JP2001198814A - Device and method for grinding plate-shaped object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reliably remove a distortion originally existing and a distortion produced during a grinding work, when grinding a plate-shaped object. SOLUTION: In this device for grinding a plate-shaped object, a supporting means 20 comprising a rotatable supporting table 21 to support the supporting surface of the plate-shaped object and a side supporting member 22 to support the side of the plate-shaped object are mounted, and the plate-shaped object can be supported by the side supporting member 22 without tightly fixing the plate-shaped object. In addition, in this method for grinding the plate-shaped object, the plate-shaped object is supported by the side supporting member 22 by using the plate-shaped object grinding device without tightly fixing the plate-shaped object, a grinding stone rotating while rotating the supporting table 21 is brought into contact with the surface of the plate-shaped object to be ground, and the plate-shaped object is ground so as to have a designated thickness.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate grinding apparatus and a plate grinding method for grinding a plate having a high flatness.

[0002]

2. Description of the Related Art When a plate-like material such as a cemented carbide substrate, glass, or a semiconductor wafer is ground to a predetermined thickness, for example, a plate-like material grinding apparatus 70 as shown in FIG. 5 is used. The plate-shaped object grinding device 70 is configured such that the support plate 54 slides on a pair of guide rails 53 arranged in the vertical direction, and the grinding means 55 connected to the support plate 54 moves up and down accordingly. In the grinding means 55, a mounter 5 provided at a lower end of a spindle 57 disposed in a vertical direction is provided.
8, a grinding wheel 59 is mounted, and with the rotation of the spindle 57, the grinding wheel 59 rotates.

On the other hand, an object to be ground 71 is fixed to a support means 72. In the illustrated example, the support means 72 includes a vacuum table 73, and the workpiece 71 is supported by being attracted to the vacuum table 73. Further, instead of the suction by the vacuum table 73, it is also possible to support by fixing with a magnet or wax down.

[0004] In this way, the object to be ground 71 is supported by the supporting means 7.
2, the grinding means 55 descends, and the grinding wheel 59 a fixed to the lower portion of the grinding wheel 59 contacts the grinding surface 71 a of the workpiece 71 while rotating, whereby the grinding surface 71 a is ground. To a predetermined thickness.

[0005]

However, when the object to be ground 71 is supported by a vacuum or the like, the object to be ground 71 is fixed in close contact with the support means 72. It is temporarily corrected and held, and in the held state, no distortion appears on the ground surface 71a. Therefore,
Even if the surface is ground in such a state, the originally generated distortion cannot be removed, and when the holding state is released after the grinding is completed, there is a problem that the distortion appears again due to rebound.

[0006] Also, when distortion occurs due to grinding,
In the state of being supported by the support means 72, the distortion is stored inside itself, and does not appear on the ground surface 71a. Therefore, even if the surface is ground in such a state, if the holding state is released after the completion of the grinding, there is a problem that distortion appears due to rebound.

As described above, in the grinding of a plate-like object requiring planar accuracy, there is a problem in that the distortion can be reliably removed.

[0008]

SUMMARY OF THE INVENTION As specific means for solving the above-mentioned problems, the present invention provides a support means for supporting a plate-like object, and a grinding method for grinding a ground surface of the plate-like object supported by the support means. A grinding apparatus comprising at least a grinding unit having a wheel, wherein the supporting unit includes a rotatable support table for supporting a supporting surface of the plate-shaped object, and a side support for supporting a side portion of the plate-shaped object. And a side support member fixed to the support table and supporting the plate-shaped object without tightly fixing the plate-shaped object.

The plate-like object grinding apparatus is characterized in that the side support member supports the plate-like object from the outer peripheral side, and when the plate-like object has an opening in the center, the side support member is a plate-like object. That the plate-like object is supported from the inner peripheral side by engaging with the opening of the plate-like object, and the clearance formed between the side part of the plate-like object and the side part supporting member is 0.1 mm to 1.0 mm. The additional requirement is that the thickness of the side support member is thinner than the finished thickness of the plate-like material, and that the side support member and the support table are fixed by wax-down, screwing, or integral formation. I do.

