JP3967860B2 - Motherboard automatic dispensing method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an automatic mother board dispensing method and apparatus for dispensing a mother board causing a problem in an electrolytic operation using the mother board.
[0002]
[Prior art]
Conventionally, for example, in a copper seed plate electrolysis, an electrolytic cell was obtained by electrolysis by performing electrolytic purification all day and night using a mother plate as a cathode and crude copper (99% Cu) as an anode (anode). A seed plate is produced by peeling off a thin plate of electrodeposited copper (99.99% Cu) on the cathode base plate.
[0003]
More specifically, FIG. 1 shows an example of a copper electrolysis base plate 100 for producing a seed plate. The base plate 100 is made of, for example, a Ti thin plate having a thickness of 3.1 mm, a width (W0) of 986 mm, and a height (H0) of 1085 mm, and edgewise protectors 101 made of an insulating material are provided on both sides. A mother beam 102 is attached to the upper end.
[0004]
When starting sheet on both surfaces of the mother plate 100 is electrodeposited in seed plate electrolytic cell, the base plate 100 is pulled up from the electrolytic bath by lifting the beam 102 at a crane, as shown in FIG. 4, It is conveyed to receiving lines ALin and BLin arranged adjacent to the electrolytic cell 110. After washing, the mother board 100 is fed into a seed plate peeling line L (L1, L2) provided with an overhead conveyor 200, respectively. The mother board 100 is conveyed while being suspended with the beam 102 locked to the hook 211 (FIG. 5) of the overhead conveyor 200. First, the mother board 100 is fed into the mouthpiece device 201, and the upper part of the seed plate is hammered to be easily peeled off. After that, it is fed into the mouth opening device 202 and sucked with a suction cup so that only the upper part of the seed plate is peeled off from the mother plate 100. Next, the seed plate is fed to the stripping device 203, and a stripping arm is inserted into the top of the stripped seed plate, and the arm is lowered to strip off the base plate 100.
[0005]
The seed plate peeled off from the mother plate 100 is transferred to the container 204 and is fed to a predetermined process by the container conveyor 205.
[0006]
The base plate 100 from which the seed plate has been removed is uniformly polished on the surface of the base plate by the polishing device 206, then sprayed with glue, fed to the electrolytic cell 110 via the discharge lines ALout and BLout, and repeatedly. used.
[0007]
Conventionally, a SUS plate or a rolled copper plate has been used as a base plate. However, in recent years, titanium (Ti) as described above is used because it is lightweight, strong, easy to handle, and easy to work with. A board is used.
[0008]
[Problems to be solved by the invention]
However, the titanium base plate 100 is easily oxidized, and an oxide film (TiO ₂ ) is formed on the surface of the base plate. This oxide film deteriorates the electrodeposition state of copper, and the electrodeposition has a mesh shape (perforated). What happens. In addition, a mother board having a problem that the edgewise protector 101 is detached is also generated.
[0009]
Therefore, conventionally, when a mother board payout unit 207 is provided on the downstream side of the seed plate stripping device 203, the operator visually monitors the electrodeposition state of the mother board and finds a problematic mother board. Temporarily stopped the operation of the stripping line, and the mother plate was manually discharged from the seed plate stripping lines L1 and L2 and prevented from being fed to the discharge lines ALout and BLout.
[0010]
Stopping the automatic operation of the stripping line L in order to pay out such a problematic mother board brings about a delay in operation and has become a big problem in terms of work efficiency. In general, as shown in FIG. 4, there are a plurality of seed plate stripping lines L (L1, L2), and an erroneous mother is used when the payout portion 207 is in a position difficult for an operator to see. In some cases, the board was dispensed.
[0011]
Accordingly, an object of the present invention is to allow a defective mother board to be dispensed without stopping automatic operation of the seed plate stripping line, and to prevent an erroneous mother board from being dispensed. It is to provide a plate automatic dispensing method and apparatus.
[0012]
[Means for Solving the Problems]
The above object is achieved by the automatic mother board dispensing method and apparatus according to the present invention.
[0013]
According to the first aspect of the present invention, when there is a problem with the mother board pulled up from the electrolytic cell, the detection member is installed at a predetermined position of the beam of the mother board, and the detecting means installed in the mother board dispensing part wherein detecting a detection member, wherein a and a mother board detection member is placed outside the line paying out the mother plate automatic dispensing method Te,
The detected member is a reflecting member that reflects visible light or infrared light, and the detecting means projects visible light or infrared light to the reflecting member, and receives reflected light from the reflecting plate, A photoelectric tube that emits a signal,
The mother board automatic dispensing method , wherein the reflecting member is an elongated U-shaped cap that can be attached to an end of a beam of a mother board, and has a surface that reflects visible light or infrared light. Is provided.
