JP2001198813A - 研磨装置及びその研磨方法 - Google Patents

研磨装置及びその研磨方法

Info

Publication number
JP2001198813A
JP2001198813A JP2000004915A JP2000004915A JP2001198813A JP 2001198813 A JP2001198813 A JP 2001198813A JP 2000004915 A JP2000004915 A JP 2000004915A JP 2000004915 A JP2000004915 A JP 2000004915A JP 2001198813 A JP2001198813 A JP 2001198813A
Authority
JP
Japan
Prior art keywords
polishing
friction
change component
polished
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000004915A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001198813A5 (enExample
Inventor
Atsushi Shigeta
厚 重田
Fumihiko Sakata
文彦 坂田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Priority to JP2000004915A priority Critical patent/JP2001198813A/ja
Publication of JP2001198813A publication Critical patent/JP2001198813A/ja
Publication of JP2001198813A5 publication Critical patent/JP2001198813A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000004915A 2000-01-13 2000-01-13 研磨装置及びその研磨方法 Pending JP2001198813A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000004915A JP2001198813A (ja) 2000-01-13 2000-01-13 研磨装置及びその研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000004915A JP2001198813A (ja) 2000-01-13 2000-01-13 研磨装置及びその研磨方法

Publications (2)

Publication Number Publication Date
JP2001198813A true JP2001198813A (ja) 2001-07-24
JP2001198813A5 JP2001198813A5 (enExample) 2004-12-24

Family

ID=18533641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000004915A Pending JP2001198813A (ja) 2000-01-13 2000-01-13 研磨装置及びその研磨方法

Country Status (1)

Country Link
JP (1) JP2001198813A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1421453A2 (en) * 2001-08-21 2004-05-26 Cabot Microelectronics Corporation Cmp process involving frequency analysis-based monitoring
JP2006093192A (ja) * 2004-09-21 2006-04-06 Disco Abrasive Syst Ltd ウェーハ研磨装置及びウェーハの研磨方法
JP2007190638A (ja) * 2006-01-18 2007-08-02 Jtekt Corp 内面研削盤
JP2011040511A (ja) * 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd ウエーハの研削方法
KR20150051150A (ko) 2013-11-01 2015-05-11 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US9440327B2 (en) 2012-04-10 2016-09-13 Ebara Corporation Polishing apparatus and polishing method
JP2017076779A (ja) * 2015-10-16 2017-04-20 株式会社荏原製作所 研磨装置、及び、研磨方法
CN108145594A (zh) * 2017-12-21 2018-06-12 上海华力微电子有限公司 研磨垫使用寿命的监测方法及监测设备
WO2019177842A1 (en) * 2018-03-12 2019-09-19 Applied Materials, Inc. Filtering during in-situ monitoring of polishing
US10744617B2 (en) 2015-10-16 2020-08-18 Ebara Corporation Polishing endpoint detection method
US10759019B2 (en) 2014-09-02 2020-09-01 Ebara Corporation End point detection method, polishing apparatus, and polishing method

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005501410A (ja) * 2001-08-21 2005-01-13 キャボット マイクロエレクトロニクス コーポレイション 周波数解析に基づく監視を含むｃｍｐプロセス
EP1421453A2 (en) * 2001-08-21 2004-05-26 Cabot Microelectronics Corporation Cmp process involving frequency analysis-based monitoring
JP2006093192A (ja) * 2004-09-21 2006-04-06 Disco Abrasive Syst Ltd ウェーハ研磨装置及びウェーハの研磨方法
JP2007190638A (ja) * 2006-01-18 2007-08-02 Jtekt Corp 内面研削盤
JP2011040511A (ja) * 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd ウエーハの研削方法
US9440327B2 (en) 2012-04-10 2016-09-13 Ebara Corporation Polishing apparatus and polishing method
KR20150051150A (ko) 2013-11-01 2015-05-11 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US9272389B2 (en) 2013-11-01 2016-03-01 Ebara Corporation Polishing apparatus and polishing method
KR20170015406A (ko) 2013-11-01 2017-02-08 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US10759019B2 (en) 2014-09-02 2020-09-01 Ebara Corporation End point detection method, polishing apparatus, and polishing method
US12285836B2 (en) 2014-09-02 2025-04-29 Ebara Corporation End point detection method, polishing apparatus, and polishing method
CN106965075A (zh) * 2015-10-16 2017-07-21 株式会社荏原制作所 研磨装置及研磨方法
CN106965075B (zh) * 2015-10-16 2020-02-07 株式会社荏原制作所 研磨装置及研磨方法
US10744617B2 (en) 2015-10-16 2020-08-18 Ebara Corporation Polishing endpoint detection method
US11260499B2 (en) 2015-10-16 2022-03-01 Ebara Corporation Polishing apparatus and polishing method
JP2017076779A (ja) * 2015-10-16 2017-04-20 株式会社荏原製作所 研磨装置、及び、研磨方法
CN108145594A (zh) * 2017-12-21 2018-06-12 上海华力微电子有限公司 研磨垫使用寿命的监测方法及监测设备
WO2019177842A1 (en) * 2018-03-12 2019-09-19 Applied Materials, Inc. Filtering during in-situ monitoring of polishing
CN111316403A (zh) * 2018-03-12 2020-06-19 应用材料公司 在抛光原位监测期间的滤波
US11446783B2 (en) 2018-03-12 2022-09-20 Applied Materials, Inc. Filtering during in-situ monitoring of polishing
US11679466B2 (en) 2018-03-12 2023-06-20 Applied Materials, Inc. Filtering during in-situ monitoring of polishing
US11969855B2 (en) 2018-03-12 2024-04-30 Applied Materials, Inc. Filtering during in-situ monitoring of polishing
CN111316403B (zh) * 2018-03-12 2024-12-13 应用材料公司 在抛光原位监测期间的滤波

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