CN217432372U - Excessive glue removing equipment for integrated circuit packaging - Google Patents
Excessive glue removing equipment for integrated circuit packaging Download PDFInfo
- Publication number
- CN217432372U CN217432372U CN202220187153.1U CN202220187153U CN217432372U CN 217432372 U CN217432372 U CN 217432372U CN 202220187153 U CN202220187153 U CN 202220187153U CN 217432372 U CN217432372 U CN 217432372U
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- glue
- face
- push rod
- electric push
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 title abstract description 59
- 238000004806 packaging method and process Methods 0.000 title abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000007921 spray Substances 0.000 claims abstract description 35
- 230000000694 effects Effects 0.000 claims abstract description 9
- 238000005538 encapsulation Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 20
- 239000007788 liquid Substances 0.000 abstract description 7
- 238000005457 optimization Methods 0.000 description 5
- 230000001771 impaired effect Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
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- Coating Apparatus (AREA)
Abstract
The utility model belongs to the field of glue overflow removing equipment, in particular to integrated circuit packaging glue overflow removing equipment, which comprises a bottom plate, wherein a first electric push rod is fixedly arranged at the right end of the upper end surface of the bottom plate, a movable plate is fixedly arranged at the output end of the first electric push rod, fixed plates are fixedly arranged at the left end and the right end of the upper end surface of the movable plate, a screw rod is respectively penetrated through and movably arranged at one side of the upper end surface of the movable plate, so that the position of an integrated circuit board is fixed through two clamping plates, then a glue dissolving agent in a water tank is pumped into a spray pipe through a hose through a water pump, the spray pipe uniformly sprays the glue dissolving agent on the area with glue on the integrated circuit board, the glue is softened, the rotating rod is driven by a motor to rotate, the rotating rod drives a sponge sleeve to rotate, liquid on the integrated circuit board is removed, and the effect of removing the glue is achieved, the glue removing efficiency is effectively improved, and the damage of the integrated circuit board is avoided.
Description
Technical Field
The utility model relates to an excessive gluey clean-up equipment field, concretely relates to integrated circuit encapsulation excessive gluey clean-up equipment.
Background
The integrated circuit board is a carrier for loading the integrated circuit, but the integrated circuit is usually carried on the integrated circuit board, the integrated circuit board is mainly composed of silica gel, therefore, the silicon wafer is generally green, a semiconductor manufacturing process is adopted to manufacture a plurality of transistors, resistors, capacitors and other components on a smaller single crystal silicon wafer, the manufacture process comprises printing circuit board, cutting the light-sensitive plate for copper-clad plate to obtain circuit board, pretreating copper-clad plate, transferring circuit board, etching circuit board reflow soldering machine, drilling circuit board, pretreating circuit board, soldering electronic components, and packaging, during packaging, glue overflows, the glue can shield an electronic circuit, and the electric circuit cannot be transmitted, so that the circuit board is easily damaged.
The prior equipment for removing the excessive glue in the integrated circuit packaging mainly adopts a scraping technology when removing the excessive glue on the integrated circuit board, and the scraping technology is easy to damage a circuit diagram on the integrated circuit board and cause the damage of the integrated circuit board, even manual operation is needed sometimes, and the removing efficiency is not high.
SUMMERY OF THE UTILITY MODEL
For solving the problem that proposes in the above-mentioned background art, the utility model provides an excessive gluey clean-up equipment of integrated circuit encapsulation has the region that has glue through the spray tube can evenly spray the glue dissolving agent on integrated circuit board, softens glue, drive the dwang through the motor and rotate for the dwang drives the sponge cover and rotates, clears away the liquid on the integrated circuit board, reaches the effect of clearing up glue, the effectual efficiency of clearing away that improves glue, the impaired characteristics of integrated circuit board have been avoided.
In order to achieve the above object, the utility model provides a following technical scheme: the integrated circuit packaging excessive glue removing equipment comprises a bottom plate, wherein a first electric push rod is fixedly mounted at the right end of the upper end face of the bottom plate, a movable plate is fixedly mounted at the output end of the first electric push rod, fixed plates are fixedly mounted at the left end and the right end of the upper end face of the movable plate, screws penetrate through and are movably mounted at one sides, away from the two fixed plates, of the two fixed plates, a clamping plate is mounted at one end, opposite to the two screws, of the bottom plate, a water tank is fixedly mounted at the rear end face of the bottom plate, a water pump is mounted at the inner bottom end face of the water tank, a water pump water outlet is communicated with a hose, the other end of the hose penetrates through the upper end face of the water tank, extends to the upper part of the water tank and is communicated with a spray pipe, a second electric push rod is fixedly mounted at the upper end of the front end face of the water tank, a mounting plate is fixedly mounted at the output end face of the second electric push rod, and a motor is fixedly mounted at the upper end face of the mounting plate, the output fixed mounting of motor has the dwang, the parcel can be dismantled to the lateral wall of dwang front end has the sponge cover, the equal fixed mounting in both ends has the slide bar, two about the terminal surface before the water tank the equal activity of lateral wall of slide bar has cup jointed the slider, two one side that the slider is relative respectively with the left and right sides fixed connection of mounting panel.
