CN101161391B - Welding flux film forming device and smoothing method for welding flux surface - Google Patents
Welding flux film forming device and smoothing method for welding flux surface Download PDFInfo
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- CN101161391B CN101161391B CN2007101514356A CN200710151435A CN101161391B CN 101161391 B CN101161391 B CN 101161391B CN 2007101514356 A CN2007101514356 A CN 2007101514356A CN 200710151435 A CN200710151435 A CN 200710151435A CN 101161391 B CN101161391 B CN 101161391B
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Abstract
The present invention provides a welding fluid film forming device, which can remove welding fluid drag generated in return of welding fluid container, such that formed welding fluid film keeps even. A table board (46) having concave section (50) for welding fluid film forming is arranged in a welding fluid film forming device (42); the concave section (50) is filled with welding fluid (40B) by moving a welding fluid container (48) with An opening on bottom (52) on the table board relatively horizontally; the film forming device (42) has a scraper (72) and makes a wall surface of (58) of the welding fluid container (48) reaches to the position of the upper concave section by moving the welding fluid container (48) horizontally; and the film forming device (42) is linked with the welding fluid container (48) by horizontal movement, and the scarper slides on surface (58) (its chamfer section (60)) of the welding fluid container (48) to scrape down the welding fluid (40B) attached on the chamfer section (60).
Description
Technical field
The present invention relates to a kind of welding flux film forming device and utilized the smoothing method of the welding flux surface of this film formation device.
Background technology
In surface mounting apparatus, when on substrate, electronic unit being installed, carry out going up the operation of coating solder flux to the electrode portion (bump) of this electronic unit.This operation is performed such: be immersed in by electrode portion and utilize in the thin flux film that welding flux film forming device forms electronic unit, and with welding flux transfer-printing to this electrode portion.In order to carry out transfer printing well, must be formed uniformly the flux film that is used for transfer printing.
At present, use device shown in Figure 5 to carry out the film forming of this solder flux.
Yet, in welding flux film forming device 10 with this structure, the solder flux piece 20B that moves the solder flux 20 of getting together by flux container 18, because the viscosity that this solder flux 20B itself has, and can't reclaim by recoverer 22, still pull the problem that this solder flux piece 20B returns when existing flux container 18 to return.
In order to tackle this problem, a kind of technology of trying every possible means in shape at flux container 18 is disclosed in patent documentation 1.Its summary shown in Figure 6.In this technology, attempt by making flux container 18A form circle, when recess 12 sides are advanced, as much as possible unnecessary solder flux 24 is expressed to the both sides (with reference to dotted arrow) of direction of advance at flux container 18A, and reduces the solder flux amount of when flux container 18 returns, towing back to together.
Patent documentation 1: the spy opens the 2002-172460 communique
Summary of the invention
Yet, because disclosed film formation device adopts the thin accumulation horizon that will be present in the solder flux 20B on the table top 14 to be squeezed to the structure of both sides in this patent documentation 1, though therefore can reduce the solder flux 24A that the central authorities on the table top 14 pile up reliably, have the tendency of the accumulation increase that makes both sides on the contrary.Therefore, when flux container 18 returned round about, the residue solder flux 24A that aforementioned both sides are increased entered recess 12, exists thus even film forming is produced dysgenic problem.
In addition, following phenomenon takes place sometimes,, makes the unnecessary solder flux of piling up along the wall of this flux container 18 at flux container 18 24 when recess 12 sides are advanced that is, when returning, drop in film forming with recess 12 tops, also might produce membrane thickness unevenness at the width central portion of recess 12.
The present invention proposes in order to solve this prior art problems, its purpose is, make and when flux container advances, be deposited in together residue solder flux piece, can when flux container returns, not be drawn on the recess once more, thereby can in the whole zone of recess, form uniform flux film all the time.
The present invention is a kind of welding flux film forming device, it has table top, this table top (46) has the recess (50) that welding flux film forming is used, relatively move horizontally on this table top by the flux container that makes bottom surface (52) opening, and in aforementioned recess, fill up solder flux, it is characterized in that, has curette (72), when it arrives the position that surpasses aforementioned recess top at the wall that makes this flux container by moving horizontally of aforementioned flux container, go up slip with the moving horizontally interlock of aforementioned flux container at the wall (58) of this flux container, scrape off attached to the solder flux on this wall, thereby address the above problem.
