CN216634944U

CN216634944U - Seed crystal bonding device for silicon carbide production

Info

Publication number: CN216634944U
Application number: CN202123033086.2U
Authority: CN
Inventors: 李有群; 高攀; 贺贤汉; 章磊; 周杰; 孙大方
Original assignee: Anhui Microchip Changjiang Semiconductor Materials Co ltd
Current assignee: Anhui Microchip Changjiang Semiconductor Materials Co ltd
Priority date: 2021-12-06
Filing date: 2021-12-06
Publication date: 2022-05-31
Anticipated expiration: 2031-12-06

Abstract

The utility model relates to the technical field of silicon carbide, in particular to a seed crystal bonding device for silicon carbide production, which comprises a machine body, a collecting box fixedly arranged on the inner side of the machine body, a rotary supporting mechanism, a clamping mechanism, a pressing mechanism, a gluing mechanism, a glue scraping mechanism and a scraping mechanism, wherein the rotary supporting mechanism is fixedly arranged in the collecting box, the rotary supporting mechanism and the scraping mechanism are arranged, when glue drops on the top of a wafer, an electric lifting sleeve rod is opened to drive a scraper to move up and down to a proper height so as to keep a proper distance between the scraper and the wafer, a sliding block of a screw rod sliding table is opened to drive the scraper to move, so that the glue on the top of the wafer is scraped by the scraper, the glue can be more uniformly laid on the top of the wafer, the glue is more uniformly distributed, and bubbles can be effectively prevented from being generated in the bonding process, resulting in the falling of the subsequent seed wafer, and effectively improving the bonding effect of the device.

Description

Seed crystal bonding device for silicon carbide production

Technical Field

The utility model relates to the technical field of silicon carbide production, in particular to a seed crystal bonding device for silicon carbide production.

Background

The silicon carbide is an inorganic substance, has a chemical formula of SiC, is prepared by adding raw materials such as salt and the like into quartz sand, petroleum coke and wood chips to produce green silicon carbide and smelting the green silicon carbide at high temperature by using a resistance furnace, rare minerals such as the silicon carbide also exist in nature, the moyashi, and the seed crystal is a small crystal with the same crystal orientation as the required crystal, is a seed for growing a single crystal and is also called as the seed crystal. The seed crystals with different crystal orientations are used as the seed crystals, single crystals with different crystal orientations can be obtained, and the seed crystal pieces are bonded when the silicon carbide is generated.

The adhesive device who uses at present can't be more convenient usually strickles off glue when using, and the glue unevenness can lead to the bonding in-process to produce the bubble in bonding process, leads to the bonding inhomogeneous, and long-time the use can lead to droing of seed wafer, can't be better at the in-process of pasting simultaneously guarantee the level and smooth of edge, influence the effect of bonding.

Accordingly, there is a need to devise a seed wafer bonding apparatus for silicon carbide production that addresses one or more of the problems set forth above.

SUMMERY OF THE UTILITY MODEL

In order to solve one or more problems in the prior art, the utility model provides a seed wafer bonding device for producing silicon carbide.

The technical scheme adopted by the utility model to achieve the aim is as follows: a seed crystal piece bonding device for silicon carbide production comprises a machine body, a collecting box fixedly arranged on the inner side of the machine body, a rotary supporting mechanism, a clamping mechanism, a pressing mechanism, a gluing mechanism and a leveling mechanism, wherein the rotary supporting mechanism is fixedly arranged inside the collecting box, a wafer is placed at the top of the rotary supporting mechanism, the clamping mechanism is fixedly arranged on two sides of the inner wall of the collecting box, the pressing mechanism is fixedly arranged on the top of the machine body, the bottom of the pressing mechanism is connected with the seed wafer, the gluing mechanism is arranged on two sides of the top of the machine body, the gluing mechanism is fixedly arranged on one side of the top of the collecting box, the gluing mechanism comprises a lead screw sliding table fixedly arranged on one side of the top of the collecting box, a second mounting block fixedly arranged on the top of a sliding block of the lead screw sliding table, an electric lifting sleeve rod fixedly arranged on the top of the second mounting block and a scraper plate fixedly arranged at the telescopic end of the electric lifting sleeve rod, the scraping mechanism is fixedly arranged on one side of the inner wall of the collecting box.