[0015]
According to the second aspect of the present invention , when there is a problem with the mother board pulled up from the electrolytic cell, the detection member is installed at a predetermined position of the beam of the mother board, and the detection means installed in the mother board payout portion Detecting the detected member, and automatically discharging the mother board on which the detected member is installed to the outside of the line,
The detected member is a reflecting member that reflects visible light or infrared light, and the detecting means projects visible light or infrared light to the reflecting member, and receives reflected light from the reflecting plate, A photoelectric tube that emits a signal,
The reflecting member has a cap elongated U-shape that can be mounted on the beam of the base plate, the base plate automatic dispensing method characterized by having a reflector which is attached to the surface of the cap is provided.
[0016]
According to the third aspect of the present invention, a detecting means for detecting a detected member attached to the mother beam,
Drive means that operates in response to a signal from the detection means;
Receiving arm means for engaging the beam of the mother board conveyed by the overhead conveyor by the driving means, and lifting the beam upward from the hook of the overhead conveyor;
Rail support means for integrating the mother beam carried by the receiving arm means;
A base disposed adjacent to the overhead conveyor;
A support frame attached to the upper end of the base;
A movable support base supported movably in a horizontal direction with respect to the support frame;
And the driving means and the receiving arm means are provided on the movable support base .
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the automatic mother board dispensing method and apparatus according to the present invention will be described in more detail with reference to the drawings.
[0019]
According to one embodiment, the automatic mother board payout method of the present invention can be implemented, for example, in the seed plate stripping line L (L1, L2) in the copper seed plate electrolysis described with reference to FIG. . The overall configuration of the seed plate stripping line L is as described above, and the mouthpiece device 201, the mouth opening device 202, the stripping device 203, the polishing device 206, and the like installed along the stripping line L Since it is well known to the traders, detailed description is omitted.
[0020]
Usually, in the electrolysis of copper seed plates and electrolytic refining is finished, seed plates, i.e., the base plate 100 is pulled up from the electrolytic bath 110, as described above, is fed to the starting sheet stripping line L but electrodeposition condition is visually inspected by an operator when the raised pull the mother board 100 from the cell 110.
[0021]
At this time, according to the present invention, for example, when a defective mother board is found causing a problem such as mesh-like (perforated) electrodeposition or the edgewise protector 101 being detached. As shown in FIGS. 1 and 2, the worker attaches the detection member 120 to a predetermined position of the beam 102 of the mother board 100. As will be described later, the position of the base beam 102 to which the detected member 120 is attached may be any position as long as the detected member 120 can be detected by a detecting means 130 such as a phototube. However, in this embodiment, as shown in FIGS. 1 and 2, it is attached to the end portion (ear portion) of the mother plate beam 102.
[0022]
In addition, as will be understood with reference also to FIG. 3A, the member 120 to be detected is an elongated U-shaped cap that can be attached to the mother plate beam 102 from above. The cap 120 has a surface capable of reflecting visible light projected from the phototube which is the detection means 130. Therefore, the cap itself can be made of a material having a high reflectivity, for example, a bright color material such as white. For example, it is preferable to prepare with a white vinyl chloride resin or the like. Alternatively, as shown in FIG. 3B, a reflecting plate 120b capable of reflecting visible light may be attached to the surface of the elongated U-shaped cap body 120a. If desired, infrared light can be used instead of visible light.
[0023]
As understood above, according to the present invention, the difference in light reflectivity of a substance is utilized. That is, the phototube as the detecting means 130 does not react to the beam 102 of the mother board, but reacts to the member 120 to be detected.
[0024]
According to the present embodiment, in order to carry out the automatic mother board dispensing method of the present invention, the detecting means 130 is installed in the automatic mother board dispensing apparatus installed on the downstream side of the mother board polishing apparatus 206 (FIG. 5). . As described above, in this embodiment, as the photoelectric tube of the detection means 130, an amplifier built -in type photoelectric switch (trade name: E3S-AD / 66 diffuse reflection type) manufactured by OMRON Corporation using visible light was used. . Therefore, as the reflector 120b attached to the cap body 120a that forms the member to be detected 120, a reflector (trade name: E39-RS3) manufactured by OMRON Corporation made of an acrylic resin plate is preferably used. The reflecting plate 120 was used by being attached to the surface of an elongated U-shaped cap body 120a.