[0010] The present invention is also a method for grinding a plate-like object using the above-mentioned plate-like object grinding apparatus, wherein the plate-like object is supported by a side support member on a support table without being closely fixed.
The grinding wheel that constitutes the grinding wheel is brought into contact with the plate-like object,
Provided is a plate-like object grinding method for grinding a plate-like object to a predetermined thickness by rotating a support table and a grinding wheel.

The plate-like object grinding method has an additional requirement that the plate-like object is a cemented carbide.

According to the plate-shaped object grinding apparatus and the plate-shaped object grinding method configured as described above, the grinding is performed in a state where the plate-shaped object is supported by the supporting means without being tightly fixed, and the plate-shaped object is preliminarily fixed. Even if there is a distortion, the grinding can be performed in a state where the distortion appears on the ground surface, so that the distortion can be surely removed and a flat surface can be finished. Further, even if the plate-like object is temporarily distorted by the grinding, the distortion also appears on the ground surface, and can be removed by the subsequent grinding.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As an embodiment of the present invention, FIG.
The case of grinding the ground surface 11 of the cemented carbide substrate 10 shown in FIG. The cemented carbide substrate 10 is a substrate before processing the outer periphery serving as a base in manufacturing a circular saw used for cutting various hard members by cutting a blade on the outer periphery, and is formed in a circular shape. This cemented carbide substrate 10
Ultimately, it must be formed smooth, but distortion may occur before grinding.

The cemented carbide substrate 10 is ground while being supported by, for example, support means 20 as shown in FIG. The support means 20 includes a support table 21 that can support and rotate a support surface, which is the back surface of the cemented carbide substrate 10, and a ring-shaped side support member 22 fixed to the support table 21. The side support member 22 is formed in a ring shape, and is fixed to the support table 21 by wax-down or screwing. Note that the support table 21 and the side support members 22 may be formed integrally.

The inner diameter of the side support member 22 corresponds to the outer diameter of the cemented carbide substrate 11, and when the cemented carbide substrate 11 is accommodated in the opening 23, the side support member 22 The alloy substrate 10 is supported from the outer peripheral side. That is, in this case, the outer periphery of the cemented carbide substrate 10 is the side portion. This support eliminates the need for conventional support means such as suction, magnets, and wax down.

Here, when the cemented carbide substrate 11 is accommodated in the opening 23 of the side support member 22, there is a gap between the outer periphery of the cemented carbide substrate 11 and the inner periphery of the side support member 22. The clearance is formed. This clearance is
It is desirable to set it to about 0.1 to 1.0 mm. In this manner, the cemented carbide substrate 10 is supported by the support means 20 without being closely fixed. Further, in order to completely remove the distortion generated in the cemented carbide substrate 10, the thickness of the side support member 22 is desirably slightly smaller than the finished thickness of the cemented carbide substrate 10 after grinding.

When the ground surface 31 of the cemented carbide substrate 30 formed in a ring shape as shown in FIG. 2 is ground, the surface comprises a support table 21 and side support members 41 fixed to the support table 21. The support means 40 is used. In this case, the opening 3 formed in the center of the cemented carbide substrate 30
2 engages the side support member 41 to support the cemented carbide substrate 30 from the inner peripheral side. That is, in this case, the cemented carbide substrate 3
The inner circumference of 0 is the side.

Also in this case, a clearance is formed between the inner peripheral portion of the cemented carbide substrate 30 and the outer peripheral portion of the side support member 41. This clearance is desirably about 0.1 to 1.0 mm. In this way, the support means 4
0 supports the cemented carbide substrate 30 without being closely fixed. Also in this case, in order to completely remove the distortion generated in the cemented carbide substrate 30, the thickness of the side support member 41 is desirably slightly smaller than the finished thickness of the cemented carbide substrate 30 after grinding. . In addition, the ring-shaped cemented carbide substrate 30 can be supported from the outer peripheral side as in the case of FIG.

The support means 20 shown in FIG. 1 and the support means 40 shown in FIG. 2 are mounted on, for example, a plate-like object grinding apparatus 50 as shown in FIG. Here, the support means 20 shown in FIG.
The case of grinding 0 will be described as an example. Parts that are configured similarly to the conventional plate-shaped object grinding apparatus 70 shown in FIG. 5 will be described with the same reference numerals.