Preferably, the rotary supporting mechanism comprises a supporting frame, a base, an electric turntable and a supporting table, the supporting frame is fixedly installed at the bottom of the inner wall of the collecting box, the base is fixedly installed at the top of the supporting frame, the electric turntable is fixedly installed at the top of the base, and the supporting table is fixedly installed at the top of the electric turntable.

Preferably, the clamping mechanism comprises two fixing rods respectively fixedly mounted on two sides of the top of the collecting box, two first mounting blocks respectively fixedly mounted on one side of the two fixing rods, two electric push rods respectively fixedly mounted on one side of the two first mounting blocks, and two clamping plates respectively fixedly mounted at telescopic ends of the two electric push rods.

Preferably, the pushing mechanism comprises a first cylinder, a first push rod, a first connecting block, a first clamping groove, a first clamping block and a sucker, the first cylinder is fixedly mounted at the top of the machine body, the first push rod is fixedly mounted at the output end of the first cylinder, the first connecting block is fixedly mounted at the bottom of the first push rod, the first clamping groove is formed in the bottom of the first connecting block, the first clamping block is mounted on the inner side of the first clamping groove in a matched mode, and the sucker is fixedly mounted at the bottom of the first clamping block.

Preferably, rubberizing mechanism includes that two respectively fixed mounting hold the jar in organism top both sides, two cooperate respectively to install at two covers that hold tank deck portion, two respectively fixed mounting be at the second cylinder at two cover tops, two respectively fixed connection be at the second push rod of the output of two second cylinders, two respectively fixed mounting be at the piston of two second push rod bottoms, two respectively set up the play jiao kou that holds tank bottoms portion respectively, two respectively fixed mounting be at the electronic rotatory piece of two play jiao kou bottoms, two respectively fixed mounting be at the connecting pipe of two electronic rotatory piece bottoms and two respectively fixed mounting be at the play jiao zui of two connecting pipe bottoms.

Preferably, strickle mechanism and include second connecting block, second draw-in groove, second fixture block, fixed block, round pin axle, movable block, adsorb cotton piece, backup pad, gag lever post and a plurality of spacing hole of seting up respectively at the movable block top, second connecting block fixed mounting is in collecting box inner wall one side, the second draw-in groove is seted up in second connecting block one side, the cooperation of second fixture block is installed at the second draw-in groove inboardly, fixed block fixed mounting is in second fixture block one side, round pin axle fixed connection is in fixed block one side, the movable block is articulated with the fixed block through the round pin axle, adsorb cotton piece fixed mounting in movable block one side, backup pad fixed mounting is in second fixture block top one side, gag lever post fixed mounting is in the backup pad bottom.

The utility model has the beneficial effects that:

one is as follows: by arranging the glue scraping mechanism and the strickling mechanism, when glue drops on the top of a wafer, the electric lifting sleeve rod is opened to drive the scraper to move up and down to a proper height so as to keep a proper distance between the scraper and the wafer, the screw rod sliding table is opened to drive the sliding block of the screw rod sliding table to drive the scraper to move so as to ensure that the scraper scrapes the glue on the top of the wafer, the glue can be more uniformly laid on the top of the wafer, the distribution of the glue is more uniform, bubbles generated in the bonding process can be effectively prevented to cause the falling of subsequent seed wafers, the bonding effect of the device is effectively improved, the fixed block is pushed to drive the second clamping block to be clamped and connected with the second clamping groove, so that the fixed block is fixedly arranged on one side of the inner wall of the collecting box, the movable block is pulled to drive the pin shaft to rotate, and the adsorption cotton block is contacted with the edge of the wafer, insert spacing downthehole portion with the gag lever post, carry out spacing fixed to the movable block, the position according to equidimension not the wafer of movable block that can be more convenient is adjusted, ensure that the edge of movable block and wafer is laminated, after the bonding is accomplished, open electric turntable and make electric turntable drive a supporting bench rotate, thereby it rotates to drive the wafer, thereby make the wafer edge rub in absorption cotton piece one side, the glue that spills over cleans the absorption, conflict of movable block and wafer simultaneously, can be more convenient scrape flat between wafer and the seed crystal piece, make alignment that can be better between the two, the adhesive effect has been promoted greatly.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic structural view of a spreading mechanism of the present invention;

FIG. 3 is a schematic structural view of a strickle mechanism of the present invention;

fig. 4 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.