That is to say, in the present invention, utilizing moving horizontally of flux container, when making this flux container arrive the position that surpasses recess top, move horizontally interlock and curette is slided along wall with this, scrape off attached to behind the solder flux on this wall, make flux container be back to the recess side by this slip.Its result can make flux container have the state of solder flux to return with non-cohesive on its wall, can prevent to damage the uniformity of the flux film that forms in recess reliably.
Preferred implementation of the present invention constitutes, aforementioned curette is made of the part of the spring members (62) that bar-shaped material bending is formed, another part of this spring members is fixed on aforementioned table top side, the aforementioned levels of an aforementioned part and flux container moves interlock and slides along aforementioned wall, works as aforementioned curette thus.Like this, can constitute curette with simple structure, itself and moving horizontally in linkage of flux container are moved.
In addition, more preferably welding flux film forming device constitutes, in the wall bottom of aforementioned flux container, towards the direct of travel rear side of this flux container and form chamfered section (60).Like this, can scrape off attached to the solder flux on the wall more smooth and more reliably.
In addition, if near the terminal part that the aforementioned levels of the aforementioned flux container of table top moves, form recoverer (80,82), their recyclable solder flux that scrapes from aforementioned wall then can successfully reclaim the solder flux that is scraped from wall by curette, can prevent pulling of solder flux more reliably.
The effect of invention
According to the present invention, the residue solder flux piece of getting together when flux container advances can be drawn on the recess when flux container returns once more, thereby can in the whole zone of recess, form uniform flux film all the time.
Description of drawings
Fig. 1 is the approximate vertical view of the welding flux film forming device that relates to of an example of embodiments of the present invention.
Fig. 2 is its orthogonal view.
Fig. 3 is the flow chart figure of expression flux container mobile process on table top.
Fig. 4 is that expression utilizes curette to scrape the partial enlarged drawing of the process of deflux.
Fig. 5 is the figure of an example of the existing welding flux film forming device of expression, (A) is its approximate vertical view, (B)～(D) is the orthogonal view of this flux container of expression mobile operation process on table top.
Fig. 6 is the figure of the example of another existing apparatus of expression, (A) is its approximate vertical view, (B) is its orthogonal view.
The specific embodiment
Below, based on an example of accompanying drawing detailed description embodiments of the present invention.
In Fig. 1, Fig. 2, on the base 44 of this film formation device 42, be formed with table top 46, flux container 48 can (relatively) be moved horizontally on this table top 46.On table top 46, be formed for filling up the recess 50 of solder flux.On the other hand, bottom surface 52 openings of flux container 48.Wall 54 around the flux container 48 is overlooked in the present embodiment to roughly square, accommodates solder flux 40 in inside.Bottom at wall 54 is the chamfered section 60 of α (with reference to Fig. 4) towards the direct of travel rear side angulation of this flux container 48, wall (surface of wall 54) 58 lateral buckling behind direct of travel.
In addition, in this manual for simplicity, flux container 48 is defined as direct of travel to the direction that recess 50 moves, rightabout is defined as Return-ing direction.About the function of this chamfered section 60 as described later in detail.In addition, label 56 is the lids that are positioned in wall 54 tops.
The additional spring members 62 that is provided with on film formation device 42, it is by being roughly for overlooking that the U font forms with the club-shaped material bending.Spring members 62 is made of a pair of fixed part 64A, 64B, a pair of arm 68A, 68B and curette 72.Fixed part 64A, 64B are positioned at the outermost of spring members 62, are fixed on (table top side) on the base 44. Arm 68A, 68B lift with elevation angle theta respectively from above-mentioned a pair of fixed part 64A, 64B end 66A, 66B separately.Curette 72 is corresponding with the part of the top 70A, the 70B that link above-mentioned arm 68A, 68B.The aforementioned elevation angle theta of arm 68A, 68B can dwindled when above-mentioned arm 68A, 68B apply to the load of downside via curette 72.That is to say, by to the load of downside with the height H 1 of curette 72 from being equivalent to elevation angle theta, be pressed into the height H 2 roughly the same with table top 46.In addition, by removing load, the height H 1 (aftermentioned) that can utilize the elastic force of arm 68A, 68B that curette 72 is returned to be equivalent to elevation angle theta.
