JP2001189353A - Device and method for probe inspection - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe inspection device, capable of measuring the positions of the positions of probes in a state that the probes are contacted with the contact surface of a deformed body and the optimal push-in depths of the probes in advance and a probe inspection method. SOLUTION: A probe inspection device has a deformed body 7, having a flat contact surface to the same degree as that of a material to be inspected, a probe card 3 consisting of plural probes 1, a means for contacting the contact surface with the probes 1, a means for observing plural probe scars 8 formed in the contact surface, a means for measuring the size of apertures formed in the probe scars 8 and the positions of plural probe point scars and a means for calculating the push-in depths of the probes 1 from the size of the apertures formed in the probe scars 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe inspection apparatus and a probe inspection method used in a semiconductor chip inspection process. In particular, a probe alignment method that can simultaneously determine a probe tip position and an optimal probe insertion depth by contacting a plurality of probes simultaneously with a contact body different from an electrode pad of a semiconductor chip. Get involved.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, before packaging an IC chip (die) formed on a wafer, an electrical characteristic test of each IC chip is performed in a wafer state, and a non-defective IC chip is screened in advance. Process. In this inspection step, a probe device is usually used. The probe device generally includes a loader chamber for transferring a wafer, and a prober chamber adjacent to the loader chamber for inspecting electrical characteristics of the wafer transferred from the loader chamber. A main chuck movable in the X, Y, Z, and θ directions is provided in the prober chamber, and a probe card is fixed on the upper surface of the loader chamber so as to face the main chuck.

When inspecting using a probe device, the main chuck is moved to X, Y, and X in a state where the wafer transferred from the loader chamber is vacuum-sucked on the main chuck.
The electrode pads of each IC chip on the wafer moving in the Z and θ directions (for example, formed of aluminum)
After aligning the probe with the probe of the probe card, the main chuck rises in the Z direction, and the electrode pad of the IC chip and the probe come into contact with each other. The probe is further pushed into the electrode pad to a predetermined depth to make electrical contact. The electrical characteristics of the IC chip are inspected.

[0004]

However, in the conventional probe inspection apparatus, it is necessary to perform probe alignment and wafer alignment. After determining the position of the probe, the relative movement distances X, Y, and Z to the respective electrode pads of the IC chip to be evaluated on the wafer are calculated and moved. The conventional positioning of the probe means, as shown in FIG. 11, observing the probe card 53 using the CCD camera 54 from the direction of the probe tip 51a, focusing the CCD 54 on the tip of the probe tip 51a,
The purpose was to determine the position of the probe tip 51a. C
The probe card 53 observed by the CD camera 54 is shown in FIG.
As shown in FIG. 2A, the entire probe card 53 is observed at a low magnification, and the probe 51 surrounded by the dotted line 55 is observed at a high magnification. As shown in FIG. Measure the coordinates. Further, in order to detect the rotation angle of the probe card 53, it is necessary to determine the positions of the plurality of probe tips 51a. Therefore, in the conventional probe positioning operation, the steps of focusing the probe tip 51a, reading the position of the probe tip 51a, and finely adjusting the rotation angle θ are repeated several times. This has made it difficult to shorten the probe alignment time.

[0005] Another problem is as follows. That is, in the conventional probe inspection apparatus, the position of the probe tip 1a is determined by directly observing the probe 1 from the side of the probe tip 51a. However, in order to actually obtain stable electrical contact between the electrode pad of the IC chip and the probe 51, it is necessary to push the probe tip 51a into the electrode pad to a predetermined depth. At this time, depending on the probe 51, the probe tip 51a may be shifted in the lateral direction. That is, the position of the probe tip 51a in a state where the probe 51 is in contact with the electrode pad is determined in a state where the probe tip 51a is pushed into the electrode pad. Therefore, the conventional probe alignment is performed by directly observing the probe tip and checking the probe tip 1a in a non-contact state.
The position was determined. There is a possibility that the probe may be displaced from the electrode pad in a state where the probe is pushed in, and in the past, the optimum contact depth was determined by actually making contact with the electrode pad several times in advance.

The present invention has been made to solve such problems of the prior art, and has as its object to provide a probe inspection apparatus and a probe inspection apparatus capable of measuring the position of a probe tip in a contact state in advance. It is to provide a probe inspection method.

It is another object of the present invention to provide a probe inspection apparatus and a probe inspection method capable of measuring an optimal depth of a probe beforehand.

It is still another object of the present invention to provide a probe inspection apparatus and a probe inspection method in which the time required for probe alignment is short.

[0009]

Means for Solving the Problems To achieve the above object, a first feature of the present invention is that a deformed body having a flat contact surface of the same degree as an object to be inspected and a probe card comprising a plurality of probes are provided. A probe inspection device having means for contacting a contact surface with a plurality of probes, means for observing a plurality of probe marks formed on the contact surface, and means for measuring the positions of a plurality of probe tip marks It is.