Description of reference numerals: 1. a body; 2. a collection box; 3. a rotation support mechanism; 31. a support frame; 32. a base; 33. an electric turntable; 34. a support table; 4. a wafer; 5. a clamping mechanism; 51. fixing the rod; 52. a first mounting block; 53. an electric push rod; 54. a splint; 6. a pressing mechanism; 61. a first cylinder; 62. a first push rod; 63. a first connection block; 64. a first card slot; 65. a first clamping block; 66. a suction cup; 7. a seed wafer; 8. a gluing mechanism; 81. a holding tank; 82. a can lid; 83. a second cylinder; 84. a second push rod; 85. a piston; 86. a glue outlet; 87. an electric rotating block; 88. a connecting pipe; 89. a glue outlet; 9. a glue scraping mechanism; 91. a screw rod sliding table; 92. a second mounting block; 93. an electric lifting loop bar; 94. a squeegee; 10. a strickling mechanism; 101. a second connecting block; 102. a second card slot; 103. a second fixture block; 104. a fixed block; 105. a pin shaft; 106. a movable block; 107. adsorbing the cotton blocks; 108. a support plate; 109. a limiting rod; 1010. and a limiting hole.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

As shown in figures 1 to 4, the utility model provides a seed crystal wafer bonding device for producing silicon carbide, which comprises a machine body 1 and a collecting box 2 fixedly arranged on the inner side of the machine body 1, and further comprises a rotary supporting mechanism 3, a clamping mechanism 5, a pressing mechanism 6, a gluing mechanism 8, a glue scraping mechanism 9 and a leveling mechanism 10, wherein the rotary supporting mechanism 3 is fixedly arranged in the collecting box 2, a wafer 4 is placed at the top of the rotary supporting mechanism 3, the clamping mechanism 5 is fixedly arranged on two sides of the inner wall of the collecting box 2, the pressing mechanism 6 is fixedly arranged on the top of the machine body 1, the bottom of the pressing mechanism 6 is connected with a seed wafer 7, the gluing mechanism 8 is arranged on two sides of the top of the machine body 1, the glue scraping mechanism 9 is fixedly arranged on one side of the top of the collecting box 2, the glue scraping mechanism 9 comprises a screw rod sliding table 91 fixedly arranged on one side of the top of the collecting box 2, and a second mounting block 92 fixedly arranged on the top of the sliding block of the screw rod sliding table 91, An electric lifting loop bar 93 fixedly arranged on the top of the second mounting block 92 and a scraping plate 94 fixedly arranged at the telescopic end of the electric lifting loop bar 93, wherein the scraping mechanism 10 is fixedly arranged on one side of the inner wall of the collecting box 2.

The above-described specific embodiment: when glue drips at wafer 4 top, open electric lift loop bar 93 and make electric lift loop bar 93 drive scraper blade 94 and reciprocate to suitable height, make and keep suitable interval between scraper blade 94 and the wafer 4, open lead screw slip table 91 again and make the sliding block of lead screw slip table 91 drive scraper blade 94 and remove, make scraper blade 94 strike off the glue at wafer 4 top, make the glue can be more even lay at the top of wafer 4, the more even of distribution of glue, can effectually prevent at bonding in-process gassing, lead to droing of follow-up seed wafer 7, the effectual bonding effect who has promoted the device.

Specifically, rotatory supporting mechanism 3 includes support frame 31, base 32, electric turntable 33 and brace table 34, support frame 31 fixed mounting is in 2 inner wall bottoms of collecting box, base 32 fixed mounting is at support frame 31 top, electric turntable 33 fixed mounting is at base 32 top, brace table 34 fixed mounting is at electric turntable 33 top, through being provided with support frame 31, base 32, electric turntable 33 and brace table 34, can be more convenient carry out fixed stay to wafer 4, and can drive wafer 4 and rotate, can be more convenient after the bonding scrape flat the processing to the edge of wafer 4, it is more convenient to use.