In order to facilitate the position of adjusting the spray tube, as the utility model relates to an excessive gluey clean-up equipment of integrated circuit encapsulation is preferred, the up end fixed mounting of bottom plate has the slide rail that distributes around two, two the slide rail respectively with the spout sliding connection of movable plate bottom.
In order to facilitate the position of adjusting the spray tube, as the utility model relates to an excessive gluey clean-up equipment of integrated circuit encapsulation is preferred, the other end fixed mounting of spray tube is in the up end of mounting panel, the spray tube is located the right side of motor.
In order to avoid the slider to drop from the slide bar, conduct the utility model relates to an excessive gluey cleaning equipment of integrated circuit encapsulation is preferred, two the preceding terminal surface fixed mounting of slide bar has the stopper.
In order to facilitate the spray tube to spray the glue dissolving agent on integrated circuit board, conduct the utility model relates to an integrated circuit encapsulation overflows gluey scavenging apparatus and is preferred, a plurality of spouts have been seted up in the bottom of spray tube lateral wall through.
In order to make the device be convenient for operate, conduct the utility model relates to an excessive gluey cleaning equipment of integrated circuit encapsulation is preferred, the preceding terminal surface fixed mounting of bottom plate has operating panel, operating panel respectively with first electric push rod, second electric push rod and motor electric connection.
Compared with the prior art, the beneficial effects of the utility model are that:
the integrated circuit packaging glue overflow clearing device is characterized in that a glue dissolving agent is added into a water tank, an integrated circuit board is placed on a movable plate, two clamping plates move towards the integrated circuit board by rotating two screw rods, so that the two clamping plates fix the position of the integrated circuit board and avoid moving, the glue dissolving agent in the water tank is pumped into a hose by a water pump, the glue dissolving agent flowing into the hose is sprayed out of a spray pipe and is sprayed, the first electric push rod is started to push the movable plate to move along two slide rails so as to adjust the position of the movable plate, and the second electric push rod is started to push a mounting plate to move in a matching manner by pushing the mounting plate to move, so that the spray pipe can uniformly spray the glue dissolving agent on a glue area on the integrated circuit board to soften the glue, by starting the motor, the motor drives the rotating rod to rotate, so that the rotating rod drives the sponge sleeve to rotate, the sponge sleeve rotates to remove liquid on the integrated circuit board, the glue cleaning effect is achieved, and the mounting plate and the motor are pushed to move through the second electric push rod, so that glue in any area on the integrated circuit board is removed by the sponge sleeve, the glue removing efficiency is effectively improved, and the integrated circuit board is prevented from being damaged;
to sum up, this kind of integrated circuit encapsulation overflows and glues clean-up equipment, fix integrated circuit board's position through making two splint, pass through the hose suction through the glue dissolving agent of water pump in with the water tank to the spray tube in after that, make the spray tube can evenly spray the region that has glue on integrated circuit board with the glue dissolving agent, soften glue, it rotates to drive the dwang through the motor, make the dwang drive the sponge cover and rotate, clear away the liquid on the integrated circuit board, reach the effect of clearing up glue, the effectual clearance efficiency that improves glue, it is impaired to have avoided integrated circuit board.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
In the drawings:
FIG. 1 is a top view of the integrated circuit package flash removing apparatus of the present invention;
FIG. 2 is a front view of the base plate of FIG. 1 according to the present invention;
fig. 3 is a left perspective view of the sponge cover in fig. 1 according to the present invention.