[0025]
When the phototube 130 reacts, the automatic mother board dispensing device installed in the dispensing unit 207 operates. Next, the automatic mother board dispensing device will be described.
[0026]
5 to 7 show an embodiment of the automatic mother board dispensing device 1. According to the present embodiment, the automatic mother board dispensing device 1 includes a base 2 made of a framework installed adjacent to the overhead conveyor 200. At the upper end of the base 2, a mother board lifting and moving device 4 is disposed.
[0027]
The mother board lifting and moving device 4 includes a support frame 6 attached to the upper end of the base 2, and the support frame 6 supports a movable support base 60 movably in the horizontal direction.
[0028]
That is, in the present embodiment, the support frame 6 has the guide shaft 61, and the movable support base 60 is slidably supported along the guide shaft 61 via the bearing 62.
[0029]
A lead screw mechanism 63 is installed between the support frame 6 and the movable support base 60. That is, the support frame 6 is provided with a lead screw 63 a that is rotatable in parallel with the guide shaft 61 and is driven to rotate through the drive motor M and the chain 64 installed on the support frame 6. On the other hand, a nut member 63b screwed to the lead screw 63a is attached to the movable support base 60. Therefore, by energizing the drive motor M, the movable support base 60 can reciprocate in the direction of the arrow in FIG.
[0030]
Further, a vertical support plate 12 to which an air cylinder 10 as a driving means is attached is fixed to the movable support base 60. An upper end portion 21 of a receiving arm 20 extending in an oblique direction is attached to a lower end of the piston 11 extending downward from the air cylinder 10 via a shaft 22. A scratching member 30 is rotatably attached to the upper end portion 21 of the receiving arm 20 via a shaft 31. In FIG. 5, the scratching member 30 is urged clockwise by a spring means (not shown), but the rotational force is applied by a stopper member 32 provided at the upper end of the scratching member 30. It is regulated.
[0031]
As described above, the mother board 100 is conveyed while being hung by being hooked to the hook 211 of the overhead conveyor 200 installed on the stripping line L with the mother board beam 102 attached to the upper end.
[0032]
As described above, when the target mother board 100 to which the detected member 120 is attached reaches the position where the automatic mother board dispensing apparatus 1 is installed, the detected member 120 is detected by the detecting means 130 and the signal is transmitted to the mother board. It transmits to the automatic dispensing device 1. In this embodiment, the detection means 130 is attached at a position separated from the detected member 120 by a distance (H) = about 30 cm, but the detected member 120 can be reliably detected.
[0033]
The drive motor M is energized by a signal from the detection means 130, the movable support base 60 is moved by the lead screw mechanism 63, and the base 23 provided at the lower end of the receiving arm 20 as shown by the solid line in FIG. Is positioned below the overhead conveyor 200.
[0034]
Next, the air cylinder 10 is actuated, whereby the receiving arm 20 moves upward, and the cradle 23 provided at the lower end of the receiving arm 20 is attached to the beam 102 of the mother board 100 as shown by a one-dot chain line in FIG. Engage from below. Further, by operating the air cylinder 10, the beam 102 is lifted above the hook 211 of the overhead conveyor 200. Thereby, the conveyance relationship between the mother board 100 and the overhead conveyor 200 is lost, and the conveyance of the mother board 100 by the overhead conveyor 200 is stopped.
[0035]
Next, the drive motor M is driven, and the movable support base 60 that supports the air cylinder 10 by the lead screw mechanism 63 is moved away from the overhead conveyor 200, that is, to the right in FIG. As a result, the mother board 100 is carried by the receiving arm 20 and transferred onto the rail 14 provided in the automatic mother board dispensing apparatus 1. When the support base 8 moves to the right side, the lower end 31 of the scratching member 30 is engaged with the beam 102 of the mother board 100 that has been transferred onto the rail 14 first, and the mother board 100 is moved to the rail 14. In FIG. 5, gather to the right end.
[0036]
Next, when the air cylinder 10 is operated and the receiving arm 20 moves downward, the beam 102 of the mother board 100 carried on the receiving base 23 of the receiving arm 20 is transferred onto the rail 14 and received. The engagement between the base 23 and the beam 102 of the mother board 100 is released. Thereafter, the drive motor M is driven, and the movable support base 60 is moved to the initial position closer to the overhead conveyor 200 by the lead screw mechanism 63.