According to the first aspect of the present invention, the probe is brought into contact with the deformed body by bringing the probe into contact with the object to be inspected and observing the probe mark formed on the deformed body. In this state, the position of the probe tip can be measured. Therefore, in the IC chip inspection process,
The position of the probe tip when the probe is brought into contact with the electrode pad can be known in advance. The probe tip does not move due to the contact with the electrode pad, and the probe tip does not slip off the electrode pad.

[0011] In the first aspect of the present invention, the probe inspection apparatus further includes means for measuring the size of the opening of the plurality of probe marks, and means for calculating the depth to which the probe is pushed from the size of the opening. It is desirable. Since the depth of the probe pushed into the deformed body can be obtained from the size of the opening of the probe mark, by pushing the probe into the deformed body until the opening of the probe mark is formed sufficiently large for all probes, A sufficient indentation depth can be determined for all probes. By pushing the probe into the deformable body to a sufficient pushing depth, stable electrical contact can be obtained. Therefore, when all the probes are pushed into the deformable body to a sufficient pushing depth, all the probes can obtain stable electrical contact. That is, it is possible to optimize the pushing depth required to absorb variations in the height of the probe tip.

It is preferable that the object to be inspected and the deformed body are made of the same material. Further, it is desirable that the deformed body is a conductor. The probe can be cleaned by applying a potential difference between the contact surface of the deformable body and the probe in a state where the tip of the probe is in contact with the contact surface of the deformable body or in a state where the probe is slightly apart. Further, it is desirable that the conductor is made of a material mainly containing aluminum. Usually, the electrode pads of the IC chip are made of a material containing aluminum as a main component and also containing silicon, copper, and the like. It is desirable that the inspection object and the deformed body have the same thickness. By adjusting the conditions of the object to be inspected and the film thickness, the moving distance of the tip of the probe can be accurately measured.

Further, it is desirable that the probe inspection apparatus according to the first aspect of the present invention further has a stage for supporting the deformable body, and the deformable body can be removed from the stage. The deformed body after making several probe marks can be replaced. Alternatively, the probe inspection device according to the first aspect of the present invention may further include a reproduction processing unit that removes a probe mark formed on the contact surface of the deformed body. As a regeneration processing means for removing probe traces, the probe inspection apparatus preferably further has a stage for supporting the deformed body, and the stage preferably has heating means for heating the deformed body and melting the contact surface. Alternatively, the regeneration processing means for removing the probe marks may be a polishing means for polishing the contact surface with a cloth or plate having an abrasive. Further, the deformable body may be an elastic body in which a time required for restoring the plurality of probe marks formed on the contact surface is longer than a time required for observing the plurality of probe marks. There is no need to replace the deformed body on which the probe marks are formed, and it is not necessary to perform a regeneration process for removing the probe marks.

A probe inspection apparatus according to a second aspect of the present invention has a position sensor having a contact surface as flat as the object to be inspected and having a sufficient resolution with respect to the diameter of the tip of the probe, and a plurality of position sensors. The probe inspection apparatus includes a probe card including a probe, a unit configured to contact the contact surface with the plurality of probes, and a first measurement unit configured to measure coordinates of contact positions of the plurality of probes detected by the position sensor. is there.

According to the second aspect of the present invention, the probe is brought into contact with the position sensor before the probe is brought into contact with the inspection object, and the coordinates of the contact position of the probe are measured. The position of the tip of the probe can be measured. Therefore, the position of the probe tip when the probe is brought into contact with the electrode pad can be known in advance in the IC chip inspection process. The probe tip does not move due to the contact with the electrode pad, and the probe tip does not slip off the electrode pad.

In the second aspect of the present invention, it is preferable that the probe inspection apparatus further includes a second measuring means for measuring the indentation depth of the plurality of probes detected by the position sensor. Further, it is desirable that the position sensor has a plurality of electrodes arranged in a matrix. Further, it is desirable that the measuring means measures the coordinates of the contact position of the probe by conduction between the plurality of electrodes. Alternatively, it is desirable that the measuring unit measures the coordinates of the contact position of the probe and the depth of the probe being pressed in based on a change in capacitance between the plurality of electrodes. Further, it is preferable that the apparatus further includes a protective film disposed on a contact surface of the position sensor, and the protective film is brought into contact with the plurality of probes. Alternatively, in the measuring means based on conduction between a plurality of electrodes, the protective film has an anisotropic conductive sheet having a conductor disposed so as to penetrate the front and back surfaces at an interval having sufficient resolution with respect to the diameter of the probe tip. It may be. By pushing the tip of the probe into a protective film or an anisotropic conductive sheet disposed on the contact surface of the position sensor, the pushing depth of the tip of the probe can be determined. By pushing the probe tip to a sufficient pushing depth for all the probes, a sufficient pushing depth can be obtained for all the probes. By pushing the probe into the protective film or the anisotropic conductive sheet to a sufficient pushing depth, stable electrical contact can be obtained. Therefore, by pushing all the probes into the protective film or the anisotropic conductive sheet to a sufficient pushing depth, all the probes can obtain stable electrical contact. That is, it is possible to optimize the pushing depth required to absorb variations in the height of the probe tip.