In the figure, 1, a bottom plate; 101. a slide rail; 102. a first electric push rod; 103. an operation panel; 2. moving the plate; 3. a fixing plate; 301. a screw; 302. a splint; 4. a water tank; 401. a water pump; 402. a hose; 403. a nozzle; 5. a second electric push rod; 501. mounting a plate; 6. a motor; 601. rotating the rod; 602. a sponge sleeve; 7. a slide bar; 701. a limiting block; 702. a slide block.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1-3, the present invention provides the following technical solutions: an integrated circuit packaging excessive glue removing device comprises a bottom plate 1, a first electric push rod 102 is fixedly arranged at the right end of the upper end face of the bottom plate 1, a movable plate 2 is fixedly arranged at the output end of the first electric push rod 102, fixed plates 3 are fixedly arranged at the left end and the right end of the upper end face of the movable plate 2, screws 301 are respectively and movably arranged on the opposite sides of the two fixed plates 3, a clamping plate 302 is respectively arranged at the opposite ends of the two screws 301, a water tank 4 is fixedly arranged on the rear end face of the bottom plate 1, a water pump 401 is arranged on the inner bottom end face of the water tank 4, a water outlet of the water pump 401 is communicated with a hose 402, the other end of the hose 402 penetrates through the upper end face of the water tank 4 and extends to the upper part of the water tank 4 and is communicated with a spray pipe 403, a second electric push rod 5 is fixedly arranged at the upper end of the front end face of the water tank 4, a mounting plate 501 is fixedly arranged at the output end of the second electric push rod 5, and a motor 6 is fixedly arranged on the upper end face of the mounting plate 501, the output fixed mounting of motor 6 has dwang 601, and the parcel can be dismantled to the lateral wall of dwang 601 front end has sponge cover 602, and the equal fixed mounting in both ends has slide bar 7 about the terminal surface before water tank 4, and the equal activity of lateral wall of two slide bars 7 has cup jointed slider 702, and the one side that two sliders 702 are relative respectively with mounting panel 501's the left and right sides fixed connection.
In this embodiment: the integrated circuit board is placed on the moving plate 2, the two screw rods 301 are rotated to enable the two clamping plates 302 to move towards the integrated circuit board, so that the two clamping plates 302 fix the position of the integrated circuit board and avoid moving, the glue dissolving agent in the water tank 4 is pumped into the spray pipe 403 through the hose 402 by the water pump 401, the glue dissolving agent flowing into the hose 402 is sprayed out of the spray pipe 403, so that the glue dissolving agent is sprayed, the moving plate 2 is pushed by the first electric push rod 102 to move along the two slide rails 101 by starting the first electric push rod 102, so that the position of the moving plate 2 is adjusted, the second electric push rod 5 is pushed by the second electric push rod 5 to move in cooperation with the moving plate 2, so that the glue dissolving agent can be uniformly sprayed on the area with glue on the integrated circuit board by the spray pipe 403, the glue is softened, and the glue is softened by starting the motor 6, motor 6 drives dwang 601 and rotates for dwang 601 drives sponge cover 602 and rotates, thereby makes sponge cover 602 rotate and clears away the liquid on the integrated circuit board, reaches the effect of clearing up glue, and effectual improvement clear away efficiency of glue, has avoided the integrated circuit board impaired.
As a technical optimization scheme of the utility model, the up end fixed mounting of bottom plate 1 has the slide rail 101 that distributes around two, two slide rails 101 respectively with the spout sliding connection of movable plate 2 bottoms.
In this embodiment: by providing the two slide rails 101, when the first electric push rod 102 pushes the moving plate 2 to move, the moving plate 2 moves along the two slide rails 101, and the two slide rails 101 can support the moving plate 2 to stably move.
As a technical optimization scheme of the utility model, the other end fixed mounting of spray tube 403 is in the up end of mounting panel 501, and spray tube 403 is located the right side of motor 6.
In this embodiment: by fixing the nozzle 403 to the mounting plate 501, the nozzle 403 can be moved by the movement of the mounting plate 501, thereby facilitating the adjustment of the position of the nozzle 403.
As a technical optimization scheme of the utility model, two slide bar 7's preceding terminal surface fixed mounting has stopper 701.
In this embodiment: by installing the limiting block 701, the limiting block 701 can limit the moving position of the sliding block 702, and the sliding block 702 is prevented from falling off from the sliding rod 7.
As a technical optimization scheme of the utility model, the bottom of spray tube 403 lateral wall is run through and has been seted up a plurality of spouts.
In this embodiment: by forming a plurality of nozzles on the nozzle 403, the nozzle 403 can spray the glue dissolving agent on the ic board.
As a technical optimization scheme of the utility model, bottom plate 1's preceding terminal surface fixed mounting has operating panel 103, operating panel 103 respectively with first electric push rod 102, second electric push rod 5 and motor 6 electric connection.
In this embodiment: the operation of each component is controlled by the operation panel 103, so that the device is convenient to operate.
