せず）にて時計方
向に付勢されているがその回転力は、引き掻き部材３０
の上方端に設けられたストッパ部材３２にて規制されて
いる。Further, a vertical support plate 12 to which an air cylinder 10 as a driving means is mounted is fixed to the movable support base 60. An upper end 21 of a receiving arm 20 extending in an oblique direction is attached to a lower end of a piston 11 extending below the air cylinder 10 via a shaft 22. A scratching member 30 is rotatably mounted on an upper end 21 of the receiving arm 20 via a shaft 31. In FIG. 5, the scratching member 30 is urged clockwise by a spring means (not shown).
Is restricted by a stopper member 32 provided at an upper end of the first member.
【００３１】母板１００は、上述のように、上端部に取
付けた母板ビーム１０２が剥ぎ取りラインＬに設置され
たオーバーヘッドコンベア２００のフック２１１に係止
されて懸吊されながら搬送される。As described above, the mother plate 100 is conveyed while the mother plate beam 102 attached to the upper end portion is suspended by the hook 211 of the overhead conveyor 200 installed on the stripping line L.
【００３２】上述のように、被検出部材１２０が取付け
られた問題の母板１００が母板自動払出装置１が設置さ
れた位置に到達すると、検出手段１３０により被検出部
材１２０が検知され、信号を母板自動払出装置１に送信
する。検出手段１３０は、本実施例では、被検出部材１
２０より距離（Ｈ）＝３０ｃｍ程度離間した位置に取付
けたが、確実に被検出部材１２０を検知することができ
た。As described above, when the mother plate 100 to which the detected member 120 is attached reaches the position where the automatic mother plate dispensing device 1 is installed, the detecting member 130 detects the detected member 120 and outputs a signal. Is transmitted to the motherboard automatic dispensing apparatus 1. In this embodiment, the detecting means 130 is a member to be detected 1
Although it was mounted at a position separated by a distance (H) of about 30 cm from 20, the detected member 120 could be reliably detected.
【００３３】検出手段１３０からの信号により駆動モー
タＭが付勢され、親ねじ機構６３により可動支持台６０
を移動させ、図５に実線にて示すように、受取り腕２０
の下方端に設けた受け台２３がオーバーヘッドコンベア
２００の下方位置へと位置される。The drive motor M is energized by a signal from the detection means 130, and is driven by the lead screw mechanism 63.
Is moved, and as shown by a solid line in FIG.
Is located at a position below the overhead conveyor 200.
【００３４】次いで、エアシリンダ１０が作動され、そ
れによって、受取り腕２０が上方へと移動し、図５に一
点鎖線にて示すように、その下方端に設けた受け台２３
を母板１００のビーム１０２に下方側より係合させる。
更に、エアシリンダ１０を作動することにより、ビーム
１０２をオーバーヘッドコンベア２００のフック２１１
より上方へと持上げる。これによって、母板１００とオ
ーバーヘッドコンベア２００との搬送関係がなくなり、
母板１００のオーバーヘッドコンベア２００による搬送
が停止する。Next, the air cylinder 10 is operated, whereby the receiving arm 20 moves upward, and as shown by the dashed line in FIG.
Is engaged with the beam 102 of the mother plate 100 from below.
Further, by operating the air cylinder 10, the beam 102 is moved to the hook 211 of the overhead conveyor 200.
Lift up more. As a result, the transport relationship between the base plate 100 and the overhead conveyor 200 disappears,
The conveyance of the mother plate 100 by the overhead conveyor 200 stops.
【００３５】次いで、駆動モータＭを駆動し、親ねじ機
構６３によりエアシリンダ１０を支持している可動支持
台６０をオーバーヘッドコンベア２００より離間する方
向へと、即ち、図５にて、右側へと移動させる。これに
よって、母板１００は、受取り腕２０により担持されて
母板自動払出装置１に設けられたレール１４上へと移送
される。支持台８が右側へと移動するとき、引き掻き部
材３０の下方端３１が先にレール１４上へと移載されて
いる母板１００のビーム１０２に係合し、母板１００を
レール１４の、図５にて右側端へと寄せ集める。Next, the drive motor M is driven to move the movable support base 60 supporting the air cylinder 10 by the lead screw mechanism 63 away from the overhead conveyor 200, that is, to the right side in FIG. Move. As a result, the mother plate 100 is carried by the receiving arm 20 and transferred onto the rail 14 provided in the automatic mother plate dispenser 1. When the support base 8 moves to the right, the lower end 31 of the scratching member 30 engages with the beam 102 of the mother plate 100 previously transferred onto the rail 14, and the mother plate 100 is moved to the rail 14. , To the right end in FIG.