A third feature of the present invention is that a plurality of probes are brought into contact with a contact surface of a deformed object having a contact surface as flat as the object to be inspected, and a plurality of probes formed on the contact surface. The present invention is a probe inspection method including a step of observing a trace and a step of measuring positions of a plurality of probe tip traces.

According to a third aspect of the present invention, the probe inspection method further includes a step of measuring the size of the openings of the plurality of probes, and a step of calculating the depth of pushing of the probes from the sizes of the openings. Is desirable.

A fourth feature of the present invention is that a plurality of probes are brought into contact with a contact surface of a position sensor having a contact surface as flat as the object to be inspected and having a sufficient resolution with respect to the diameter of the probe tip. And a step of measuring the coordinates of the contact positions of the plurality of probes on the contact surface.

[0020] In the fourth aspect of the present invention, it is preferable that the probe inspection method further includes a step of measuring a pressing depth of the plurality of probes on the contact surface.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. In the description of the drawings, parts similar to those of the related art are denoted by similar reference numerals.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
It is a figure showing the composition of the probe inspection device concerning an embodiment. As shown in FIG. 1, a probe inspection apparatus according to a first embodiment of the present invention includes a deformed body 7 having a flat contact surface of the same degree as an object to be inspected, a plurality of probes 1, and a plurality of probes 1. A probe card 3 consisting of a stage 2 for fixing the probe tips 1a in the same direction, a means for contacting the contact surface of the deformable body 7 with a plurality of probes 1, and a plurality of probes formed on the contact surface of the deformable body 7. Means for observing the probe marks 8, means for measuring the size of the openings of the plurality of probe marks 8 and the positions of the plurality of probe tip marks, and means for calculating the indentation depth of the probe 1 from the size of the openings. Having.

The deformed body 7 has a flat surface which is different from the object to be inspected but is substantially the same as that of the object to be inspected. Further, it is desirable that the material is the same as that of the inspection object. Further, it is desirable to have the same film thickness as the inspection object. The inspection object is, for example, an IC
This is an electrode pad of the chip. Here, an aluminum film 7 having a thickness of 1 μm is used as a deformed body. The planar shape of the deformed body 7 is not particularly defined. Further, the deformable body 7 may be a material that undergoes plastic deformation. Further, the deformable body 7 may be an elastic body. However, the time until the probe mark 8 formed by the elastic deformation is restored needs to be longer than the time sufficient for observing the probe mark 8.

The probe card 3 comprises a plurality of probes 1 oriented in the same direction with the probe tips 1a aligned and a stage 2 for fixing the plurality of probes 1. A wiring connected to each probe 1 is embedded in the stage 2.
The probe 1 is a conductor needle, and performs screening of an IC chip by bringing the tip 1a of the probe into contact with an electrode pad.

The means for bringing the plurality of probes 1 into contact with the contact surface of the deformable body 7 is not shown in the figure, but is provided in a conventional probe inspection apparatus comprising a loader chamber and a prober chamber.
It is desirable to use a means for bringing the probe 1 into contact with the electrode pad of the C chip. Instead of the wafer to be inspected, the probe 1 may be brought into contact with the contact surface of the deformable body 7 placed at a place different from the main chuck.

As a means for observing a plurality of probe marks 8 formed on the contact surface of the deformable body 7, a CCD camera 4 capable of two-dimensional imaging is used. CCD camera 4
Is to observe the entirety of the plurality of probe marks 8 at a low magnification,
In addition, each probe mark 1a can be observed at a high magnification.

The means for measuring the size of the openings of the plurality of probe marks 8 and the positions of the plurality of probe tip marks is based on the size of the opening of each probe mark 8 based on the image of the probe marks 8 observed by the CCD camera 4. This is an image processing means for measuring the position of the probe tip traces. Conventionally, CC
The size of the opening of the probe mark 8 and the positions of the plurality of probe mark marks may be measured by using the means for measuring the position of the probe mark 1a from the imaging image of the probe mark 1a observed by the D camera 4 as it is.

The means for calculating the pushing depth of the probe 1 from the size of the opening of the probe mark 8 is means for calculating the depth of the probe 1 pushed into the deformable body 7 from the size of the opening of the probe mark 8. is there. Usually, since the probe has a conical shape, the depth of the probe 1 pushed into the deformable body 7 can be obtained from the size of the opening of the probe mark 8.

