JP2001194416A - Apparatus for inspecting semiconductor chip and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for inspecting semiconductor chips, which can input and output electrical signals at a high speed and generates no wiring delay. SOLUTION: This apparatus 1 for inspecting semiconductor chips has pins 12 and 13 for contacting. One end of the pin 13 for contacting is connected to a driver 22. The other end of the pin 13 for contacting can butt against the first part of a lead pin 103 separated by a fixed distance from a semiconductor chip 105. One end of the pin 12 for contacting is connected to a comparator 23. The other end of the pin 12 for contacting can butt against the second part of the lead pin 103 separated by a nearly equal distance to the fixed distance from the semiconductor chip 105.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inspecting a semiconductor chip and a semiconductor device, and more particularly to an apparatus for inspecting a semiconductor chip for inputting / outputting information through lead terminals and a semiconductor device using the semiconductor chip. is there.

[0002]

2. Description of the Related Art In recent years, with an increase in demand for semiconductor devices,
The production volume of semiconductor devices is expanding. This semiconductor device has a chip for processing an electric signal and a lead terminal for inputting and outputting data to and from the chip.

When a semiconductor device is manufactured, an inspection is performed to determine whether the chip operates normally. FIG. 13 is a top view of a conventional semiconductor chip inspection apparatus. Referring to FIG. 13, a conventional semiconductor chip inspection device 110 has a frame 111 and contact pins 114. A plurality of contact pins 114 are attached to the frame 111.

[0004] A semiconductor device 100 is mounted in a frame 111. The semiconductor device 100 includes a mold member 101.
, Lead terminals 102 and 103, semiconductor chip 1
05. The semiconductor chip 105 is the mold member 1
01. A plurality of electrodes not shown in FIG. 13 are formed on the surface of the semiconductor chip 105. Each of the electrodes is electrically connected to each of the lead terminals 102 and 103. The lead terminals 102 are formed to extend in the same direction. The lead terminals 103 are formed to extend in the same direction. The direction in which the lead terminal 102 extends and the direction in which the lead terminal 103 extends are substantially orthogonal. Each of the lead terminals 102 and 103 is electrically connected to a contact pin 114.

FIG. 14 is a diagram showing a cross section and an inspection circuit taken along line XIV-XIV in FIG. FIG.
With reference to FIG.
, A chip 105, an electrode 106, a bonding wire 107, and a lead terminal 103. Chip 10
On the surface of 5, a plurality of electrodes 106 are formed. The electrode 106 is connected to the lead terminal 1 by a bonding wire 107.
03 is electrically connected. The lead terminal 103 is in direct contact with the contact pin 114. This contact pin 1
14 is electrically connected to the inspection circuit 120 by a lead 125.

The test circuit 120 includes a tester control unit 121
And a driver 122 electrically connected to the tester control unit 121, a comparator 123 electrically connected to the tester control unit 121, and a connection wiring 124 electrically connected to the driver 122 and the comparator 123. .

Next, the operation of the above-described semiconductor chip inspection apparatus will be described. When testing the semiconductor chip 105, first, the tester control unit 121 supplies an electric signal to the driver 122. The driver 122 is the tester control unit 1
In response to the electric signal from 21, an electric signal for inspection is issued. This electric signal is either a signal whose potential is higher than a predetermined value or a signal whose potential is lower than the predetermined value.
This electric signal is transmitted to the semiconductor chip 105 in the semiconductor device 100 via the connection wiring 124, the lead 125, and the contact pin 114. In response to the electric signal, the semiconductor chip 105 outputs an electric signal. This electric signal is also a signal having a higher potential than a predetermined value or a signal having a lower potential than the predetermined value. This electric signal is the contact pin 1
14, the signal is transmitted to the comparator 123 via the lead 125 and the connection wiring 124. The comparator 123 determines whether or not the electric signal sent from the semiconductor chip 105 has a predicted potential. The result is transmitted to the tester control unit 121. When the information that the electric signal received by the comparator 123 is the predicted value is transmitted to the tester control unit 121, the tester control unit 121 determines that the semiconductor chip 105 has no defect. When the information that the electric signal received by the comparator 123 is not a predicted value is transmitted to the tester control unit 121, the tester control unit 121 determines that the semiconductor chip 105 is defective.