In the plate grinding apparatus 50 shown in FIG. 3, a pair of rails 53 are vertically arranged on the inner surface of a wall 52 provided upright from the end of a base 51, The grinding means 55 attached to the support plate 54 moves up and down as the support plate 54 moves up and down along 53. On the base 51, a turntable 56 is rotatably disposed.
A support table 21 for supporting a plate-like object is rotatably disposed on the table 6.

In the grinding means 55, a mounter 5 formed at the tip of a spindle 57 having a vertical axis is provided.
A grinding wheel 59 is mounted on 8, and the grinding wheel 59 rotates with the rotation of the spindle 57. A grinding wheel 59a made of abrasive grains such as diamond is fixed to a lower portion of the grinding wheel 59.

As shown in FIG. 4, the grinding means 55 is supported by a support plate 54, and a nut 54a penetrating the wall 52 from the support plate 54 has a ball screw 60 vertically disposed at the rear side of the wall 52. Is screwed into. The ball screw 60 is connected to a pulse motor 61, and the pulse motor 61 is connected to a control unit 63 via a pulse motor driver 62. Then, the pulse motor 61 is driven under the control of the control unit 63, and the ball screw 60 is rotated accordingly, whereby the nut 54ag moves up and down, and the grinding means 55 moves up and down.
Further, the vertical position information of the grinding unit 55 is measured by the linear scale 64, and the information is transmitted to the control unit 63, and is used for precise control of the vertical movement of the grinding unit 55.

The control unit 63 includes a servo driver 65
Servo motor 6 connected to the support table 21 through the
6 and the encoder 67, and the rotation of the support table 21 is controlled under the control of the control unit 63.

When grinding the cemented carbide substrate 10 using the plate-shaped object grinding device 50, as shown in FIG. 3, the side support member 22 corresponding to the shape and size of the cemented carbide substrate 10 is used. The support means 20 is fixed to the support table 21.
Then, the cemented carbide substrate 10 shown in FIG. 1 to be ground is accommodated in the opening 23, and the cemented carbide substrate 10 is supported by the support means 20 without being tightly fixed. When the ring-shaped cemented carbide substrate 30 shown in FIG. 2 is ground, the side support members 41 corresponding to the shape and size are fixed to the support table 21.

In this way, the cemented carbide substrate 10 is
The grinding wheel 59 is positioned immediately above the cemented carbide substrate 10 in a state where the grinding wheel 59 is freely supported without being fixedly adhered thereto, and the spindle 57 is rotated while the grinding means 55 is lowered. Then, with the rotation of the spindle 57, the grinding wheel 59 rotates and the support table 21 rotates in the opposite direction, grinding water is supplied from the grinding water supply nozzle 68, and the rotating grinding wheel 59a is When the pressing force is applied in contact with the grinding surface 11, the grinding surface 11 is ground by the grinding wheel 59a.

At this time, the cemented carbide substrate 10 is
0, a clearance is formed between the outer peripheral portion of the cemented carbide substrate 10 and the inner peripheral portion of the side support member 22, and the cemented carbide substrate 10 is free at the opening 23. Becomes Since the thickness of the side support member 22 is smaller than the finished thickness of the cemented carbide substrate 10 after grinding, the ground surface 11 of the cemented carbide substrate 10 is
2 protrudes above the upper surface.

Therefore, at the position projecting upward from the side support member 22, the cemented carbide substrate 10 is not restrained in the vertical direction and is free at the opening 23, so that the cemented carbide substrate 10 The distortion appears on the ground surface 11 as it is and is ground by the grinding wheel 59a, so that the distortion is reliably removed and the surface becomes smooth. Then, even if the cemented carbide substrate 10 is taken out from the opening 23 after the grinding is completed and the support state is released, distortion does not appear again due to rebound, and planar accuracy can be maintained.

Also, even if the cemented carbide substrate 10 is temporarily distorted by grinding, the distortion appears freely on the ground surface 11 and can be removed by subsequent grinding. Even if the cemented carbide substrate 10 is removed from the support means 20, no distortion appears again, and the planar accuracy can be maintained.