【００３６】次いで、エアシリンダ１０が作動され、受
取り腕２０が下方へと移動することにより、受取り腕２
０の受け台２３に担持されている母板１００のビーム１
０２はレール１４上へと移載され、受け台２３と母板１
００のビーム１０２との係合が解除される。その後、駆
動モータＭを駆動し、親ねじ機構６３により可動支持台
６０をオーバーヘッドコンベア２００により接近した初
期位置へと移動させる。Next, the air cylinder 10 is operated, and the receiving arm 20 moves downward, so that the receiving arm 2 is moved.
0 of the base plate 100 supported on the cradle 23
02 is transferred onto the rail 14, and the cradle 23 and the base plate 1
00 is disengaged from the beam 102. Then, the drive motor M is driven, and the movable support base 60 is moved by the lead screw mechanism 63 to an initial position closer to the overhead conveyor 200.
【００３７】このようにして、問題のある母板１００
は、オーバーヘッドコンベア２００による搬送ラインＬ
より払出される。In this way, the problematic mother plate 100
Is the transport line L by the overhead conveyor 200
More paid out.
【００３８】上記構成の母板自動払出装置１を使用する
と、１日の母板引き揚げ枚数が２７３０枚とされる中、
通常約２０〜３０枚程度発生する、問題のある不良母板
を無人で自動的に完全に抽出することができた。When the automatic motherboard dispensing apparatus 1 having the above structure is used, the number of motherboard lifted per day is 2730,
A problematic defective mother plate, which usually occurs about 20 to 30 sheets, could be completely extracted automatically and unattended.
【００３９】又、種板剥ぎ取り後において不良母板を発
見することもあるが、従来においては、このような不良
母板が工程内に残ってしまい、翌日に確実に払出すこと
ができていなかった。これに対し、本発明によれば、こ
のような種板剥ぎ取り後において発見した不良母板であ
っても、この不良母板についてその場で母板ビームにキ
ャップ状の被検出部材を被せておけば、翌日に母板自動
払出装置にて確実に、且つ自動的に払出すことができ
る。In some cases, a defective mother plate is found after the seed plate is peeled off. However, in the related art, such a defective mother plate remains in the process and can be reliably dispensed the next day. Did not. On the other hand, according to the present invention, even if a defective mother plate is found after such a seed plate is stripped off, a cap-shaped detection member is put on the mother plate beam on the defective mother plate on the spot. If this is the case, the payout can be made surely and automatically by the mother plate automatic payout device the next day.
【００４０】上記実施例においては、本発明は、銅種板
電解に適用されるものとして説明したが、他にＩＳＡプ
ロセス、Ｋｉｄｄプロセスなど、母板を使用する全ての
電解に適用し、同様の効果を奏し得る。In the above embodiment, the present invention has been described as being applied to copper seed plate electrolysis. However, the present invention is also applicable to all electrolysis using a mother plate, such as an ISA process and a Kidd process. It can be effective.
【００４１】[0041]
【発明の効果】以上説明したように、本発明によると、
電解槽より引き上げた母板に問題がある場合には、この
母板のビームの所定の位置に被検出部材を設置し、母板
払出部に設置した検出手段にて被検出部材を検出し、被
検出部材が設置された母板をライン外へと払出す構成と
されるので、種板剥ぎ取りラインの自動運転を停止させ
ることなく、不良母板を払い出すことができ、又、誤っ
た母板を払い出してしまうことを防止することができ
る。As described above, according to the present invention,
If there is a problem with the mother plate pulled up from the electrolytic cell, a member to be detected is installed at a predetermined position of the beam of the mother plate, and the member to be detected is detected by the detecting means installed in the mother plate dispensing section, Since the base plate on which the member to be detected is set is paid out of the line, the defective base plate can be paid out without stopping the automatic operation of the seed stripping line, and Dispensing of the motherboard can be prevented.
【図１】銅電解用母板の一実施例を示す正面図である。FIG. 1 is a front view showing an embodiment of a mother plate for copper electrolysis.
【図２】母板ビームに被検出部材を設置した態様を示す
斜視図である。FIG. 2 is a perspective view showing an aspect in which a detection target member is installed on a mother plate beam.
【図３】被検出部材の実施例を示す斜視図である。FIG. 3 is a perspective view showing an embodiment of a detected member.
【図４】銅電解用母板からの種板剥ぎ取りラインの全体
構成を説明するための概略構成図である。FIG. 4 is a schematic configuration diagram for explaining an entire configuration of a seed plate stripping line from a copper electrolysis mother plate.
【図５】母板自動払出装置の側面図である。FIG. 5 is a side view of the motherboard automatic dispensing apparatus.
【図６】母板自動払出装置の正面図である。FIG. 6 is a front view of the motherboard automatic dispensing apparatus.
【図７】母板自動払出装置の平面図である。FIG. 7 is a plan view of the automatic motherboard payout apparatus.