FIG. 15 is a cross-sectional view of another conventional semiconductor chip inspection apparatus. Referring to FIG. 15, a semiconductor chip inspection apparatus 131 includes a frame 141 and a contact pin 14.
And 2. The contact pins 142 are fixed to the frame 141, respectively.

In the frame 141, a semiconductor device 200 having ball-shaped terminals is positioned. This semiconductor device 200 has a mold member 201 and a terminal 202. A semiconductor chip is provided in the mold member 201, and this semiconductor chip is
2 are electrically connected. The terminal 202 is electrically connected to the contact terminal 142. This contact pin 14
2 are electrically connected to the connection wiring 124 shown in FIG. Such a semiconductor chip inspection apparatus 13
Even in the case of 1, the semiconductor chip is inspected by the same method as the semiconductor chip inspection apparatus 110 shown in FIGS.

[0010]

In recent years, with the increase in the efficiency of semiconductor chip inspection, the speed of input and output of electric signals has been increased even in the semiconductor chip inspection process. That is, the time from inputting one signal into the semiconductor chip to inputting the next electric signal into the semiconductor chip is greatly reduced. Therefore, one electric signal may be input to the semiconductor chip, and the next electric signal may be output from the driver before the comparator receives the electric signal output from the semiconductor chip corresponding to the electric signal. In this case, the semiconductor chip 1
The electrical signal output from the receiver 05 and received by the comparator 123 and the electrical signal output from the driver 122 and received by the semiconductor chip 105 collide on the connection wiring 124. As a result, there is a problem that accurate information cannot be input to the semiconductor chip 105 and an electric signal output from the semiconductor chip 105 cannot be accurately read.

Conventionally, JP-A-11-67399 and JP-A-2-27676 disclose an apparatus for inspecting a semiconductor chip in which two contact pins contact one lead terminal to input and output data. ing. However, in these devices, a portion where one contact pin contacts the lead terminal and a portion where another contact pin contacts the lead terminal are located at different distances from the semiconductor chip. Therefore, a signal delay occurs in input and output of the electric signal. When this signal delay occurs, the input and output of the electric signal are not performed within a predetermined time, and there is a problem that the tester control unit cannot read the signal accurately.

In view of the above, the present invention has been made to solve the above-described problems, and prevents collision between an electric signal input to a semiconductor chip and an electric signal output from the semiconductor chip, and It is an object of the present invention to provide a semiconductor chip inspection device and a semiconductor device that do not cause a signal delay.

[0013]

An apparatus for inspecting a semiconductor chip according to one aspect of the present invention is an apparatus for inspecting a semiconductor chip connected to a terminal for inputting / outputting data. And a second contact member. One end of the first contact member is connected to a driver that generates an electric signal for inspection. The other end of the first contact member can abut on the first portion of the terminal which is separated from the semiconductor chip by a certain distance. One end of the second contact member is
It is connected to a comparator that receives an electric signal output from the semiconductor chip in response to the electric signal given from the driver. The other end of the second contact member can contact the second portion of the terminal which is separated from the semiconductor chip by a distance substantially equal to a predetermined distance.

In the semiconductor chip inspection device thus configured, the first contact member is connected to the driver and the terminal. Further, the second contact member is connected to the comparator and the terminal. Therefore, when an electric signal is output from the semiconductor chip, the electric signal is transmitted to the first contact member and the second contact member via the terminal. The electric signal transmitted to the second contact member reaches the comparator. The electric signal transmitted to the first contact member is transmitted to the driver.
At this time, the driver outputs an electric signal having a signal strength greater than the signal output from the semiconductor chip.
Here, a large signal strength means that a deviation from a predetermined value is large. Thus, even if the electric signal output from the driver and the electric signal output from the semiconductor device collide with each other on the first contact member, the signal intensity of the electric signal output from the driver is large, so that the output from the driver is large. The electric signal output is not affected by the electric signal output from the semiconductor device. As a result, accurate information can be given to the semiconductor device even when the electric signal collides, and the electric signal output from the semiconductor device can be accurately read.

Further, the first portion of the terminal contacted by the first contact member and the second portion of the terminal contacted by the second contact member are separated from the semiconductor chip by substantially the same distance. ing. Therefore, accurate input or output of an electric signal can be performed without causing a signal delay when an electric signal is input to or output from the semiconductor chip.