[0037]
In this way, the problematic mother board 100 is paid out from the transfer line L by the overhead conveyor 200.
[0038]
Using mother plate automatic dispensing device 1 having the above configuration, in the mother plate pulling up the number of daily are 2730 sheets, automatically generated usually about 20 to 30 sheets, a defective motherboard problematic unattended Could be extracted completely.
[0039]
Further, a defective mother board may be found after the seed plate is peeled off. However, conventionally, such a defective mother board remains in the process and cannot be surely discharged on the next day. On the other hand, according to the present invention, even if such a defective mother board is found after peeling off the seed plate, a cap-shaped detection member is put on the mother board beam on the spot for the defective mother board. If so, it can be surely and automatically paid out by the automatic mother board dispensing device on the next day.
[0040]
In the above embodiments, the present invention has been described as being applied to copper seed plate electrolysis. However, the present invention can be applied to all electrolysis using a mother plate such as an ISA process and a Kidd process. obtain.
[0041]
【The invention's effect】
As described above, according to the present invention, when there is a problem with the mother board pulled up from the electrolytic cell, the member to be detected is installed at a predetermined position of the beam of the mother board, and is installed in the mother board dispensing part. Since the detection member is detected by the detection means, and the mother board on which the detection member is installed is discharged out of the line, the defective mother board is not stopped without stopping the automatic operation of the seed plate stripping line. Can be dispensed, and the wrong mother board can be prevented from being dispensed.
[Brief description of the drawings]
FIG. 1 is a front view showing one embodiment of a mother board for copper electrolysis.
FIG. 2 is a perspective view showing an aspect in which a member to be detected is installed on a mother board beam.
FIG. 3 is a perspective view showing an example of a member to be detected.
FIG. 4 is a schematic configuration diagram for explaining an entire configuration of a seed plate stripping line from a copper electrolysis base plate.
FIG. 5 is a side view of the automatic mother board dispensing device.
FIG. 6 is a front view of the automatic mother board dispensing device.
FIG. 7 is a plan view of the automatic mother board dispensing device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Mother board automatic delivery apparatus 2 Base 4 Mother board lifting movement apparatus 6 Support frame 10 Air cylinder (drive means)
14 rail 20 receiving arm 23 receiving base 60 movable support base 61 guide shaft 62 bearing 63 lead screw mechanism 100 base plate 101 edgewise protector 102 base plate beam 120 detected member 120a cap body 120b reflecting plate 130 detecting means 200 overhead conveyor

Claims (3)

When there is a problem with the mother board pulled up from the electrolytic cell, a member to be detected is installed at a predetermined position of the beam of the mother board, and the member to be detected is detected by the detecting means installed at the mother board payout portion. , A mother board automatic dispensing method for dispensing the mother board on which the detected member is installed to the outside of the line ,
The detected member is a reflecting member that reflects visible light or infrared light, and the detecting means projects visible light or infrared light to the reflecting member, and receives reflected light from the reflecting plate, A photoelectric tube that emits a signal,
The mother board automatic dispensing method , wherein the reflecting member is an elongated U-shaped cap that can be attached to an end of a beam of a mother board, and has a surface that reflects visible light or infrared light. . When there is a problem with the mother board pulled up from the electrolytic cell, a member to be detected is installed at a predetermined position of the beam of the mother board, and the member to be detected is detected by the detecting means installed at the mother board payout portion. , A mother board automatic dispensing method for dispensing the mother board on which the detected member is installed to the outside of the line,
The detected member is a reflecting member that reflects visible light or infrared light, and the detecting means projects visible light or infrared light to the reflecting member, and receives reflected light from the reflecting plate, A photoelectric tube that emits a signal,
The reflecting member has a cap elongated U-shape that can be mounted on the beam of the base plate, the base plate automatic dispensing how to; and a reflecting plate to be attached to the surface of the cap. Detection means for detecting a detected member attached to the mother plate beam;
Drive means that operates in response to a signal from the detection means;
Receiving arm means for engaging the beam of the mother board conveyed by the overhead conveyor by the driving means, and lifting the beam upward from the hook of the overhead conveyor;
Rail support means for accumulating the mother beam carried by the receiving arm means;
A base disposed adjacent to the overhead conveyor;
A support frame attached to the upper end of the base;
A movable support base supported so as to be movable in the horizontal direction with respect to the support frame;
And the driving means and the receiving arm means are installed on the movable support base .

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