FIG. 2A shows an image of the probe mark 8 on the deformed body 7 observed at a low magnification by the CCD camera 4. As shown in FIG. 2A, probe marks 8 are formed on the deformable body 7 by the number of probes in contact. FIG. 2B shows an imaging image obtained by observing the probe mark 8 surrounded by a dotted line in FIG. As shown in FIG. 2B, the probe marks 8 formed on the deformed body 7 are two probe marks 8a and 8
b. These two probe marks 8a and 8b are formed by displacement of the probe tip 1a due to pushing the probe to a predetermined pushing depth in order to obtain stable electrical contact. In other words, the probe with the shallow indentation depth forms the first probe mark 8b, but when the indentation depth becomes deeper, the probe tip 1a
Shifts to form a second probe mark 8a. As a result, a probe tip mark 9 which is a mark of the probe tip 1a of the probe pushed into the predetermined pushing depth is formed at the center of the second probe mark 8a. By measuring the position of the probe tip mark 9 from the observed imaging image, the position of the probe tip 1a in the contact state can be measured. Further, the depth of pushing of the probe can be measured from the size of the opening of the second probe mark 8a.

FIG. 3 shows an image of the probe mark 8 on the deformed body 7 observed at a low magnification by the CCD camera 4 as in FIG. 2A. As shown in FIG. 3, among a plurality of probe marks 8 formed on the deformable body 7, the probe mark 30 surrounded by a dotted line has a smaller opening size than the other probe marks 8. It can be confirmed that the difference is also observed in the imaging image of FIG. This difference in the size of the opening mainly occurs when the probe tips 1a are not aligned. If the size of the opening of the probe mark 8 is insufficient, there is a possibility that the pressing depth of the probe is insufficient and the actual contact with the electrode pad of the IC chip is also insufficient. . Therefore, it can be seen from the imaging images shown in FIG. 3 that not all the probes have been pushed to a sufficient pushing depth.

The deformed body 7 after the probe mark 8 has been applied several times
Need to be replaced. This is because the probe mark 8 cannot be specified in the deformed body 7 filled with the probe mark 8. It is desirable that the probe inspection apparatus according to the first embodiment be provided with a mechanism capable of replacing the deformable body 7. Specifically, the probe device may further include a stage for supporting the deformable body 7 as shown in FIG. 1 so that the deformable body 7 can be detached from the stage. Further, instead of replacing the deformed body 7, a function for realizing the following modified body reproduction processing method may be provided. FIG. 4 is a main process cross-sectional view showing two methods for regenerating a contact surface of the deformed body 7 on which the probe mark 8 is formed by contact with the probe 1.
FIG. 4A is a cross-sectional view of the deformed body 7 on which the probe mark 8 is formed and the stage 10 supporting the deformed body 7. First,
A method of heating the deformable body 7 to bury the probe marks 8 will be described. The deformable body 7 is heated by heating means such as a heating element 11 embedded in the stage 10 to melt the contact surface of the deformable body 7 on which the probe marks 8 are formed. FIG. 4 (d)
As shown in (1), the deformed body 7 that has melted fills in the probe marks 8, and the deformed body 7 having a flat contact surface can be regenerated. As a material of the deformable body 7 suitable for the regeneration treatment by the heat treatment, there are a low melting point metal, an alloy, and an organic insulator. Next, the contact surface of the deformable body 7 is polished to
A method for removing the will be described. As shown in FIG. 4C, the contact surface of the deformable body 7 on which the probe marks 8 are formed is polished using a cloth or a plate having an abrasive. FIG. 4 (d)
As shown in (1), the deformed body 7 having a flat contact surface can be regenerated by scraping the contact surface and removing the probe mark. Here, the regeneration treatment method by heating and polishing has been described, but the flatness of the contact surface of the deformable body 7 may be restored by a method using pressure, a method combining pressure and heating, or the like.

As described above, according to the first embodiment, the probe is brought into contact with the object to be inspected before being brought into contact with the object to be inspected, and the probe mark formed on the object is observed, whereby the probe is formed. It is possible to measure the position of the probe tip in a state where the probe is in contact with the deformable body. Therefore, in the IC chip screening step, the position of the tip of the probe when the probe is brought into contact with the electrode pad can be known in advance. The probe tip does not move due to the contact with the electrode pad, and the probe tip does not slip off the electrode pad.

Further, since the depth of the probe pushed into the deformable body can be determined from the size of the opening of the probe mark, the probe is deformed until the opening of the probe mark is formed sufficiently large for all the probes. By pushing in the probe, a sufficient pushing depth can be obtained for all the probes. By pushing the probe into the deformable body to a sufficient pushing depth, stable electrical contact can be obtained. Therefore, when all the probes are pushed into the deformable body to a sufficient pushing depth, all the probes can obtain stable electrical contact. That is, it is possible to optimize the pushing depth required to absorb variations in the height of the probe tip.