[0016] Preferably, the first contact member and the second contact member are provided separately from each other. The terminal has a ball shape, and the first and second contact members contact the ball-shaped terminal.

A device for inspecting a semiconductor chip according to another aspect of the present invention is a device for inspecting a semiconductor chip connected to a terminal for inputting / outputting data, the device comprising: a first contact member; 2 contact members. One end of the first contact member is connected to a driver that generates an electric signal for inspection. The other end of the first contact member is electrically connected to a terminal portion separated from the semiconductor chip by a predetermined distance via a conductive member. One end of the second contact member is connected to a comparator that receives an electric signal output from the semiconductor chip in response to an electric signal given from the driver. The other end of the second contact member is electrically connected via a conductive member to a terminal portion separated from the semiconductor chip by a distance substantially equal to a predetermined distance.

In the semiconductor chip inspection apparatus thus configured, the first contact member is connected to the driver and to the terminal via the conductive member. In addition, the second contact member is connected to the comparator, and is connected to the terminal via the conductive member. Therefore, when an electric signal is output from the semiconductor chip, the electric signal is transmitted to the first contact member and the second contact member via the terminal and the conductive member. The electric signal transmitted to the second contact member reaches the comparator. The electric signal transmitted to the first contact member is transmitted to the driver. At this time, the driver outputs an electric signal having a signal strength greater than the signal output from the semiconductor chip. Thus, even if the electric signal output from the driver and the electric signal output from the semiconductor device collide with each other on the first contact member, the signal intensity of the electric signal output from the driver is large, so that the output from the driver is large. The electric signal output is not affected by the electric signal output from the semiconductor device. As a result, accurate information can be given to the semiconductor device even when the electric signal collides, and the electric signal output from the semiconductor device can be accurately read.

The other end of the first contact member is electrically connected to the terminal via the conductive member, and the other end of the second contact member is electrically connected to the terminal via the conductive member. Each of the terminals is separated from the semiconductor chip by substantially the same distance. Therefore, accurate input or output of an electric signal can be performed without causing a signal delay when an electric signal is input to or output from the semiconductor chip.

A semiconductor device according to the present invention includes a semiconductor chip, a first lead terminal, and a second lead terminal. The semiconductor chip includes a first electrode for data input / output. The first lead terminal extends while being electrically connected to the first electrode. The second lead terminal is electrically connected to the first electrode, and extends in the same direction as the first lead terminal at a certain interval in the width direction.

In the semiconductor device configured as described above, a first lead terminal and a second lead terminal are electrically connected to the first electrode of the semiconductor device. for that reason,
If the first lead terminal is connected to the driver of the semiconductor chip inspection device and the second lead terminal is connected to the comparator, the electric signal output from the semiconductor chip is applied to the first lead terminal and the second lead terminal. Convey. The electric signal transmitted to the second lead terminal reaches the comparator. The electric signal transmitted to the first lead terminal is transmitted to the driver. At this time, the driver outputs an electric signal having a signal strength greater than the signal output from the semiconductor chip. Even if the electric signal is output from the driver and collides with the signal output from the semiconductor device on the first lead terminal, the signal strength of the electric signal output from the driver is large, so that the signal is not affected by the collision. Correct electrical signals are provided to the semiconductor chip. As a result, in such a semiconductor device, an accurate electric signal is given without being affected by data collision at the time of inspection, and the inspection can be performed reliably.

Preferably, the semiconductor chip further includes a second electrode different from the first electrode. The semiconductor device further includes a third lead terminal electrically connected to the second electrode. The sum of the distance between the first lead terminal and the second lead terminal, the width of the first lead terminal, and the width of the second lead terminal is substantially equal to the width of the third lead terminal.

In this case, the width of the third lead terminal and the width of the first
Since the width of the second lead terminal and the distance between them are substantially equal to each other, the first terminal and the second terminal may be in contact with the same pin as the inspection pin that contacts the third lead terminal. it can. As a result, the semiconductor device can be inspected without providing a new contact pin.

[0024]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a diagram showing a semiconductor chip inspection apparatus according to Embodiment 1 of the present invention. With reference to FIG. 1, a semiconductor chip inspection apparatus 1 includes a socket unit 10 and an inspection circuit 20 electrically connected to the socket unit 10. The socket portion 10 includes a frame 11, a contact pin 13 as a first contact member, a contact pin 12 as a second contact member, and a contact pin 14. Each of the contact pins 12 to 14 is a frame 1
Fixed to 1. The contact pins 12 and 13 are provided separately from each other.