The utility model discloses a theory of operation and use flow: firstly, adding a glue dissolving agent into the water tank 4, then placing the integrated circuit board on the movable plate 2, moving the two clamping plates 302 towards the integrated circuit board by rotating the two screws 301, so that the two clamping plates 302 fix the position of the integrated circuit board and avoid moving, pumping the glue dissolving agent in the water tank 4 into the spray pipe 403 through the hose 402 by the water pump 401, spraying the glue dissolving agent from the spray pipe 403 after the glue dissolving agent flows into the hose 402, moving the movable plate 2 along the two slide rails 101 by pushing the first electric push rod 102 by starting the first electric push rod 102 so as to adjust the position of the movable plate 2, and moving the movable plate 2 by pushing the mounting plate 501 to match with the movable plate 2 by starting the second electric push rod 5 so that the spray pipe 403 can uniformly spray the glue dissolving agent on the area of the integrated circuit board with glue, soften glue, through starter motor 6, motor 6 drives dwang 601 and rotates, make dwang 601 drive sponge cover 602 rotate, thereby make sponge cover 602 rotate and clear away the liquid on the integrated circuit board, reach the effect of clearing up glue, and promote mounting panel 501 and motor 6 through second electric push rod 5 and remove, thereby make sponge cover 602 clear away the glue liquid of arbitrary region on the integrated circuit board, the effectual efficiency of clearing away of glue that has improved, it is impaired to have avoided the integrated circuit board.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. An excessive gluey clean-up equipment of integrated circuit encapsulation, includes bottom plate (1), its characterized in that: the electric water heater is characterized in that a first electric push rod (102) is fixedly mounted at the right end of the upper end face of the bottom plate (1), a movable plate (2) is fixedly mounted at the output end of the first electric push rod (102), fixed plates (3) are fixedly mounted at the left end and the right end of the upper end face of the movable plate (2), one sides, far away from each other, of the two fixed plates (3) are respectively penetrated and movably mounted with a screw rod (301), clamping plates (302) are respectively mounted at the opposite ends of the two screw rods (301), a water tank (4) is fixedly mounted at the rear end face of the bottom plate (1), a water pump (401) is mounted on the inner bottom face of the water tank (4), a water outlet of the water pump (401) is communicated with a hose (402), the other end of the hose (402) penetrates through the upper end face of the water tank (4) and extends to the upper side of the water tank (4) and is communicated with a spray pipe (403), a second electric push rod (5) is fixedly mounted at the upper end of the front end face of the water tank (4), the output fixed mounting of second electric putter (5) has mounting panel (501), up end fixed mounting motor (6) of mounting panel (501), the output fixed mounting of motor (6) has dwang (601), the parcel can be dismantled to the lateral wall of dwang (601) front end has sponge cover (602), the equal fixed mounting in both ends has slide bar (7), two about the terminal surface before water tank (4) the equal activity of lateral wall of slide bar (7) has cup jointed slider (702), two one side that slider (702) is relative respectively with the left and right sides fixed connection of mounting panel (501).
2. The integrated circuit package flash removal apparatus of claim 1, wherein: the upper end face of the bottom plate (1) is fixedly provided with two sliding rails (101) which are distributed in the front-back direction, and the two sliding rails (101) are respectively connected with sliding grooves in the bottom of the moving plate (2) in a sliding mode.
3. The integrated circuit package flash removal apparatus of claim 1, wherein: the other end of the spray pipe (403) is fixedly arranged on the upper end face of the mounting plate (501), and the spray pipe (403) is positioned on the right side of the motor (6).
4. The integrated circuit package flash removal apparatus of claim 1, wherein: and the front end faces of the two slide bars (7) are fixedly provided with limit blocks (701).
5. The integrated circuit package flash removal apparatus of claim 1, wherein: and a plurality of nozzles are formed in the bottom of the outer side wall of the spray pipe (403) in a penetrating manner.
6. The integrated circuit package flash removal apparatus of claim 1, wherein: an operation panel (103) is fixedly mounted on the front end face of the bottom plate (1), and the operation panel (103) is electrically connected with the first electric push rod (102), the second electric push rod (5) and the motor (6) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220187153.1U CN217432372U (en) | 2022-01-24 | 2022-01-24 | Excessive glue removing equipment for integrated circuit packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220187153.1U CN217432372U (en) | 2022-01-24 | 2022-01-24 | Excessive glue removing equipment for integrated circuit packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217432372U true CN217432372U (en) | 2022-09-16 |
Family
ID=83211236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220187153.1U Expired - Fee Related CN217432372U (en) | 2022-01-24 | 2022-01-24 | Excessive glue removing equipment for integrated circuit packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217432372U (en) |
-
2022
- 2022-01-24 CN CN202220187153.1U patent/CN217432372U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220916 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |