CN211768742U

CN211768742U - Wafer transfer device suitable for spot welding and coating processing of miniature quartz wafers

Info

Publication number: CN211768742U
Application number: CN202020208569.8U
Authority: CN
Inventors: 谢尚平; 毛毅
Original assignee: Zhuhai Dong Jingda Electronics Technology Co ltd
Current assignee: Zhuhai Dong Jingda Electronics Technology Co ltd
Priority date: 2020-02-26
Filing date: 2020-02-26
Publication date: 2020-10-27
Anticipated expiration: 2030-02-26

Abstract

The utility model discloses a wafer moves and carries device suitable for miniature quartz chip spot welding and coating film processing aims at providing a reasonable in design, use manpower sparingly cost and high wafer that is applicable to miniature quartz chip spot welding and coating film processing moves and carries device of production efficiency. The utility model discloses a lifting platform, be provided with the hand-basket on the lifting platform, the equal symmetry of the inside both sides wall of hand-basket is equipped with a plurality of pair support groove, and is every right all be provided with the carrier board between the support groove, be provided with the plate electrode on the carrier board, the plate electrode upper berth is equipped with a plurality of wafer, one side of lifting platform be provided with sideslip mechanism and with the tray that sideslip mechanism is connected, the tray is in stretch into under the sideslip mechanism drive the hand-basket is inside extremely the lower extreme of carrier board. The utility model discloses be applied to the wafer and move the technical field who carries the device.

Description

Wafer transfer device suitable for spot welding and coating processing of miniature quartz wafers

Technical Field

The utility model relates to a wafer moves and carries device, in particular to wafer moves and carries device suitable for miniature quartz chip spot welding and coating film processing.

Background

The current wafer transferring method for quartz crystal wafer dispensing and coating processing comprises the following steps: loading the wafers into a film-coated electrode plate (540 pieces per plate) one by one, evaporating silver in vacuum to adhere to two sides of the wafers to form electrodes, manually turning the silver pieces in the electrode plate into a transplanting plate after film coating is finished, and then transferring to the next glue dispensing process operation; during dispensing, one transplanting plate is placed for operation each time, after the silver sheets in the plate are used up, the empty plate is manually taken out and the next transplanting plate is placed, and therefore the operation is circulated; however, this method has the following disadvantages: 1. the existing glue is fed manually, the working efficiency is slow, 3 persons are assigned to the glue dispensing post in each shift, the glue dispensing yield in each shift is approximately equal to 16 ten thousands when the persons work for 8 hours; 2. the silver sheet is required to be turned over to a transplanting plate after film coating and then is provided for a dispensing process for use, foreign matter is easily attached to a silver sheet electrode and a silver layer is easily scratched in the turning process, the appearance of a wafer is damaged, the silver sheet after turning is inspected to have the silver layer scratch of about 0.6% under a 20-time microscope, and the edge of the wafer is damaged badly; 3. after the film is coated, the silver sheets on the coated electrode plate need to be manually turned into the dispensing transplanting plate, and the turning action takes about 10 minutes/hour, so that the production efficiency is reduced.

Disclosure of Invention

The utility model aims to solve the technical problem that overcome prior art not enough, provide a reasonable in design, use manpower sparingly cost and high wafer that is applicable to miniature quartz wafer spot welding and coating film processing of production efficiency moves and carries device.

The utility model adopts the technical proposal that: the utility model discloses a lifting platform, be provided with the hand-basket on the lifting platform, the equal symmetry of the inside both sides wall of hand-basket is equipped with a plurality of pair support groove, and is every right all be provided with the carrier board between the support groove, be provided with the plate electrode on the carrier board, the plate electrode upper berth is equipped with a plurality of wafer, one side of lifting platform be provided with sideslip mechanism and with the tray that sideslip mechanism is connected, the tray is in stretch into under the sideslip mechanism drive the hand-basket is inside extremely the lower extreme of carrier board.

Furthermore, guide grooves are formed in the two sides of the front end face and the rear end face of the carrier plate, a driving device and a driving plate connected with the driving device are installed at the lower end of the tray, guide pillars matched with the guide grooves are arranged on the periphery of the driving plate, and guide holes matched with the guide pillars are formed in the tray.