The semiconductor device 100 is positioned within the frame 11. The semiconductor device 100 has a mold member 101, lead terminals 102 and 103, and a semiconductor chip 105. FIG.
Although not shown, a plurality of electrodes are provided, and each electrode is electrically connected to each of lead terminals 102 and 103. The lead terminals 102 are formed so as to extend in the same direction. Lead terminal 10
Reference numeral 3 extends in a direction substantially perpendicular to the direction in which the lead terminals 102 extend. The lead terminal 102 is electrically connected to each of the contact pins 14. Each of the lead terminals 103 is electrically connected to each of the contact pins 12 and 13. Two contact pins 12 and 13 are in contact with one lead terminal 103.

The test circuit 20 includes a tester control unit 21 and
A driver 22 for generating an electric signal for inspection, and a comparator 23 for receiving an electric signal output from the semiconductor chip
And connection wirings 24 and 25. The tester control unit 21 is electrically connected to the driver 22. The tester control unit 21 is electrically connected to the comparator 23. The connection wiring 24 is connected to the driver 22 and the lead 26. The lead 26 is connected to the contact pin 13. Therefore, one end of the contact pin 13 is
2 and the other end of the contact pin 13 is a lead terminal 1
03 is connected.

The connection wiring 25 is connected to the comparator 23. The connection wiring 25 is also connected to the contact pin 12 via the lead 27. Therefore, one end of the contact pin 12 is connected to the comparator 23, and the other end is connected to the lead terminal 103.

The distance between the portion where the contact pin 13 contacts the lead terminal 103 and the semiconductor chip 105 is substantially equal to the distance between the portion where the contact pin 12 contacts the lead terminal 103 and the semiconductor chip 105. .

FIG. 2 is a view showing a cross section taken along line II-II in FIG. Referring to FIG. 2, semiconductor device 1
00 is placed on the frame 11. Semiconductor device 10
0 mold member 101 is in contact with frame 11. The mold member 101 surrounds the semiconductor chip 105. Electrodes 106 for inputting and outputting data are provided on the surface of the semiconductor chip 105. The electrode 106 is electrically connected to the lead terminal 103 by a bonding wire 107. The lead terminal 103 is the frame 11
Contact with. The contact pins 13 are in contact with the lead terminals 103. The contact pins 13 pass through the inside of the frame 11 and are electrically connected to the leads 26.

Next, the operation of the semiconductor chip inspection apparatus shown in FIGS. 1 and 2 will be described. FIG. 3 to FIG.
FIG. 4 is a diagram for explaining the operation of the semiconductor chip inspection device indicated by. Referring to FIG. 3, first, when inspecting a semiconductor chip, lead terminals 102 and 103 of semiconductor device 100 are brought into contact with contact pins 12, 13 and 14. Next, the tester control unit 21 sends an electric signal to the driver 22. In response to this electric signal, driver 22 applies, for example, a voltage (3.0 V) higher than a predetermined value (2.0 V).
Is output in the direction indicated by the arrow 22a. Connection wiring 2
The signal sent to 4 is transmitted to the semiconductor chip 105 in the semiconductor device 100 via the lead 26 and the contact pin 13.

Referring to FIG. 4, chip 105 to which the electric signal has been input applies a signal having a voltage (1.8 V) lower than a predetermined value (2.0 V) to lead terminal 103 in the direction indicated by arrow 105a. This is applied to the lead terminal 103.

Referring to FIG. 5, a signal applied to lead terminal 103 is transmitted to contact pins 12 and 13, and transmitted to connection wirings 24 and 25 via leads 26 and 27, respectively. The tester control unit 21 sends a signal to the driver 22. Upon receiving this signal, driver 22 applies a voltage (3.0 V) higher than a predetermined value (2.0 V), for example.
Is sent in the direction indicated by the arrow 22b.