In addition, the label 80 among the figure is that solder flux accumulates portion's (recoverer), and it is formed near the terminal part that moves horizontally of flux container 48 of table top 46, can reclaim the solder flux 40 that scrapes from wall 58.In addition, the solder flux of label 82 expression opposition sides accumulates portion.
The following describes the effect of this film formation device 42.
Shown in Fig. 3 (A), when flux container 48 was positioned at position P1, arm 68A, the 68B of spring members 62 kept elevation angle theta.Therefore, curette 72 is positioned at maximum height H1.
Shown in Fig. 3 (B), if flux container 48 move and in-position P2 near, then remaining solder flux 40B begins to be deposited near the chamfered section 60 of wall 58.
Fig. 3 (C) illustrates and flux container 48 is moved further and makes its wall 58 just and curette 72 state of contact.At this moment, flux container 48 is positioned at than the end that moves, is the slightly near position P3 of position P4.
In Fig. 4 (A), amplify the state that flux container 48 in-position P3 are shown.If make flux container 48 continue to move from this state, the height H 1 of curette 72 then from being equivalent to elevation angle theta, on chamfered section 60 slide and on one side begin descend on one side, flux container 48 arrives the position P4 shown in Fig. 3 (D).In this stage, curette 72 drops to the minimum altitude H2 shown in Fig. 4 (B) gradually.Its result will almost all scrape and be housed in solder flux and accumulate in the portion 80 attached near the solder flux 40B the chamfered section 60 of wall 58.
As mentioned above, accumulate in the portion 80 owing to will scrape and be housed in solder flux forcibly attached to the solder flux 40B on the wall 58 (chamfered section 60), thus at flux container 48 when position P1 returns, can not make solder flux 40B attached on the wall 58.Therefore, make the top that covers the flux film A on the recess 50, still keep by the smooth surface (Fig. 3 (E)) after bottom surface 52 stricklings of flux container 48.
In addition, in the above-described embodiment, curette is made of the part of the spring members that club-shaped material is bent to form, this curette and flux container moving horizontally the interlock and on the wall of flux container, slide, but in the present invention, adopting what kind of structure to slide on wall for curette does not limit especially.Key is, as long as by the moving horizontally of aforementioned flux container, when making the wall of this flux container arrive the position that surpasses aforementioned recess top, can make curette and this move horizontally interlock and gets final product along the wall slip.
Shown in above-mentioned embodiment, if owing to can utilize " drive source " that slides that move horizontally of flux container itself as curette, then can make simple in structure and can reduce cost, thereby preferred this mode, but for example under the situation that requires to scrape off more completely, also can constitute by moving horizontally when making flux container arrive near terminal position (or terminal), connect switch and electronic curette round moving on wall, this structure are also contained in the notion of " curette that slides on the wall of this flux container with the moving horizontally interlock of flux container " described in the present invention.
In addition, be associated therewith, be designed in the above-described embodiment form chamfered section in the wall bottom of flux container, so that the slip of curette is more successfully carried out, but chamfered section certainly is not set under the situation of electronic curette, in addition, even without chamfered section, also can constitute and for example pass through suitably the arm length and the elevation angle of setting spring parts, descend on one side and curette is slided on wall on one side.Therefore, in the present invention, the formation of chamfered section is not necessary condition.
In addition, in the above-described embodiment, constitute near the terminal part that moves horizontally of the flux container on the table top and to form the resettlement section that to accommodate the solder flux that scrapes from wall, and make the solder flux that scrapes be difficult to return once more, but when the distance of the recess of for example using from welding flux film forming between the terminal part that moves horizontally of flux container is big, also can omit the formation of this resettlement section sometimes.
Industrial applicibility
The present invention is applicable to the field that forms flux film that is used to apply solder flux when being installed in electronic unit on the substrate by surface mounting apparatus.
Claims (5)
1. welding flux film forming device, it has table top, and this table top has the recess that welding flux film forming is used, and relatively move horizontally on this table top by the flux container that makes the bottom surface opening, and in aforementioned recess, fill up solder flux,
It is characterized in that,
Has curette, when it arrives the position that surpasses aforementioned recess top at the wall that makes this flux container by moving horizontally of aforementioned flux container, slide on the wall of this flux container with the moving horizontally interlock of aforementioned flux container, scrape off attached to the solder flux on this wall.