Furthermore, carrier baffles are fixed on two sides of the rear end face of the basket, baffle doors are hinged to two sides of the front end face of the basket, and a handle is arranged at the top end of the basket.

Further, the rear end of tray is provided with carrier board violently pushes away the mechanism, carrier board violently pushes away the mechanism and includes violently pushing away cylinder and the horizontal push pedal of carrier.

Further, the wafer transplanting device further comprises an MCU controller, and the lifting platform, the transverse moving mechanism, the driving device and the transverse pushing cylinder are all electrically connected with the MCU controller.

Furthermore, a positioning groove matched with the lifting basket is formed in the lifting platform.

The utility model has the advantages that: because the utility model comprises a lifting platform, a lifting basket is arranged on the lifting platform, a plurality of pairs of supporting grooves are symmetrically arranged on two side walls in the lifting basket, a carrier plate is arranged between each pair of supporting grooves, an electrode plate is arranged on the carrier plate, a plurality of wafers are laid on the electrode plate, one side of the lifting platform is provided with a traversing mechanism and a tray connected with the traversing mechanism, the tray is driven by the traversing mechanism to extend into the interior of the lifting basket to the lower end of the carrier plate, the lifting platform is a feeding lifting platform on a dispenser, after the wafer coating is finished, the electrode plates are put into a newly designed tool lifting basket layer by layer, the lifting basket can be directly positioned and placed in the feeding lifting platform of the dispenser, each lifting basket can be put into a plurality of layers of carrier plates once, automatic layer by layer feeding is realized through the cooperation of the tray and the lifting platform, and the empty lifting basket is taken out after the whole coating is finished, then placing the next basket in the container, thereby circularly operating; therefore, the utility model solves the operation mode that only one plate can be loaded at each time, reduces the operation intensity and improves the working efficiency; the utility model discloses a after the application, cancelled the flow of frock upset behind the coating film, the coating film plate electrode can directly be used for the point to glue, stops silver piece and receives the pollution, and the damaged possibility of fish tail has promoted the silver piece qualification rate, has avoided the hidden danger to flow, and the coating film plate electrode no longer need overturn in addition, has promoted production efficiency, has reduced the frock use cost.

Drawings

Fig. 1 is a top view of the present invention;

fig. 2 is a schematic structural view of the carrier.

Detailed Description

As shown in fig. 1 and 2, in this embodiment, the utility model discloses an elevating platform 1, be provided with basket 2 on elevating platform 1, 2 inside both sides wall of basket are all symmetrical to be equipped with seven pairs of support grooves 3, and are every right it all is provided with carrier board 4 to hold between the groove 3, be provided with electrode plate 5 on the carrier board 4, electrode plate 5 upper berth is equipped with a plurality of wafer 6, one side of elevating platform 1 be provided with sideslip mechanism 7 and with the tray 8 that sideslip mechanism 7 is connected, tray 8 is in the drive of sideslip mechanism 7 is stretched into down the basket 2 is inside extremely the lower extreme of carrier board 4.

In this embodiment, guide slots 9 are disposed on both sides of the front and rear end faces of the carrier plate 4, a driving device and a driving plate connected to the driving device are mounted at the lower end of the tray 8, guide posts adapted to the guide slots 9 are disposed around the driving plate, and guide holes 10 adapted to the guide posts are disposed on the tray 8, so that when the tray 8 moves below the carrier plate 4, the lifting table 1 descends to support the carrier plate 4 on the tray 8, so that the carrier plate 4 is supported by the guide slots 9, and then the driving device drives the driving plate to ascend to the corresponding guide slots 9, and then the traverse mechanism 7 resets to allow the tray 8 to support the carrier plate, and the design of the guide posts makes the process of the tray 8 supporting the carrier plate 4 more stable.