Referring to FIG. 6, the signal transmitted to connection wiring 25 is transmitted in the direction indicated by arrow 105a and read by comparator 23. The comparator 23 determines whether the voltage of this signal is a predetermined value. The result of the determination is sent to the tester control unit 21. Based on the result, the tester control unit 21 determines whether the semiconductor chip 105 has a defect. Further, a signal moving in the direction indicated by arrow 22b in FIG. 5 and a signal moving in the direction indicated by arrow 105a collide on the connection wiring 24. However, since the signal moving in the direction indicated by arrow 22b has a greater signal strength than the signal moving in the direction indicated by arrow 105a, the signal moving in the direction indicated by arrow 22b is affected by the signal moving in the direction indicated by arrow 105a. I do not receive. As a result, driver 2
The signal output from 2 is connected to the arrow 22b via the lead 26.
The connection wiring 13 and the lead terminal 1
03 to the semiconductor chip 105. Thus, the input and output of the electric signal are performed.

In the semiconductor chip inspection apparatus thus configured, first, as shown in FIGS. 3 to 6, the electric signal output from the semiconductor chip 105 is supplied to the comparator 23.
, The electric signal output from the driver 22 can be input to the semiconductor chip 105 without being affected by the electric signal output from the semiconductor chip 105.
As a result, the time from when the driver 22 inputs one electric signal to the semiconductor chip to when the driver 22 inputs the next electric signal to the semiconductor chip 105 can be shortened. As a result, high-speed inspection is possible, and erroneous operations at the time of inspection are reduced.

The contact pins 13 and the lead terminals 103
And the distance between the semiconductor chip 105 and the portion where the contact pins 12 contact the lead terminals 103 is substantially equal to the distance between the semiconductor chip 105 and the driver 2.
2 until the electric signal is transmitted to the semiconductor chip 105 is substantially equal to the time until the electric signal output from the semiconductor chip 105 is transmitted to the comparator 23. As a result, a signal delay can be prevented, and accurate reading of an electric signal in the comparator 23 becomes possible.

Further, according to the present invention, the driver 22
Since the circuit from the terminal to the lead terminal 103 and the circuit from the comparator 23 to the lead terminal 103 are separate, accurate calibration (correction of the electric signal) can be performed.

(Second Embodiment) FIG. 7 is a sectional view of a semiconductor chip inspection apparatus according to a second embodiment of the present invention. Referring to FIG. 7, a semiconductor chip inspection apparatus 31 according to a second embodiment of the present invention
And a contact pin 43 as a second contact member. The contact pins 42 and 43 are fixed to the frame 41, respectively.

The semiconductor device 200 includes a mold member 201.
And a semiconductor chip provided in the mold member, and a ball-shaped terminal 202 connected to the semiconductor chip.

One end of the contact pin 43 is electrically connected to the driver 22 shown in FIG. The other end of the contact pin 42 is in contact with the ball-shaped terminal 202. One end of the contact pin 42 is electrically connected to the comparator 23 shown in FIG. The other end of the contact pin 42 is in contact with the ball-shaped terminal 202. The distance between the portion where the contact pin 42 contacts the terminal 202 and the semiconductor chip is substantially equal to the distance between the portion where the contact pin 43 contacts the terminal 202 and the semiconductor chip.

In the semiconductor chip inspection apparatus 31 thus configured, the contact pins 42 and 43 for contacting the ball-shaped terminals 202 are connected to the comparator 23 and the driver 22, respectively.
The same effects as those of the semiconductor chip inspection apparatus 1 indicated by the symbol are obtained.

(Embodiment 3) FIG. 8 is a cross-sectional view of a semiconductor chip inspection apparatus according to Embodiment 3 of the present invention. Referring to FIG. 8, a semiconductor chip inspection apparatus 61 according to a third embodiment of the present invention includes a frame 71, a moving member 72, a spring 73, and contact pins 82 and 83.
And a conduction member 84. The semiconductor device 100 is mounted on the frame 71. One ends of two springs 73 are fixed on the frame 71. The other end of the spring 73 is fixed to the moving member 72. Frame 71
Contact pin 8 as a first contact member so as to penetrate through
2 and a contact pin 83 as a second contact member are fixed. One end of the contact pin 82 is electrically connected to the driver 22 shown in FIG. The other end of the contact pin 82 is connected to the lead terminal 103 of the semiconductor device 100 via the conductive member 84. One end of the contact pin 83 is shown in FIG.
Are electrically connected to the comparator 23 indicated by. The other end of the contact pin 83 is connected to the semiconductor device 1 via a conductive member 84.
00 is electrically connected to the lead terminal 103. The distance from the portion where the contact pin 82 contacts the lead terminal 103 via the conducting member 84 to the semiconductor chip 105, and the distance from the portion where the contact pin 83 contacts the lead terminal 103 via the conducting member 84 to the semiconductor chip 105 Is equal to the distance of The conductive member 84 has a “T” shape, one end of which contacts the contact pins 82 and 83, and the other end of which contacts the lead terminal 103.