Further, the focus of the CCD camera can be fixed to the contact surface of the deformable body. This eliminates the need to repeatedly perform the conventional probe positioning operation, and can reduce the time required for positioning the probe tip.

In the first embodiment, it is desirable that the deformable body 7 is made of a conductor. The probe 1 can be cleaned by applying a potential difference between the contact surface of the deformable body 7 and the probe 1 in a state in which the probe tip 1a is in contact with the contact surface of the deformable body 7 or in a state where it is slightly separated. . In addition, although it has been described that the material of the deformable body 7 is desirably the same as the material to be inspected such as an electrode pad of an IC chip, the present invention is not limited to this. A different metal may be used as long as the probe 1 has plastic deformability. Furthermore, an insulator may be used instead of a conductor. When the deformed body 7 is made of an insulator, a potential difference is supplied to the deformed body and the probe 1 cannot be cleaned. However, the probe mark 8 is formed, the probe mark 8 is observed, and the coordinates of the probe tip mark 9 are obtained. Measurement and calculation of the pushing depth of the probe 1 can be performed from the size of the opening.

(Second Embodiment) FIG. 5 is a view showing the structure of a probe inspection apparatus according to a second embodiment of the present invention. As shown in FIG. 5, the probe inspection apparatus according to the second embodiment has a position sensor 13 having a contact surface as flat as the object to be inspected and having a sufficient resolution with respect to the diameter of the probe tip. And a plurality of probes 1 and a plurality of probes 1 arranged in the same direction with the probe tips aligned.
A probe card 3 consisting of a stage 2 for fixing the probe, means for contacting the contact surface of the position sensor 13 with the plurality of probes 1, coordinates of contact positions 17 of the plurality of probes 1 on the position sensor 13, and a pressing depth of the probe 1 Measuring means for measuring the height.

The position sensor 13 has a flat contact surface as much as the object to be inspected, similarly to the deformed body 7 in the first embodiment. Further, the position sensor 13 has a sufficient position resolution with respect to the diameter of the tip of the probe 1 to measure the position where the tip of the probe 1 is in contact.

Means for bringing the contact surface of the position sensor 13 into contact with the plurality of probes 1 is not shown in the figure, but the electrode pad of the IC chip and the probe included in a conventional probe inspection apparatus comprising a loader chamber and a prober chamber. It is desirable to use a means for bringing 1 into contact. The probe 1 may be brought into contact with the contact surface of the position sensor 13 placed at a place different from the main chuck instead of the wafer to be inspected.

The coordinates of the contact position 17 of the plurality of probes 1 on the position sensor 13 and the means for measuring the depth of depression of the probe 1 indicate the position of the tip of the probe detected by the position sensor 13 as coordinates on the position sensor 13. It is a means to do. As such a measuring means, for example, there is a decoder connected to the position sensor 13. FIG. 6 is a plan view showing the position sensor 13 and the column decoder 15 and the row decoder 16 connected to the position sensor 13. As shown in FIG. 6, a column decoder 15 and a row decoder 16 are connected to two sides of the rectangular position sensor 13 that are not opposed to each other. The contact position 17 of the probe tip detected by the position sensor 13 by the contact with the probe 1 is represented as two-dimensional coordinate data by the column decoder 15.
And the row decoder 16.

<First Position Detection Method> A specific example of the position detection method of the position sensor will be described. First, FIG.
FIG. 5 is a cross-sectional view of a position sensor for describing a method of detecting contact of the probe tip 1a based on a change in capacitance between electrodes arranged in a matrix. Inside the position sensor 13, a plurality of column electrodes 18 are wired in parallel in the row direction, and a plurality of row electrodes are wired in parallel in the column direction. By changing the wiring layer between the column electrode 18 and the row electrode 19, wiring can be performed so that the column electrode 18 and the row electrode 19 cross each other without contact.
At the intersection of the column electrode 18 and the row electrode 19,
The sensor portions 18a and 19a extending in the direction perpendicular to the contact surface of the position sensor 13
And the row electrode 19. A predetermined voltage is applied between the column electrode 18 and the row electrode 19. Therefore, the sensor units 18a and 19a form a capacitor having a predetermined capacitance. In addition, since the column electrode 18 and the row electrode 19 may be damaged due to the contact of the probe tip 1a, the protective film 14 is disposed on the contact surface of the position sensor 13, and the protective film 14 and the probe tip 1 are disposed.
a.

