JP2001194384A - Contact pin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact pin requiring no bending work of a contact part. SOLUTION: A pin body part 4 to be electrically connected to a probe substrate side and a contact part 6 extending from the tip of the pin body part 4 in a different direction at a specified angle to electrically make contact with the terminal part of a product are integrally formed by electroforming.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin and a composite contact pin fixed to a probe base and electrically connected to a terminal of a product to be inspected.

[0002]

2. Description of the Related Art Conventionally, a probe board having a plurality of contact pins has been used for testing semiconductor products such as ICs, LSIs, LCDs, and PDPs. Interposed between them. Such a probe base has a base main body attached to the inspection device side, a plurality of contact pins are provided at intervals on the base main body, and the contact portions of the plurality of contact pins correspond to a product to be inspected. Electrical contact with the terminal portion.

[0003]

Heretofore, such contact pins have been formed of tungsten because sufficient strength and wear resistance are required. On the other hand, with the recent high-density mounting of semiconductor products, the number of terminal portions of the semiconductor products tends to increase, whereby the pitch interval between the contact pins of the probe board also tends to decrease. As one method for responding to such a reduction in pitch, it is conceivable to reduce the wire diameter of a contact pin. However, if the wire diameter of a conventional contact pin is simply reduced, sufficient rigidity cannot be secured, and Cause poor electrical contact. In general, the surface of the terminal of a product is covered with an oxide film, so that when the contact part of the contact pin is brought into contact with the terminal of the product, a load is applied to the tip of the contact pin, and the tip of the contact is The oxide film on the surface is peeled off, but if the rigidity is insufficient,
When a load is applied, the contact pins themselves are bent and the oxide film on the surface cannot be peeled off, resulting in poor electrical contact of the contact pins.

In order to solve the insufficient rigidity of the contact pins, it is only necessary to increase the wire diameter. However, when the wire diameter is increased, the number of contact pins that can be fixed to one probe board is reduced. For this reason, in order to cope with recent high-density mounting, a plurality of probe substrates are required, and when there are many probe substrates, 4 to 5 substrates are required, which complicates the structure and significantly increases the manufacturing cost. In order to solve such a problem, it has been proposed to form the contact pins by electroforming, that is, so-called electroforming. When formed by electroforming, it is possible to manufacture a relatively thin and highly rigid material, which can correspond to a smaller pitch of the contact pins. However, the contact portion is bent at a predetermined angle with respect to the pin body. Is difficult. Also, when the pitch of the contact pins becomes smaller,
It is difficult to fix a plurality of contact pins to the probe base with a predetermined positional relationship, and the operation becomes very complicated.

An object of the present invention is to provide a contact pin which does not require a contact portion to be bent. Another object of the present invention is to provide a contact pin capable of easily fixing a plurality of contact pin portions to a probe base while maintaining a predetermined positional relationship. Still another object of the present invention is to provide a composite contact pin capable of easily fixing a plurality of conductive contact pins and a plurality of ground contact pins to a probe base while maintaining a predetermined positional relationship. is there.

[0006]

According to the present invention, there is provided a pin body electrically connected to a probe base, and a pin body extending in a different direction from a tip end of the pin body at a specific angle to a terminal of a product. The contact pin, which is formed integrally with the contact portion to be electrically contacted by electroforming. According to the present invention, since the contact portion is integrally formed by electroforming so as to extend in different directions from the pin main portion, it is necessary to bend the contact portion with respect to the pin main portion in a later step. Thus, a highly accurate contact pin having a desired shape can be formed relatively easily.

In the present invention, the thickness of the pin body and the contact formed by electroforming is 20 to 300 μm. According to the present invention, since the thickness of the pin body and the contact portion is 20 to 300 μm, sufficient rigidity as a contact pin can be secured. Further, in the present invention, a concave portion is provided in a connection portion between the pin body portion and the contact portion, and the contact portion is elastically pressed against a terminal portion of the product by elastic deformation of the concave portion. .

According to the present invention, since the concave portion is provided in the connecting portion between the pin body and the contact portion, the thickness of the concave portion is thin, so that a certain amount of elastic deformation is possible in the concave portion. The contact portion can be elastically pressed against the terminal portion of the product by utilizing the elastic deformation of the concave portion. Further, the present invention has a pin main body electrically connected to the probe base side and a contact part electrically connected to a terminal of the product, wherein at least a part of the pin main body has an insulating property. It is a contact pin characterized by being covered with a covering layer.

According to the present invention, at least a part of the pin main body is covered with the insulating coating layer, so that electrical insulation of the adjacent pin main body can be maintained. Also,
The present invention is characterized in that a metal layer is further provided on the surface of the insulating coating layer. According to the present invention, since the surface of the insulating coating layer that covers at least a part of the pin main body is further covered with the metal layer, the pin main body can be electromagnetically shielded, and when the product is inspected. Accurate inspection can be performed while suppressing generation of noise.

Further, according to the present invention, a pin body electrically connected to the probe base and a contact portion electrically connected to a terminal of a product are integrally formed by electroforming. This contact pin is characterized in that the electroless plating layer is crystallized after the body portion and the contact portion are subjected to electroless plating. According to the present invention, the electroless plating layer formed on the surface after the pin body and the contact are formed by electroforming is crystallized, so that the contact pin has a hard surface and wear resistance. It will be excellent.

Further, the present invention includes a plurality of contact pin portions each having a tip portion corresponding to a terminal portion of a product, and a connecting portion for connecting the contact pin portions. The contact pin is characterized in that the connection part is formed integrally by electroforming. According to the present invention, since the plurality of contact pin portions and the connection portion are integrally formed by electroforming, the plurality of contact pin portions can be formed simultaneously while maintaining a predetermined positional relationship. Further, since the plurality of contact pin portions are connected via the connection portions, handling thereof is facilitated, and when fixing to the probe substrate, it can be easily fixed while maintaining a predetermined positional relationship.

In the present invention, the plurality of contact pin portions are held by a holding member. According to the present invention, since the plurality of contact pin portions are held by the holding member, the plurality of contact pin portions can be reliably held in a predetermined positional relationship, and the contact pin portions can be easily attached to the probe base while maintaining such a state. Can be fixed. Further, in the present invention, the connection portion is removed after the plurality of contact pin portions are electrically connected to corresponding terminal portions of the probe board.

According to the present invention, the connection portion for connecting the plurality of contact pin portions is removed after each contact pin portion is electrically connected to the corresponding terminal portion using, for example, solder. Before being mounted on the probe, the plurality of contact pin portions are handled as one component, so that the handling is easy and the fixing work to the probe base is also easy. The present invention also provides a plurality of conductive contact pin portions having a tip corresponding to the conductive terminal portion of the product, a plurality of ground contact pin portions having a tip corresponding to the ground terminal portion of the product, A plurality of conductive contact pin portions and a connection portion for connecting the plurality of ground contact pin portions, wherein the plurality of conductive contact pin portions, the plurality of ground contact pin portions, and the connection portion are integrated by electroforming. It is a composite contact pin characterized by being formed in a uniform manner.

According to the present invention, the plurality of conductive contact pins, the plurality of ground contact pins, and the connection are integrally formed by electroforming. The ground contact pin portions can be formed simultaneously while maintaining a predetermined positional relationship. Further, since the plurality of conductive contact pin portions and the plurality of ground contact pin portions are connected via the connection portion, their handling is facilitated, and a predetermined positional relationship is maintained even when fixing to the probe base. It can be fixed easily.

Further, the present invention is characterized in that the plurality of conductive contact pins and the plurality of ground contact pins are held by a holding member. According to the present invention, the plurality of conductive contact pins and the plurality of ground contact pins can be reliably held in a predetermined positional relationship by the holding member, and the conductive contact pins are maintained while maintaining such a state. And the ground contact pin can be easily fixed to the probe base.

Further, in the present invention, the connecting portion electrically connects the plurality of conductive contact pins to corresponding conductive terminals of the probe base and connects the plurality of ground contact pins to the probe base. Is removed after being electrically connected to the corresponding ground terminal. According to the present invention, the connecting portion connecting the plurality of conductive contact pin portions and the plurality of ground contact pin portions is formed by connecting each conductive contact pin portion and each ground contact pin portion to a corresponding terminal portion using, for example, solder. Since it is removed after being electrically connected, the plurality of conductive contact pins and the plurality of ground contact pins are handled as one part before being attached to the probe board, and the handling is easy and the probe board is easily connected to the probe board. Can be easily fixed.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the accompanying drawings, embodiments of a contact pin and a composite contact pin according to the present invention will be described below. First embodiment of contact pin
State Figure 1 is a front view showing a first embodiment of a contact pin according to the present invention, FIG. 2 is a front view showing a use state of the contact pin of Fig. 1, Fig. 3 (a) ~ (f )
FIG. 2 is a simplified diagram for explaining a method of manufacturing the contact pin of FIG.

Referring to FIGS. 1 and 2, the illustrated contact pin 2 has a pin body 4 extending linearly and a contact 6 extending from the tip of the pin body 4, which will be described later. In this way, they are integrally formed by electroforming, so-called electroforming. As shown in FIG. 2, the angle α between the pin body 4 and the contact part 6 is such that the tip end face of the contact part 6 is
0, a specific angle that reliably contacts the surface, for example 95-11
It is set to about 0 degrees. Although it can be formed by bending to the above-mentioned specific angle, it is formed integrally by electroforming so as to have the form shown in FIG. 1, in other words, in the width direction of the contact pin 2 (in FIG. Direction) to form the metal by electroforming so that the metal adheres
The specific angle can be formed relatively easily and with high precision.

A probe board (not shown) is attached to an inspection device (not shown) for inspecting the semiconductor product 8, and the pin body 4 of the contact pin 2 corresponds to the probe board. The terminal portion (not shown) is electrically connected and fixed by, for example, solder, and the tip portion extends from the probe base as shown in FIG. At the time of inspection, the semiconductor product 8 to be inspected is held in a predetermined positional relationship with respect to the probe board.
Of the corresponding terminal portion 10 of the semiconductor product 8
Is pressed against. At this time, a predetermined load of, for example, about 5 to 10 g is applied to the distal end of the contact pin 2, and the distal end of the contact portion 6 is somewhat elastically deformed by the applied load to act to scratch the surface of the terminal portion 10. The oxide film on the surface of the terminal portion 10 of the semiconductor product 8 is peeled off by the scratching action, and the contact portion 6 of the contact pin 2 is elastically pressed against the terminal portion 10 to make electrical contact therewith.

Such a contact pin 2 is formed as shown in FIG. First, as shown in FIG. 3A, a photoresist layer 14 is formed substantially uniformly on the surface of the metal substrate 12 (photoresist layer forming step). Next, as shown in FIG. 3B, the surface of the formed photoresist layer 14 is covered with a photomask 16 for exposure, and then the unexposed portion of the photoresist is removed (exposure and development step). A pattern opening 18 having a shape corresponding to the contact pin 2 to be formed, that is, a shape as shown in FIG. 1 is formed in the photomask 16. Therefore, after the exposure and development process is performed, the pattern opening 18 is formed as shown in FIG. As shown, the photoresist in the region corresponding to the side surface shape of the contact pin 2 is removed. This removal can be performed, for example, with alcohol or the like.

Next, as shown in FIG. 3D, contact pins 2 are formed by electroforming on the surface of the metal substrate 12 from which the photoresist has been removed (electroforming step). At this time, nickel, a nickel alloy, or the like can be used as the metal material, and thus, the contact pin 2 made of nickel, a nickel alloy, or the like is formed. Thereafter, as shown in FIG. 3E, the photoresist layer 14 remaining on the metal substrate 12 (the unexposed portion of the photoresist layer 14) is removed by dissolving with a solvent such as acetone (photoresist removing step). . Then, as shown in FIG. 3F, the contact pins 2 formed on the surface of the metal substrate 12 are peeled from the surface (peeling step). In order to facilitate the separation of the contact pins 2 from the metal substrate 12, the surface of the metal substrate 12 may be treated with a release agent before forming the photoresist layer 14.

In this manner, the contact pin 2 as shown in FIG. 1, that is, the pin body 4 and the contact 6 formed at a specific angle is formed, and the contact 6 is bent. Thus, the contact pins 2 with high precision can be formed. In the contact pin 2 thus formed, the thickness in the width direction (the thickness in the direction perpendicular to the paper surface in FIG. 1) of the pin body 4 and the contact 6 is preferably formed to be 20 to 300 μm. Desirably, by setting the thickness as described above, the contact pin 2 itself can have sufficient rigidity, and the pin main body 4 is largely bent even when a load is applied to the tip of the contact pin 2 during inspection. The oxide film on the surface of the terminal portion 10 (FIG. 2) can be reliably removed by the contact portion 6.

When the contact pins 2 are formed by electroforming such that a metal is applied in the width direction, the thickness of the contact pins in the vertical direction can be freely controlled as described later to form a desired shape. In the case where the contact portion is formed by bending the tip of the contact pin, if the thickness in the vertical direction is increased, the contact cannot be bent. Also in this connection,
In order to increase the rigidity of the contact pins themselves, the thickness in the width direction must be increased, and if the thickness in the width direction is increased in this way, there is a new problem that the pitch of the contact pins cannot be reduced. Occurs. On the other hand, when formed as described above, the contact pins 2 do not need to be bent, so that the thickness in the vertical direction can be increased, and thus sufficient rigidity can be obtained even if the thickness in the width direction is reduced. And the pitch of the contact pins can be reduced.

When the contact pins 2 are formed by electroforming as described above, the contact pins 2 may be subjected to an electroless plating process using nickel, for example, and then the electroless plating layer may be crystallized. For example, contact pins made of nickel, nickel alloy,
Although the hardness and rigidity are lower than those formed from conventional tungsten, the treatment can increase the hardness and rigidity of the contact pin 2 itself. The crystallization treatment of the electroless plating layer can be performed, for example, by placing it in a heating furnace (not shown) maintained at a temperature of 400 to 450 ° C. for a predetermined time and heating.

In order to make the electrical contact of the contact pin 2 to the semiconductor product 8 more reliably, a connection portion 24 (see FIGS. 1 and 2) between the pin main body portion 4 and the contact portion 6, for example, an inner corner portion is provided. A concave portion may be formed. By forming the concave portion in this manner, the thickness is reduced, and when a load is applied to the tip of the contact pin 2, elastic deformation is facilitated, so that the surface of the terminal portion 10 is further scratched and the contact portion 6 Of the contact portion 6 is elastically pressed against the surface of the terminal portion 10, so that the distal end surface of the contact portion 6 can be reliably electrically connected to the terminal portion 10. In addition, this concave portion can be formed in an appropriate shape such as a semicircular shape or a trapezoidal shape.

When the contact pins are formed by electroforming as described above, the side surfaces of the contact pins can be formed in any appropriate shape.
Alternatively, it can be formed as shown in FIG. In the modification shown in FIG. 4, the vertical thickness (thickness) of the pin body 4 of the contact pin 2A is formed relatively thin, and the contact 6 is formed in a tapered shape tapering toward the tip. I have. In another modification shown in FIG. 5, the thickness of the contact pin 2B in the vertical direction of the pin body 4 is formed relatively thick, and the rigidity of the pin body 4 is increased. The tip end of the pin body 4 is tapered on the inside (lower side in FIG. 5) toward the contact portion 6 so that the thickness is gradually reduced, thereby being formed to be elastically deformable. Further, the contact part 6 is formed in a tapered shape toward the tip. In this manner, the thickness and shape of the pin body 4 of the contact pin 2A (2B) in the vertical direction can be arbitrarily formed, so that the pin body 4 important when contacting the terminal 10 of the semiconductor product 8 can be formed. The rigidity can be set to a required size.

To prevent the semiconductor product 8 from slipping with the terminal portion 10 and to increase the contact area, FIG.
Can be configured as shown in FIG. Referring to FIG.
In this modification, the contact portion 6 of the contact pin 2C is
Are provided with a large number of irregularities on the tip end surface 6a (the contact surface with the terminal portion 10). When the unevenness is provided in this manner, the terminal surface 1
The contact resistance with zero increases, and slip during contact can be prevented. In addition, the unevenness of the tip end surface 6 a
The oxide coating on the zero surface is peeled off, whereby the contact area with the terminal portion 10 can be increased. The irregularities on the tip end surface 6a of the contact portion 6 can be formed, for example, by performing electrical discharge machining or sand blasting, or require electroforming processing conditions (electroforming conditions) when forming the contact pins 2. It can be formed by setting as follows.

Second Embodiment of Contact Pin FIG. 7 is a sectional view showing a second embodiment of the contact pin according to the present invention. Referring to FIG. 7, the illustrated contact pin 52 has a pin body 54 extending linearly and a contact 56 extending from the tip of the pin body 54, which are the same as in the first embodiment. And formed integrally by electroforming. In the second embodiment, almost the entire area of the pin main body 54 is covered with an insulating coating 58, and the surface of the insulating coating 58 is further provided with a metal layer 60. The insulating coating layer 58 is formed of, for example, a synthetic resin. By providing the insulating coating layer 58 in this manner, the adjacent contact pins 5
Electrical insulation between the two can be reliably maintained. The metal layer 60 is formed of, for example, iron, phosphor bronze, or the like. By providing the metal layer 60 in this way, the pin body 54 of the contact pin 52 can be magnetically shielded.