FIG. 9 is a diagram for explaining the operation of the moving member 72 shown in FIG. Referring to FIG.
When a force is applied to the spring 2 from the direction indicated by the arrow 72a, the spring 73
Shrinks. Thereby, the moving member 72 moves downward. The conductive member 84 moves in a direction away from the lead terminal 103. Thus, the conductive member 84 is connected to the lead terminal 1.
The semiconductor device 100 mounted on the frame 71 can be moved by setting the semiconductor device 100 apart from the semiconductor device 03.

The semiconductor chip inspection device 61 thus configured has the same effects as the semiconductor chip inspection device 1 shown in FIG.

(Fourth Embodiment) FIG. 10 is a top view of a semiconductor device according to a fourth embodiment of the present invention. FIG.
With reference to, the semiconductor device 80 has a mold member 81 and lead terminals 82 to 87. The semiconductor chip is sealed in the mold member 81. The semiconductor chip is electrically connected to each of the lead terminals 82 to 87.

The lead terminals 82 to 84 are formed to extend at a distance from each other in the same direction.
The lead terminals 85 to 87 are formed to extend in the same direction at a distance from each other. The direction in which the lead terminals 82 to 84 extend is substantially orthogonal to the direction in which the lead terminals 85 to 87 extend.

FIG. 11 is a perspective view of a portion surrounded by a dotted line XI in FIG. Referring to FIG. 11, mold member 81
The semiconductor chip 88 is positioned therein. The semiconductor chip 88 has a plurality of electrodes 89 for inputting and outputting electric signals (data). One electrode (second electrode)
Reference numeral 89 is electrically connected to a lead terminal 85 as a third lead terminal by a bonding wire 90.
Another electrode (first electrode) 89 is a bonding wire 91
And 92 are electrically connected to a lead terminal 87 as a first lead terminal and a lead terminal 86 as a second lead terminal, respectively. The width of lead terminal 85 is substantially equal to the sum of the width of lead terminals 86 and 87 and the width between lead terminals 86 and 87.

FIG. 12 is a diagram showing an apparatus for inspecting the semiconductor device shown in FIGS. When testing the semiconductor device shown in FIG. 10, a device for testing a semiconductor chip having a frame 11 and contact pins 12, 13 and 14 is prepared. This frame 11 is similar to the frame 11 shown in FIG. Also, contact pins 12 to 14
Are the same as the contact pins 12 to 14 shown in FIG. The contact pin 12 is electrically connected to the lead terminal 86 and the comparator 23 shown in FIG. Contact pin 1
3 is electrically connected to the lead terminal 87 and the driver 22 shown in FIG. Contact pin 14 is electrically connected to lead terminals 82 and 85.

The contact pins 12 and 13 are connected to relatively narrow lead terminals 86 and 87, and the contact pins 14 are relatively wide lead terminals 82 and 83.
Is electrically connected to When inspecting semiconductor device 80, input and output of electric signals are performed according to the same steps as those shown in FIGS.

In the semiconductor device 80 thus configured, the circuit for data input and the circuit for data output are divided up to the vicinity of the electrode 89 of the semiconductor chip 88.
That is, an electric signal input to the semiconductor chip 88 of the semiconductor device is output from the driver, and the electric signal is input to the electrode 89 via the connection wiring 24, the contact pin 13, the lead terminal 87, and the bonding wire 92. . An electric signal output from the semiconductor chip 88 is transmitted to the comparator 23 via the bonding wire 91, the lead terminal 86, and the connection wiring 25. That is, the lead terminal 8
6 and 87 and bonding wires 91 and 92 also
Since the path is divided into two paths, signal collision is less likely to occur. As a result, even when a high-speed inspection is performed, an accurate inspection can be performed without signal collision.

The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[0052]

According to the invention described in claims 1 to 4,
It is possible to provide a semiconductor chip inspection apparatus that prevents a collision between an electric signal input to a semiconductor chip and an electric signal output from the semiconductor chip and does not cause signal delay.