１ 母板自動払出装置 ２ 基台 ４ 母板持上げ移動装置 ６ 支持フレーム １０ エアシリンダ（駆動手段） １４ レール ２０ 受取り腕 ２３ 受け台 ６０ 可動支持台 ６１ ガイドシャフト ６２ 軸受け ６３ 親ねじ機構 １００ 母板 １０１ エッジワイズプロテクタ １０２ 母板ビーム １２０ 被検出部材 １２０ａ キャップ本体 １２０ｂ 反射板 １３０ 検出手段 ２００ オーバーヘッドコンベア REFERENCE SIGNS LIST 1 automatic motherboard dispensing device 2 base 4 lifting motherboard moving device 6 support frame 10 air cylinder (drive means) 14 rail 20 receiving arm 23 receiving table 60 movable support table 61 guide shaft 62 bearing 63 lead screw mechanism 100 motherboard 101 Edgewise protector 102 Mother plate beam 120 Detected member 120a Cap body 120b Reflector 130 Detecting means 200 Overhead conveyor
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐藤 茂 大分県北海部郡佐賀関町大字関３の3382番 地 日鉱金属株式会社佐賀関製錬所内 Ｆターム(参考） 2G055 AA05 BA09 CA06 FA02 4K058 AA13 BA21 EB02 EB16 FA10 FA14 FB02 FB04 GC08 GC16 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Shigeru Sato 3382-3, Seki, Saganoseki-cho, Sakaseki-cho, North Sea District, Oita Prefecture F-term in the Saganoseki Smelter & Refinery (reference) 2G055 AA05 BA09 CA06 FA02 4K058 AA13 BA21 EB02 EB16 FA10 FA14 FB02 FB04 GC08 GC16
Claims (6)
場合には、この母板のビームの所定の位置に被検出部材
を設置し、母板払出部に設置した検出手段にて前記被検
出部材を検出し、前記被検出部材が設置された母板をラ
イン外へと払出すことを特徴とする母板自動払出方法。When there is a problem with a mother plate pulled up from an electrolytic cell, a member to be detected is set at a predetermined position of a beam of the mother plate, and the member is detected by a detecting means installed at a base plate dispensing section. An automatic motherboard payout method, comprising: detecting a detection member; and paying out the motherboard on which the detected member is installed to outside the line.
光線を反射する反射部材であり、前記検出手段は、前記
反射部材に可視光線或いは赤外光線を投射し、前記反射
板からの反射光を受光し、信号を発する光電管であるこ
とを特徴とする請求項１の母板自動払出方法。2. The member to be detected is a reflecting member that reflects visible light or infrared light, and the detecting means projects visible light or infrared light onto the reflecting member and reflects light from the reflecting plate. 2. A method according to claim 1, wherein the photoelectric tube is a phototube that receives light and emits a signal.
装着し得る細長Ｕ字形状のキャップであり、可視光線或
いは赤外光線を反射する表面を有していることを特徴と
する請求項２の母板自動払出方法。3. The reflection member is an elongated U-shaped cap that can be attached to an end of the beam of the mother plate, and has a surface that reflects visible light or infrared light. 3. The method for automatically dispensing a mother plate according to claim 2.
得る細長Ｕ字形状のキャップと、該キャップの表面に貼
り付けられる反射板とを有することを特徴とする請求項
２の母板自動払出方法。4. The mother plate according to claim 2, wherein the reflecting member has an elongated U-shaped cap attachable to a beam of the mother plate, and a reflector attached to a surface of the cap. Automatic payout method.
知する検出手段と、 前記検出手段からの信号により作動する駆動手段と、 前記駆動手段によりオーバーヘッドコンベアにて搬送さ
れている母板のビームに係合し、ビームをオーバーヘッ
ドコンベアのフックより上方へと持上げる受取り腕手段
と、 前記受取り腕手段により担持された前記母板ビームを集
積するためのレール支持手段と、を有することを特徴と
する母板自動払出装置。5. A detecting means for detecting a member to be detected attached to a motherboard beam, a driving means operated by a signal from the detecting means, and a beam of the motherboard being conveyed on an overhead conveyor by the driving means. Receiving arm means for engaging and lifting the beam above the hooks of the overhead conveyor, and rail supporting means for accumulating the mother plate beam carried by the receiving arm means. Automatic plate dispensing device.