In the above-described embodiment, the insulating cover layer 58 and the metal layer 60 extend over substantially the entire length of the pin body 54.
The desired effect can be achieved by providing the layers 58 and 60 in at least a part thereof, that is, at a necessary portion. When the electromagnetic shield is not particularly required, the metal layer 60 can be omitted. First Embodiment of Composite Contact Pin FIG. 8 is a plan view showing a main part of a first embodiment of a composite contact pin according to the present invention. Referring to FIG. 8, the illustrated composite contact pin 102 includes a plurality (four in FIG. 8) of conductive contact pin portions 104 (functioning as contact pins) and a plurality (three in FIG. 8). Ground contact pin portion 106 (which functions as a ground pin) and a connecting portion 108 for connecting the bases of the conductive contact pin portion 104 and the ground contact pin portion 106.
And the conductive contact pin portions 104 and the ground contact pin portions 106 are alternately arranged. The composite contact pin 102 in the form shown in FIG. 8 is integrally formed in the form shown in FIG. 8 by the same electroforming as in the first embodiment, and thus, a plurality of conductive contact pin portions 104 are formed. In addition, the plurality of ground contact pins 106 can be simultaneously formed with high precision.

When the composite contact pins 102 are formed as shown in FIG. 8, as will be easily understood, each conductive contact pin portion 104 and each ground contact pin portion 10
The tip of 6 is bent downward in a direction perpendicular to the plane of FIG. 8, for example, so as to have a shape as shown in FIG. Therefore, each conductive contact pin portion 104 is composed of a pin body portion extending linearly from the connection portion 108 and a bent contact portion, and the pin body portion is connected to the conductive terminal portion of the probe board (not shown) by, for example, soldering. It is fixedly connected, and its contact portion is electrically contacted with a conductive terminal portion of a semiconductor product (not shown) at the time of inspection. Each of the ground contact pins 106 also includes a pin body extending linearly from the connection 108 and a bent contact. The pin body is connected to the ground terminal of the probe board (not shown) by, for example, soldering. It is fixedly connected, and its contact part is electrically contacted with a ground terminal part of a semiconductor product (not shown) at the time of inspection. Since each conductive contact portion 104 and each ground contact portion 106 are electrically connected in this manner, each conductive contact portion 1
The pin body portion of 04 corresponds to the conductive terminal portion of the probe board, the contact portion is formed so as to correspond to the conductive terminal portion of the semiconductor product to be inspected, and the pin body portion of each ground contact section 106 is formed of the probe board. The contact portion is formed so as to correspond to the ground terminal portion of the semiconductor product to be inspected. In the case where it is not necessary to remove the oxide coating present on the surface of the terminal portion of the semiconductor product at the time of inspection, the tip portions of the conductive contact pin portion 104 and the ground contact pin portion 106 can be used without being bent as described above. In such a case, in the form shown in FIG. 8, the base of the conductive contact pin 104 is electrically fixedly connected to the conductive terminal of the probe base, and the base of the ground contact pin 106 is electrically fixed to the ground terminal of the probe base. Connected.

In this embodiment, the width t of each ground contact portion 106 is formed smaller than the width T of the conductive contact portion 104. Thus, the ground contact portion 10
6, the contact pin portion 104 per unit length and the ground contact pin portion 10 are reduced.
6 can be increased, and the mounting density on the probe board can be increased. This composite contact pin 1
02, a plurality of conductive contact pin portions 104 and a plurality of ground contact pin portions 106 are integrally formed via a connection portion 108, so that these can be handled as one, and the handling is conventionally performed. It is easier than Also, when handling, the conductive contact pin portion 104 and the ground contact pin portion 106
Is held in a predetermined positional relationship, for example, when electrically connected to the conductive terminal portion and the ground terminal portion of the probe board by, for example, solder, it can be easily performed,
The work can be remarkably simple and easy as compared with a case where these are fixed by solder one by one. As will be described later, the connection portion 108 is removed by cutting or the like after the conductive contact portion 104 is connected to the conductive terminal portion of the probe board and the ground contact portion 106 is connected to the ground terminal portion.

In the illustrated embodiment, the conductive contact pin portions 104 and the ground contact pin portions 106 are alternately arranged. However, it is not always necessary to arrange them in this manner. These can be appropriately arranged corresponding to the arrangement of the ground terminal portion. In the embodiment shown in FIG. 8, the tip of each conductive contact portion 104 and each ground contact portion 106 is formed in a parabolic shape, and the tip is sharpened, and the oxide film of the conductive terminal portion and the ground terminal portion of the semiconductor product is formed. Are easily peeled off, but their leading ends, especially the wide conductive contact portions 104, may be formed as shown in FIG. 9 or FIG. If the width of the ground contact portion 106 is large,
6 can be similarly formed.