2. welding flux film forming device according to claim 1 is characterized in that,
Aforementioned curette is made of the part of the spring members that bar-shaped material bending is formed,
Another part of this spring members is fixed on aforementioned table top side,
The aforementioned levels of an aforementioned part and flux container moves interlock and slides along aforementioned wall, works as aforementioned curette thus.
3. welding flux film forming device according to claim 1 is characterized in that,
In the wall bottom of aforementioned flux container, towards the direct of travel rear side of this flux container and form chamfered section.
4. according to each described welding flux film forming device in the claim 1 to 3, it is characterized in that,
Form recoverer near the terminal part that the aforementioned levels of the aforementioned flux container of aforementioned table top moves, it can reclaim the solder flux that scrapes from aforementioned wall.
5. the smoothing method of the welding flux surface in the welding flux film forming device, this welding flux film forming device has table top, and this table top has the recess that welding flux film forming is used, and relatively moves horizontally on this table top by the flux container that makes the bottom surface opening, and in aforementioned recess, fill up solder flux
It is characterized in that, comprise following operation:
By the moving horizontally of aforementioned flux container, when making the wall of this flux container arrive the position that surpasses aforementioned recess top, with this operation that moves horizontally interlock and curette is slided along aforementioned wall; And
Scrape off attached to behind the solder flux on the wall by this slip, make aforementioned flux container return the operation of aforementioned recess side.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006278258 | 2006-10-12 | ||
| JP2006-278258 | 2006-10-12 | ||
| JP2006278258A JP5037084B2 (en) | 2006-10-12 | 2006-10-12 | Flux deposition system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101161391A CN101161391A (en) | 2008-04-16 |
| CN101161391B true CN101161391B (en) | 2011-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101514356A Active CN101161391B (en) | 2006-10-12 | 2007-10-12 | Welding flux film forming device and smoothing method for welding flux surface |
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| Country | Link |
|---|---|
| JP (1) | JP5037084B2 (en) |
| CN (1) | CN101161391B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI564105B (en) * | 2014-11-11 | 2017-01-01 | Shinkawa Kk | Flux accumulation device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097109A (en) * | 2021-03-31 | 2021-07-09 | 华天科技(南京)有限公司 | Soldering flux disc capable of preventing Bump cold solder joint, dipping system and method |
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|---|---|---|---|---|
| JP2001198505A (en) * | 2000-01-19 | 2001-07-24 | Matsushita Electric Ind Co Ltd | Supply device for paste |
| US6293317B1 (en) * | 1999-04-12 | 2001-09-25 | Esec Trading Sa | Method and device for the application of a liquid substance |
| JP2002172460A (en) * | 2000-12-05 | 2002-06-18 | Towa Corp | Device for and method of coating flux |
| WO2004100629A1 (en) * | 2003-05-09 | 2004-11-18 | Fuji Machine Mfg. Co., Ltd. | Flux transferring device and method of transferring flux |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0939198A (en) * | 1995-07-25 | 1997-02-10 | Nec Kansai Ltd | Screen printer |
| JP3470265B2 (en) * | 2000-03-10 | 2003-11-25 | サンユレック株式会社 | Stencil for resin printing and resin printing method using the same |
| JP2003023036A (en) * | 2001-07-06 | 2003-01-24 | Matsushita Electric Ind Co Ltd | Method of mounting electronic component having bump |
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2006
- 2006-10-12 JP JP2006278258A patent/JP5037084B2/en active Active
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- 2007-10-12 CN CN2007101514356A patent/CN101161391B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6293317B1 (en) * | 1999-04-12 | 2001-09-25 | Esec Trading Sa | Method and device for the application of a liquid substance |
| JP2001198505A (en) * | 2000-01-19 | 2001-07-24 | Matsushita Electric Ind Co Ltd | Supply device for paste |
| JP2002172460A (en) * | 2000-12-05 | 2002-06-18 | Towa Corp | Device for and method of coating flux |
| WO2004100629A1 (en) * | 2003-05-09 | 2004-11-18 | Fuji Machine Mfg. Co., Ltd. | Flux transferring device and method of transferring flux |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI564105B (en) * | 2014-11-11 | 2017-01-01 | Shinkawa Kk | Flux accumulation device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5037084B2 (en) | 2012-09-26 |
| CN101161391A (en) | 2008-04-16 |
| JP2008093697A (en) | 2008-04-24 |
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