FIG. 7A shows a state where the probe tip 1a is sufficiently separated from the sensor sections 18a and 19a. On the other hand, FIG. 7B shows a state in which the probe tip 1a is sufficiently close to the sensor sections 18a and 19a.
The capacitance of the sensor units 18a and 19a changes as the probe tip 1a approaches. The position sensor detects the approach of the probe tip 1a based on the change in the capacitance. Further, the depth of the probe tip 1a pushed into the protective film 14 can be obtained from the change in capacitance. The detected contact position 17 of the probe tip 1a is
5 and the row decoder 16 measure the coordinates on the position sensor.

<Second Position Detecting Method> Next, the probe tip 1a is turned on by conduction between electrodes arranged in a matrix.
The following describes two methods of detecting the contact of the user. FIG.
FIG. 4 is a perspective view of a position sensor for describing a first method for detecting contact of the probe tip 1a by conduction between electrodes arranged in a matrix. On the position sensor, a plurality of column electrodes 18 are wired in parallel in the row direction, and a plurality of row electrodes 19 are wired in parallel in the column direction. By changing the wiring layer in the column direction and the row direction, wiring can be performed so that the column electrode 18 and the row electrode 19 intersect without contacting each other. 8 (a) and 8
FIG. 2B is a perspective view showing a portion where the column electrode 18 and the row electrode 19 intersect in such a matrix of electrodes. FIG. 8A is a perspective view showing a non-contact state, and FIG. 8B is a perspective view showing a contact state. 8A and 8B, the column electrode 2
The row electrode 21 is disposed on the zero. Further, at a portion where the column electrode 20 and the row electrode 21 intersect, the sensor portion 18a extends from the column electrode 18 in the direction perpendicular to the contact surface of the position sensor, and the sensor portion 19a extends from the row electrode 19. I have. Sensor unit 18a, 1
9a is exposed on the contact surface of the position sensor. The interval at which the sensor portions 18a and 19a are arranged is shorter than the diameter of the probe tip 1a. In FIG. 8A, since the probe tip 1a does not contact the position sensor, the probe tip 1a does not contact the sensor unit 18a and the sensor unit 19a. On the other hand, in FIG. 8B, since the probe tip 1a is in contact with the position sensor, the probe tip 1a has the sensor section 18a and the sensor section 19.
a simultaneously. Then, at the intersection, the sensor unit 18a and the sensor unit 19a conduct, and the column electrode 18 to which the sensor unit 18a is connected and the sensor unit 1 are connected.
The row electrode 21 to which 9a is connected conducts. The column decoder 15 and the row decoder 16
The contact position 17 of the probe tip 1a is measured from the information on the short circuit between the probe electrode 1 and the row electrode 19.

FIG. 9 shows a second example of detecting contact of the probe tip 1a by conduction between electrodes arranged in a matrix.
It is a perspective view of a position sensor for explaining the method of. On the position sensor, a plurality of electrodes are wired in parallel in the column direction and the row direction, respectively. By changing the wiring layer in the column direction and the row direction, wiring can be performed so that the respective electrodes cross each other without contact. FIG.
FIG. 9A and FIG. 9B are perspective views showing a portion where an electrode in a column direction and an electrode in a row direction intersect among such electrodes arranged in a matrix. FIG. 9A is a perspective view showing a non-contact state, and FIG. 9B is a perspective view showing a contact state. 9 (a) and 9 (b),
The row electrode 21 is arranged on the column electrode 20.
Further, at a portion where the column electrode 20 and the row electrode 21 intersect, the row electrode 21 has a function of being deformed by a force applied in a direction perpendicular to the contact surface of the position sensor and coming into contact with the column electrode 20. In FIG. 9A, since the probe tip 1a does not contact the position sensor, the column electrode 20 and the row electrode 21 do not contact at the intersection. On the other hand, in FIG.
a is in contact with the position sensor. That is, the probe tip 1a applies a stress to the row electrode 21 in a direction perpendicular to the contact surface. Then, the deformed row electrode 21 and column electrode 20 are short-circuited at the intersection. The column decoder 15 and the row decoder 16 measure the contact position 17 of the probe tip 1a from the information of the short circuit between the electrodes.

In the position detecting method based on conduction between the electrodes shown in FIG. 8, an anisotropic conductive sheet 22 having local conductivity is arranged on the contact surface as shown in FIG. desirable. The electrodes 18, 19 of the position sensor 13 by the probe tip 1a are formed by the anisotropic conductive sheet 22.
Damage can be suppressed. Anisotropic conduction sheet 22
Consists of a conductor that penetrates the front and back surfaces at an interval having sufficient resolution with respect to the diameter of the probe tip 1a, and an insulator that insulates the adjacent conductor. Specifically, FIG.
As shown in the figure, the anisotropic conductive sheet 22 is composed of a conductor 22a penetrating the front and back surfaces at portions corresponding to the sensor portions 18a and 19a of the position sensor, and an insulator 22b insulating between adjacent conductors 22a. It is configured. At the contact surface between the position sensor 13 and the anisotropic conductive sheet 22, the conductor 22a and the sensor portions 18a and 19a are in electrical contact. Probe tip 1a in contact with anisotropic conductive sheet 22
Simultaneously contact the conductor 22a that has contacted the sensor section 18a and the sensor section 19a. Therefore, the conductor 2
2a, the probe tip 1a is connected to the sensor section 18a.
And the sensor part 19a at the same time.