Specifically, fixture 5 includes two dead levers 51 of fixed mounting in collecting box 2 top both sides respectively, two first installation pieces 52 of fixed mounting in two dead lever 51 one sides respectively, two electric putter 53 of fixed mounting in two first installation pieces 52 one sides respectively and two splint 54 of fixed mounting in the flexible end of two electric putter 53 respectively, through being provided with dead lever 51, first installation piece 52, electric putter 53 and splint 54, it is stable to carry out the centre gripping to wafer 4 at the adhesive in-process that can be better, prevent that the pressure is too big in the bonding process, lead to the skew of wafer 4 position, influence the effect of bonding.

Specifically, the pushing-down mechanism 6 comprises a first cylinder 61, a first push rod 62, a first connecting block 63, a first clamping groove 64, a first clamping block 65 and a suction disc 66, the first cylinder 61 is fixedly installed at the top of the machine body 1, the first push rod 62 is fixedly installed at the output end of the first cylinder 61, the first connecting block 63 is fixedly installed at the bottom of the first push rod 62, the first clamping groove 64 is formed in the bottom of the first connecting block 63, the first clamping block 65 is installed on the inner side of the first clamping groove 64 in a matched mode, the suction disc 66 is fixedly installed at the bottom of the first clamping block 65, through the arrangement of the first cylinder 61, the first push rod 62, the first connecting block 63, the first clamping groove 64, the first clamping block 65 and the suction disc 66, the seed crystal plate 7 can be taken and pushed down more conveniently, the seed crystal plate 7 can be better protected by the arrangement of the suction disc 66, and damage to the seed crystal plate 7 caused in the sticking process is avoided.

Specifically, the glue applying mechanism 8 includes two holding tanks 81 respectively fixedly mounted on two sides of the top of the machine body 1, two tank covers 82 respectively mounted on the top of the two holding tanks 81 in a matching manner, two second cylinders 83 respectively fixedly mounted on the top of the two tank covers 82, two second push rods 84 respectively fixedly connected to the output ends of the two second cylinders 83, two pistons 85 respectively fixedly mounted at the bottoms of the two second push rods 84, two glue outlets 86 respectively formed at the bottoms of the two holding tanks 81, two electric rotating blocks 87 respectively fixedly mounted at the bottoms of the two glue outlets 86, two connecting pipes 88 respectively fixedly mounted at the bottoms of the two electric rotating blocks 87, and two glue outlets 89 respectively fixedly mounted at the bottoms of the two connecting pipes 88, and the glue applying mechanism is formed by arranging the holding tanks 81, the tank covers 82, the second cylinders 83, the second push rods 84, the pistons 85, and the glue outlets 86, Electric rotating block 87, connecting pipe 88 and play jiao zui 89, can be more convenient carry out the ejection of compact to glue, make the automatic quantitative drippage that glue can be more in the position of needs, electric rotating block 87 drives connecting pipe 88 and play jiao zui 89 simultaneously and carries out rotary motion, and the position of glue zui 89 is gone out in better regulation, ensures that glue can effectually drip at wafer 4 top.

Specifically, the strickle mechanism 10 includes a second connecting block 101, a second clamping groove 102, a second clamping block 103, a fixed block 104, a pin 105, a movable block 106, an adsorption cotton block 107, a supporting plate 108, a limiting rod 109 and a plurality of limiting holes 1010 respectively formed at the top of the movable block 106, the second connecting block 101 is fixedly installed at one side of the inner wall of the collecting box 2, the second clamping groove 102 is formed at one side of the second connecting block 101, the second clamping block 103 is installed at the inner side of the second clamping groove 102 in a matching manner, the fixed block 104 is fixedly installed at one side of the second clamping block 103, the pin 105 is fixedly connected at one side of the fixed block 104, the movable block 106 is hinged with the fixed block 104 through the pin 105, the adsorption cotton block 107 is fixedly installed at one side of the movable block 106, the supporting plate 108 is fixedly installed at one side of the top of the second clamping block 103, the limiting rod 109 is fixedly installed at the bottom of the supporting plate 108, and the second connecting block 101, the second clamping groove 102, the second clamping block 103, the fixed block 103, the pin is fixedly installed at one side of the inner wall of the collecting box 2, Fixed block 104, round pin axle 105, movable block 106, adsorb cotton piece 107, backup pad 108, gag lever post 109 and spacing hole 1010, can be more convenient adjust the position of movable block 106 according to the wafer 4 of equidimension not, ensure that movable block 106 laminates with the edge of wafer 4, after the bonding is accomplished, open electric turntable 33 and make electric turntable 33 drive brace table 34 rotate, thereby it rotates to drive wafer 4, thereby make wafer 4 edge rub in adsorbing cotton piece 107 one side, wipe the absorption to the glue that spills over, simultaneously movable block 106 and wafer 4's conflict, can be more convenient scrape between wafer 4 and the seed crystal piece 7 flat, make alignment that can be better between the two, the adhesive effect has been promoted greatly.

