JP2001198505A - Supply device for paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a supply device for paste capable of improving productivity without needing the scraping work for the paste. SOLUTION: In the supply device for paste for forming a paste film having a prescribed thickness by spreading the paste on a table by a squeeze 13a, a scraping member 14 for scraping the paste pushed out of the moving range of the squeeze 13a in the squeezing to return to the moving range of the squeeze 13a is mounted along the back surface of a main body part 13c to scrape the flux swollen out from a side wall part 14a to prevent the swelling out of the flux creeping up along the inside surface of both side wall part of a table 11 from the table by an overhung part 14b. As a result, the flux is constantly automatically scraped with the movement of the squeeze 13a to save the scraping work by workers.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste supplying apparatus for extending a paste such as a flux and supplying the paste in the form of a paste film having a predetermined thickness.

[0002]

2. Description of the Related Art As a method for mounting electronic components, a method using solder bonding is widely used. At the time of solder joining, a paste-like flux is supplied to a solder joint for the purpose of improving solder jointability. As a method of supplying the flux, a method by transfer is known. In this method, a flux film is formed on a table, and the flux is transferred to the transfer target by bringing a transfer target such as a solder ball or a transfer pin for forming a solder bump into contact with the flux film.

[0003]

By the way, in the transfer of the flux by the above method, a film forming operation of forming a flux film having a predetermined film thickness is performed by spreading the flux on a flat table by a squeegee. During this squeegee, the flux is raked in the direction of movement of the squeegee and is pushed away on both sides of the squeegee.
In recent years, high-viscosity flux has been used, so the fluidity of the flux has decreased, and the flux that has been pushed away on both sides of the squeegee is difficult to return to the squeegee's movement range. A flux pool where the flux stops is likely to be formed.

[0004] The flux that is in a constant accumulation state outside the squeegee movement range is solidified as it is if left unstirred for a certain period of time. The flux solidified in this manner must be removed and discarded, so in a conventional flux supply device, when targeting high-viscosity flux, the flux pushed to both sides of the squeegee is moved manually by the squeegee. There is a problem that it is necessary to frequently carry out the work of scraping into the range, and this work takes time and labor and the productivity is reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a paste supplying apparatus which can improve the productivity without requiring the operation of scraping the paste.

[0006]

According to a first aspect of the present invention, there is provided a paste supply apparatus for extending a paste on a table by a squeegee to form a paste film having a predetermined thickness. The squeegee is provided with a scraping portion for scraping the paste that is pushed out of the moving range of the squeegee by the horizontal movement into the moving range.

According to the present invention, by providing a scraping portion for scraping the paste which is pushed out of the movement range of the squeegee by the horizontal movement of the squeegee into the movement range, the paste is always automatically generated with the movement of the squeegee. It can be manually scraped, and the scraping work by the operator can be omitted.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of a solder ball mounting apparatus according to one embodiment of the present invention, FIG. 2 is a cross-sectional view of a flux supply unit of the solder ball mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 4 is a perspective view of a squeegee of a flux supply unit of the solder ball mounting device of one embodiment of the present invention. FIG. 4 is a plan view of a flux supply unit of the solder ball mounting device of one embodiment of the present invention. FIG. 4 is a flowchart of a solder ball mounting operation according to one embodiment.

First, a device for mounting a solder ball will be described with reference to FIG. In FIG. 1, a transport path 2 for transporting a work 3 is provided at the center of the base 1. The transport path 2 is provided with a work positioning portion, and a solder ball is mounted on the work 3 positioned by the positioning portion.

At both ends of the upper surface of the base 1, a Y-axis table 4 is provided.
And a guide section 5 are provided. The Y-axis table 4 includes a Y-axis motor 4a, a feed screw 4c, and a guide rail 4.
b, and the guide section 5 includes a guide rail 5a. An X-axis table 6 is provided on the Y-axis table 4 and the guide section 5, and by driving a Y-axis motor 4a to rotate a feed screw 4c, the X-axis table 6 moves along the guide rails 4b and 5a. Move horizontally.

The X-axis table 6 includes an X-axis motor 6a, a feed screw 6c, and a guide rail 6b. The X-axis table 6 is provided with a transfer head 7 that is movable in the horizontal direction along the guide rail 6b. Have been. X-axis motor 6a
Is driven to rotate the feed screw 6c, so that the transfer head 7 moves in the horizontal direction.

A ball supply unit 9 is provided on the front side of the transport path 2. A large number of solder balls 8 (see FIG. 2) are stored in the ball supply unit 9. The transfer head 7 is moved to be positioned on the ball supply unit 9, where the transfer head 7 is moved.
The transfer head 7 adsorbs and holds the solder ball 8 on the lower surface thereof. That is, the transfer head 7 performs a ball suction operation of sucking the solder ball 8.

A flux supply unit 10 is provided beside the ball supply unit 9. The flux supply unit 10
A table 11 and a squeegee head 12 that moves horizontally on the table 11 are provided. By sliding the squeegee head 12 on the table 11 in a state where the flux is supplied on the table 11, the flux is spread on the table 11 to form a flux film.
That is, the flux supply unit 10 performs the film forming operation of the flux 23.