In this embodiment, both sides of the rear end surface of the basket 2 are fixed with carrier baffles, the carrier baffles can prevent the carrier plates 4 from sliding out of the rear end of the basket 2, both sides of the front end surface of the basket 2 are hinged with baffle doors 11, the baffle doors 11 can be closed when the basket 2 is transferred, so that the carrier plates 4 are prevented from sliding out of the front end of the basket 2 when the basket 2 is transferred manually, the top end of the basket 2 is provided with a handle 12, and the handle 12 facilitates manual transfer and extraction.

In this embodiment, tray 8's rear end is provided with carrier board violently pushes away mechanism, carrier board violently pushes away the mechanism including violently pushing away cylinder 13 and the horizontal push pedal 14 of carrier, carrier board violently pushes away the mechanism and can work as directly push back carrier board 4 after the crystal operation on the carrier board 4 on tray 8 is accomplished in the hand-basket 2, can avoid tray 8 to stretch into and place in the hand-basket 2 carrier board 4 stretches back the normal position again, waits for the operating time of getting carrier board 4 after elevating platform 1 goes up and down in stretching into the hand-basket 2, improves production efficiency.

In this embodiment, the wafer transplanting device further comprises an MCU controller, and the lifting platform 1, the traversing mechanism 7, the driving device and the traversing cylinder 13 are all electrically connected to the MCU controller.

In this embodiment, the lifting platform 1 is provided with a positioning groove adapted to the basket 2.

To sum up, the utility model has the advantages of it is following: 1. the wafer transfer tool lifting basket in the film coating and dispensing process is used, the dispensing position is reduced by one person, and the production efficiency is improved by 30%; after the turnover of the tool after film coating is cancelled, the film coating yield is improved by 4% per shift, the utilization rate of silver sheets is improved by 0.6%, and defective products are prevented from flowing out.

The utility model discloses be applied to wafer transplanting device's technical field.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not intended to limit the scope of the invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims

1. A wafer transfer device suitable for micro quartz wafer spot welding and coating processing is characterized in that: it includes elevating platform (1), be provided with hand-basket (2) on elevating platform (1), the equal symmetry of the inside both sides wall of hand-basket (2) is equipped with a plurality of pair and holds in the palm groove (3), and is every right all be provided with carrier board (4) between holding in the palm groove (3), be provided with electrode board (5) on carrier board (4), electrode board (5) upper berth is equipped with a plurality of wafer (6), one side of elevating platform (1) be provided with sideslip mechanism (7) and with tray (8) that sideslip mechanism (7) are connected, tray (8) are in stretch into under the drive of sideslip mechanism (7) inside extremely of hand-basket (2) the lower extreme of carrier board (4).

2. The wafer transfer device suitable for spot welding and coating of a micro quartz wafer as claimed in claim 1, wherein: guide grooves (9) are formed in two sides of the front end face and the rear end face of the carrier plate (4), a driving device and a driving plate connected with the driving device are installed at the lower end of the tray (8), guide pillars matched with the guide grooves (9) are arranged on the periphery of the driving plate, and guide holes (10) matched with the guide pillars are formed in the tray (8).

3. The wafer transfer device suitable for spot welding and coating of a micro quartz wafer as claimed in claim 1, wherein: the carrying device is characterized in that carrier baffles are fixed on two sides of the rear end face of the basket (2), baffle doors (11) are hinged on two sides of the front end face of the basket (2), and a handle (12) is arranged at the top end of the basket (2).

4. The wafer transfer device suitable for spot welding and coating of a micro quartz wafer as claimed in claim 2, wherein: the rear end of tray (8) is provided with carrier board violently pushes away the mechanism, carrier board violently pushes away the mechanism and includes violently pushing away cylinder (13) and the horizontal push pedal (14) of carrier.

5. The wafer transfer device suitable for micro quartz wafer spot welding and coating processing according to claim 4, wherein: the wafer transplanting device further comprises an MCU controller, and the lifting platform (1), the transverse moving mechanism (7), the driving device and the transverse pushing cylinder (13) are electrically connected with the MCU controller.

6. The wafer transfer device suitable for spot welding and coating of a micro quartz wafer as claimed in claim 1, wherein: the lifting platform (1) is provided with a positioning groove matched with the lifting basket (2).