In the modification shown in FIG. 9, as shown in FIG. 9 (a), the tip of the conductive contact portion 104A is tapered. Then, as shown in FIG. 9 (b), the stepped portion 111 is bent and bent so that the contact portion 1
14 are formed. Even with such a configuration, since the tip of the contact portion 114 becomes thin, the oxide film on the surface of the terminal portion can be easily removed.

In the modification shown in FIG. 10, a small rectangular slit 1 is formed at the center of the tip of the conductive contact portion 104B.
16 are formed, and the leading end thereof is branched into two by the slit 116 to be thin. The thinning also facilitates peeling of the oxide film as described above. In this modification, the slit 1
The contact portion at which the tip 16 is formed is bent in the same manner as described above to form a contact portion.

Second Embodiment of Composite Contact Pin FIG. 11 is a plan view showing a main part of a second embodiment of the composite contact pin according to the present invention. Referring to FIG.
The illustrated composite contact pin 152 includes a plurality (four in FIG. 11) of conductive contact pins 154, a plurality (three in FIG. 11) of ground contact pins 156, and these conductive contact pins 154. And connecting part 15 for connecting the base of ground contact pin part 156
8, the conductive contact pin portions 154 and the ground contact pin portions 156 are alternately arranged, and the basic configuration is substantially the same as that of the first embodiment shown in FIG.

In the composite contact pin according to the second embodiment, the pitch between the conductive terminal and the ground terminal on the semiconductor product side is different from the pitch between the conductive terminal and the ground terminal on the probe board side. Is smaller than the pitch on the probe substrate side. That is, in the composite contact pin 152, the pitch of the contact portions of the conductive contact pin portion 154 and the ground contact pin portion 156 is small, and the pitch of the base portion (the portion connected to the connection portion 158) of the pin body is large. Have been. In connection with this, in the ground contact portion 156, the width of the base portion of the pin main body portion is small, and the ground contact portion 156 is formed to have substantially the same narrow width from the pin main body portion to the contact portion. On the other hand, in the conductive contact portion 154, the width of the base of the pin body is large, and the width is gradually reduced from the base of the pin body to the tip thereof.

In the composite contact pin of the second embodiment, the same effect as that of the composite contact pin of the first embodiment is achieved, and even if the pitch between the conductive terminal portion and the ground terminal portion of the semiconductor product is small. Can respond. In the second embodiment, as in the composite ground pin 102 of the first embodiment, the connecting portion 1
58 is cut and removed, for example, after the conductive contact portion 154 and the ground contact portion 156 are fixedly connected to the conductive terminal portion and the ground terminal portion of the probe board.

Third Embodiment of Composite Contact Pin FIGS. 12 and 13 schematically show a third embodiment of a composite contact pin according to the present invention, and FIG. 14 shows a composite contact pin of the third embodiment. 1 schematically shows the manner of attachment to the probe base. 12 and 13, the illustrated composite contact pin 202 includes a plurality of conductive contact pin portions 204, a plurality of ground contact pin portions 206, and these conductive contact pin portions 204.
And a connecting portion 208 for connecting the base of the ground contact pin portion 206 to the conductive contact pin portion 20.
4 and the ground contact pin portions 206 are alternately arranged, and the basic configuration is substantially the same as that of the first embodiment shown in FIG.

In the third embodiment, the composite contact pins 202 are integrally formed on the surface of the metal substrate 210 by the same electroforming as in the first embodiment, as shown in FIG. The plurality of conductive contact pin portions 204 and the plurality of ground contact pin portions 206 can be simultaneously formed with high precision. After forming the composite contact pin 202 in this manner, the plurality of conductive contact pin portions 204 and the plurality of ground contact pin portions 206 are held by the holding member 212, and are formed by electroforming after being held. The composite contact pin 202 is peeled from the metal substrate 210. Therefore, in the peeled state, as shown in FIG. 13, the base side of the plurality of conductive contact pin portions 204 and the plurality of ground contact pin portions 206 is connected to the connection portion 208.
And their distal ends are held by holding members 21.
2, the conductive contact pin portion 204 and the ground contact pin portion 206 can be securely held in a predetermined positional relationship, and the handling of the composite contact pin 202 is further facilitated.

The holding member 212 is made of an insulating synthetic resin adhesive, a synthetic resin adhesive film, or the like, and fixedly holds, for example, a portion of about 2 to 30 mm from the ends of the conductive contact pin 204 and the ground contact pin 206. . The holding member 212 is connected to the conductive contact pin portion 204 and the ground contact pin portion 206 as described later.
When the holding member 212 is detachably attached to the probe base 214 by attaching the conductive contact pin part 204 and the ground contact pin part 206 to the probe base 214, these contact pin parts 204, 206 may be detached.