According to the fifth and sixth aspects of the present invention,
It is possible to provide a semiconductor device which prevents a collision between an electric signal input to a semiconductor chip and an electric signal output from the semiconductor chip and does not cause signal delay.

[Brief description of the drawings]

FIG. 1 is a diagram showing a semiconductor chip inspection device according to a first embodiment of the present invention.

FIG. 2 is a view showing a cross section viewed along the line II-II in FIG. 1;

FIG. 3 is a view for explaining a first operation of the semiconductor chip inspection apparatus shown in FIG. 1;

FIG. 4 is a diagram for explaining a second operation of the semiconductor chip inspection device shown in FIG. 1;

FIG. 5 is a diagram for explaining a third operation of the semiconductor chip inspection device shown in FIG. 1;

FIG. 6 is a view for explaining a fourth operation of the semiconductor chip inspection device shown in FIG. 1;

FIG. 7 is a sectional view of an apparatus for inspecting a semiconductor chip according to a second embodiment of the present invention;

FIG. 8 is a sectional view of a semiconductor chip inspection device according to a third embodiment of the present invention.

FIG. 9 is a view for explaining the operation of the moving member shown in FIG. 8;

FIG. 10 is a top view of a semiconductor device according to a fourth embodiment of the present invention.

11 is a perspective view of a portion surrounded by a dotted line XI in FIG.

FIG. 12 is a view showing an apparatus for inspecting the semiconductor device shown in FIGS. 10 and 11;

FIG. 13 is a top view of a conventional semiconductor chip inspection apparatus.

14 is a diagram showing a cross section and an inspection circuit as viewed along the line XIV-XIV in FIG.

FIG. 15 is a cross-sectional view of another conventional semiconductor chip inspection apparatus.

[Explanation of symbols]

1,31,61 Semiconductor chip inspection equipment, 12,1
3, 42, 43, 82, 83 Contact pins, 22 drivers, 23 comparators, 80 semiconductor devices, 85,
86, 87 Lead terminals.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G003 AA07 AG01 AG15 2G011 AA02 AA15 AC11 AC31 AD01 AE02 AF02 2G032 AA00 AB01 AF01 AF06 AK01 AK11 AL00 5E024 CA07 CA18 CB03 CB04 9A001 KK54 LL05

Claims (6)

[Claims] 1. A device for inspecting a semiconductor chip connected to a terminal for inputting / outputting data, wherein one end is connected to a driver for generating an electric signal for inspection, and a predetermined distance from the semiconductor chip. A first contact member, the other end of which can contact the first portion of the terminal separated by only one end, and one end of which is connected to a comparator that receives an electric signal output from the semiconductor chip in response to the electric signal given from the driver. A semiconductor chip inspection device, comprising: a second contact member connected to the second portion of the terminal, the second end of which is in contact with the second portion of the terminal at a distance substantially equal to the predetermined distance from the semiconductor chip. 2. The semiconductor chip inspection device according to claim 1, wherein the first contact member and the second contact member are provided separately from each other. 3. The first and second terminals are ball-shaped.
3. The semiconductor chip inspection device according to claim 1, wherein said contact member contacts a ball-shaped terminal. 4. An apparatus for inspecting a semiconductor chip connected to a terminal for inputting / outputting data, one end of which is connected to a driver for generating an electric signal for inspection, and a predetermined distance from the semiconductor chip. A first contact member, the other end of which is electrically connected to a portion of the terminal via a conductive member, and a comparator that receives an electric signal output from the semiconductor chip in response to an electric signal given from the driver; A semiconductor chip inspection, comprising: a second contact member connected at one end to a terminal portion separated from the semiconductor chip by substantially the same distance as the predetermined distance, the other end being electrically connected via a conductive member. Equipment. 5. A semiconductor chip including a first electrode for data input / output, a first lead terminal that is electrically connected to the first electrode and extends, and an electrical connection to the first electrode. And a second lead terminal connected to the first lead terminal and extending in the same direction at a fixed interval in the width direction. 6. The semiconductor chip further includes a second electrode different from the first electrode, and further includes a third lead terminal electrically connected to the second electrode. The sum of the distance between the first lead terminal and the second lead terminal, the width of the first lead terminal, and the width of the second lead terminal is substantially equal to the width of the third lead terminal. ,
The semiconductor device according to claim 5.