As described above, according to the second embodiment, before the probe is brought into contact with the object to be inspected, the probe is brought into contact with the position sensor, and the coordinates of the contact position of the probe are measured. The position of the tip of the probe in a state of contact with the probe can be measured. Therefore,
In the IC chip screening step, the position of the probe tip when the probe is brought into contact with the electrode pad can be known in advance. The probe tip does not move due to the contact with the electrode pad, and the probe tip does not slip off the electrode pad.

Further, by pushing the tip of the probe into a protective film or an anisotropic conductive sheet disposed on the contact surface of the position sensor, the pushing depth of the tip of the probe can be obtained. By pushing the probe tip to a sufficient pushing depth for all the probes, a sufficient pushing depth can be obtained for all the probes. By pushing the probe into the protective film or the anisotropic conductive sheet to a sufficient pushing depth, stable electrical contact can be obtained. Therefore, by pushing all the probes into the protective film or the anisotropic conductive sheet to a sufficient pushing depth, all the probes can obtain stable electrical contact. That is, it is possible to optimize the pushing depth required to absorb variations in the height of the probe tip.

In the second embodiment, since the contact surface of the position sensor is made of a metal such as a sensor, the probe tip is in contact with the contact surface of the deformable body, or is slightly apart. In this state, the probe can be cleaned by applying a potential difference between the contact surface of the position sensor and the probe.

[0048]

As described above, according to the present invention, it is possible to provide a probe inspection apparatus and a probe inspection method capable of measuring the position of the probe tip in a contact state in advance.

Further, according to the present invention, it is possible to provide a probe inspection apparatus and a probe inspection method capable of measuring an optimum lobe indentation depth in advance.

Further, according to the present invention, it is possible to provide a probe inspection apparatus and a probe inspection method in which the time required for probe alignment is short.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a probe inspection device according to a first embodiment of the present invention.

FIG. 2A is a diagram showing the shape of a plurality of probe marks formed on a deformed body observed at a low magnification by a CCD camera, and FIG. It is a figure showing the shape of one probe mark formed on the deformation object observed by magnification.

FIG. 3 is a view showing the shape of a plurality of probe marks formed on a deformed body observed at a low magnification by a CCD camera, and showing a case where the indentation depth is insufficient at the time of contact between the probe and the deformed body. It is.

FIG. 4 is a main process diagram showing a method of regenerating a deformed body of the probe inspection device according to the first embodiment.

FIG. 5 is a diagram showing a configuration of a probe inspection device according to a second embodiment of the present invention.

FIG. 6 is a plan view showing a configuration of a position sensor according to a second embodiment of the present invention.

7A and 7B are cross-sectional views illustrating a first method of detecting the position of the tip of the probe. FIG. 7A illustrates a state where the tip of the probe is sufficiently separated from the sensor unit, and FIG.
Indicates a state in which the probe tip is sufficiently close to the sensor unit.

FIG. 8 is a perspective view illustrating a second method (part 1) of detecting the position of the probe tip, where FIG. 8 (a) shows a non-contact state of the probe tip, and FIG. This shows the contact state of the probe tip.

FIG. 9 is a perspective view for explaining a second method (part 2) of detecting the position of the tip of the probe. FIG. 9 (a) shows a non-contact state of the tip of the probe, and FIG. This shows the contact state of the probe tip.

FIG. 10 is a cross-sectional view showing the structures of a position sensor and an anisotropic conductive sheet according to a second method (part 1) for detecting the position of the probe tip.

FIG. 11 is a diagram showing a configuration of a conventional probe inspection apparatus.

FIG. 12 (a) is a diagram showing positions of a plurality of probe tips observed at a low magnification by a CCD camera, and FIG. 12 (b) is a graph showing one position observed at a high magnification by a CCD camera; FIG. 4 is a diagram illustrating a position of a probe tip.