配置された基台と、 前記基台の上端に取付けられた支持フレームと、 前記支持フレームに対し水平方向に移動自在に支持され
た可動支持台と、を有し、前記駆動手段及び受取り腕手
段は、前記可動支持台に設置されることを特徴とする請
求項５の母板自動払出装置。6. A base arranged adjacent to the overhead conveyor, a support frame attached to an upper end of the base, and a movable support movably supported in a horizontal direction with respect to the support frame. 6. The automatic mother plate dispensing device according to claim 5, wherein the driving means and the receiving arm means are installed on the movable support table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000011053A JP3967860B2 (en) | 2000-01-19 | 2000-01-19 | Motherboard automatic dispensing method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000011053A JP3967860B2 (en) | 2000-01-19 | 2000-01-19 | Motherboard automatic dispensing method and apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001200385A true JP2001200385A (en) | 2001-07-24 |
| JP2001200385A5 JP2001200385A5 (en) | 2004-10-14 |
| JP3967860B2 JP3967860B2 (en) | 2007-08-29 |
Family
ID=18538979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000011053A Expired - Fee Related JP3967860B2 (en) | 2000-01-19 | 2000-01-19 | Motherboard automatic dispensing method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3967860B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009167532A (en) * | 2009-03-16 | 2009-07-30 | Nippon Mining & Metals Co Ltd | Device for and method of sorting defective cathode plate |
| JP2010065288A (en) * | 2008-09-11 | 2010-03-25 | Pan Pacific Copper Co Ltd | Method and system for selectively eliminating defective negative plate |
| JP2010070798A (en) * | 2008-09-18 | 2010-04-02 | Pan Pacific Copper Co Ltd | Method and system for sorting/removing defective cathode plate |
| CN110804749A (en) * | 2019-11-29 | 2020-02-18 | 金川集团股份有限公司 | Intelligent robot blank stripping unit |
| CN114113138A (en) * | 2021-11-22 | 2022-03-01 | 合肥维信诺科技有限公司 | Product registration detection device |
-
2000
- 2000-01-19 JP JP2000011053A patent/JP3967860B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010065288A (en) * | 2008-09-11 | 2010-03-25 | Pan Pacific Copper Co Ltd | Method and system for selectively eliminating defective negative plate |
| JP2010070798A (en) * | 2008-09-18 | 2010-04-02 | Pan Pacific Copper Co Ltd | Method and system for sorting/removing defective cathode plate |
| JP2009167532A (en) * | 2009-03-16 | 2009-07-30 | Nippon Mining & Metals Co Ltd | Device for and method of sorting defective cathode plate |
| JP4588092B2 (en) * | 2009-03-16 | 2010-11-24 | Ｊｘ日鉱日石金属株式会社 | Defective cathode plate sorting device and defective cathode plate sorting method |
| CN110804749A (en) * | 2019-11-29 | 2020-02-18 | 金川集团股份有限公司 | Intelligent robot blank stripping unit |
| CN114113138A (en) * | 2021-11-22 | 2022-03-01 | 合肥维信诺科技有限公司 | Product registration detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3967860B2 (en) | 2007-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204278680U (en) | A kind of large glass laminating machine | |
| KR100979859B1 (en) | Optical member adhesion method and device using same | |
| CN114162417B (en) | Film tearing mechanism | |
| JP2001200385A (en) | Method and apparatus for automatically delivering base plate | |
| EP0118265A1 (en) | Automatic specimen sealing system | |
| JP2007131942A (en) | Board unloading device and board unloading method | |
| US6607192B2 (en) | Sheet feeder and sheet feeding method for plate-shaped members | |
| CN113218944A (en) | Flaw detection system for coating machine and online detection method | |
| JP4884439B2 (en) | Eliminating apparatus for defective cathode plate and method for eliminating defective cathode plate | |
| CN213200239U (en) | Double-end sticking film machine | |
| CN219996917U (en) | System for full-automatic detection FPC | |
| JP2001337280A (en) | Cover glass affixing device for microscopic specimen | |
| KR102066181B1 (en) | Film protective holder removal device | |
| JPH08175659A (en) | Automatic carrying and treating device for negative electrode plate | |
| CN211555838U (en) | Automatic pad pasting device of disk | |
| CN216013117U (en) | Full-automatic visual detection device | |
| CN115283953A (en) | Engine cylinder cover mounting device and control method | |
| JP2001200385A5 (en) | ||
| CN210614400U (en) | Paper cup raw paper sheet selecting device adopting machine vision | |
| CN211768742U (en) | Wafer transfer device suitable for spot welding and coating processing of miniature quartz wafers | |
| CN209905877U (en) | Feeding device for blind hole workpiece | |
| JP2516126B2 (en) | Control system in automatic labeling equipment | |
| CN217180636U (en) | Surface quality detection device for refrigerator metal plate | |
| US4994129A (en) | Method and apparatus for temporarily covering openings of containers | |
| JP2001215415A (en) | Device for sticking cover glass of microscope sample |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20041111 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060516 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20060519 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061212 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070111 |
|
| A911 | Transfer of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20070403 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070529 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070601 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100608 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110608 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110608 Year of fee payment: 4 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110608 Year of fee payment: 4 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110608 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120608 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120608 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130608 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140608 Year of fee payment: 7 |
|
| LAPS | Cancellation because of no payment of annual fees |