In summary, the present invention includes: firstly, an external power supply is switched on, the wafer 4 is fixed on the top of the supporting platform 34, then the electric push rod 53 is opened to enable the electric push rod 53 to drive the clamping plate 54 to move inwards until the clamping plate 54 is contacted with the two sides of the wafer 4 to clamp and fix the wafer 4, then the second air cylinder 83 is opened to enable the second air cylinder 83 to drive the second push rod 84 to extend downwards, thereby driving the piston 85 to move downwards on the inner side of the containing tank 81, enabling the glue to drip out of the inner side of the glue outlet nozzle 89 through the connecting pipe 88, completing gluing, then the electric lifting loop rod 93 is opened to enable the electric lifting loop rod 93 to drive the scraper 94 to move upwards and downwards to a proper height, enabling the scraper 94 and the wafer 4 to keep a proper distance, then the sliding block 91 of the screw rod sliding block 91 is opened to enable the scraper 94 to move, enabling the scraper 94 to scrape the glue on the top of the wafer 4, enabling the glue to be more uniformly laid on the top of the wafer 4, then, the electric rotating block 87 is opened to make the electric rotating block 87 drive the connecting pipe 88 to rotate to the other side, the first cylinder 61 is opened to make the first cylinder 61 drive the first push rod 62 to move downwards, thereby driving the suction cup 66 and the seed crystal 7 to move downwards, then the fixing block 104 is pushed to make the fixing block 104 drive the second clamping block 103 to be clamped and connected with the second clamping groove 102, thereby making the fixing block 104 fixedly mounted on one side of the inner wall of the collection box 2, then the movable block 106 is pulled to make the movable block 106 drive the pin shaft 105 to rotate, so that the adsorption cotton block 107 is contacted with the edge of the wafer 4, the limiting rod 109 is inserted into the limiting hole 1010 to limit and fix the movable block 106, finally, the electric rotating disc 33 is opened to make the electric rotating disc 33 drive the supporting table 34 to rotate, thereby driving the wafer 4 to rotate, thereby making the edge of the wafer 4 rub on one side of the adsorption cotton block 107, wiping and adsorbing the overflowing glue, the model of the electric turntable 33 is: DG60-5, the model of electric putter 53 is: YS-NZ100-12A, the model number of the first cylinder 61 is as follows: TJC-C1-T3-P-P, the model number of the second cylinder 83 is as follows: TJC-C1-T3-P-P, the model of the electric rotating block 87 is as follows: y200RA60, the model of lead screw slip table 91 is: PKH40, the model of electric lift loop bar 93 is: XYDA 24-800.

The above-described embodiments are merely illustrative of one or more embodiments of the present invention, and the description is specific and detailed, but not restrictive of the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a seed crystal bonding device that carborundum produced usefulness, includes organism (1) and fixed mounting in the inboard collecting box (2) of organism (1), its characterized in that: still include rotary supporting mechanism (3), fixture (5), push down mechanism (6), rubberizing mechanism (8), scrape gluey mechanism (9) and strike-off mechanism (10), rotary supporting mechanism (3) fixed mounting is inside collecting box (2), wafer (4) have been placed at rotary supporting mechanism (3) top, fixture (5) fixed mounting is in collecting box (2) inner wall both sides, push down mechanism (6) fixed mounting at organism (1) top, push down mechanism (6) bottom and be connected with seed wafer (7), rubberizing mechanism (8) set up in organism (1) top both sides, scrape gluey mechanism (9) fixed mounting in collecting box (2) top one side, scrape gluey mechanism (9) including fixed mounting in sliding table (91) of collecting box (2) top one side, second installation piece (92) at the sliding block top of lead screw (91) of fixed mounting at lead screw (91), lead screw (9), The scraping mechanism comprises an electric lifting loop bar (93) fixedly mounted at the top of the second mounting block (92) and a scraping plate (94) fixedly mounted at the telescopic end of the electric lifting loop bar (93), and the scraping mechanism (10) is fixedly mounted on one side of the inner wall of the collecting box (2).