The composite contact pin 202 is attached to the probe base 214, for example, as shown in FIG. At a substantially central portion of the probe base 214, for example, a square opening 216 is formed.
16, a semiconductor product 218 to be inspected is positioned;
The composite contact pin 202 is attached to each side edge of the opening 216. That is, in a state where the conductive contact pin portions 204 are connected by the connecting portion 208 and held by the holding member 212,
For example, each of the ground contact pins 206 is fixedly connected to its corresponding ground terminal (not shown) by, for example, solder. When four composite contact pins 202 are attached, the state shown in FIG.
The tips of the conductive contact pin portion 204 and the ground contact pin portion 206 are connected to the opening 216 of the probe base 214.
The tips of the composite contact pin portion 204 and the ground contact pin portion 206 can be electrically connected to the conductive terminal portion and the ground terminal portion (both not shown) of the semiconductor product 218 to be inspected.

After being attached in this manner, in each composite contact pin 202, as shown by a broken line 220 in FIG. 14, the bases of the conductive contact pin portion 204 and the ground contact pin portion 206 are cut, for example, to remove the connection portion 208. . By doing so, when attaching the composite contact pin 202, the conductive contact pin portion 2
04 and the ground contact pin portion 206 are connected to the connection portion 208.
And the contact pin portions 204 and 206 held by the holding member 212 and corresponding terminal portions (not shown).
Can be easily and easily fixedly connected. Also,
In each of the contact pin portions 204 and 206, a portion between the portion connected by the connection portion 208 and the portion held by the holding member 212 is fixedly connected to the corresponding terminal portion by, for example, solder. In this case, the pitch shift and the deformation of the contact pin portions 204 and 206 are significantly suppressed.

The embodiments of the contact pin and the composite contact pin according to the present invention have been described above.
The present invention is not limited to these embodiments, and various changes and modifications can be made without departing from the scope of the present invention. For example, the illustrated composite contact pin 102
In (152, 202), the conductive contact pin portion 104
(154, 204) and the ground contact pin 106
(156, 206) to the connection unit 108 (158, 208).
For example, in a contact pin having a plurality of conductive contact pin portions (a contact pin in which a ground contact pin portion is omitted in a composite contact pin), these conductive contact pin portions are connected to each other by a connecting portion (this connecting portion is , As described above, which is removed after being attached to the probe board). Further, in such a contact pin, the leading end side of the contact pin portion may be held by a holding member as necessary.

[0044]

According to the contact pin of the first aspect of the present invention, it is not necessary to bend the contact portion with respect to the pin body portion, and a highly accurate contact pin having a desired shape can be formed relatively easily. be able to. According to the contact pin of the second aspect of the present invention, sufficient rigidity as the contact pin can be secured.

According to the third aspect of the present invention, the contact portion is elastically pressed against the terminal portion of the product by utilizing the elastic deformation of the concave portion of the connecting portion between the pin body and the contact portion. be able to. Also, claim 4 of the present invention
According to the contact pin described above, it is possible to maintain electrical insulation between adjacent pin main portions. Further, according to the contact pin of the fifth aspect of the present invention, the pin body can be electromagnetically shielded to suppress the generation of noise. According to the contact pin of the sixth aspect of the present invention, the hardness and the wear resistance can be improved.

According to the contact pin of the seventh aspect of the present invention, it is easy to handle, and the plurality of contact pin portions can be fixed to the probe base in a state of maintaining a predetermined positional relationship. Further, according to the contact pin of claim 8 of the present invention, it is possible to reliably hold the plurality of contact pin portions in a predetermined positional relationship. According to the contact pin of claim 9 of the present invention, the connection portion is removed after each contact pin portion is electrically connected to the terminal portion of the probe base, so that the handling of the contact pin is easy and the probe Fixing work to the base is also easy.

According to the composite contact pin of the tenth aspect of the present invention, handling is easy, and the conductive contact pin portion and the ground contact pin portion can be fixed while maintaining a predetermined positional relationship. . Further, according to the composite contact pin of the present invention, the conductive contact pin portion and the ground contact pin portion can be more easily fixed to the probe base.

Further, according to the composite contact pin of the twelfth aspect of the present invention, each conductive contact pin portion is electrically connected to the conductive terminal portion of the probe board, and each ground contact pin portion is electrically connected to the ground terminal portion. Since the connecting portion is later removed, the handling of the composite contact pin is easy, and the fixing work to the probe base is also easy.

[Brief description of the drawings]

FIG. 1 is a front view showing a first embodiment of a contact pin according to the present invention.