[Explanation of symbols]

 Reference Signs List 1 probe 1a probe tip 2 stage 3 probe card 4 CCD camera 7 deformed body 8 probe mark 9 probe tip mark 10 stage 11 heating element 12 polishing cloth (plate) 13, 23 position sensor 14 protective film 15 column decoder 16 low decoder 17 contact Position 18, 20 Column electrode 18a, 19a Sensor 19, 21 Row electrode 22 Anisotropic conductive sheet

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Katsuya Okumura 8 Shinsugita-machi, Isogo-ku, Yokohama-shi, Kanagawa F-term in Toshiba Yokohama Office (reference) 2G011 AA02 AA16 AB06 AB08 AB10 AC06 AC14 AE03 AF07 2G032 AB02 AF02 AF03 AF04 AK04 AL04 4M106 AA02 BA01 BA11 BA14 CA38 CA50 DD05 DD06 DD13 DD18 DD30 DJ02 DJ11 DJ38 DJ39

Claims (22)

[Claims] A deformable body having a contact surface as flat as the object to be inspected; a probe card comprising a plurality of probes; a means for contacting the contact surface with the plurality of probes; A probe inspection apparatus comprising: means for observing a plurality of formed probe marks; and means for measuring positions of a plurality of probe tip marks. 2. The apparatus according to claim 1, further comprising: means for measuring the size of the opening of the plurality of probe marks; and means for calculating the depth of pushing of the probe from the size of the opening. Probe inspection equipment. 3. The probe inspection apparatus according to claim 1, wherein the object to be inspected and the deformed body are made of the same material. 4. The probe inspection apparatus according to claim 1, wherein the deformable body is a conductor. 5. The probe inspection apparatus according to claim 4, wherein the conductor is made of a material containing aluminum as a main component. 6. The probe inspection apparatus according to claim 1, wherein the object to be inspected and the deformed body have the same thickness. 7. The probe inspection apparatus according to claim 1, further comprising a stage for supporting the deformable body, wherein the deformable body can be detached from the stage. 8. The probe inspection apparatus according to claim 1, further comprising a reproduction processing unit that removes the probe mark formed on the contact surface. 9. The apparatus according to claim 1, further comprising: a stage for supporting the deformable body, wherein the stage has, as the regeneration processing means, heating means for heating the deformable body and melting the contact surface. 8. The probe inspection device according to 8. 10. The probe inspection apparatus according to claim 8, wherein said regeneration processing means comprises polishing means for polishing said contact surface with a cloth or a plate having an abrasive. 11. The deformable body is an elastic body in which a time for restoring the plurality of probe traces is longer than a time required for observing the plurality of probe traces. Or the probe inspection device according to 2. 12. A position sensor having a contact surface as flat as the object to be inspected and having a sufficient resolution with respect to the diameter of the probe tip, a probe card comprising a plurality of probes, A probe inspection apparatus, comprising: means for contacting a plurality of probes; and first measurement means for measuring coordinates of contact positions of the plurality of probes detected by the position sensor. 13. The probe inspection apparatus according to claim 12, further comprising a second measuring means for measuring a depth of the plurality of probes pressed by the position sensor. 14. The position sensor has a plurality of electrodes arranged in a matrix, and the first measuring means measures coordinates of a contact position of the probe by conduction between the plurality of electrodes. The probe inspection apparatus according to claim 12, wherein: 15. The position sensor has a plurality of electrodes arranged in a matrix, and the first measuring means determines a coordinate of a contact position of the probe by a change in capacitance between the plurality of electrodes. The probe inspection apparatus according to claim 12, wherein the measurement is performed. 16. The position sensor has a plurality of electrodes arranged in a matrix, and the second measuring means changes the depth of the probe indentation by a change in capacitance between the plurality of electrodes. 14. The probe inspection apparatus according to claim 13, wherein the measurement is performed. 17. The apparatus according to claim 17, further comprising: a protection film disposed on the contact surface, wherein the means for contacting the contact surface with the plurality of probes includes:
14. The probe inspection device according to claim 12, wherein the probe inspection device is a means for bringing the plurality of probes into contact with the protective film. 18. The anisotropic conductive sheet according to claim 18, wherein the protective film is a conductive sheet having a conductor disposed so as to penetrate the front and back surfaces at an interval having a sufficient resolution with respect to the diameter of the probe tip. The probe inspection apparatus according to claim 14, wherein 19. A step of bringing a plurality of probes into contact with a contact surface of a deformable body having a contact surface as flat as the object to be inspected, and observing a plurality of probe marks formed on the contact surface. And a step of measuring the positions of a plurality of probe tip marks. 20. The method according to claim 19, further comprising the steps of: measuring a size of an opening of the plurality of probe marks; and calculating a depth of pushing of the probe from the size of the opening. Probe inspection method. 21. A step of bringing a plurality of probes into contact with the contact surface of a position sensor having a contact surface as flat as the object to be inspected and having a sufficient resolution with respect to the diameter of the probe tip; Measuring coordinates of contact positions of the plurality of probes on a surface. 22. A probe inspection method, further comprising the step of measuring the depth of the plurality of probes pushed on the contact surface.