2. A seed-wafer bonding apparatus for silicon carbide production as set forth in claim 1, wherein: the rotary supporting mechanism (3) comprises a supporting frame (31), a base (32), an electric turntable (33) and a supporting table (34), the supporting frame (31) is fixedly installed at the bottom of the inner wall of the collecting box (2), the base (32) is fixedly installed at the top of the supporting frame (31), the electric turntable (33) is fixedly installed at the top of the base (32), and the supporting table (34) is fixedly installed at the top of the electric turntable (33).

3. A seed-wafer bonding apparatus for silicon carbide production as set forth in claim 1, wherein: the clamping mechanism (5) comprises two fixing rods (51) fixedly mounted on two sides of the top of the collecting box (2) respectively, two first mounting blocks (52) fixedly mounted on one sides of the two fixing rods (51) respectively, two electric push rods (53) fixedly mounted on one sides of the two first mounting blocks (52) respectively and two clamping plates (54) fixedly mounted at telescopic ends of the two electric push rods (53) respectively.

4. A seed-wafer bonding apparatus for silicon carbide production as set forth in claim 1, wherein: push down mechanism (6) and include first cylinder (61), first push rod (62), first connecting block (63), first draw-in groove (64), first fixture block (65) and sucking disc (66), first cylinder (61) fixed mounting is at organism (1) top, first push rod (62) fixed mounting is at the output of first cylinder (61), first connecting block (63) fixed mounting is in the bottom of first push rod (62), first draw-in groove (64) are seted up in first connecting block (63) bottom, first fixture block (65) cooperation is installed in first draw-in groove (64) inboard, sucking disc (66) fixed mounting is in first fixture block (65) bottom.

5. A seed-wafer bonding apparatus for silicon carbide production as set forth in claim 1, wherein: the gluing mechanism (8) comprises two containing tanks (81) which are respectively and fixedly arranged at the two sides of the top of the machine body (1), two tank covers (82) which are respectively and cooperatively arranged at the tops of the two containing tanks (81), two second cylinders (83) which are respectively and fixedly arranged at the tops of the two tank covers (82), and two second push rods (84) which are respectively and fixedly connected with the output ends of the two second cylinders (83), two pistons (85) which are respectively and fixedly installed at the bottoms of the two second push rods (84), two glue outlets (86) which are respectively arranged at the bottoms of the two containing tanks (81), two electric rotating blocks (87) which are respectively and fixedly installed at the bottoms of the two glue outlets (86), two connecting pipes (88) which are respectively and fixedly installed at the bottoms of the two electric rotating blocks (87) and two glue outlets (89) which are respectively and fixedly installed at the bottoms of the two connecting pipes (88).

6. A seed-wafer bonding apparatus for silicon carbide production as set forth in claim 1, wherein: the strickle mechanism (10) comprises a second connecting block (101), a second clamping groove (102), a second clamping block (103), a fixed block (104), a pin shaft (105), a movable block (106), an adsorption cotton block (107), a support plate (108), a limiting rod (109) and a plurality of limiting holes (1010) which are respectively arranged at the top of the movable block (106), the second connecting block (101) is fixedly arranged at one side of the inner wall of the collecting box (2), the second clamping groove (102) is arranged at one side of the second connecting block (101), the second clamping block (103) is arranged at the inner side of the second clamping groove (102) in a matching way, the fixed block (104) is fixedly arranged at one side of the second clamping block (103), the pin shaft (105) is fixedly connected at one side of the fixed block (104), the movable block (106) is hinged with the fixed block (104) through the pin shaft (105), the adsorption cotton block (107) is fixedly arranged at one side of the movable block (106), the supporting plate (108) is fixedly installed on one side of the top of the second clamping block (103), and the limiting rod (109) is fixedly installed at the bottom of the supporting plate (108).