FIG. 2 is a front view showing a use state of the contact pin of FIG. 1;

FIGS. 3A to 3F are simplified diagrams for explaining a method of manufacturing the contact pin of FIG. 1;

FIG. 4 is a side view showing a part of a modified form of the contact pin.

FIG. 5 is a side view showing a part of another modification of the contact pin.

FIG. 6A is a side view showing a part of still another modification of the contact pin, and FIG. 6B is a bottom view showing a part of the contact pin.

FIG. 7 is a partial sectional view showing a second embodiment of the contact pin according to the present invention.

FIG. 8 is a plan view showing a first embodiment of a composite contact pin according to the present invention.

FIG. 9A is a partial plan view showing a modification of the contact pin portion, and FIG. 9B is a partial front view showing this modification.

FIG. 10 is a partial plan view showing another modification of the contact pin.

FIG. 11 is a plan view showing a second embodiment of the composite contact pin according to the present invention.

FIG. 12 is a simplified plan view showing a state before a composite contact pin according to a third embodiment of the present invention is peeled from a metal substrate.

13 is a simplified plan view showing a state where the composite contact pin of FIG. 12 is peeled off from a metal substrate.

FIG. 14 is a plan view schematically showing a manner of attaching the composite contact pin of FIG. 12 to a probe board.

[Explanation of symbols]

2, 2A, 2B, 2C, 52 Contact pin 4, 54 Pin body 6, 56 Contact 8, 218 Semiconductor product 10 Terminal 12, 210 Metal substrate 14 Photoresist layer 58 Insulating coating layer 60 Metal layer 102, 152 , 202 Composite contact pin 104, 104A, 104B, 154, 204 Conductive contact pin 106, 156, 206 Earth contact pin 108, 158, 208 Connection 212 Holding member 214 Probe base

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G011 AA04 AA09 AA10 AA15 AB04 AC21 AE03 AF06 4M106 AA04 BA01 CA01 DD04 DD10 DD18 DD30

Claims (12)

[Claims] 1. A pin body electrically connected to a probe base side, and a contact portion extending in a different direction from a tip of the pin body at a specific angle and electrically contacting a terminal of a product. Are formed integrally by electroforming. 2. The method according to claim 1, wherein the thickness of the pin body and the contact formed by electroforming is 20.
The contact pin according to claim 1, wherein the thickness of the contact pin is from 300 μm to 300 μm. 3. A contact portion between the pin body and the contact portion is provided with a concave portion, and the contact portion is elastically pressed against a terminal portion of the product by elastic deformation of the concave portion. Item 3. The contact pin according to item 1 or 2. 4. A pin body electrically connected to the probe base side and a contact part electrically connected to a terminal of a product, wherein at least a part of the pin body is insulatively coated. A contact pin characterized by being covered by a layer. 5. The contact pin according to claim 4, wherein a metal layer is further provided on a surface of said insulating coating layer. 6. A pin body electrically connected to the probe base and a contact portion electrically connected to a terminal of a product are integrally formed by electroforming, and the pin body and the pin body are formed integrally with each other. A contact pin, wherein the electroless plating layer is crystallized after the contact portion is subjected to electroless plating. 7. A semiconductor device comprising: a plurality of contact pin portions each having a tip portion corresponding to a terminal portion of a product; and a connection portion connecting the contact pin portions, wherein the plurality of contact pin portions and the connection portion are connected to each other. A contact pin formed integrally by electroforming. 8. The contact pin according to claim 7, wherein said plurality of contact pin portions are held by a holding member. 9. The contact pin according to claim 7, wherein said connection portion is removed after electrically connecting said plurality of contact pin portions to corresponding terminal portions of a probe board. 10. A plurality of conductive contact pins having a tip corresponding to a conductive terminal of a product, a plurality of ground contact pins having a tip corresponding to a ground terminal of the product, and the plurality of contacts. And a connecting portion for connecting the plurality of ground contact pin portions. The plurality of conductive contact pin portions, the plurality of ground contact pin portions, and the connection portion are integrally formed by electroforming. A composite contact pin characterized by being formed in a composite contact pin. 11. The composite contact pin according to claim 10, wherein said plurality of conductive contact pins and said plurality of ground contact pins are held by a holding member. 12. The connecting portion electrically connects the plurality of conductive contact pins to corresponding conductive terminals of a probe board and connects the plurality of ground contact pins to a corresponding ground of the probe board. The composite contact pin according to claim 10, wherein the composite contact pin is removed after being electrically connected to the terminal portion.