The flux is transferred to the solder ball 8 by lowering the transfer head 7 holding the solder ball 8 with respect to the flux film and bringing the solder ball 8 into contact with the flux film. That is, the transfer head 7 performs a flux transfer operation. Then, the transfer head 7 holding the solder balls 8 to which the flux 23 has been transferred is moved onto the work 3, where the transfer head 7 is moved up and down, whereby the transfer head 7 mounts the solder balls 8 on the work 3. That is, the transfer head 7 performs a mounting operation.

Next, referring to FIG.
Will be described. In FIG. 2, the upper surface of the table 11 is a container having a flat bottom surface 11a.
A flux 23 is supplied on 1a. Table 11
The squeegee head 12 is disposed on the upper side, and a feed screw 25 is provided below the bracket 20 of the squeegee head 12.
Is screwed into the nut 24. Feed screw 25
A pulley 26 is connected to the end of the motor, and a belt 28 is tuned to the pulley 26 and the pulley 27 at the shaft end of the motor 29.

When the motor 29 is driven, the feed screw 25 rotates, whereby the bracket 20 moves together with the nut 24 in the horizontal direction. Two cylinders 21 are disposed on the upper surface of the bracket 20, and squeegees 13a and 13b are mounted on the lower end of the rod 21a of each cylinder 21. The squeegees 13a and 13b scrape the flux when the squeegee head 12 moves leftward and rightward on the table 11, respectively.

Here, referring to FIG. 3, squeegees 13a,
13b will be described. FIG. 3A shows the squeegee 13.
The body part 13c of a and 13b is shown. Main body 13c
Is a slender plate-like member that scrapes the flux 23 by the protrusion at the lower end, and the front side (in the direction of arrow A) in the scraping direction has a gentle V whose thickness decreases toward the center.
It has a shape cross section.

FIG. 3B shows a state where the scraping member 14 is mounted on the main body 13c. Scraping member 14
Are mounted along the rear surface of the main body portion 13c, and both end portions bend and protrude in the squeegee advancing direction.
a and an overhanging portion 14b on the upper surface. The lower end of the side wall portion 14a is mounted so as to be at substantially the same height position as the lower end portion of the main body portion 13c.
The width W between them is the width W of the table 11 (see FIG. 4).
It is provided so as to substantially match with.

Therefore, when the squeegees 13a and 13b, on which the scraping members 14 are mounted, are moved on the table 11 in the squeezing direction, the side walls 14a move along the inner surfaces of both side walls of the table 11, and The flux 23 protruding outside the moving range of the main body 13c is swept into the moving range by the side wall 14a. In addition, since the overhang portion 14b covers the upper portion of the outer portion of the main body portion 13c, the flux 23 pushed out of the moving range by the squeezing crawls up along the inner surfaces of both side wall portions of the table 11. Table 1
It can be prevented from protruding from one.

The solder ball mounting device is configured as described above, and the operation will be described below with reference to the drawings. In FIG. 5, first, a ball suction operation (ST1) in which the transfer head 7 suctions and holds the solder ball 8 of the ball supply unit 9 is performed. In parallel with this, in the flux supply unit 10, the flux 23
(ST2) for forming the flux 23 on the flux film 23a having a predetermined thickness is repeatedly performed. Then, after that, the solder ball 8 is brought into contact with the flux film 23a of the flux supply section 10 so that the flux 23
Is performed (ST4), and thereafter, a mounting operation of mounting the solder balls 8 on the work 3 is performed (S4).
T5).

In the process of repeating the film forming operation in ST3, an operation of repeatedly scraping the flux 23 in the left and right directions on the table by the squeegees 13a and 13b is performed as shown in FIG. At this time, the squeegee 13
There is a gap between both sides of a and 13b and the inner surface of the table side wall. In the range B of the gap, the flux 23 is not scraped.

As shown in FIG. 3, the squeegees 13a and 13b used in the present embodiment scrape the flux 23, which is pushed to the outside of the moving range by squeezing at both ends, into the moving range. Member 1
4, the squeegee 13 is located in the range B.
The flux 23 removed by the a and 13b does not remain in the stagnant state for a long time.

Therefore, it is possible to prevent waste of resources due to the fact that the conventional flux is left standing in a fixed reservoir state for a long time and hardened to become waste, and it is not necessary to manually scrape the flux in this range. .

[0024]

According to the present invention, the squeegee is provided with a scraping portion for scraping the paste which is pushed out of the moving range of the squeegee by the horizontal movement of the squeegee. Are automatically scraped, and the scraping work by the operator can be omitted.

[Brief description of the drawings]

FIG. 1 is a plan view of a solder ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a flux supply unit of the solder ball mounting device according to one embodiment of the present invention.

FIG. 3 is a perspective view of a squeegee of a flux supply unit of the solder ball mounting device according to one embodiment of the present invention;

FIG. 4 is a plan view of a flux supply unit of the solder ball mounting device according to one embodiment of the present invention.

FIG. 5 is a flowchart of a solder ball mounting operation according to an embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 3 Work 7 Transfer head 8 Solder ball 9 Ball supply unit 10 Flux supply unit 11 Table 13a, 13b Squeegee 23 Flux

Claims (1)

[Claims] An apparatus for supplying a paste for forming a paste film having a predetermined thickness by spreading the paste on a table by a squeegee, wherein the paste which is pushed out of a squeegee movement range by a horizontal movement of the squeegee. A paste supply device, comprising: a scraping portion that scrapes in a moving range.