As described above, since the strain originally caused in the cemented carbide substrate 10 and the strain caused by grinding can be removed, a blade is formed on the outer periphery of the unstrained cemented carbide substrate 10 thereafter. Thereby, a highly accurate circular saw can be formed. Then, by performing cutting using a high-precision circular saw, the quality of the workpiece can be improved.

In the present embodiment, the case of grinding a cemented carbide substrate has been described as an example. However, the object to be ground is not limited to a cemented carbide substrate, but may be a metal, glass, ceramic, It can be widely used for grinding various kinds of plate-like objects, such as semiconductor wafers, requiring planar accuracy. Also,
The shape of the object to be ground is not limited to a circle.

[0031]

As described above, according to the plate-shaped object grinding apparatus and the plate-shaped object grinding method of the present invention, the plate is ground in a state where the plate is supported by the supporting means without being closely fixed. Even if the plate-like object has a distortion in advance, the plate-like object is ground in a state where the distortion appears on the ground surface, and the distortion can be surely removed and a flat surface can be finished. And since the distortion does not appear again even if the plate-like object is removed from the support means,
Plane accuracy can be maintained.

Further, even if the plate-like object is temporarily distorted by the grinding, the distortion appears on the ground surface and can be removed by the subsequent grinding. Even if it is removed from the means, no distortion appears again, and the planar accuracy can be maintained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first example of a supporting means constituting a plate-like object grinding apparatus according to the present invention.

FIG. 2 is a perspective view showing a second example of the support means constituting the plate-like object grinding apparatus.

FIG. 3 is a perspective view showing an example of the embodiment of the plate-like object grinding apparatus.

FIG. 4 is an explanatory view showing a configuration of the plate-like object grinding apparatus.

FIG. 5 is a perspective view showing a conventional plate-shaped object grinding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Cemented carbide substrate 11 ... Grinding surface 20 ... Support means 21 ... Support table 22 ... Side support member 23 ... Opening 30 ... Cemented carbide substrate 31 ... Grinding surface 32 ... Opening 40 ... Support means 41 ... Side Supporting member 50 ... Plate grinding apparatus 51 ... Base 52 ... Wall 53 ... Rail 54 ... Support plate 54a ... Nut 55 ... Grinding means 56 ... Turn table 57 ... Spindle 58 ... Mounter 59 ... Grinding wheel 59a ... Grinding grindstone 60 ... Ball screw 61 ... Pulse motor 62 ... Pulse motor driver 63 ... Control unit 64 ... Linear scale 65 ... Servo driver 66 ... Servo motor 67 ... Encoder 68 ... Grinding water supply nozzle 70 ... Plate-like object grinding device 71 ... Object to be ground 71a ... Grinding surface 72 ... Supporting means 73 ... Vacuum table

Claims (8)

[Claims] 1. A grinding apparatus comprising at least a support means for supporting a plate-like object and a grinding means provided with a grinding wheel for grinding a grinding surface of the plate-like object supported by the support means, The support means includes a rotatable support table for supporting a support surface of the plate-like object, and a side support member for supporting a side portion of the plate-like object, wherein the side support member is provided on the support table. A plate-like object grinding device that is fixed and supports the plate-like object without tightly fixing it. 2. The plate-shaped object grinding apparatus according to claim 1, wherein the side support member supports the plate-shaped object from an outer peripheral side. 3. When the plate-shaped object has an opening at the center, the side support member engages with the opening of the plate-shaped object to support the plate-shaped object from the inner peripheral side. 3. The plate-like object grinding device according to 1. 4. The plate-shaped object grinding apparatus according to claim 1, wherein a clearance formed between a side portion of the plate-shaped object and the side support member is 0.1 mm to 1.0 mm. 5. The apparatus according to claim 1, wherein a thickness of the side support member is smaller than a finished thickness of the plate. 6. The plate-like object grinding apparatus according to claim 1, wherein the side support member and the support table are fixed by any of wax down, screwing, and integral formation. 7. A method for grinding a plate-like object using the plate-like object grinding apparatus according to claim 1, wherein the plate-like object is supported by a side support member on a support table without being tightly fixed. A plate grinding method for bringing a grinding wheel constituting a grinding wheel into contact with the plate, rotating the support table and the grinding wheel to grind the plate to a predetermined thickness. 8. The method of claim 7, wherein the plate is a cemented carbide.